CN103362827A - Pump device and manufacturing method of pump device - Google Patents
Pump device and manufacturing method of pump device Download PDFInfo
- Publication number
- CN103362827A CN103362827A CN201310101035XA CN201310101035A CN103362827A CN 103362827 A CN103362827 A CN 103362827A CN 201310101035X A CN201310101035X A CN 201310101035XA CN 201310101035 A CN201310101035 A CN 201310101035A CN 103362827 A CN103362827 A CN 103362827A
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- circuit substrate
- connector
- pump
- projection
- unit
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D13/00—Pumping installations or systems
- F04D13/02—Units comprising pumps and their driving means
- F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D13/0686—Mechanical details of the pump control unit
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D13/00—Pumping installations or systems
- F04D13/02—Units comprising pumps and their driving means
- F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D13/0606—Canned motor pumps
- F04D13/064—Details of the magnetic circuit
Abstract
Provided is a pump device which can help to ensure large space for forming a driving circuit on a circuit substrate. The pump device (1) comprises an annular wall (20) and a plate-shaped wall (21) which blocks on side of the annular wall. The stator (5) comprises driving coils (4), each of which is configured to be a circular ring shape and is fixed on a peripheral side of the annular wall. Each driving coil comprises a terminal pin (35) which projects in the direction of a central axis (L). The circuit substrate (7) is fixed on the plate-shaped wall, and, in the state of being orthogonal with the direction of the central axis, is configured to be located at a position where is overlapped with the multiple driving coils when observed in the direction of the central axis. Multiple terminal pin through holes (47) for the penetration by terminal pins (35) of the driving coils are disposed on the circuit substrate. A fastening mechanism (49) which is used for fixing the circuit substrate onto a dividing wall (18) is formed at a position that is far away from the central axis and faces towards a radial outer side. As a result, large space in the multiple terminal pin through holes can be guaranteed.
Description
Technical field
The present invention relates to a kind of pump chamber and the separated partition of stator manufacture method of being fixed with pump-unit and the pump-unit of circuit substrate configuring impeller.
Background technique
In patent documentation 1, put down in writing a kind of pump-unit, the stator of the ring-type that it comprises rotor that impeller is installed, comprise a plurality of drive coils that are configured to ring-type and be used for carrying out towards the circuit substrate of the power supply control of a plurality of drive coils disposes the pump chamber of impeller and is separated by partition with stator and circuit substrate.
In the pump-unit of patent documentation 1, partition comprises: with the annular wall section of the coaxial formation of central axis of a plurality of drive coils; And the tabular wall section that a side of the central axial direction of this annular wall section is stopped up.Stator is fixed in the outer circumferential side of annular wall section, and each drive coil comprises terminal pins, and terminal pins is outstanding along central axial direction under the state of the end portion that is wound with winding wire.Circuit substrate is rounded, and with the state of central axial direction quadrature under be disposed at when observing from central axial direction and position that a plurality of drive coil is overlapping.Circuit substrate is fixed in tabular wall section, be used for the retention mechanism that circuit substrate is fixed in partition be formed in circuit substrate the center, be central axis.Circuit substrate comprises a plurality of through holes that are arranged in ring-type along the outer periphery of circuit substrate, and the terminal pins of each drive coil runs through each through hole.
Patent documentation 1: Japanese Patent Laid-Open 2007-288959 communique
In the pump-unit of patent documentation 1, be formed in the center of circuit substrate for the retention mechanism that circuit substrate is fixed in partition.In addition, the terminal pins of each drive coil runs through the outer peripheral edge portion of circuit substrate in all-round scope.Consequently, do not have large space at circuit substrate, thereby have the low such problem of design freedom of the wiring pattern that designs the drive circuit that consists of at circuit substrate.
Summary of the invention
In view of the above problems, technical problem of the present invention is to provide a kind of and can guarantees for the pump-unit in the large space that consists of drive circuit and the manufacture method of pump-unit at circuit substrate.
For solving the problems of the technologies described above, the feature of pump-unit of the present invention is to comprise: rotor, and this rotor is equipped with impeller; Stator, this stator comprise a plurality of drive coils that are configured to ring-type; Circuit substrate, this circuit substrate comprises for the drive circuit to controlling towards the power supply of a plurality of above-mentioned drive coils, and when observing from the central axial direction of a plurality of above-mentioned drive coils and the overlapping position of a plurality of above-mentioned drive coil be configured to state with above-mentioned central axial direction quadrature; And partition, this partition will dispose the pump chamber of above-mentioned impeller and separate with foregoing circuit substrate and said stator, and be fixed with foregoing circuit substrate and said stator, each drive coil is included under the state of the end portion that is wound with winding wire along the outstanding terminal pins of above-mentioned central axial direction, and the foregoing circuit substrate has: a plurality of through holes that run through for the above-mentioned terminal pins of each drive coil; And the wiring pattern of the above-mentioned drive circuit that is electrically connected with the end portion of above-mentioned winding wire, the retention mechanism that foregoing circuit substrate and above-mentioned partition is fastening is located at the position from above-mentioned central axis towards radially outside skew.
According to the present invention, be located at towards the position of radial outside away from central axis for the retention mechanism that circuit substrate is fixed in partition, therefore, situation about being located on the central axis with retention mechanism compares, and can easily guarantee large space at circuit substrate.Therefore, when when circuit substrate forms the wiring pattern of drive circuit, can improve the design freedom of wiring pattern.
