CN103358351B - Boring device - Google Patents
Boring device Download PDFInfo
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- CN103358351B CN103358351B CN201310109619.1A CN201310109619A CN103358351B CN 103358351 B CN103358351 B CN 103358351B CN 201310109619 A CN201310109619 A CN 201310109619A CN 103358351 B CN103358351 B CN 103358351B
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- circuit board
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- hole
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Abstract
Boring device of the present invention possesses: image unit (16), is taken the printed circuit board (PCB) as perforate object by through hole; And perforate unit (17), carry out perforate on a printed circuit.On standing part in boring device and pedestal (12), formed to be positioned at and carry out the main through hole (12a) of the processing region of perforate by perforate unit (17) and be positioned at the secondary through hole (12b) removing entrance side of printed circuit board (PCB).Especially when carrying out perforate on less printed circuit board (PCB), via secondary through hole (12b), printed circuit board (PCB) is taken, make based on photographing information printed circuit board (PCB) move to main through hole (12a), and determine the position of carrying out perforate based on the information of carrying out shooting gained at main through hole (12a).
Description
Technical field
The present invention relates to a kind of boring device, specifically, the present invention relates to a kind of boring device of perforate on a printed circuit.
Background technology
In the electronic device, along with IC(integrated circuit, integrated circuit) miniaturization of the surface installation electronic component such as chip, resistance, capacitor, the printed circuit board (PCB) also densification gradually of these parts, complicated is installed.In densification like this, complicated printed circuit board (PCB), for overlapping single-layer printed circuit plate makes respective Wiring pattern consistent and form multilayer board or split by completed one piece of larger printed circuit board (PCB), obtain polylith printed circuit board (PCB), and have the situation being formed datum hole by boring device.
As the boring device of perforate on a printed circuit, there will be a known as lower device: utilize X-ray camera to take the alignment mark formed on a printed circuit, and determine the punch position of printed circuit board (PCB) based on captured image.In the boring device recorded in patent document 1, the platform of mounting printed circuit board (PCB) forms through hole.This boring device, via this through hole, utilizes the alignment mark of X-ray camera to printed circuit board (PCB) to take, and utilizes drill perforate in the position based on photographing information.
[background technology document]
[patent document]
[patent document 1] Japanese Patent Laid-Open 2008-227422 publication
Summary of the invention
[inventing problem to be solved]
In the boring device recorded in patent document 1, the front end of printed circuit board (PCB) is inserted into boring device in the mode forming the position of through hole making the alignment mark of printed circuit board (PCB) and be positioned at platform by operator.Herein, be configured in apart from when moving into mouth position far away at the through hole of platform, if printed circuit board (PCB) is less, so have the position of opening of printed circuit board (PCB) cannot arrive the possibility forming the position of through hole of platform.On the other hand, be configured in apart from when moving into the nearer position of mouth at the through hole of platform, be support larger printed circuit board (PCB), and workbench must be made significantly to stretch out to moving into before mouth.Therefore, larger-scale unit is caused.
The present invention completes in view of above-mentioned actual conditions, its object is to provide a kind of can easily perforate and can the boring device of miniaturization of implement device on the printed circuit board (PCB) of all size.
[technological means of dealing with problems]
In order to reach described object, boring device of the present invention from move into mouth insert printed circuit board (PCB) on perforate; It is characterized in that possessing:
Mounting table, the 1st shooting hole is formed in the processing region of specifying, and the 2nd shooting hole is formed in removes entrance side than described 1st shooting hole closer to described, and described printed circuit board (PCB) is placed in mounting surface;
Image unit, arranges movably and takes described printed circuit board (PCB) via described 1st shooting hole or described 2nd shooting hole;
Transport mechanism, based on the photographing information of being taken via described 2nd shooting hole by described image unit, obtain and load the position of described printed circuit board (PCB), and based on acquired position, the mode entering to described processing region of specifying with the predetermined openings position of described printed circuit board (PCB) moves described printed circuit board (PCB); And
Perforate unit, based on the photographing information of being taken via described 1st shooting hole by described image unit, determine the predetermined openings position of described printed circuit board (PCB), move to the predetermined openings position of determined described printed circuit board (PCB), perforate on the printed circuit board.
And, also can preset and multiplely the described printed circuit board (PCB) of perforate should to be placed in position in mounting table and initial move-in position; And
Described image unit is when selecting the reference mark and the described 2nd of described printed circuit board (PCB) to take the described initial move-in position of overlapping position, hole as described printed circuit board (PCB), first, carry out the shooting of the described printed circuit board (PCB) via described 2nd shooting hole, secondly, carry out the movement of the described printed circuit board (PCB) based on described transport mechanism, then, carry out the shooting of the described printed circuit board (PCB) via described 1st shooting hole, afterwards, the perforate based on described perforate unit is carried out; And
When the initial move-in position of position as described printed circuit board (PCB) selecting described reference mark to be configured on described 1st shooting hole, do not carry out via the described 2nd shooting shooting in hole and the movement based on described transport mechanism, after carrying out the shooting via the described printed circuit board (PCB) in described 1st shooting hole, carry out the perforate based on described perforate unit.
And described image unit also can have: X-ray produces mechanism, to the printed circuit board (PCB) X-ray irradiation be placed in described mounting table; And photographic unit, arrange with producing mechanism's subtend with this X-ray and the transmission picture of the X-ray exposed on described printed circuit board (PCB) is taken.
