WO2018203373A1

WO2018203373A1 - Mounting device, information processing device, mounting system, mounting method, and information processing method

Info

Publication number: WO2018203373A1
Application number: PCT/JP2017/017186
Authority: WO
Inventors: 雅史天野
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2017-05-01
Filing date: 2017-05-01
Publication date: 2018-11-08
Also published as: JP6837138B2; JPWO2018203373A1

Abstract

This mounting device is provided with a control unit that causes a mounting head to collect a first component requiring an image having higher resolution than a captured image and a predetermined second component serving as a position reference, causes an imaging unit to capture, at a plurality of imaging positions, images including the first component and the second component collected by this mounting head, and executes super-resolution processing of generating, by using the captured plurality of images, an image of the first component having higher resolution than the captured images, with the position of the second component as the reference position.

Description

Mounting apparatus, information processing apparatus, mounting system, mounting method, and information processing method

The invention disclosed in this specification relates to a mounting apparatus, an information processing apparatus, a mounting system, a mounting method, and an information processing method.

Conventionally, as a mounting apparatus, the holding state of a component by a holding member is recognized based on a reference mark attached to a specified position of a moving head and high resolution data generated by super-resolution processing using a plurality of image data. An apparatus including an image processing unit has been proposed (see, for example, Patent Document 1). In this apparatus, a plurality of images are aligned using a reference mark provided on a moving head to generate high resolution data.

International Publication No. 2015/083220 Pamphlet

However, in the mounting apparatus described in Patent Document 1, it is necessary to perform image processing on reference marks other than parts when generating high-resolution data, and it has been required to further simplify image processing.

The invention disclosed in this specification has been made in view of such problems, and further simplifies image processing when performing super-resolution processing that generates a high-resolution image using a plurality of images. It is a main object to provide a mounting apparatus, an information processing apparatus, a mounting system, a mounting method, and an information processing method.

The invention disclosed in this specification has taken the following measures in order to achieve the above-mentioned main object.

The mounting apparatus disclosed in this specification is:
A mounting device that executes a mounting process for placing components on a board,
A mounting head that picks up and moves multiple parts;
An imaging unit that captures an image of the component collected by the mounting head;
The mounting head picks up a first part that requires an image with a higher resolution than the captured image and a predetermined second part that serves as a reference for the position, and the first part and the second part that are picked up by the mounting head An image of the first component having a resolution higher than that of the captured image by causing the imaging unit to capture an image including the image at a plurality of imaging positions and using the plurality of captured images as a position of the second component. A control unit that executes super-resolution processing for generating
It is equipped with.

In this mounting apparatus, the mounting head collects the first component that requires an image with a higher resolution than the captured image and the predetermined second component that serves as a reference for the position, and the first component and the second component that are collected by the mounting head. Are captured at a plurality of imaging positions. In this mounting apparatus, a super-resolution process is performed in which a plurality of captured images are used and the position of the second component is used as a reference position to generate an image of the first component having a higher resolution than the captured image. In this mounting apparatus, when performing super-resolution processing that generates a high-resolution image using a plurality of images, image processing other than components (for example, fiducial marks) is omitted, and image processing is further simplified. Can do.

1 is a schematic explanatory diagram illustrating an example of a mounting system 10. FIG. Explanatory drawing of the mounting part 13 and the imaging part 15. FIG. Explanatory drawing of components Pa, P1, and P2. 4 is an explanatory diagram illustrating an example of mounting condition information 19 stored in a storage unit 18. FIG. Explanatory drawing showing an example of the information memorize | stored in the memory | storage part 33. FIG. The flowchart showing an example of a mounting condition setting process routine. The flowchart showing an example of a mounting process routine. Explanatory drawing of the 1st image 51, the 2nd image 52, and the 3rd image 53. FIG. Explanatory drawing which shows an example of a super-resolution process. Explanatory drawing which produces | generates super-resolution image 54A, 54B.

This embodiment will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram of a mounting system 10 which is an example of the present disclosure. FIG. 2 is an explanatory diagram illustrating an example of the mounting processing unit 13 and the imaging unit 15. FIG. 3 is an explanatory diagram of the parts Pa, P1, and P2. FIG. 4 is an explanatory diagram illustrating an example of the mounting condition information 19 stored in the storage unit 18. FIG. 5 is an explanatory diagram illustrating an example of a component database (DB) 34 and mounting condition information 35 stored in the storage unit 33. The mounting system 10 is a system that executes a process of mounting the component P on the board S, for example. The mounting system 10 includes a mounting device 11 and a management computer (PC) 30. The mounting system 10 is configured as a mounting line in which a plurality of mounting apparatuses 11 that perform mounting processing for mounting a component P on a substrate S are arranged from upstream to downstream. In FIG. 1, only one mounting apparatus 11 is shown for convenience of explanation. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS. Parts P1, P2, Pa (see FIG. 3) and the like are collectively referred to as parts P.

As shown in FIG. 1, the mounting apparatus 11 includes a substrate processing unit 12, a mounting unit 13, a component supply unit 14, an imaging unit 15, and a control unit 16. The substrate processing unit 12 is a unit that carries in, transports, fixes and unloads the substrate S at the mounting position. The substrate processing unit 12 has a pair of conveyor belts provided at intervals in the front and rear direction of FIG. 1 and spanned in the left-right direction. The board | substrate S is conveyed by this conveyor belt.