In the present invention, comparatively it is desirable to, above-mentioned drive circuit comprises for the drive integrated circult to controlling towards the power supply of a plurality of above-mentioned drive coils, and above-mentioned drive integrated circult is disposed on the above-mentioned central axis of foregoing circuit substrate.Like this, can easily install the so relatively large electronic component of ratio of drive integrated circult.In this case, comparatively it is desirable to, be formed with fastening projection and a location projection used at above-mentioned partition, the above-mentioned fastening above-mentioned retention mechanism that is configured for the foregoing circuit substrate is fixed in above-mentioned partition with projection, above-mentioned location is used for the foregoing circuit substrate is positioned with projection, and, be formed with the fastener hole that inserts for above-mentioned fastening projection and the positioning hole that inserts for above-mentioned location projection at the foregoing circuit substrate, does not give prominence in the outside from above-mentioned positioning hole towards above-mentioned circuit substrate with the front end of projection above-mentioned location.If the employing said structure then can with circuit substrate with respect to the location of partition permanent circuit substrate easily, in addition, can also prevent from locating the configuration that hinders other circuit elements device with projection.In addition, even if drive integrated circult is larger components and parts, as long as be disposed at the face of the foregoing circuit substrate of an opposite side with projection with respect to above-mentioned location, then also can drive integrated circult be disposed at circuit substrate in the mode that hinders with projection that is not positioned.
In the present invention, comparatively it is desirable to, the said pump device has for being supplied to from the electric power of outside the connector of above-mentioned drive circuit, above-mentioned connector is electrically connected with above-mentioned wiring pattern under the state of the outer peripheral edge portion that is fixed in the foregoing circuit substrate, this outer peripheral edge portion be the foregoing circuit substrate be positioned at the part of a side opposite to above-mentioned retention mechanism across above-mentioned central axis.Like this, can in the large space of guaranteeing to be used to form wiring pattern near the part of connector, therefore, can suppress the loss of electric power.
In the present invention, touch drive coil, circuit substrate for fear of the liquid that in pump chamber, circulates, comparatively it is desirable to, the said pump device comprises resin seal member, and this resin seal member is fixed under the state that the part of said stator, foregoing circuit substrate and above-mentioned connector is covered and is positioned at the face of an opposite side with respect to above-mentioned pump chamber in the above-mentioned partition.
In the present invention, comparatively it is desirable to, above-mentioned connector comprises the bonder terminal that extends abreast with the foregoing circuit substrate, and above-mentioned wiring pattern comprises that in the outer peripheral edge portion of foregoing circuit substrate soldering has the connector connecting pad of above-mentioned bonder terminal.Like this, by the attachment portion between bonder terminal and connector connecting pad is increased, can improve the adhesive strength of soldering.
In the present invention, can adopt following structure, the said pump device comprises for the connector fixed mechanism that above-mentioned connector is fixed in the foregoing circuit substrate, above-mentioned connector fixed mechanism comprises circuit substrate side fixing part and connector side fixing part, wherein, foregoing circuit substrate-side fixing part is located at the position of the circumferential both sides that are positioned at above-mentioned connector connecting pad on the foregoing circuit substrate, and above-mentioned connector side fixing part is located at the position of the circumferential both sides that are positioned at above-mentioned bonder terminal on the above-mentioned connector.If comprise such connector fixed mechanism, then can make fixedly to become firm between connector and circuit substrate.
In the present invention, comparatively it is desirable to, the gate vestiges of above-mentioned resin seal member be positioned at than foregoing circuit substrate more by above-mentioned radially the outside and than the position of the more close above-mentioned retention mechanism of above-mentioned connector.According to this structure, when using mould that resin seal member is carried out moulding, cast gate be formed in retention mechanism near, resin is near the injection of retention mechanism.Therefore, can suppress to make because of the resin that injects the situation of circuit substrate deflection.In this case, can adopt following structure: be formed with fastening projection and a location projection used at above-mentioned partition, the above-mentioned fastening above-mentioned retention mechanism that is configured for the foregoing circuit substrate is fixed in above-mentioned partition with projection, above-mentioned location is used for the foregoing circuit substrate is positioned with projection, and, be formed with the fastener hole that inserts for above-mentioned fastening projection and the positioning hole that inserts for above-mentioned location projection at the foregoing circuit substrate, what above-mentioned drive integrated circult was disposed at the foregoing circuit substrate fasteningly is positioned at the face of an opposite side with projection and above-mentioned location with respect to above-mentioned with projection, and is disposed at above-mentioned fastening with between projection and the above-mentioned connector.
In this case, comparatively it is desirable to, above-mentioned gate vestiges is located on above-mentioned central axial direction than foregoing circuit substrate more by the position of a plurality of above-mentioned drive coil one sides, and above-mentioned wiring pattern is located at the real estate with the opposite side of a plurality of above-mentioned drive coils of being positioned in the foregoing circuit substrate.Like this, when using mould that resin seal member is carried out moulding, cast gate is formed in an opposite side of real estate, and resin injects from a side opposite with real estate.Therefore, can prevent from or suppress because of the resin that injects the wiring pattern of being located at circuit substrate being stripped from.
In the present invention, peel off from circuit substrate in order to suppress drive integrated circult, comparatively it is desirable to, above-mentioned gate vestiges occurs in a position, when observing from above-mentioned central axial direction, above-mentioned gate vestiges, above-mentioned retention mechanism, above-mentioned central axis, above-mentioned drive integrated circult and above-mentioned connector are positioned on the straight line.In this case, comparatively it is desirable to, each above-mentioned drive coil comprises the bobbin that is wound with above-mentioned winding wire, above-mentioned bobbin is formed by the insulative resin material, and comprise above-mentioned cylinder section, be formed at the lip part of inboard of above-mentioned cylinder section both sides and the lip part in the outside, and for the fixing terminal pins fixing part of above-mentioned terminal pins, above-mentioned terminal pins fixing part is with respect to being configured in the lip part of being located at the above-mentioned inboard of above-mentioned bobbin with the above-mentioned drive coil of the overlapping position of above-mentioned connector, and above-mentioned terminal pins fixing part is with respect to being configured in the lip part of being located at the above-mentioned outside of above-mentioned bobbin with the above-mentioned drive coil of the nonoverlapping position of above-mentioned connector.If the employing said structure, then connector is in the position away from cast gate, in addition, is positioned at the terminal pins supporting of lip part that near the cast gate circuit substrate is located at the outside of bobbin, therefore, can suppress to make the circuit substrate deflection because of the resin that injects.