In this case, described perforate unit also can have: tapping mechanism, forms hole on the printed circuit board; Cover plate (cover plate), with this tapping mechanism subtend to arrange and being contacted with described printed circuit board (PCB) to during described printed circuit board (PCB) perforate; And possess further:
1st travel mechanism, makes the side in described X-ray generation mechanism and described photographic unit and described tapping mechanism move integratedly; And
2nd travel mechanism, makes the opposing party in described X-ray generation mechanism and described photographic unit and described cover plate move integratedly; And
Described tapping mechanism is disposed in described 1st travel mechanism and moves into the farther side of mouth described in the side's distance in described X-ray generation mechanism and described photographic unit; And
Described cover plate is disposed in described 2nd travel mechanism and moves into the nearer side of mouth described in the opposing party's distance in described X-ray generation mechanism and described photographic unit.
And, also can possess and move into mouth described in being configured in and shielding produces the shield assembly of the X-ray of mechanism from described X-ray.
And, also can possess the display module photographing information of taking via described 1st shooting hole and described 2nd shooting hole being shown to operator.
And, also can possess the fixation kit be fixed on by the printed circuit board (PCB) be placed in described mounting table in mounting surface.
[effect of invention]
According to boring device of the present invention, can easily perforate and can the miniaturization of implement device on the printed circuit board (PCB) of all size.
Accompanying drawing explanation
Fig. 1 is the stereogram of the outward appearance of the boring device representing embodiments of the present invention.
Fig. 2 represents from right flank direction (-Y-direction) to observe by the central part of the width (X-direction) of the boring device shown in Fig. 1 side view with the summary of the formation of the boring device section that the face at a right angle with XY plane is parallel.
Fig. 3 is the stereogram representing workbench and image unit, perforate unit.
Fig. 4 is the stereogram representing conveying unit and moving part.
Fig. 5 is the stereogram representing moving part.
Fig. 6 is the stereogram of the position relationship representing image unit and perforate unit.
Fig. 7 is the key diagram of control device.
Fig. 8 is the flow chart of the example representing perforate process.
Fig. 9 is the figure that position alignment is described.
Figure 10 is x-ray bombardment machine and with Fig. 2 corresponding figure of X-ray camera across secondary through hole during subtend.
Figure 11 is x-ray bombardment machine and with Fig. 3 corresponding figure of X-ray camera across secondary through hole during subtend.
Figure 12 is the figure corresponding with Fig. 2 when carrying out perforate via main through hole by perforate unit.
[explanation of symbol]
10 boring devices
11 shells
12 pedestals
13 workbench
14 printed circuit board (PCB) clinchings
15 conveying units
16 image units
17 perforate unit
18 travel mechanisms
Travel mechanism on the upside of 18T
Travel mechanism on the downside of 18D
19 control parts
161 x-ray bombardment machines
162 X-ray cameras
171,172 tapping mechanisms
173 cover plate units
173a, 173b cover plate
Detailed description of the invention
Below, with reference to accompanying drawing, the boring device of embodiments of the present invention is described.The boring device 10 of this embodiment as shown in the formation synoptic diagram of the outside drawing of Fig. 1 or Fig. 2 and Figure 10, possess block inner and outside shell 11, pedestal (mounting table) 12, workbench 13, printed circuit board (PCB) clinching 14, conveying unit 15, image unit 16, perforate unit 17, travel mechanism 18 and control part 19.In the following description, by printing board PCB (PrintCircuit Board), by conveying unit 15, the direction (conveyance direction) of movement is set to X-direction, by vertical with X-direction and the direction of level (width of boring device 10) is set to Y-direction, vertical (short transverse of boring device 10) is set to Z-direction.
The hollow arrow AR of Fig. 1 and Fig. 2 in order to represent operator position and towards.Operator stands in the position of arrow A R, and the direction (positive direction of X-axis) towards arrow A R indication operates boring device 10.Printing board PCB is inserted into boring device 10 by operator, is taken out by printing board PCB after end perforate process in boring device 10.Mouthful 10a that moves into of printing board PCB is covered by X-ray shielding part (shield assembly) 11a of shell 11.X-ray shielding part 11a is formed by the material shielding the X-ray produced by x-ray bombardment machine 161, and-the Z of X-ray shielding part 11a holds (lower end) to be do not hinder the insertion of printing board PCB, the degree of movement, (upper surface) is held to be separated by distance to a declared goal and configuring with+the Z of workbench 13.In-Z the side of X-ray shielding part 11a, such as, be provided with the rubber cutting means enclosure containing lead of short strip shape.The mode that this cutting means enclosure is contacted with the upper surface of workbench 13 with-Z end (lower end) is formed.Therefore, can easily carrying-in/carrying-out printing board PCB, and when can prevent carrying-in/carrying-out printing board PCB, X-ray is externally leaked.
Pedestal 12 is arranged on the inside of shell 11.On pedestal 12, be supported in movably in X-direction in order to the workbench 13 of mounting as the printing board PCB of perforate object.The upper surface of workbench 13 becomes smooth and the mounting surface of level.Pedestal 12 has parallel with the mounting surface of workbench 13 (i.e. level) supporting surface.On this supporting surface, as shown in Figure 3, main through hole (the 1st shooting hole) 12a and secondary through hole (the 2nd shooting hole) 12b is formed successively from apart from moving into a mouthful 10a side far away.