The mounting unit 13 is a unit that collects the component P from the component supply unit 14 and arranges the component P on the substrate S fixed to the substrate processing unit 12. The mounting unit 13 includes a head moving unit 20, a mounting head 21, and a suction nozzle 22 (collecting unit). The head moving unit 20 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider. The mounting head 21 collects a plurality of components and moves in the XY directions by the head moving unit 20. The mounting head 21 is detachably mounted on the slider. One or more suction nozzles 22 are detachably mounted on the lower surface of the mounting head 21 via a holding portion 21a. The mounting head 21 can be mounted with a holding portion 21a in which a plurality of suction nozzles 22 for collecting the component P are arranged on the circumference. To the mounting head 21, holders 21a to 21c having different numbers of attached suction nozzles 22 are mounted in a replaceable manner. In addition, any of the plurality of types of suction nozzles 22 is attached to the holding portions 21a to 21c. A plurality of suction nozzles 22 (for example, eight or four) are attached to the holding unit 21a and the holding unit 21b, and a plurality of components P can be collected. The suction nozzle 22 collects components using negative pressure and is detachably mounted on the mounting head 21. The parts may be collected by a mechanical chuck that mechanically holds the parts P in addition to the suction nozzle 22. The plurality of suction nozzles 22 are stored in the nozzle storage unit 24, and the holding units 21a to 21c are stored in the holding unit storage unit 25, and are replaced here by the mounting head 21 when in use.

The component supply unit 14 is a unit that supplies the component P to the mounting unit 13. The component supply unit 14 includes a plurality of reels and is detachably attached to the front side of the mounting apparatus 11. A tape is wound around each reel, and a plurality of parts P are held on the surface of the tape along the longitudinal direction of the tape. The tape is unwound from the reel toward the rear, and is sent out by the feeder unit to a sampling position where the tape is sucked by the suction nozzle 22 with the components exposed. The component supply unit 14 may include a tray unit having a tray on which a plurality of components are arranged and placed.

The components P used in the mounting apparatus 11 include components P1, P2, and Pa as shown in FIG. The component P1 is a fine component and requires an image with a higher resolution than the captured image (also referred to as a first component). The component Pa, which will be described in detail later, can serve as a reference for the relative position with other components collected by the mounting head 21 (also referred to as a reference component or a second component). The second component is, for example, a large component having a size larger than that of the first component, and may be a component that does not require an image with a higher resolution than the captured image. The component Pa includes a plate-like main body portion 40 and a plurality of leads 41 disposed on the main body portion 40. In some cases, the second component serving as a reference for the position preferably has a portion such as a lead 41 where a plurality of edges can be determined. The component P2 includes a main body portion 42 that can serve as a position reference, and a bump 43 that is a portion that requires an image with a higher resolution than the captured image. The bumps 43 are electrodes arranged in a large number below the plate-like main body 42. The component P2 is a first component, but can also be used as a second component. Here, for convenience of description, the description will be made mainly on the component P1 and the component Pa.

The imaging unit 15 is a device that captures an image, and is a parts camera that captures an image of one or more components P collected and held by the mounting head 21. The imaging unit 15 is disposed between the component supply unit 14 and the substrate processing unit 12. The imaging range of the imaging unit 15 is above the imaging unit 15. When the mounting head 21 holding the component P passes over the imaging unit 15, the imaging unit 15 captures one or more images and outputs the captured image data to the control unit 16.

As shown in FIG. 1, the control unit 16 is configured as a microprocessor centered on a CPU 17 and includes a storage unit 18 for storing various data. The control unit 16 outputs control signals to the substrate processing unit 12, the mounting unit 13, the component supply unit 14, and the imaging unit 15, and inputs signals from the mounting unit 13, the component supply unit 14, and the imaging unit 15. The storage unit 18 stores mounting condition information 19 including an arrangement order and an arrangement position for mounting the component P on the substrate S. As shown in FIG. 4, the mounting condition information 19 includes, in order to mount the component P, the collection order, arrangement order, identification information (ID) of the component P, necessity information for super-resolution processing, super-resolution processing. Information on the reference parts used in the above, holding information for holding the reference parts without placing them, information on the suction nozzles to be used, imaging conditions, information on the arrangement position (coordinates) on the substrate S, and the like. Further, the mounting condition information 19 includes information on the size of parts (not shown). Note that super-resolution processing refers to processing (multi-frame super-resolution processing) for generating an image having a higher resolution than a predetermined resolution from a plurality of images having a predetermined resolution. Further, the necessity information of the super-resolution processing is information regarding whether or not an image having a higher resolution than the captured image is required in the component P collected by the mounting head 21. The holding information is information indicating that when the number of second components is less than a predetermined value, the process of collecting and arranging the first components on the mounting head 21 while holding the second components is repeated. The holding information is given to the last component arranged among the second components collected together with the first component group. In addition, after mounting the first component and the second component on the mounting head 21, the mounting condition information 19 is a new one while retaining the second component when any of the first components is not used for the mounting process. Further included is information for causing the mounting head 21 to collect the first component. The mounting apparatus 11 acquires the mounting condition information 19 generated by the management PC 30 from the management PC 30 before the mounting process, and stores it in the storage unit 18.