In this case, comparatively it is desirable to, the plane shape of observing from above-mentioned central axial direction of above-mentioned drive integrated circult is rectangular, and long side direction and the imaginary line quadrature that above-mentioned gate vestiges, above-mentioned retention mechanism, above-mentioned central axis, above-mentioned drive integrated circult and above-mentioned connector are connected.Like this, when resin seal member is carried out moulding, can shorten the length of drive integrated circult on the direction of the easy deflection of circuit substrate.Therefore, can prevent that drive integrated circult is from strippable substrate or damage.
In the present invention, comparatively it is desirable to, each drive coil comprises the bobbin that is wound with above-mentioned winding wire, and the part between above-mentioned bobbin and above-mentioned terminal pins of the end portion of the above-mentioned winding wire of each drive coil is in lax state.Like this, when resin seal member is carried out moulding, can prevent from or suppress cutting off the end portion of winding wire because of the resin that injects.
Then, the feature of the manufacture method of said pump device of the present invention is, above-mentioned connector is fixed in the foregoing circuit substrate, and said stator and foregoing circuit substrate be fixed in above-mentioned partition, said stator and circuit substrate are disposed in the mould, and utilize mould to keep in the outer peripheral edge portion of above-mentioned partition and the above-mentioned connector from foregoing circuit substrate side-prominent connector connection part outwardly, with resin from than foregoing circuit substrate more by above-mentioned radially the outside and inject above-mentioned mould than the position of the more close above-mentioned retention mechanism of above-mentioned connector, with above-mentioned resin seal member moulding.
According to the present invention, when using mould that resin seal member is carried out moulding, therefore resin, can be suppressed to make the circuit substrate deflection because of the resin of injection by near the injection from the retention mechanism that circuit substrate and partition is fastening.
According to the present invention, can guarantee at circuit substrate the large space of configurable drive integrated circult etc.
Description of drawings
Fig. 1 is the sectional view of the pump-unit of embodiment of the present invention.
Fig. 2 is the stereogram of partition, stator, circuit substrate and connector.
Fig. 3 is the exploded perspective view of partition and stator.
Fig. 4 is the worm's eye view from beneath partition, stator, circuit substrate and connector.
Fig. 5 is the sectional view of partition, stator, circuit substrate and connector.
(symbol description)
1 pump-unit
3 rotors
4,4 (1)～4 (12) drive coils
5 stators
6 drive circuits
7 circuit substrates
The 7a real estate
8 impellers
9 connectors
15 pump chambers
18 partitions
19 resin seal member
33 bobbins
34 winding wires
35 terminal pins
40 drive integrated circults
43 wiring patterns
43c connector connecting pad
47,47 (1)～47 (12) terminal pins through hole (through hole)
49 retention mechanisms
52 connector fixed mechanisms
53 connector fixed holes (circuit substrate side fixing part)
55 bonder terminals
56 is fixing with hook portion (connector side fixing part)
70 gate vestiges
The L central axis
The L1 imaginary line
Embodiment
Below, with reference to accompanying drawing, the pump-unit of embodiment of the present invention is described.
(overall structure)
Fig. 1 is the sectional view of the pump-unit 1 of embodiment of the present invention.In the following description, the upside (Z1 direction side) of Fig. 1 is made as " on " side, the downside (Z2 direction side) of Fig. 1 is made as the D score side.
The pump-unit 1 of present embodiment is the pump that is called as the canned pump formula, and it has: the rotor 3 that comprises magnet 2; The stator 5 that comprises a plurality of drive coils 4 that are configured to ring-type; And comprise for the circuit substrate 7 to the drive circuit 6 controlled towards the power supply of a plurality of drive coils 4.At rotor 3 impeller 8 is installed, is equipped with for the connector 9 that electric power is supplied to drive circuit 6 from the outside at circuit substrate 7.Impeller 8, rotor 3, stator 5 and circuit substrate 7 are disposed at the inboard of housing 11, and the conduct of connector 9 is exposed from housing 11 with the connector connection part 9a of the outside joint that is connected.Housing 11 comprises shell 12 and the upper shell 13 that the top of shell 12 is covered, and shell 12 and upper shell 13 are by screw 14 fixed to one another being in the same place.
Be formed with the sucting 13a of fluid and the discharge portion 13b of fluid at upper shell 13.Be formed with pump chamber 15 between shell 12 and upper shell 13, this pump chamber 15 flows through towards discharge portion 13b for the fluid that sucks from sucting 13a.Anastomosis part between shell 12 and upper shell 13 disposes the sealing component (O shape ring) 16 be used to the sealing of guaranteeing pump chamber 15.Shell 12 comprises partition 18 and be fixed in the resin seal member 19 of partition 18 under the state that the lower surface of partition 18 and side are covered.Partition 18 comprises: be set as the annular wall section 20 coaxial with axis L; The discoid tabular wall section 21 that the lower end of annular wall section 20 is stopped up; And the partition lip part 22 that enlarges towards radial outside from the upper end part of annular wall section 20, the top of partition lip part 22 forms pump chamber 15.Partition 18 will be separated between pump chamber 15, impeller 8 and rotor 3 and stator 5 and the circuit substrate 7.
When powering towards a plurality of drive coils 4 via drive circuit 6, rotor 3 rotates around axis L.Make by this impeller 8 when pump chamber 15 interior rotation, fluid is inhaled into pump chamber 15 from sucting 13a, and discharges from discharge portion 13b.
(rotor)
As shown in Figure 1, rotor 3 comprises magnet 2, sleeve 24 and the retaining member 25 that magnet 2 and sleeve 24 are kept.The lip part 27 that retaining member 25 comprises a section 26 and radially enlarges above cylinder section 26, impeller 8 is fixed in lip part 27.Magnet 2 is fixed in the outer circumferential side of a section 26.Sleeve 24 is cylindric, and is fixed in interior all sides of a section 26.
(stator)
Fig. 2 is the stereogram of partition 18, stator 5, circuit substrate 7 and connector 9.Fig. 3 is the exploded perspective view of partition 18 and stator 5.Such as Fig. 1, shown in Figure 3, stator 5 comprises: be configured to circular a plurality of drive coils 4; And the stator core 30 that above-mentioned a plurality of drive coils 4 are supported.Such as Fig. 2, shown in Figure 3, in this example, stator 5 comprises 12 drive coils 4 (1)～4 (12).Stator 5 is installed on the outer circumferential side of the annular wall section 20 of partition 18, a plurality of drive coils 4 (1)～4 (12) across annular wall section 20 diametrically with the magnet 2 relative (with reference to Fig. 1) of rotor 3.