Main through hole 12a is the hole of carrying out the shooting of image unit 16 pairs of printing board PCBs and the perforate of perforate unit 17 pairs of printing board PCBs, and is the elongated hole extended along Y-direction.Secondary through hole 12b is the hole of the shooting carrying out image unit 16 pairs of printing board PCBs, and the hole of 2 general square shape arranged symmetrically for (Y-direction) about the center line relative to supporting surface.
The reason of elongated hole that main through hole 12a is formed as extending along Y-direction is: be for object and carrying out with the gamut of the Y-direction of printing board PCB via the shooting of main through hole 12a and perforate.On the other hand, via the shooting of secondary through hole 12b due to only in order to identify the alignment mark being arranged on bight on printing board PCB, therefore compared with main through hole 12a, the region of necessary opening is limited.Therefore, secondary through hole 12b is the rigidity reducing opening and guarantee pedestal 12, and be formed as each one around through hole but not as the elongated hole of main through hole 12a.When guaranteeing the rigidity of pedestal 12 fully, also secondary through hole 12b can be formed as the elongated hole-shape extended along Y-direction.About via the shooting of main through hole 12a and perforate, details via the shooting of secondary through hole 12b, hereafter carrying out describing.
On workbench 13, form the not shown multiple through holes in order to carry out the shooting based on image unit 16 and the perforate based on perforate unit 17.And, in the mounting surface of workbench 13, form not shown adsorption hole.This adsorption hole is in order to adsorb the printing board PCB be placed on workbench 13.By making to be negative pressure in adsorption hole, and printing board PCB is adsorbed, is fixed on workbench 13.In the following description, by temporarily fixing for being fixedly called of the printing board PCB based on this absorption.
Printed circuit board (PCB) clinching 14 is configured in the+Z side (with reference to Fig. 4, not shown in figure 3) of the main through hole 12a of pedestal 12.Printed circuit board (PCB) clinching 14 is supported in Z-direction movably by the assembly up and down 500 of printed circuit board (PCB) clinching.Add man-hour carrying out perforate to printing board PCB, printed circuit board (PCB) clinching 14 declines thus is pressed by printing board PCB and be fixed on workbench 13.In the following description, by formal fixing for being fixedly called of the printing board PCB based on this printed circuit board (PCB) clinching 14.
Conveying unit 15 is arranged on pedestal 12.Conveying unit 15 as shown in Figure 4, possesses the one group of guide rail 151 extended in X direction and the motor 153 that the not shown ball screw extended in X direction is rotated.Conveying unit 15 makes workbench 13 move along guide rail 151 to X-direction by making ball screw rotate by motor 153.
Image unit 16 is in order to take printing board PCB via main through hole 12a or secondary through hole 12b.Image unit 16 as shown in Figure 2 or Figure 3, comprising: x-ray bombardment machine 161, be configured in pedestal 12+Z side and to printing board PCB X-ray irradiation; And X-ray camera 162, the transmission picture of the X-ray exposed on the printing board PCB of-Z side being configured in pedestal 12 is taken.In the present embodiment, as shown in Fig. 4 or Fig. 5, be provided with 2 image units 16.The x-ray bombardment machine 161 of each image unit 16 and X-ray camera 162 are configured to by following upside travel mechanism 18T and downside travel mechanism 18D and move to X-direction and Y-direction.
Perforate unit 17 as shown in Figure 2 or Figure 3, is configured in+Z the side of pedestal 12, and has: tapping mechanism 171,172, uses instrument (such as drill etc.) to carry out perforate to printing board PCB; And cover plate 173a, 173b, be configured in-Z the side of pedestal 12 and be contacted with printing board PCB.Tapping mechanism 171,172 is moved to Z-direction by not shown actuator.Cover plate 173a, 173b are also moved to Z-direction by not shown actuator.
2 tapping mechanisms 171,172 configure in the X direction side by side.On 2 tapping mechanisms 171,172, such as, the instrument of different-diameter is installed.
Cover plate 173a, 173b produce distortion or burr in order to prevent printing board PCB in tap operation.Cover plate unit 173 is made up of 2 cover plates 173a, the 173b configured side by side in the Y direction.On cover plate 173a, 173b, form the hole of the diameter with the diameter of the instrument be arranged on tapping mechanism 171,172 corresponding respectively.When carrying out perforate, insert the instrument of the tapping mechanism 171,172 in the hole corresponding to cover plate 173a, 173b.
The diameter in the hole of cover plate 173a, 173b is roughly equal with the diameter of corresponding instrument.Therefore, when carrying out the perforate to printing board PCB, cover plate 173a, 173b and instrument come in contact, and thus the diameter in the hole of cover plate 173a, 173b becomes large.If the diameter in the hole of cover plate 173a, 173b is greater than fixing size, be so easy to produce distortion or burr, therefore determine to exchange cover plate 173a, 173b.When exchanging cover plate 173a, 173b, as long as after the state that cover plate 173a, 173b become overlapping with secondary through hole 12b, carry out the exchange of cover plate 173a, 173b via secondary through hole 12b.If like this, cover plate 173a, 173b so can be made through secondary through hole 12b, therefore not make cover plate 173a, 173b disturb workbench 13, just easily can carry out the exchange of cover plate 173a, 173b.