The management PC 30 is a computer that manages information of each device of the mounting system 10. As shown in FIG. 1, the management PC 30 includes a control device 31, a storage unit 33, a display 38, and an input device 39. The control device 31 is configured as a microprocessor centered on the CPU 32. The storage unit 33 is a device that stores various data such as a processing program such as an HDD. The display 38 is a liquid crystal screen that displays various types of information. The input device 39 includes a keyboard, a mouse, and the like through which an operator inputs various commands. The storage unit 33 stores a component DB 34 including information on the component P. As shown in FIG. 5, the component DB 34 collects a component ID, component size, component type, necessity information for super-resolution processing, information on the corresponding reference component to be used when executing the super-resolution processing, and the component. Information on possible nozzles to be used, imaging conditions used when imaging the component, and the like are included. The component DB 34 is a set of component information used in the mounting process. The type of component P includes, for example, a component that is fine enough to require super-resolution processing, a general-purpose component that does not require super-resolution processing, and a large component that can serve as a reference position. Since the mounting apparatus 11 can recognize the component type from the component size, the component type may be omitted in the component DB 34. The imaging conditions include an exposure time range, an illumination pattern range, an illumination intensity range, and the like. The management PC 30 uses the component DB 34 to create mounting condition information 35 including which component P is disposed at which position and in which order the mounting apparatus 11 is arranged. The mounting condition information 35 is the same information as the mounting condition information 19.

Next, the operation of the mounting system 10 of the present embodiment configured as described above, first, the processing for setting the order of arrangement of the components P on the board S will be described. FIG. 6 is a flowchart illustrating an example of a mounting condition setting process routine executed by the CPU 32 of the management PC 30. This routine is stored in the storage unit 33 and executed based on the operator's setting start input. When this routine is started, the CPU 32 first reads information on the component P mounted on the substrate S from the component DB 34 (S100). The CPU 32 may identify the component P from information (for example, CAD data) of the board S to be produced and read this information. Next, the CPU 32 extracts a first component that requires super-resolution processing based on the read component information (S110). The CPU 32 extracts the first part based on the necessity information included in the part DB 34.

Next, the CPU 32 prioritizes the commonality of the second component that is the position reference when picked up by the mounting head 21 and sets the component group of the first component (S120). The CPU 32 includes, for example, any one or more of the commonality of the suction nozzle 22 to be used and the commonality of the component type of the first component in addition to the commonality of the second component, and using this arbitrary priority order. The part group of the first part may be set. This priority order may be determined based on the efficiency of the mounting process, for example, that the mounting head 21 can simultaneously collect as many components P as possible and that the change in the suction nozzle 22 is suppressed as much as possible. Subsequently, the CPU 32 sets a component group including at least one second component when collecting the first component (S130). At this time, when the number of second components is smaller than the predetermined value, the CPU 32 lastly holds holding information which is information indicating that the mounting head 21 collects and arranges the first components while holding the second components. It is given to the second part to be placed. This predetermined value may be determined, for example, as the number of repetitions in which sampling and arrangement are repeated while the mounting head holds the first component as much as possible. In this case, when the second part is insufficient, the same second part is repeatedly used, thereby preventing the lack of the reference part.

Next, the CPU 32 prioritizes the movement distance and sets the arrangement order of the parts P so that the movement distance of the mounting head 21 is as short as possible (S140). For example, since eight suction nozzles 22 are mounted on the holding unit 21a, eight parts P can be arranged by one movement of the mounting head 21 (one pass). When the mounting head 21 collects the first component that requires super-resolution processing, it is necessary to collect at least one second component. In this case, a case where there are 21 first parts and two second parts will be described as an example with reference to FIG. In the first pass n1, seven parts P1 and one part Pa are sampled and arranged at the arrangement position. The same applies to the second pass n2, but since there is no new component Pa in the third pass n3, the component P1 is collected and arranged while holding the component Pa collected in the second pass. Holding information is attached to the component Pa, and the component Pa is held by the mounting head 21 until all the components P1 of this set are arranged. Then, in S140, the CPU 32 sets a combination of the component P1 and the component Pa whose distance becomes shorter in the one to three passes.

Subsequently, the CPU 32 determines whether or not the arrangement order has been set a predetermined number of times (S150). If the arrangement order has not been set a predetermined number of times, the arrangement order setting condition is changed (S160). ), And the processes after S140 are repeated. For example, the CPU 32 may change the arrangement order of any component P as a change in the arrangement order setting condition. When the arrangement order is set a predetermined number of times in S150, the CPU 32 selects the arrangement order of the shortest time among the set arrangement orders (S170), and stores the selected arrangement order in the storage unit 33 as the mounting condition information. (S180), and this routine is finished as it is. In this way, when collecting the first component, the mounting condition information 35 that causes the mounting head 21 to collect at least one or more second components is created. Further, the mounting apparatus 11 acquires the mounting condition information 35 before executing the mounting process, and stores it in the storage unit 18 as the mounting condition information 19.

Next, the mounting process executed by the mounting apparatus 11 using the created mounting condition information will be described. FIG. 7 is a flowchart illustrating an example of a mounting process routine executed by the CPU 17 of the mounting apparatus 11. This routine is stored in the storage unit 18 and is executed based on the worker's mounting start input. When this routine is started, the CPU 17 first reads and acquires the mounting condition information 19 (S200), and causes the substrate processing unit 12 to carry and fix the substrate S (S210). Next, the CPU 17 sets the component P to be picked up by the suction nozzle 22 based on the arrangement order of the mounting condition information 19 (S220). Next, the CPU 17 mounts the holding unit and the suction nozzle 22 on the mounting head 21 based on the set component P (S230), and causes the mounting unit 13 to perform suction and movement processing of the component P (S240). At this time, the CPU 17 moves the mounting head 21 so as to pass above the imaging unit 15.