Each drive coil 4 comprises: bobbin 33; Be wound in the winding wire 34 of bobbin 33; And the pair of terminal pin 35 that is wound with the end portion of winding wire 34.Bobbin 33 is formed by insulating properties materials such as resins, and it comprises: axis is towards radially cylinder section 36; From the both sides of the axial direction of cylinder section 36 at the lip part 37 of the paired inboard that the direction with the axis quadrature enlarges and the lip part 37 in the outside; And the terminal pins fixing part 38 of lower portion of lip part 37 of being located at axial direction one side of a section 36.Terminal pins fixing part 38 is radially outstanding from the lip part 37 of a side.
Winding wire 34 is wound in the outer circumferential side of a section 36 between the lip part 37 in paired medial flange section 37 and the outside.Pair of terminal pin 35 is pressed into the fixed hole 38a that is located at terminal pins fixing part 38, and outstanding in the axis L direction.Twining the end portion of winding wire 34 in terminal pins 35.The part of the end portion of winding wire 34 between bobbin 33 and terminal pins 35 is in lax state.The cylinder section 36 of bobbin 33 is sheathed on salient pole 32 from inboard radially, so that each drive coil 4 is supported on stator core 30.Consequently, winding wire 34 is in the state that is wound in salient pole 32 by bobbin 33.
Herein, a plurality of drive coils 4 (1)～4 (12) are respectively mutually the same shape, but when observing from the axis L direction, be disposed at three drive coils 4 (1)～4 (3) of the overlapping position of connector 9 towards the cover set direction of salient pole 32 and the sheathed opposite direction towards salient pole 32 of other nine drive coils 4 (4)～4 (12).That is, three drive coils 4 (1)～4 (3) are sheathed on salient pole 32 terminal pins fixing part 38 is positioned under the state of radially inner side, and make the lip part 37 and annulus section 31 butts that does not form terminal pins fixing part 38 1 sides.Therefore, the lip part 37 of three drive coils 4 (1)～4 (3) in the inboard that is disposed at radially inner side with respect to connector 9 disposes terminal pins fixing part 38.In addition, all the other nine drive coils 4 (4)～4 (12) are sheathed on salient pole 32 terminal pins fixing part 38 is positioned under the state of radial outside, and make the lip part 37 and annulus section 31 butts that is formed with terminal pins fixing part 38 1 sides.That is, the lip part 37 in the outside that is disposed at radial outside disposes terminal pins fixing part 38.As shown in Figure 2, in nine drive coils 4 (4)～4 (12), make the upper-end surface 38b (by the face of stator core 30 1 sides) of the terminal pins fixing part 38 of bobbin 33 and the lower end surface 31a butt of the annulus section 31 of stator core 30.
(circuit substrate)
Fig. 4 is the worm's eye view of beneath partition 18, stator 5, circuit substrate 7 and connector 9 from the axis L direction.Circuit substrate 7 is firm substrates of rigidity, is on the whole the plane shape of circular.Circuit substrate 7 with the state of axis L direction quadrature under be disposed at when observing from the axis L direction and position that a plurality of drive coil 4 (1)～4 (12) is overlapping.Circuit substrate 7 is double-sided substrates that the wiring pattern 43 of drive circuit 6 is formed at the two sides.
As shown in Figure 4, drive circuit 6 comprises: be used for the drive integrated circult 40 to controlling towards the power supply of a plurality of drive coils 4 (1)～4 (12); The Hall element (electronic component) 41 that rotor 3 is detected around the angle of swing of axis L according to the magnetic force of magnet 2; And resistance 42, be equiped with these members at circuit substrate 7.
Such as Fig. 2, shown in Figure 4, circuit substrate 7 comprises the first notch part 45 that is cut out breach (otch) by straight line shape in the part of its periphery.In addition, also comprise the second notch part 46 that is cut out breach by straight line shape being positioned at across axis L with the part of the first notch part 45 opposite sides.The first notch part 45 and the second notch part 46 are used for the location when circuit substrate 7 forms wiring patterns 43 etc.Perhaps, the first notch part 45 and the second notch part 46 are for the location when the electronic parts and components with drive circuit 6 are installed in circuit substrate 7.In addition, as shown in Figure 4, be formed with a plurality of terminal pins through hole (through hole) 47 at circuit substrate 7, a plurality of Hall elements through hole 48, fastener hole 50, two positioning holes 51 and two connector fixed holes 53, wherein, above-mentioned a plurality of terminal pins runs through with the terminal pins 35 of through hole 47 for each drive coil 4, above-mentioned a plurality of Hall element runs through with the terminal of through hole 48 for Hall element 41, above-mentioned fastener hole 50 consists of the retention mechanism 49 that circuit substrate 7 is fixed in partition 18, above-mentioned two positioning holes 51 are used for circuit substrate 7 is positioned partition 18, and above-mentioned two connector fixed holes 53 are configured for the connector fixed mechanism 52 of fixed connector 9.The terminal of each terminal pins 35 and Hall element 41 is in the state that runs through circuit substrate 7 via terminal pins with through hole 47 and Hall element with through hole 48, the terminal that is wound in the end portion of winding wire 34 of each terminal pins 35 and Hall element 41 by soldering on the wiring pattern 43 that is positioned at the real estate of each drive coil 4 opposite sides.