Travel mechanism 18 is as shown in Fig. 4 ~ Fig. 6, there is each 2 of the travel mechanism 18T and downside travel mechanism 18D in upside, on the upside of this, travel mechanism 18T is arranged on the+Z side of pedestal 12, support X ray irradiating machine 161 and tapping mechanism 171,172, and move to X-direction and Y-direction integratedly, on the downside of this, travel mechanism 18D is arranged on the-Z side of pedestal 12, support X ray camera 162 and cover plate 173a, 173b, and moves integratedly.The movement of 2 upside travel mechanism 18T and the movement of 2 downside travel mechanism 18D can be carried out independently of each other.
As shown in Figure 5 or Figure 6, on each upside travel mechanism 18T, x-ray bombardment machine 161 and tapping mechanism 171,172 are arranged side by side successively from-X side.And, on each downside travel mechanism 18D, be arranged side by side cover plate 173a, 173b and X-ray camera 162 successively from-X side.Owing to being this kind of configuration, therefore at x-ray bombardment machine 161 and X-ray camera 162 in vertical during subtend, tapping mechanism 171,172 and cover plate 173a, 173b not subtend, at tapping mechanism 171,172 and cover plate 173a, 173b in vertical during subtend, x-ray bombardment machine 161 and X-ray camera 162 not subtend.Because x-ray bombardment machine 161 is more configured at-X side than tapping mechanism 171,172, therefore+X side is configured at from x-ray bombardment machine 161 different, do not make x-ray bombardment machine 161 disturb X-ray shielding part 11a just can move to-X side, thus secondary through hole 12b can be formed in more-X side.Thus, boring device 10 can be made miniaturized.And, because cover plate 173a, 173b are more configured at-X side than X-ray camera 162, be therefore configured at+X side from cover plate 173a, 173b different, easily can exchange cover plate 173a, 173b accordingly with the instrument etc. being arranged on tapping mechanism 171,172.
On the framework 181T of upside travel mechanism 18T, be provided with the track 182T extended along Y-direction, and on this track 182T, support Y-axis pedestal 183T movably.Y-axis pedestal 183T engages movably along track 182T with the ball screw 184T extended along Y-direction in Y-direction.The motor 185T being supported in framework 181T that is driven through of Y-axis pedestal 183T makes ball screw 184T rotate and carry out.Although not shown, but the rotating shaft of the rotating shaft of motor 185T and ball screw 184T is via power transmission mechanism, such as conveyer belt and linking, if the rotating shaft of motor 185T rotates, so the rotating shaft of ball screw 184T also rotates thereupon.
And, on the Y-axis pedestal 183T of upside travel mechanism 18T, be provided with the track 186T extended in X direction, and on this track 186T, support the moving body 187T of support X ray irradiating machine 161 and tapping mechanism 171,172 movably.Moving body 187T engages movably along track 186T with the ball screw 188T extended in X direction in X-direction.The ball screw 188T that is driven through of moving body 187T is driven by the motor 189T be supported on Y-axis pedestal 183T and carries out.Consist of this kind, upside travel mechanism 18T can make X-ray camera 162 and tapping mechanism 171,172 move to X-direction, Y-direction.
On the framework 181D of downside travel mechanism 18D, be provided with the track 182D extended along Y-direction, and support Y-axis pedestal 183D movably on this track 182D.Y-axis pedestal 183D is sticked in the ball screw 184D extended along Y-direction movably in Y-direction along track 182D.The movement of Y-axis pedestal 183D is driven by the motor 185D being supported in framework 181D by ball screw 184D and carries out.Although not shown, but the rotating shaft of the rotating shaft of motor 185D and ball screw 184D is via power transmission mechanism, such as conveyer belt and linking, if the rotating shaft of motor 185D rotates, so the rotating shaft of ball screw 184D also rotates thereupon.
And on downside travel mechanism 18D, the track 186D extended in X direction is arranged on Y-axis pedestal 183D.On this track 186D, be provided with the moving body 187D supporting cover plate 173a, 173b and x-ray bombardment mechanism 161 movably.Moving body 187D engages with the ball screw 188D extended in X direction.Therefore, if the motor 189D be arranged on Y-axis pedestal 183D makes ball screw 188D rotate, so moving body 187D moves along track 186D to X-direction.Consist of this kind, downside travel mechanism 18D can make cover plate 173a, 173b and X-ray camera 162 move to X-direction, Y-direction.
Control device 19 as shown in Figure 7, possesses control unit 191, main storage portion 192, exterior storage portion 193, operating portion 194, display part 195 and input and output portion 196.Main storage portion 192, exterior storage portion 193, operating portion 194, display part 195 and input and output portion 196 are all connected to control unit 191 via internal bus 198.
Control unit 191 comprises CPU(Central Processing Unit, central processing unit) etc., and according to the formula be stored in exterior storage portion 193, perform following process.
Main storage portion 192 comprises RAM(Random-Access Memory, random access memory) etc., and be loaded into the formula be stored in exterior storage portion 193, as the working region of control unit 191.
Exterior storage portion 193 comprises flash memory, hard disk, DVD-RAM(Digital Versatile DiscRandom-Access Memory, digital versatile disc-random access memory), DVD-RW(DigitalVersatile Disc Rewritable, digital versatile disc-CD-RW) etc. non-volatility memorizer.Exterior storage portion 193 prestores to make control unit 191 carry out the formula of described process, and according to the instruction of control unit 191, the data being stored in formula is supplied to control unit 191, stores the data supplied by control unit 191.