Next, the CPU 17 determines whether or not there is a component P that requires super-resolution processing among the samples collected by the mounting head 21 (S250). If there is no component P that requires super-resolution, it is collected. The imaging unit 15 is caused to perform imaging processing of the component P (S260). Next, the CPU 17 detects the amount of displacement of the suction position of the component P from the captured image (S270), and determines whether there is a component that cannot be placed in the currently collected component (S280). The non-placeable parts include, for example, a part P (collection error part) collected with an amount of deviation exceeding an allowable collection position deviation, or a part P (shape having a shape that does not match the allowable shape. Shape error parts). The defective shape of the component P can be determined based on matching with the reference shape data. When there is a non-placeable part, the corresponding part P is discarded, and the order of placement is set so that it can be mounted later (S290). After S290 or when there is no non-placeable part in S280, the part P is placed at the placement position on the substrate S while correcting the shift amount (S300).

On the other hand, in S250, when there is a component P that requires super-resolution processing among the samples collected by the mounting head 21, the CPU 17 displays an image including the first component and the second component collected by the mounting head 21 with a plurality of images. The imaging unit 15 is caused to capture an image at the imaging position (S310). The imaging unit 15 images all the parts P held by the plurality of suction nozzles 22 within the same field of view. At this time, the second component only needs to include a part whose position can be specified in the image, a part of the second component may be included in the image, or the entire second component may be included in the image. It is good also as what is contained in. Further, the CPU 17 may stop the movement of the mounting head 21 for each imaging process when capturing images at a plurality of imaging positions, or perform the imaging process a plurality of times while moving the mounting head 21. It may be done. FIG. 8 is an explanatory diagram illustrating an example of the first image 51, the second image 52, and the third image 53 captured at a plurality of positions. Subsequently, the CPU 17 performs a super-resolution process for generating an image of the first component having a higher resolution than the captured image using the plurality of captured images as the reference position of the second component (S320). ).

This super-resolution processing uses, for example, a plurality of images, obtains an accurate movement amount between the first image and the second image based on the position of the second component, generates a temporary high-resolution image, A blur estimation process and a reconstruction process are performed on the temporary image to generate an image with a higher resolution than the captured image. 9A and 9B are explanatory diagrams of super-resolution processing. FIG. 9A is a conceptual diagram of a low-resolution image, and FIG. 9B is a conceptual diagram of a high-resolution image obtained by superimposing the low-resolution images. . FIG. 10 is an explanatory diagram for generating super-resolution images 54A and 54B. FIG. 10A shows a super-resolution image of the bump 43 generated from the first image 51A, the second image 52A, and the third image 53A. FIG. 10B is an image diagram of the super-resolution image 54B of the chip component generated from the first image 51B, the second image 52B, and the third image 53B. As shown in FIG. 9B, when images obtained by shifting a low-resolution image by shifting in a range of pixel pitch other than an integer (for example, 0.5 pixel, 1.5 pixel, etc.) are superimposed, information between pixels is obtained. Can be increased more. In addition, since an actually captured image is used, it is possible to generate a high-resolution image with higher reliability than simply estimating and interpolating information between pixels. As shown in FIG. 10, the mounting apparatus 11 can generate a high-resolution image using a relatively low-resolution image. The mounting apparatus 11 is required to image from a relatively small chip component to a relatively large component. In general, the imaging unit 15 narrows the imaging range (field of view) when attempting to capture a high-resolution image and cannot capture a large component, and when attempting to capture a large component, the resolution of the small component is insufficient. The mounting apparatus 11 can sufficiently secure an imaging range when imaging a large component and can sufficiently ensure image resolution when imaging a small component or a small part by performing super-resolution processing. . In addition, since the relative positional relationship between the first component and the second component is the same for a plurality of images, for example, the images can be superimposed on the basis of the second component without using a reference mark or the like. .

Subsequently, the CPU 17 detects the shift amount of the first part from the obtained super-resolution image (S330), and determines whether there is a non-placeable part (S340). When there is no non-placeable part, the CPU 17 places the part P at the position where the shift amount is corrected in S300, and executes the subsequent processing. On the other hand, when there is a non-placeable part in the first part, the CPU 17 places a part other than the non-placeable part in the position where the shift amount is corrected while holding the second part, discards the non-placeable part and cannot place it. A new first part instead of the part is collected, an image is generated by super-resolution processing, and the positional deviation is corrected, and the first part is arranged at the arrangement position (S350). At this time, the CPU 17 may first perform the placement of the first part other than the non-placeable parts and the disposal, collection, and placement of the non-placeable parts. In the mounting apparatus 11, when discarding a component that cannot be arranged, the super-resolution processing of a new first component can be performed by holding the second component.

After S350 or after S300, the CPU 17 determines whether or not the current board mounting process has been completed (S360), and if not completed, executes the processes of S220 and higher. That is, the CPU 17 sets the component P to be next sucked, replaces the holding unit and the suction nozzle 22 as necessary, images the component P, corrects the shift amount, and places the component P on the substrate S. On the other hand, when the mounting process of the current substrate is completed in S360, the CPU 17 causes the substrate processing unit 12 to discharge the mounted substrate S (S370), and determines whether the production is completed (S380). When the production is not completed, the CPU 17 executes the processes after S210, and when the production is completed, the routine is finished as it is.

Here, the correspondence between the constituent elements of the present embodiment and the constituent elements of the present disclosure will be clarified. The mounting head 21 of this embodiment corresponds to a mounting head, the suction nozzle 22 corresponds to a sampling unit, the imaging unit 15 corresponds to an imaging unit, the control unit 16 corresponds to a control unit, and the storage unit 18 corresponds to a storage unit. It corresponds to. The control device 31 corresponds to a setting unit, and the storage unit 33 corresponds to a storage unit. In the present embodiment, an example of the mounting method is clarified by explaining the operation of the mounting apparatus 11, and an example of the information processing method is clarified by explaining the operation of the management PC 30.