As shown in Figure 4, the winding wire as the attachment portion that is connected with the end portion of each drive coil 4 is formed at the edge of opening that each terminal pins is used through hole 47 with pad 43a in the wiring pattern 43.In addition, the Hall element as the attachment portion that is connected with the terminal of Hall element 41 is formed at the edge of opening that Hall element is used through hole 48 with pad 43b in the wiring pattern 43.In addition, in the wiring pattern 43 as the connector connecting pad 43c of the attachment portion that is connected with connector 9 on the real estate 7a of the downside of circuit substrate 7 from the edge section of the first notch part 45 along with the direction extension of breach quadrature.As shown in Figure 2, connector fixed hole 53 is located at the circumferential both sides of connector connecting pad 43c.Herein, connector 9 comprises the bonder terminal 55 that extends abreast with circuit substrate 7 and is located at the fixing hook portion 56 of using that is positioned at the position of bonder terminal 55 both sides circumferential below circuit substrate 7, by with bonder terminal 55 on the real estate 7a of the downside of circuit substrate 7 soldering in connector connecting pad 43c, and will fix with hook portion 56 embedding connector fixed holes 53, thereby connector 9 is installed on circuit substrate 7.That is, the fixing connector fixed mechanism 52 that connector 9 is fixed in circuit substrate 7 with hook portion 56 and connector fixed hole 53 formations.
As shown in Figure 4, be formed at a plurality of terminal pins of circuit substrate 7 with in the through hole 47, terminal pins is formed at the inboard of connector connecting pad 43c with through hole 47 (1)～47 (3), this terminal pins runs through for the terminal pins 35 that is disposed at when the axis L direction is observed with three drive coils 4 (1)～4 (3) of the overlapping position of connector 9 with through hole 47 (1)～47 (3).Each terminal pins 35 of three drive coils 4 (1)～4 (3) respectively penetrating terminal pin is extended with through hole 47 (1)～47 (3) and towards the below.Be wound in each terminal pins 35 winding wire 34 end portion be located at the winding wire of each terminal pins with the edge of opening of through hole 47 (1)～47 (3) and be connected with pad 43a.
The terminal pins through hole 47 (4)～47 (12) that runs through for the terminal pins 35 of nine drive coils 4 (4)～4 (12) except three drive coils 4 (1)～4 (3) is formed at the outer peripheral edge portion of circuit substrate 7, and upwards arranges in week along outer periphery.These terminal pins of being located at the outer peripheral edge portion of circuit substrate 7 cut out circuit substrate 7 breach and form from outer circumferential side with through hole 47 (4)～47 (12), and towards the periphery side opening.Each terminal pins 35 of nine drive coils 4 (4)～4 (12) runs through respectively these terminal pins and extends with through hole 47 (4)～47 (12) and towards the below.Be wound in each terminal pins 35 winding wire 34 end portion be located at the winding wire of each terminal pins with the edge of opening of through hole 47 (4)～47 (12) and be connected with pad 43a.
Herein, drive coil 4 (1), drive coil 4 (4), drive coil 4 (7) and drive coil 4 (10) utilize wiring pattern 43 to be electrically connected, and consist of U phase, V phase, the W for example U phase in mutually.Drive coil 4 (2), drive coil 4 (5), drive coil 4 (8) and drive coil 4 (11) utilize wiring pattern 43 to be electrically connected, and consist of U phase, V phase, the W for example V phase in mutually.Drive coil 4 (3), drive coil 4 (6), drive coil 4 (9) and drive coil 4 (12) utilize wiring pattern 43 to be electrically connected, and consist of U phase, V phase, the W for example W phase in mutually.Therefore, three drive coils 4 (1)～4 (3) that are disposed at when the axis L direction is observed with the overlapping position of connector 9 become respectively out of phase drive coil.
Be formed with Hall element with through hole 48 in the terminal pins that is formed at radially inner side with the circumferential side of through hole 47 (1)～47 (3).Be equiped with resistance 42 in terminal pins with the circumferential opposite side of through hole 47 (1)～47 (3).As shown in Figure 2, Hall element 41 is disposed at the annular wall section 20 of partition 18 in the mode near the annular wall section 20 of partition 18 for the magnetic force to the magnet 2 of the inboard that is positioned at annular wall section 20 detects.The terminal of Hall element 41 runs through Hall element and extends with through hole 48 and towards the below, terminal be located at the Hall element of Hall element with the edge of opening of through hole 48 and be connected with pad 43b.
Plane shape is arranged is rectangular drive integrated circult 40 in the position configuration on the bobbin thread L of being arranged on the lower surface of circuit substrate 7.Drive integrated circult 40 is disposed at the space that terminal pins is used the inboard of through hole 47 (1)～47 (12) in circuit substrate 7.As shown in Figure 2, on circuit substrate 7, between the second notch part 46 and drive integrated circult 40 and towards radial outside, be provided with fastener hole 50 away from the position of middle bobbin thread L.Fastener hole 50 is positioned at drive coil 4 (8) one sides away from connector 9 in the inboard of a plurality of drive coils 4 (1)～4 (12) that are configured to ring-type.In addition, as shown in Figure 2, between the first notch part 45 and axis L, be formed with two positioning holes 51.Herein, the center of fastener hole 50, drive integrated circult 40, axis L and connector 9 are positioned on the straight line, and drive integrated circult 40 is configured to the imaginary line L1 quadrature that its long side direction is connected with center, drive integrated circult 40, axis L and connector 9 with fastener hole 50.Terminal 40a, the 40b of drive integrated circult 40 is located at respectively a pair of side relative on the short side direction of this drive integrated circult 40, and the terminal 40a that is located at the side relative with connector 9 utilizes wiring pattern 43 to be electrically connected with bonder terminal 55.When two positioning holes 51 are observed from the axis L direction and drive integrated circult 40 overlapping, and be formed at respectively the both sides of imaginary line L1.
(shell)
Fig. 5 is the sectional view of partition 18, stator 5, circuit substrate 7 and connector 9.Such as Fig. 2, Fig. 3, shown in Figure 5, be formed with for one that circuit substrate 7 is fixed in partition 18 fastening with projection 60 be used for two location that circuit substrate 7 is positioned with projections 61 at the lower surface of the tabular wall section 21 of partition 18.Fasteningly be formed at the position corresponding with the fastener hole 50 of circuit substrate 7 with projection 60 at the lower surface of tabular wall section 21, the location is formed at the position corresponding with positioning hole 51 with projection 61 at the lower surface of tabular wall section 21.