Operating portion 194 comprises indicator device such as keyboard or mouse etc. and keyboard or indicator device etc. is connected to the interface arrangement of internal bus 198.The instruction etc. that input starts or ends process via operating portion 194, is supplied to control unit 191.In addition, operating portion 194 also can be configured to make display part 195 or other monitors be contact panel mode, uses the finger of user or special input pen etc. to enter the operating instructions.
Display part 195 such as comprises CRT(Cathode Ray Tube, cathode-ray tube) or LCD(Liquid CrystalDisplay, liquid crystal display), and display is based on the shooting of image unit 16 or warning, instruction etc. to operator.
Input and output portion 196 comprises serial interface or LAN(Local Area Network, LAN) interface.From image unit 16, captured picture signal etc. is inputed to control unit 191 via input and output portion 196.And, via input and output portion 196 from control unit 191 export drive the not shown adsorption section of workbench 13 or conveying unit 15, travel mechanism 18 signal or drive the signal of image unit 16, perforate unit 17.In addition, conveying unit 15 or travel mechanism 18, image unit 16, perforate unit 17 are not limited to via input and output portion 196 and are connected to control unit 191, also can be configured to such as the picture signal from image unit 16 to be inputed to control unit 191 grade via image capture plate and exchange signal via special plate with control unit 191.
(action)
Secondly, the action of boring device 10 is described.The control unit 191 of boring device 10, such as when starting, drives various actuator to carry out initial treatment.In initial treatment, workbench 13, image unit 16, perforate unit 17 is made to move to the initial position of specifying.In the initial treatment of present embodiment, workbench 13 configures with through hole for shooting and the perforate through hole mode overlapping with the main through hole 12a of pedestal 12, as shown in Figure 2 or Figure 3, with x-ray bombardment machine 161, across main through hole 12a, the mode of subtend configures image unit 16 with X-ray camera 162.
Control unit 191 is such as connected by operator ON() starting switch, to select initial move-in position as the printing board PCB of perforate object for opportunity, perform the perforate process shown in Fig. 8.Herein, so-called initial move-in position, refers to that operator is the printing board PCB of perforate being placed in position on workbench 13.In the present embodiment, 2 initial move-in position are set.Operator is such as when the printing board PCB of wanted perforate is less than the size of specifying, select the initial move-in position being viewed as nearby side (-X side) from operator, when printing board PCB is greater than the size of specifying, select the initial move-in position of inboard (+X side).
If the perforate process shown in beginning Fig. 8, so control unit 191 will first based on the printing board PCB such as in advance inputted by operator size and judge that the initial move-in position of selected printing board PCB is nearby side or inboard (step S1).Then, initial move-in position be nearby side time (step 1:Yes), workbench 13 is made to move to the through hole for shooting position overlapping with the secondary through hole 12b of pedestal 12 to-X side, and as shown in figure 11, make x-ray bombardment machine 161 and X-ray camera 162 across secondary through hole 12b subtend (step S2), make x-ray bombardment machine 161 and X-ray camera 162 be on-state (step S3a).Thus, X-ray camera 162 starts the shooting of printing board PCB.
Then, operator inserts printing board PCB from moving into mouthful 10a, and one side observes the display of display part 195, and one side carries out the position alignment roughly of printing board PCB.The image taken by X-ray camera 162 such as shown in Figure 9, is shown in display part 195(step S4a via secondary through hole 12b by control unit 191).In fig .9, display 20 is note point of aim mark on the lens of X-ray camera 162, and display M is the alignment mark of note on printing board PCB.
The mode that the display one side that operator observes display part 195 with one side makes alignment mark M come the center of point of aim mark 20 makes printing board PCB, and (X-direction), transverse direction (Y-direction) move forwards, backwards.If control unit 191 is by such as detecting alignment mark M consistent with the approximate centre of point of aim mark 20 (step S5a:Yes) by operator by switch, so by absorption, printing board PCB will be temporarily fixed on workbench 13.
Control unit 191 complete printing board PCB temporarily fixing after, based on the image taken by X-ray camera 162, and the mode being configured at (processing region of specifying) on main through hole 12a with the position of opening of printing board PCB is to+X-direction conveyance workbench 13.And, x-ray bombardment machine 161 and X-ray camera 162 are moved to as the position (step S6) of subtend across main through hole 12a.In addition, also can, at x-ray bombardment machine 161 with the movement of X-ray camera 162, these components be made to be off state.
Then, control unit 191 moves to-Z-direction by making printed circuit board (PCB) clinching 14, and by pressing, printing board PCB is formally fixed on workbench 13.Formally fixed by this, and printing board PCB is fixed on workbench 13 more firmly than temporary transient fixing before.Secondly, control unit 191 is taken the alignment mark M of printing board PCB via main through hole 12a, and based on the position of captured alignment mark M, determines the predetermined openings position (step S7) of printing board PCB.This predetermined openings position both can be the position of alignment mark M, also can be the position apart from alignment mark M only distance to a declared goal.As long as determine predetermined openings position based on the information set by operator in advance.