The mounting apparatus 11 according to the embodiment described above causes the mounting head 21 to collect the first component that requires an image with a higher resolution than the captured image and the predetermined second component that serves as a reference for the position. The image including the first component and the second component is captured at a plurality of imaging positions. The mounting apparatus 11 executes super-resolution processing for generating an image of the first component having a resolution higher than that of the captured image, using the plurality of captured images and using the position of the second component as a reference position. . In this mounting apparatus 11, when performing super-resolution processing that generates a high-resolution image using a plurality of images, image processing other than components (for example, reference marks) is omitted, and thus image processing is further simplified. be able to. Further, in the mounting apparatus 11, since the second component is used as the reference position, for example, the reference mark or the like does not need to be provided on the mounting head 21, so that the apparatus configuration can be further simplified. Furthermore, in this mounting apparatus 11, since the reference mark does not need to be provided on the mounting head 21, the effect of expanding the field of view of the imaging unit 15 can be obtained.

In the mounting apparatus 11, the second component has a size larger than that of the first component. Therefore, the second component having a smaller size is used as a reference position by using the second component having a larger size. A high-resolution image can be generated. Furthermore, the mounting apparatus 11 includes a storage unit 18 that stores mounting condition information 19 including necessity information regarding whether or not an image having a higher resolution than the captured image is required for the component P collected by the mounting head 21. The control unit 16 performs super-resolution processing based on the information stored in the storage unit 18. In the mounting apparatus 11, the super-resolution processing can be executed based on the information stored in the storage unit 18. Furthermore, the control unit 16 performs super-resolution processing based on the mounting condition information 19 stored in the storage unit 18 when the mounting head 21 collects the first component and the second component. In the mounting apparatus 11, if the first component and the second component are collected by the mounting head 21, the super-resolution processing can be executed with the second component as a reference position. The storage unit 18 also stores mounting condition information 19 that is set in advance so that the mounting head 21 collects the second component together with the first component that requires an image with a higher resolution than the captured image. Super-resolution processing is executed based on the mounting condition information 19 stored in the storage unit 18. The mounting apparatus 11 can execute super-resolution processing using predetermined mounting condition information 19.

In addition, the storage unit 18 includes mounting condition information 19 including holding information for repeating the process of collecting and arranging the first component on the mounting head 21 while holding the second component when the number of the second components is smaller than a predetermined value. Based on the mounting condition information 19, the control unit 16 repeatedly causes the mounting head to collect and arrange the first component while holding the second component. In the mounting apparatus 11, there may be a case where the number of second components is smaller than the number of first components collected by the mounting head 21, and if the second components are arranged, a subsequent reference position may not be secured. . In such a case, the mounting apparatus 11 can keep the second component held in such a case, and can perform the super-resolution processing more reliably. Further, when the first component and the second component are collected by the mounting head 21 and the first component is not used for the mounting process, the control unit 16 mounts a new first component while holding the second component. 21. In this mounting apparatus 11, when the first component cannot be used, for example, when the component shape or the sampling state is inappropriate, the super-resolution processing is executed more reliably by holding the second component. can do.

In addition, the mounting head 21 has a plurality of suction nozzles 22 (collecting units) for sampling the components P arranged on the circumference, and the imaging unit 15 has the same for all the components P held by the plurality of suction nozzles 22. Take an image within the field of view. In the so-called rotary head in which the suction nozzle 22 is arranged on the circumference, a plurality of parts P are collected at the same time, and therefore, it is highly significant to adopt the configuration of the present disclosure. Further, the control unit 16 determines one or more of the shape of the first part and the sampling position of the first part based on the image of the first part generated by the super-resolution processing. In this mounting apparatus 11, it is possible to obtain a higher quality image used for determining whether the shape and the sampling position of the component P are appropriate, and it is possible to perform these determinations more accurately.

In addition, when the management PC 30 causes the mounting head 21 to collect the first component, the management PC 30 sets the mounting condition information 35 that causes the mounting head 21 to collect both the second components that serve as reference positions. Then, the mounting apparatus 11 uses the mounting condition information 19 based on the mounting condition information 19 to capture images including the first component and the second component at a plurality of imaging positions, and performs super-resolution using the plurality of captured images. Processing can be executed. In the management PC 30, image processing can be further simplified by omitting image processing other than the component P as much as possible in the mounting apparatus 11. Further, when the number of second components is smaller than a predetermined value, the control device 31 (setting unit) includes mounting information that repeats a process of collecting and arranging the first component on the mounting head 21 while holding the second component. Condition information 35 is set. In the management PC 30, by setting the mounting condition information 35 that keeps the second component held, the super-resolution processing can be more reliably executed in the mounting apparatus 11. When the control device 31 causes the mounting head 21 to collect the first component and the second component and does not use the first component for the mounting process, the control device 31 keeps the second component while holding the new first component to the mounting head 21. The mounting condition information 35 including information to be collected is set. In the management PC 30, by setting the mounting condition information 35 that holds the second component in advance, the mounting device 11 cannot use the first component, for example, when the component shape or the sampling state is inappropriate. In addition, the super-resolution processing can be executed more reliably. Furthermore, the management PC 30 includes a storage unit 33 that stores a component DB 34 (correspondence information) in which the component type of the second component is associated with the first component, and the control device 31 performs the first operation based on the component DB 34. The second part corresponding to the part is selected. In the management PC 30, by using the component DB 34, it is possible to select a more suitable second component for the first component. The mounting system 10 includes the mounting device 11 and the management PC 30. In the mounting system 10, as in the mounting apparatus 11 and the management PC 30 described above, the image processing can be further simplified when performing super-resolution processing that generates a high-resolution image using a plurality of images. .