Such as Fig. 3, shown in Figure 5, be formed with circular stepped part 60a at fastening fore-end with projection 60, with in the projection 60, the forward end of circular stepped part 60a becomes the diameter path part 60b less than the diameter of the terminal side of circular stepped part 60a fastening.The height dimension of path part 60b is less than the thickness size of circuit substrate 7, is formed with tapped hole 60c at the front-end face of path part 60b.In addition, as shown in Figure 3, the fore-end in the location with projection 61 is formed with circular stepped part 61a, and the forward end of circular stepped part 61a becomes the diameter path part 61b less than the diameter of the terminal side of circular stepped part 61a.The location is less than the thickness size of circuit substrate 7 with the height dimension of the path part 61b of projection 61.Therefore, under the state that the positioning hole 51 that will locate the path part 61b insertion circuit substrate 7 of using projection 61 is located, the location is that the front end of path part 61b can not be positioned at than positioning hole 51 position of side more on the lower with the front end of projection 61, namely can not project to the outside of circuit substrate 7, thereby, even if the position of the positioning hole 51 of circuit substrate 7 is located in the configuring area of drive integrated circult 40 of large as a comparison components and parts, also can not hinder the configuration of the drive integrated circult 40 of the lower surface of being located at circuit substrate 7.
Herein, as shown in Figure 5, circuit substrate 7 is in fastening path part 60b with projection 60 and inserts fastener hole 50 and locate the state that inserts positioning hole 51 with the path part 61b of projection 61, and utilizing tap bolt 63 to be anchored on partition 18, this tap bolt 63 screws in tapped hole 60c from the real estate 7a side that is formed with wiring pattern 43 across packing ring 62.That is, fasteningly consist of the retention mechanism 49 that circuit substrate 7 is fixed in partition 18 with projection 60, packing ring 62 and tap bolt 63 with fastener hole 50.Be fixed at circuit substrate 7 under the state of partition 18, fixing base 7 bobbin thread L direction in the edge is in across the position of certain intervals with respect to the lower surface of tabular wall section 21 and is oriented to the posture parallel with tabular wall section 21 and around the state of axis L location.
Such as Fig. 3 and shown in Figure 5, be formed with pod (positioning part) 64 at the circular outer periphery face of the annular wall section 20 of partition 18.Each pod 64 is at the upwardly extending square groove of upper and lower, is to remove and form with the part of its backup plate shape wall section 21 1 sides and by the part of partition lip part 22 1 sides.In addition, a plurality of pods 64 are formed on annular wall section 20 all-round with the equal angles interval.Be protuberance 65 between a plurality of pods 64.
Herein, as shown in Figure 5, under the state of stator core 30 supporting drive coils 4, salient pole 32 comprises the projection 32a that gives prominence to towards radially inner side from the cylinder section 36 of bobbin 33, and stator core 30 is supported under the state that is positioned partition 18 by this projection 32a is embedded pod 64 from the below.That is, pod 64 can be chimeric with the projection 32a of salient pole 32, by embedding projection 32a in chimeric mode, stator 5 is positioned partition 18 around axis L.In addition, the inner peripheral surface part 64a butt of the upper end by making projection 32a and pod 64 is positioned stator 5 for partition 18 in the axis L direction.Be positioned at stator 5 under the state of partition 18, be located at the terminal pins fixing part 38 of lower flange 37 overlapping with inner peripheral surface part 64a on the axis L direction, the circumferential two end portions of its upper-end surface 38b is in the state with lower end surface part 65a (with reference to Fig. 3) butt of protuberance 65, wherein, above-mentioned lip part 37 refers to be configured in the lip part that is positioned at radially inner side 37 with three drive coils (1)～4 (3) of the overlapping position of connector 9 when the axis L direction is observed.In addition, be configured in the lip part that is positioned at radially inner side 37 with nine drive coils 4 (4)～4 (12) of connector 9 nonoverlapping positions and be in state with the circular-arc outer circumferential face part butt of lip part 65.
In order to avoid they are subject to the impact of fluid, it is made of resins such as unsaturated polyester resins resin seal member 19 for the protection of drive coil 4 and circuit substrate 7.Resin seal member 19 is by resin injection to the partition 18 that is under the state that is fixed with stator 5 and circuit substrate 7 is formed.In addition, resin seal member 19 covers drive coil 4 and circuit substrate 7 fully, and will be in connector 9 from circuit substrate 7 outwardly the part of the connector 9 the side-prominent connector connection part 9a cover.
When resin seal member 19 is carried out molding and forming, connector 9 is fixed in circuit substrate 7, and circuit substrate 7 and stator 5 are fixed in partition 18.Then, utilizing mould (not shown) to keep under the state of connector connection part 9a of the outer peripheral edge portion 22a (with reference to Fig. 5) of partition lip part 22 and connector 9 stator 5 and circuit substrate 7 being configured in the mould.Then, by resin is injected mould and makes it solidify to form resin seal member 19 from a cast gate being located at mould.
Herein, cast gate is located at than circuit substrate 7 more by radially the outside and than the position of connector 9 more close fastener holes 50.In addition, cast gate is located at the outer circumferential side of drive coil 4.Consequently, such as Fig. 1, shown in Figure 5, in resin seal member 19, be formed with gate vestiges 70 at the outer circumferential side that is positioned at drive coil 4 and than the position of connector 9 more close fastener holes 50.In this example, the center of gate vestiges 70, fastener hole 50, axis L, drive integrated circult 40 and connector 9 are positioned on the straight line.
(action effect)
According to this example, be located at towards the position of radial outside away from axis L for the retention mechanism 49 that circuit substrate 7 is fixed in partition 18.Therefore, situation about being located on the axis L with retention mechanism 49 compares, and can guarantee large space at circuit substrate 7.Therefore, the easy as a comparison drive integrated circult 40 of large components and parts is disposed at circuit substrate 7.In addition, when when circuit substrate 7 forms the wiring pattern 43 of drive circuit 6, can improve the design freedom of wiring pattern 43.
In addition, according to this example, retention mechanism 49 is located at across axis L and is positioned at position with connector 9 opposite sides, therefore, can guarantee large space in the part near connector 9, and can suppress the loss of electric power.