If predetermined openings position is determined, so control unit 191 makes x-ray bombardment machine 161 and X-ray camera 162 be off state (step S8).Secondly, control unit 191 makes the tapping mechanism 171,172 of the side selected in advance and corresponding with it cover plate 173a, 173b as shown in figure 12, moves to the position corresponding with the position of opening on main through hole 12a.Then, printing board PCB is contacted with by making corresponding cover plate 173a, 173b, and make the instrument of the tapping mechanism 171,172 of selected side one side rotate one to move towards-Z-direction, and in the predetermined openings position perforate (step S9) of printing board PCB.
If completed the perforate of printing board PCB, so control unit 191 stops the rotation after moving to+Z-direction making tapping mechanism 171,172, printed circuit board (PCB) clinching 14 is moved to+Z-direction, removes the formal fixing of printing board PCB.Secondly, control unit 191 carries out initial treatment again, makes workbench 13, image unit 16, perforate unit 17 turn back to initial position.Thereafter, remove the negative pressure of the adsorption hole of workbench 13, and remove the temporarily fixing of printing board PCB, terminate a series of perforate process to printing board PCB.When terminating present treatment, such as, showing message at display part 195, urging and removing printing board PCB, making operator remove printing board PCB.
As mentioned above, when the initial move-in position selecting nearby side as printing board PCB (step 1:Yes), as long as owing to making the alignment mark M position alignment of printing board PCB in being configured in the secondary through hole 12b moving into a mouthful 10a side (operator side), even if therefore less printing board PCB also can carry out the position alignment of alignment mark M.And, if complete the position alignment of printing board PCB at secondary through hole 12b, so control unit 191 makes printing board PCB move to main through hole 12a based on the photographing information obtained via secondary through hole 12b, determine predetermined openings position at main through hole 12a, carry out the perforate to printing board PCB.By carrying out this kind of process, even if also easily perforate can be carried out to less printing board PCB.
On the other hand, when the initial move-in position of printing board PCB being chosen as inboard (step 1:No), make x-ray bombardment machine 161 be on-state (step S3b) with X-ray camera 162, start the shooting of X-ray camera 162 pairs of printing board PCBs.As mentioned above, in the present embodiment, when starting boring device 10, with x-ray bombardment machine 161, across the main through hole 12a of pedestal 12, the mode of subtend completes initial configuration with X-ray camera 162.Therefore, in the position through initial configuration, carry out the shooting of the X-ray camera 162 pairs of printing board PCBs via main through hole 12a.
Then, operator inserts printing board PCB from moving into mouthful 10a, and one side observes the display of display part 195, and one side carries out the position alignment roughly of printing board PCB.The image taken by X-ray camera 162 is such as shown in display part 195(step S4b by control unit 191 as shown in Figure 9).Now, display part 195 shows the image obtained via main through hole 12a.
In the same manner as when the initial move-in position selecting nearby side as above-mentioned printing board PCB, the mode that the display one side that operator observes display part 195 with one side makes alignment mark M come the center of point of aim mark 20 makes printing board PCB, and (X-direction), transverse direction (Y-direction) are mobile forwards, backwards.If control unit 191 detects alignment mark M consistent with the approximate centre of point of aim mark 20 (step S5b:Yes), so printing board PCB temporarily will be fixed on workbench 13 by making the not shown adsorption hole of workbench 13 be negative pressure, then, by making printed circuit board (PCB) clinching 14 move to-Z side, and printing board PCB is formally fixed.Thereafter, based on the position of the alignment mark M taken by X-ray camera 162, and the position of opening (step S7) of printing board PCB is determined.That is, based on the photographing information via main through hole 12a, and the predetermined openings position of printing board PCB is determined.
Once determine the predetermined openings position of printing board PCB, control unit 191 will make x-ray bombardment machine 161 and X-ray camera 162 be off state (step S8).Then, the tapping mechanism 171,172 of the side being chosen as predetermined openings position and cover plate 173a, 173b corresponding is with it made to move.Then, make corresponding cover plate 173a, 173b be contacted with printing board PCB, and pass through the instrument of the tapping mechanism 171,172 of selected side, and carry out the perforate (step S9) to printing board PCB.Perforate one terminates, and removing the formal fixing of printing board PCB, again carrying out initial treatment, making workbench 13, image unit 16, perforate unit 17 turn back to initial position, terminating a series of perforate process with regard to making printed circuit board (PCB) clinching 14 rise.
As mentioned above, when being chosen as the inboard initial move-in position as printing board PCB (step 1:No), owing to making the alignment mark M position alignment of printing board PCB in being configured in the main through hole 12a apart from moving into mouthful 10a side far away (+X side), therefore when larger printing board PCB, can from moving into the position alignment of carrying out alignment mark M under mouthful 10a is inserted into inner state.Thus, working space the stretching out to-X side of the supporting printing board PCB in boring device 10 can be reduced, thus the miniaturization of boring device 10 can be realized.
As described above, in the boring device 10 of present embodiment, carry out the main through hole 12a of the processing region of perforate by perforate unit 17 owing to being positioned at and being positioned at the secondary through hole 12b moving into mouthful 10b side and being formed on pedestal 12, therefore when less printing board PCB is inserted into boring device 10, by the secondary through hole 12b via-X side, printing board PCB is taken, and easily can carry out the perforate processing of printing board PCB.And, when larger printing board PCB is inserted into boring device 10, because the main through hole 12a via+X side takes printing board PCB, therefore can reduces workbench 13 stretching out to-X side, thus the miniaturization of boring device 10 can be realized.