It should be noted that the present disclosure is not limited to the above-described embodiment, and it goes without saying that the present disclosure can be implemented in various modes as long as it belongs to the technical scope of the present disclosure.

For example, in the above-described embodiment, the super-resolution processing is performed with the component P1 and the component Pa having different sizes. However, the super-resolution processing is performed with the component P2 and the component Pa having a part that requires the super-resolution processing. It may be a thing. Alternatively, a plurality of mounting heads 21 are used to collect a plurality of components P2 having a portion (bump 43) that requires super-resolution processing and a portion (main body portion 42) that can be a reference position, and one or more main body portions 42 of them are collected The reference position may be used to perform super-resolution processing. In this mounting apparatus 11 as well, image processing other than the component P (for example, reference mark) can be simplified, such as omitting image processing.

In the above-described embodiment, the mounting head 21 has been described as having no reference mark, but the mounting head 21 may have a reference mark. Also in this apparatus, if the second component is used as the reference position, the image processing can be further simplified, such as omitting image processing other than the component. In the above-described embodiment, the control unit 16 performs the super-resolution processing based on the mounting condition information 19 stored in the storage unit 18, but is not particularly limited thereto. For example, the mounting head The mounting apparatus 11 may appropriately determine whether the super-resolution processing can be performed based on the components collected in 21. In the mounting apparatus 11, a reference mark is provided on the mounting head 21, and when only the first component is collected on the mounting head 21, super-resolution processing is performed using the reference mark as a reference position. What is necessary is just to perform a super-resolution process on the basis of the position of a 2nd component, when it determines with 1 components and a 2nd component having been extract | collected. Also in the mounting apparatus 11, when super-resolution is performed with the second component as a reference, image processing other than the component can be omitted, for example, image processing can be further simplified.

In the above-described embodiment, when the number of the second components is less than the predetermined value, it has been described that the process of collecting and arranging the first component on the mounting head 21 while holding the second component is repeated. It may be omitted. Further, in the above-described embodiment, when the first component is not used for the mounting process, an alternative new first component is collected while holding the second component, but this may be omitted. If the second component is not held, the second component cannot be used as a reference. However, if the mounting head 21 is provided with a reference mark to cope with an emergency, super-resolution processing can be performed. .

In the above-described embodiment, it has been described that the super-resolution processing is performed by the mounting head 21 in which the suction nozzles 22 are circumferentially arranged. It is not limited. Further, in the above-described embodiment, it has been described that all the parts P held by the suction nozzle 22 are imaged within the same field of view. However, if an image including the first part and the second part is captured, it is assumed. However, it is not particularly limited to this. For example, the second component may be held at the head and the tail of the mounting head 21 and the imaging process may be performed separately in the front and rear. Also in this mounting apparatus 11, image processing other than components can be omitted.

In the above-described embodiment, the present disclosure has been described as the mounting apparatus 11 and the management PC 30. However, for example, a mounting method or an information processing method may be used, or a program executed by a computer may be performed.

Here, in the mounting apparatus according to the present disclosure, the second component may have a size larger than that of the first component. In this mounting apparatus, it is possible to generate a high-resolution image of the first component having a smaller size by using the second component having a larger size as a reference position. Here, the second component may be a component that does not require an image having a higher resolution than the captured image.

The mounting apparatus according to the present disclosure includes a storage unit that stores information regarding whether or not an image having a higher resolution than a captured image is required in a component collected by the mounting head, and the control unit is stored in the storage unit. The super-resolution processing may be executed based on the received information. In this mounting apparatus, the super-resolution processing can be executed based on the information stored in the storage unit. In this mounting apparatus, the control unit may determine whether to perform the super-resolution processing based on information stored in the storage unit.

In the mounting apparatus of the present disclosure including a storage unit, the control unit causes the mounting head to collect the first component and the second component based on information stored in the storage unit. Super-resolution processing may be executed. In this mounting apparatus, if the first component and the second component are collected by the mounting head, the super-resolution processing can be executed with the second component as a reference position. In this mounting apparatus, when the second component is not picked up by the mounting head, the super-resolution processing using the position of the second component as a reference position may not be executed.

In the mounting apparatus according to the present disclosure including a storage unit, the storage unit is mounted in advance so that the mounting head can collect the second component together with the first component that requires an image having a higher resolution than the captured image. Condition information is stored, and the control unit may execute the super-resolution processing based on the mounting condition information stored in the storage unit. In this mounting apparatus, it is possible to execute super-resolution processing using predetermined mounting condition information. In this mounting apparatus, the storage unit includes information for repeating a process of collecting and arranging the first component on the mounting head while holding the second component when the number of the second components is smaller than a predetermined value. The mounting condition information may be stored, and the control unit may repeatedly execute a process of collecting and arranging the first component on the mounting head while holding the second component based on the mounting condition information. . In the mounting apparatus, the number of the second components may be smaller than the number of the first components collected by the mounting head, and if the second components are arranged, the subsequent reference position may not be secured. In this mounting apparatus, the second component can be held in such a case, and the super-resolution process can be executed more reliably. Here, the “predetermined value” may be set to, for example, the number of repetitions in which sampling and arrangement are repeated while the mounting head holds the first component as much as possible.

In the mounting apparatus according to the present disclosure, the control unit holds the second component when the first component and the second component are collected by the mounting head and not used in the mounting process. The new first component may be collected by the mounting head. In the mounting apparatus, the number of the second components may be smaller than the number of the first components collected by the mounting head, and if the second components are arranged, the subsequent reference position may not be secured. In this mounting apparatus, when the first component cannot be used, for example, when the component shape or the sampling state is inappropriate, the super-resolution processing is more reliably executed by holding the second component. be able to.