In addition, according to this example, connector 9 comprises the bonder terminal 55 that extends abreast with circuit substrate 7, this bonder terminal 55 by soldering on connector connecting pad 43c.Therefore, the attachment portion between bonder terminal 55 and connector connecting pad 43c is elongated, can improve the adhesive strength of soldering.In addition, connector 9 is installed on circuit substrate 7 with hook portion 56 with engaging of the connector fixed hole 53 of being located at substrate by being located at the fixing of connector 9.Therefore, fixedly the becoming firmly of 7 of connector 9 and circuit substrates, even if utilize mould to keep the connector connection part 9a of connector 9 with resin seal member 19 moulding the time, connector 9 also can not break away from from circuit substrate 7.
Then, in this example, when using mould that resin seal member 19 is carried out moulding, resin is by from more injecting by radial outside and than a side of connector 9 more close retention mechanisms 49 than circuit substrate 7.In addition, when observing from the axis L direction, center, axis L and the connector 9 of cast gate (gate vestiges 70), fastener hole 50 are positioned on the straight line.Therefore, can suppress to make because of the resin that injects the situation of circuit substrate 7 deflections.In addition, resin is by from more injecting by a side of drive coil 4 than circuit substrate 7 on the axis L direction, and the wiring pattern 43 of drive circuit 6 is located at the real estate 7a with the downside of a plurality of drive coil 4 (1)～4 (12) opposite sides in circuit substrate 7.Therefore, when using mould that resin seal member 19 is carried out moulding, can prevent from or suppress peeling off because the resin that injects makes the wiring pattern 43 of being located at circuit substrate 7.
In addition, the imaginary line L1 quadrature that the long side direction of drive integrated circult 40 is connected with center, axis L and connector 9 with cast gate (gate vestiges 70), fastener hole 50, therefore, when resin seal member 19 was carried out moulding, the length of drive integrated circult 40 on the direction of circuit substrate 7 deflections was shorter.Consequently, can prevent that drive integrated circult 40 from peeling off or damaging from substrate.
In addition, the end portion of the winding wire 34 of each drive coil 4 is wound in terminal pins 35 under lax state, therefore, when resin seal member 19 is carried out moulding, can prevent from or suppress cutting off because of the resin that injects the end portion of winding wire 34.
(other mode of execution)
In addition, in above-mentioned example, the magnet 2 of rotor 3 is disposed at the inboard of a plurality of drive coils 4 (1)～4 (12) that are configured to ring-type, uses the present invention but also can be disposed in the magnet 2 of rotor 3 in the pump-unit 1 of structure (external rotor) in the outside of a plurality of drive coils 4 (1)～4 (12) that are configured to ring-type.
In addition, in above-mentioned example, the retention mechanism 49 that is used for circuit substrate 7 is fixed in partition 18 by fastener hole 50, fasteningly consist of with projection 60, tap bolt 63, but retention mechanism 49 also can by be pressed into, the method such as riveted joint is fixed in partition 18 with circuit substrate 7.
In addition, in above-mentioned example, the cast gate of resin by injection is a place in mould, but also can come resin seal member 19 is carried out moulding with the mould that comprises a plurality of cast gates.In this case, if at least one cast gate is located at than circuit substrate 7 more by radial outside and than the position of connector 9 more close fastener holes 50, then can suppress circuit substrate 7 deflection when resin seal member 19 moulding.
Claims (18)
1. a pump-unit is characterized in that, comprising:
Rotor, this rotor is equipped with impeller;
Stator, this stator comprise a plurality of drive coils that are configured to ring-type;
Circuit substrate, this circuit substrate comprises for the drive circuit to controlling towards the power supply of a plurality of described drive coils, and when observing from the central axial direction of a plurality of described drive coils and the overlapping position of a plurality of described drive coil be configured to state with described central axial direction quadrature; And
The pump chamber that partition, this partition will dispose described impeller separates with described circuit substrate and described divided stator, and is fixed with described circuit substrate and described stator,
Each drive coil is included under the state of the end portion that is wound with winding wire along the outstanding terminal pins of described central axial direction,
Described circuit substrate has: a plurality of through holes that the described terminal pins of each drive coil of confession runs through; And the wiring pattern of the described drive circuit that is electrically connected with the end portion of described winding wire,
The retention mechanism that described circuit substrate and described partition is fastening is located at the position from described central axis towards radially outside skew.
2. pump-unit as claimed in claim 1 is characterized in that,
Described drive circuit comprises for the drive integrated circult to controlling towards the power supply of a plurality of described drive coils,
Described drive integrated circult is disposed on the described central axis of described circuit substrate.
3. pump-unit as claimed in claim 2 is characterized in that,
Be formed with fastening projection and a location projection used at described partition, the described fastening described retention mechanism that is configured for described circuit substrate is fixed in described partition with projection, described location is used for described circuit substrate is positioned with projection, and, be formed with the fastener hole that inserts for described fastening projection and the positioning hole that inserts for described location projection at described circuit substrate
Does not give prominence in the outside from described positioning hole towards described circuit substrate with the front end of projection described location.
4. pump-unit as claimed in claim 3 is characterized in that,
What described drive integrated circult was disposed at described circuit substrate is positioned at the face of an opposite side with respect to described location with projection, described location is used for described circuit substrate is positioned with projection.
5. pump-unit as claimed in claim 2 is characterized in that,
Described pump-unit has for will being supplied to from the electric power of outside the connector of described drive circuit,
Described connector is electrically connected with described wiring pattern under the state of the outer peripheral edge portion that is fixed in described circuit substrate, this outer peripheral edge portion be described circuit substrate be positioned at the part of a side opposite to described retention mechanism across described central axis.
6. pump-unit as claimed in claim 5 is characterized in that,
Described pump-unit comprises resin seal member, and this resin seal member is fixed under the state that the part of described stator, described circuit substrate and described connector is covered and is positioned at the face of an opposite side with respect to described pump chamber in the described partition.
7. pump-unit as claimed in claim 6 is characterized in that,
Described connector comprises the bonder terminal that extends abreast with described circuit substrate,
Described wiring pattern comprises that in the outer peripheral edge portion of described circuit substrate soldering has the connector connecting pad of described bonder terminal.