In the boring device 10 of present embodiment, because x-ray bombardment machine 161 is more configured at-X side than tapping mechanism 171,172, therefore compared with being configured at the situation of+X side, secondary through hole 12b can be configured at more-X side.Thus, the miniaturization of boring device 10 can be realized.And, because cover plate 173a, 173b are more configured at-X side (i.e. operator side) than X-ray camera 162, the exchange of cover plate 173a, 173b therefore easily can be carried out.
Above, describe the present invention though enumerate an embodiment, the present invention is not limited to described embodiment, and its application and distortion etc. are any.Such as, in said embodiment, though be set to+Z the side at pedestal 12, x-ray bombardment machine 161 and tapping mechanism 171,172 are supported in upside travel mechanism 18T, in-Z the side of pedestal 12, X-ray camera 162 and cover plate 173a, 173b are supported in downside travel mechanism 18D, but also can in-Z the side of pedestal 12, x-ray bombardment machine 161 and tapping mechanism 171 are supported in downside travel mechanism 18D, and in+Z the side of pedestal 12, X-ray camera 162 and cover plate 173a, 173b are supported in upside travel mechanism 18T.And, tapping mechanism 171,172 and x-ray bombardment machine 161 are supported in the side in the travel mechanism 18T and downside travel mechanism 18D of upside by the mode that to be also more configured at-X side than tapping mechanism 171,172 with x-ray bombardment machine 161, and the mode being more configured at-X side than X-ray camera 162 with cover plate 173a, 173b cover plate 173a, 173b and X-ray camera 162 are supported on the upside of the opposing party in travel mechanism 18T and downside travel mechanism 18D.
And, in said embodiment, though be set to x-ray bombardment machine 161 to be more supported in than tapping mechanism 171,172 and to move into a mouthful 10a side, X-ray camera 162 is more supported in+X side than cover plate 173a, 173b, but when pedestal 12 being formed main through hole 12a and secondary through hole 12b, regardless of the configuration of this kind of image unit 16 or perforate unit 17, all easily perforate can be carried out to the printing board PCB of all size.And, be not limited to upside travel mechanism 18T and downside travel mechanism 18D make to be configured in+Z the side of pedestal 12 and the image unit 16 of-Z side and perforate unit 17 independently and move, the image unit 16 of subtend configuration in z-direction and perforate unit 17 also can be made to move to X-direction, Y-direction integratedly.
And, in said embodiment, though image unit 16 is set to have x-ray bombardment machine 161 and X-ray camera 162, as long as take printing board PCB via through hole, then use which kind of image unit.
And, in said embodiment, the adsorption hole of workbench 13 is made to be that negative pressure is passed through absorption and is temporarily fixed on by printing board PCB on workbench 13 though be set to, but also can such as by will the printing board PCB that be placed on workbench 13 to additive methods such as-Z-direction pressings, and printing board PCB to be temporarily fixed on workbench 13.
In addition, the present invention can not depart from spirit and the scope of broad sense of the present invention, is set to various embodiment and carries out various distortion.And described embodiment is for illustration of the present invention, and non-limiting scope of the present invention.That is, scope of the present invention is represented by embodiment represented by the claim.And, the various distortion implemented in claim and in the scope of the meaning of the invention equal with it are considered as in scope of the present invention.
The present invention is based on No. 2012-76614, the Japanese patent application case of filing an application on March 29th, 2012.With the description of No. 2012-76614, Japanese patent application case, claim, all accompanying drawing for reference to being incorporated in this description.
Claims (7)
1. a boring device, from move into mouth insert printed circuit board (PCB) on perforate; It is characterized in that possessing:
Mounting table, the 1st shooting hole is formed in the processing region carrying out perforate, the 2nd shooting hole be formed in more to lean on than described 1st shooting hole described in remove entrance side, and described printed circuit board (PCB) is placed in mounting surface;
Image unit, arranges movably and takes described printed circuit board (PCB) via described 1st shooting hole or described 2nd shooting hole;
Transport mechanism, based on the photographing information of being taken via described 2nd shooting hole by described image unit, obtain and load the position of described printed circuit board (PCB), and based on acquired position, the mode of carrying out the processing region of perforate described in entering to the predetermined openings position of described printed circuit board (PCB) moves described printed circuit board (PCB); And
Perforate unit, based on the photographing information of being taken via described 1st shooting hole by described image unit, determine the predetermined openings position of described printed circuit board (PCB), and move to the predetermined openings position of determined described printed circuit board (PCB), perforate on the printed circuit board.
2. boring device according to claim 1, is characterized in that:
Preset and multiplely the described printed circuit board (PCB) of perforate should to be placed in position in mounting table and initial move-in position; And
Described image unit is when selecting the reference mark and the described 2nd of described printed circuit board (PCB) to take the described initial move-in position of overlapping position, hole as described printed circuit board (PCB), first, carry out the shooting of the described printed circuit board (PCB) via described 2nd shooting hole, secondly, carry out the movement of the described printed circuit board (PCB) based on described transport mechanism, then, carry out the shooting of the described printed circuit board (PCB) via described 1st shooting hole, afterwards, the perforate based on described perforate unit is carried out; And
When the initial move-in position of position as described printed circuit board (PCB) selecting described reference mark to be configured on described 1st shooting hole, do not carry out via the described 2nd shooting shooting in hole and the movement based on described transport mechanism, after carrying out the shooting via the described printed circuit board (PCB) in described 1st shooting hole, carry out the perforate based on described perforate unit.
3. boring device according to claim 1, is characterized in that:
Described image unit has: X-ray produces mechanism, to the printed circuit board (PCB) X-ray irradiation be placed in described mounting table; And photographic unit, arrange with producing mechanism's subtend with this X-ray and the transmission picture of the X-ray exposed on described printed circuit board (PCB) is taken.
4. boring device according to claim 3, is characterized in that:
Described perforate unit has: tapping mechanism, forms hole on the printed circuit board; And cover plate, with this tapping mechanism subtend to arrange and being contacted with described printed circuit board (PCB) to during described printed circuit board (PCB) perforate; And possess further:
1st travel mechanism, makes the side in described X-ray generation mechanism and described photographic unit and described tapping mechanism move integratedly; And
2nd travel mechanism, makes the opposing party in described X-ray generation mechanism and described photographic unit and described cover plate move integratedly; And
Described tapping mechanism is disposed in described 1st travel mechanism and moves into the farther side of mouth described in the side's distance in described X-ray generation mechanism and described photographic unit; And
Described cover plate is disposed in described 2nd travel mechanism and moves into the nearer side of mouth described in the opposing party's distance in described X-ray generation mechanism and described photographic unit.
5. boring device according to claim 3, is characterized in that:
Possess and move into mouth described in being configured in and shielding produces the shield assembly of the X-ray of mechanism from described X-ray.
6. boring device according to claim 1, is characterized in that:
Possesses the display module photographing information of taking via described 1st shooting hole and described 2nd shooting hole being shown to operator.
7. boring device according to claim 1, is characterized in that:
Possesses the fixation kit be fixed on by the printed circuit board (PCB) be placed in described mounting table in mounting surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012076614A JP5952052B2 (en) | 2012-03-29 | 2012-03-29 | Drilling device |
| JP2012-076614 | 2012-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103358351A CN103358351A (en) | 2013-10-23 |
| CN103358351B true CN103358351B (en) | 2015-08-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310109619.1A Active CN103358351B (en) | 2012-03-29 | 2013-03-29 | Boring device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5952052B2 (en) |
| CN (1) | CN103358351B (en) |
| TW (1) | TWI505883B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6252809B1 (en) * | 2016-09-14 | 2017-12-27 | 株式会社ムラキ | Automatic transfer device applied to multilayer circuit board reference drilling machine |
| CN108449576B (en) * | 2018-03-22 | 2020-05-08 | 平顶山学院 | Computer image collector |
| CN112475402A (en) * | 2020-11-23 | 2021-03-12 | 安徽有通玻璃有限公司 | Milling machine for door and window processing and use method thereof |
| CN112648946B (en) * | 2020-12-02 | 2022-04-12 | 益阳市明正宏电子有限公司 | Hole deviation detection device |
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| CN1890070B (en) * | 2004-06-01 | 2011-06-15 | 倍科有限公司 | Hole-punching apparatus |
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| TW381412B (en) * | 1997-03-14 | 2000-02-01 | Seiko Precision Kk | Manufacturing method for multilayer substrate and the manufacturing device thereof |
| JP3361251B2 (en) * | 1997-08-28 | 2003-01-07 | セイコープレシジョン株式会社 | Plate work transfer device |
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| JP4502454B2 (en) * | 2000-04-28 | 2010-07-14 | 株式会社ムラキ | Reference hole drilling machine |
| JP2001315011A (en) * | 2000-05-10 | 2001-11-13 | Canon Inc | Board working device and board working method |
| JP3978462B2 (en) * | 2001-08-15 | 2007-09-19 | Ｕｈｔ株式会社 | Work table for punching device and punching device |
| JP3095308U (en) * | 2003-01-17 | 2003-07-31 | 聯星科技股▲ふん▼有限公司 | Push plate moving structure for thin plate drilling of printed circuit board X-ray drilling machine |
| JP4210692B2 (en) * | 2006-05-30 | 2009-01-21 | セイコープレシジョン株式会社 | Drilling device |
| JP5022069B2 (en) * | 2007-03-15 | 2012-09-12 | セイコープレシジョン株式会社 | Drilling device |
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- 2012-03-29 JP JP2012076614A patent/JP5952052B2/en active Active
- 2012-12-20 TW TW101148773A patent/TWI505883B/en active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1890070B (en) * | 2004-06-01 | 2011-06-15 | 倍科有限公司 | Hole-punching apparatus |
| CN101375648A (en) * | 2006-01-30 | 2009-02-25 | 精工精密有限公司 | Boring method and boring device |
| CN101733438B (en) * | 2009-11-10 | 2011-09-28 | 重庆理工大学 | Robot for punching positioning holes on circuit board |
| CN102248556A (en) * | 2011-05-26 | 2011-11-23 | 高文祥 | Full-automatic punching machine |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI505883B (en) | 2015-11-01 |
| TW201343285A (en) | 2013-11-01 |
| CN103358351A (en) | 2013-10-23 |
| JP2013207187A (en) | 2013-10-07 |
| JP5952052B2 (en) | 2016-07-13 |
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