In the mounting apparatus according to the present disclosure, the mounting head includes a plurality of sampling units that collect components on the circumference, and the imaging unit includes all components held by the plurality of sampling units within the same field of view. It is good also as what picks up an image. In a so-called rotary head in which the collection unit is arranged on the circumference, it is highly significant to employ the configuration of the present disclosure because a plurality of parts are collected simultaneously.

In the mounting apparatus according to the present disclosure, the control unit determines one or more of the shape of the first component and the sampling position of the first component based on the image of the first component generated by the super-resolution processing. It may be a thing. In this mounting apparatus, it is possible to obtain a higher-quality image used for determining whether the shape of the component and the sampling position are appropriate, and to perform these determinations more accurately.

The information processing apparatus disclosed in this specification is:
A mounting system including a mounting apparatus that includes a mounting head that collects and moves a plurality of components and an imaging unit that captures an image of the components collected by the mounting head, and that performs a mounting process for placing the components on a substrate. An information processing apparatus used,
A setting unit that sets mounting condition information that causes the mounting head to collect both predetermined second components that serve as reference positions when the mounting head collects the first component that requires an image with a higher resolution than the captured image;
It is equipped with.

In the information processing apparatus according to the present disclosure, when the mounting head collects the first component that requires an image with a higher resolution than the captured image, the mounting condition information that causes the mounting head to collect both the predetermined second components that serve as the position reference is provided. Set. In the mounting apparatus, using the mounting condition information, an image including the first component and the second component is captured at a plurality of imaging positions, and the position of the second component is used as a reference position using the captured images. As described above, it is possible to execute a super-resolution process for generating an image of the first component having a higher resolution than the captured image. In this information processing apparatus, the image processing can be further simplified by omitting image processing other than components as much as possible in the mounting apparatus.

In the information processing apparatus according to the present disclosure, when the number of the second components is less than a predetermined value, the setting unit repeats the process of collecting and arranging the first component on the mounting head while holding the second component. The mounting condition information including information may be set. In the mounting apparatus, the number of the second components may be smaller than the number of the first components collected by the mounting head, and if the second components are arranged, the subsequent reference position may not be secured. In this information processing apparatus, the super-resolution processing can be executed more reliably in the mounting apparatus by setting the mounting condition information that keeps the second component held.

In the information processing apparatus according to the present disclosure, the setting unit holds the second component when the first component and the second component are collected by the mounting head and the first component is not used for mounting processing. The mounting condition information including information that causes the mounting head to collect a new first component may be set. In the mounting apparatus, the number of the second components may be smaller than the number of the first components collected by the mounting head, and if the second components are arranged, the subsequent reference position may not be secured. In this information processing apparatus, by setting the mounting condition information that keeps the second component held in advance, the first component cannot be used in the mounting apparatus, for example, when the component shape or the sampling state is inappropriate. However, the super-resolution processing can be executed more reliably.

The information processing apparatus according to an embodiment of the present disclosure includes a storage unit that stores correspondence information in which a component type of the second component is associated with the first component, and the setting unit includes the first information based on the correspondence information. The second component corresponding to one component may be selected. In this information processing apparatus, it is possible to select a more suitable second component for the first component by using the correspondence information.

The mounting system disclosed in this specification includes any of the mounting devices described above and any of the information processing devices described above. In this mounting system, similar to the mounting apparatus and information processing apparatus described above, the image processing can be further simplified when performing super-resolution processing that generates a high-resolution image using a plurality of images.

The implementation method disclosed in this specification is:
A mounting method that includes a mounting head that picks up and moves a plurality of components, and an imaging unit that captures an image, and executes a mounting process for arranging the components on a substrate,
(A) causing the mounting head to collect a first component that requires an image with a higher resolution than the captured image and a predetermined second component that serves as a reference for the position;
(B) causing the imaging unit to capture images including the first component and the second component collected by the mounting head at a plurality of imaging positions;
(C) performing a super-resolution process for generating an image of the first component having a higher resolution than the captured image using the plurality of captured images as the reference position of the second component; ,
Is included.

In the mounting method according to the present disclosure, similarly to the mounting apparatus described above, the image of the first component with high resolution is generated using the plurality of images using the plurality of captured images and the position of the second component as the reference position. Perform super-resolution processing. In this mounting method, the image processing can be further simplified by omitting image processing other than parts as much as possible. In this mounting method, various aspects of the mounting device described above may be adopted, and steps for realizing each function of the mounting device described above may be added.

The information processing method disclosed in this specification is:
A mounting system including a mounting apparatus that includes a mounting head that collects and moves a plurality of components and an imaging unit that captures an image of the components collected by the mounting head, and that performs a mounting process for placing the components on a substrate. An information processing method used,
A step of setting mounting condition information for causing the mounting head to sample together a predetermined second component that serves as a reference for a position when the mounting head collects the first component that requires an image having a higher resolution than the captured image;
Is included.

In the information processing method of the present disclosure, as with the information processing apparatus described above, when causing the mounting head to collect the first component that requires a higher resolution image than the captured image, the predetermined second component that serves as a reference for the position is used together. Set the mounting condition information to be collected by the mounting head. In the mounting apparatus, using the mounting condition information, an image including the first component and the second component is captured at a plurality of imaging positions, and the position of the second component is used as a reference position using the captured images. As described above, it is possible to execute super-resolution processing for generating an image of the first part with high resolution using a plurality of images. In this information processing method, the image processing can be further simplified by omitting image processing other than components as much as possible in the mounting apparatus. In this information processing method, various aspects of the information processing apparatus described above may be adopted, and steps for realizing each function of the information processing apparatus described above may be added.