8. pump-unit as claimed in claim 7 is characterized in that,
Described pump-unit comprises for the connector fixed mechanism that described connector is fixed in described circuit substrate,
Described connector fixed mechanism comprises circuit substrate side fixing part and connector side fixing part, wherein, described circuit substrate side fixing part is located at the position of the circumferential both sides that are positioned at described connector connecting pad on the described circuit substrate, and described connector side fixing part is located at the position of the circumferential both sides that are positioned at described bonder terminal on the described connector.
9. such as each described pump-unit in the claim 6 to 8, it is characterized in that,
The gate vestiges of described resin seal member be positioned at than described circuit substrate more by described radially the outside and than the position of the more close described retention mechanism of described connector.
10. pump-unit as claimed in claim 9 is characterized in that,
Described gate vestiges is located at the position of more leaning on a plurality of described drive coil one sides on described central axial direction than described circuit substrate,
Described wiring pattern is located at the real estate with the opposite side of a plurality of described drive coils of being positioned in the described circuit substrate.
11. pump-unit as claimed in claim 10 is characterized in that,
Described gate vestiges occurs in a position,
When observing from described central axial direction, described gate vestiges, described retention mechanism, described central axis, described drive integrated circult and described connector are positioned on the straight line.
12. pump-unit as claimed in claim 11 is characterized in that,
Each described drive coil comprises the bobbin that is wound with described winding wire,
Described bobbin is formed by the insulative resin material, and comprises described cylinder section, is formed at the lip part in the lip part of inboard of described cylinder section both sides and the outside and for the fixing terminal pins fixing part of described terminal pins,
Described terminal pins fixing part is with respect to being configured in the lip part of being located at the described inboard of described bobbin with the described drive coil of the overlapping position of described connector,
Described terminal pins fixing part is with respect to being configured in the lip part of being located at the described outside of described bobbin with the described drive coil of the nonoverlapping position of described connector.
13. pump-unit as claimed in claim 9 is characterized in that,
Described gate vestiges occurs in a position,
When observing from described central axial direction, described gate vestiges, described retention mechanism, described central axis, described drive integrated circult and described connector are positioned on the straight line.
14. pump-unit as claimed in claim 13 is characterized in that,
The plane shape of observing from described central axial direction of described drive integrated circult is rectangular, and long side direction and the imaginary line quadrature that described gate vestiges, described retention mechanism, described central axis, described drive integrated circult and described connector are connected.
15. pump-unit as claimed in claim 9 is characterized in that,
Each drive coil comprises the bobbin that is wound with described winding wire,
The part between described bobbin and described terminal pins of the end portion of the described winding wire of each drive coil is in lax state.
16. pump-unit as claimed in claim 9 is characterized in that,
Be formed with fastening projection and a location projection used at described partition, the described fastening described retention mechanism that is configured for described circuit substrate is fixed in described partition with projection, described location is used for described circuit substrate is positioned with projection, and, be formed with the fastener hole that inserts for described fastening projection and the positioning hole that inserts for described location projection at described circuit substrate
What described drive integrated circult was disposed at described circuit substrate fasteningly is positioned at the face of an opposite side with projection and described location with respect to described with projection, and is disposed at described fastening with between projection and the described connector.
17. the manufacture method of a pump-unit claimed in claim 6 is characterized in that,
Described connector is fixed in described circuit substrate, and described stator and described circuit substrate is fixed in described partition,
Utilize mould to keep in the outer peripheral edge portion of described partition and the described connector from described circuit substrate side-prominent connector connection part outwardly, and under this state, described stator and circuit substrate be disposed in the mould,
With resin from than described circuit substrate more by described radially the outside and inject described mould than the position of the more close described retention mechanism of described connector, with described resin seal member moulding.
18. the manufacture method of pump-unit as claimed in claim 17 is characterized in that,
When observing the cast gate of the described resin injection of confession of being located at described mould from described central axial direction, described cast gate, described retention mechanism, described central axis, described drive integrated circult and described connector are positioned on the straight line.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012071097A JP6129478B2 (en) | 2012-03-27 | 2012-03-27 | Pump device and method of manufacturing pump device |
| JP2012-071097 | 2012-03-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103362827A true CN103362827A (en) | 2013-10-23 |
| CN103362827B CN103362827B (en) | 2015-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310101035.XA Expired - Fee Related CN103362827B (en) | 2012-03-27 | 2013-03-26 | The manufacture method of pump-unit and pump-unit |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6129478B2 (en) |
| CN (1) | CN103362827B (en) |
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| CN106609761A (en) * | 2015-09-30 | 2017-05-03 | 日本电产三协（浙江）有限公司 | Pump device |
| CN107453556A (en) * | 2016-05-30 | 2017-12-08 | 日本电产三协（浙江）有限公司 | Motor |
| TWI722832B (en) * | 2020-03-16 | 2021-03-21 | 建準電機工業股份有限公司 | Liquid cooling system and pump thereof |
| CN113417878A (en) * | 2021-08-03 | 2021-09-21 | 烟台东德实业有限公司 | Stator-encapsulated hydrogen circulating pump and manufacturing method thereof |
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| JP2017025854A (en) * | 2015-07-27 | 2017-02-02 | 日本電産サンキョー株式会社 | Pump device |
| JP6556580B2 (en) | 2015-09-30 | 2019-08-07 | 日本電産サンキョー株式会社 | Motor and motor manufacturing method |
| JP6576773B2 (en) | 2015-09-30 | 2019-09-18 | 日本電産サンキョー株式会社 | Pump device |
| JP7403336B2 (en) | 2020-02-10 | 2023-12-22 | 三菱重工業株式会社 | electric compressor |
| JP2022080962A (en) * | 2020-11-19 | 2022-05-31 | 日本電産サンキョー株式会社 | Pump device |
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Also Published As
| Publication number | Publication date |
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| CN103362827B (en) | 2015-10-28 |
| JP2013204431A (en) | 2013-10-07 |
| JP6129478B2 (en) | 2017-05-17 |
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