The present invention can be used for an apparatus for performing a mounting process in which components are arranged on a substrate.

10 mounting system, 11 mounting device, 12 substrate processing unit, 13 mounting unit, 14 component supply unit, 15 imaging unit, 16 control unit, 17 CPU, 18 storage unit, 19 mounting condition information, 20 head moving unit, 21 mounting head , 21a to 21c holding unit, 22 suction nozzle, 24 nozzle storage unit, 25 holding unit storage unit, 30 management PC, 31 control device, 32 CPU, 33 storage unit, 34 component DB, 35 mounting condition information, 38 display, 39 Input device, 40 body part, 41 lead, 42 body part, 43 bump, 51, 51A, 51B first image, 52, 52A, 52B second image, 53, 53A, 53B third image, 54A, 54B super-resolution Image, P, P1, P2, Pa parts, S board.

Claims

A mounting device that executes a mounting process for placing components on a board,
A mounting head that picks up and moves multiple parts;
An imaging unit that captures an image of the component collected by the mounting head;
The mounting head picks up a first part that requires an image with a higher resolution than the captured image and a predetermined second part that serves as a reference for the position, and the first part and the second part that are picked up by the mounting head An image of the first component having a resolution higher than that of the captured image by causing the imaging unit to capture an image including the image at a plurality of imaging positions and using the plurality of captured images as a position of the second component. A control unit that executes super-resolution processing for generating
Mounting device.
The mounting device according to claim 1, wherein the second component has a size larger than that of the first component.
The mounting apparatus according to claim 1 or 2,
A storage unit that stores information regarding whether or not an image having a higher resolution than a captured image is required in a component collected by the mounting head;
The mounting unit is configured to perform the super-resolution processing based on information stored in the storage unit.
The control unit executes the super-resolution processing based on information stored in the storage unit when the mounting head collects the first component and the second component. The mounting apparatus described.
The storage unit stores mounting condition information set in advance so as to cause the mounting head to collect the second component together with the first component that requires an image having a higher resolution than the captured image,
The mounting apparatus according to claim 3 or 4, wherein the control unit executes the super-resolution processing based on the mounting condition information stored in the storage unit.
The storage unit includes the mounting condition information including information for repeating a process of collecting and arranging the first component on the mounting head while holding the second component when the number of the second components is less than a predetermined value. Remember,
The mounting device according to claim 5, wherein the control unit repeatedly executes a process of collecting and arranging the first component on the mounting head while holding the second component based on the mounting condition information.
When the first part and the second part are collected by the mounting head and the first part is not used for the mounting process, the control unit holds a new first part while holding the second part. The mounting apparatus according to claim 1, wherein the mounting head collects the mounting apparatus.
In the mounting head, a plurality of sampling parts for sampling components are arranged on the circumference,
The mounting apparatus according to any one of claims 1 to 7, wherein the imaging unit images all parts held by the plurality of sampling units within the same visual field.
The control unit according to any one of claims 1 to 8, wherein the control unit determines at least one of a shape of the first part and a sampling position of the first part based on an image of the first part generated by the super-resolution processing. The mounting apparatus of any one of Claims.
A mounting system including a mounting apparatus that includes a mounting head that collects and moves a plurality of components and an imaging unit that captures an image of the components collected by the mounting head, and that performs a mounting process for placing the components on a substrate. An information processing apparatus used,
A setting unit that sets mounting condition information that causes the mounting head to collect both predetermined second components that serve as reference positions when the mounting head collects the first component that requires an image with a higher resolution than the captured image;
An information processing apparatus comprising:
When the number of the second components is less than a predetermined value, the setting unit includes the mounting condition information including information for repeating the process of collecting and arranging the first component on the mounting head while holding the second component. The information processing apparatus according to claim 10, wherein the information processing apparatus is set.
When the setting unit does not use the first component for mounting processing after the first component and the second component are sampled by the mounting head, the setting unit holds a new first component while holding the second component. The information processing apparatus according to claim 10 or 11, wherein the mounting condition information including information to be collected by the mounting head is set.
The information processing apparatus according to any one of claims 10 to 12,
A storage unit that stores correspondence information in which a component type of the second component is associated with the first component;
The information processing apparatus, wherein the setting unit selects the second part corresponding to the first part based on the correspondence information.
The mounting apparatus according to any one of claims 1 to 9,
The information processing apparatus according to any one of claims 10 to 13,
Implementation system with
A mounting method that includes a mounting head that picks up and moves a plurality of components, and an imaging unit that captures an image, and executes a mounting process for arranging the components on a substrate,
(A) causing the mounting head to collect a first component that requires an image with a higher resolution than the captured image and a predetermined second component that serves as a reference for the position;
(B) causing the imaging unit to capture images including the first component and the second component collected by the mounting head at a plurality of imaging positions;
(C) performing a super-resolution process for generating an image of the first component having a higher resolution than the captured image using the plurality of captured images as the reference position of the second component; ,
Implementation method including
A mounting system including a mounting apparatus that includes a mounting head that collects and moves a plurality of components and an imaging unit that captures an image of the components collected by the mounting head, and that performs a mounting process for placing the components on a substrate. An information processing method used,
A step of setting mounting condition information for causing the mounting head to sample together a predetermined second component that serves as a reference for a position when the mounting head collects the first component that requires an image having a higher resolution than the captured image;
An information processing method including: