JP2023119106A - Control device, mounting device, and image processing method - Google Patents

Abstract

To more appropriately correct defective pixels when generating an image with higher image quality.SOLUTION: A control device is used in a mounting system including a mounting device that includes an imaging unit that captures an image of an object and that executes mounting processing. This control device includes a control unit that obtains a first image of an object and a second image of the object at a position shifted by more than one pixel from the first image, and executes super-resolution processing for generating a high-resolution image having higher resolution than the first image and the second image by using at least the first corrected image in which defective pixels included in the first image are corrected using pixels at the same position in the second image.SELECTED DRAWING: Figure 1

Description

This specification discloses a control device, a mounting device, and an image processing method.

Conventionally, as an image processing method, a defect image is detected based on data read from a memory storing data on the position of a defective pixel included in an imaging unit and the defect component level included in the output signal thereof, and on the usage status of the video camera. A technique for generating a correction signal and performing defect correction on an output signal has been proposed (see, for example, Patent Document 1). According to this image processing method, it is possible to appropriately correct image defects such as white defects and black defects, the defect level of which changes depending on changes in usage information.

JP-A-10-56596

By the way, a mounting apparatus that places a component on a board sometimes requires a higher quality image in the position determination process when picking up the component. Further, an imaging unit that captures an image may have a defective pixel as described in Japanese Patent Application Laid-Open No. 2002-200012. In this way, there has been a demand for more appropriate correction of defective pixels when generating images of higher quality.

The invention disclosed in the present specification has been made in view of such problems, and is capable of more appropriately correcting defective pixels when generating a higher quality image. The main purpose is to provide a processing method.

The invention disclosed in this specification has taken the following measures to achieve the above-mentioned main object.

The control device disclosed herein is
A control device used in a mounting system including a mounting device and having an imaging unit for imaging an object,
obtaining a first image of an object and a second image of the object at a position shifted by more than one pixel from the first image; A control unit that generates a high-resolution image having higher resolution than the first image and the second image by using at least the first corrected image in which defects are corrected using pixels at the same position in the image;
is provided.

With this control device, defective pixels can be corrected more appropriately when generating a higher quality image.

1 is a schematic explanatory diagram showing an example of a mounting system 10; FIG. FIG. 2 is an explanatory diagram of a mounting unit 20 and an imaging unit 18; 4 is a flowchart showing an example of an implementation processing routine; FIG. 5 is an explanatory diagram of an example of a first image 51 and a second image 61; Explanatory drawing which shows an example of the defect correction process of a picked-up image, and a super-resolution process. Explanatory diagram for generating a high-resolution image. FIG. 4 is an explanatory diagram showing an example of conventional interpolation processing for interpolating defective pixels; 6 is a flowchart showing an example of another implementation processing routine;

This embodiment will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram of a mounting system 10 that is an example of the present disclosure. FIG. 2 is an explanatory diagram showing an example of the mounting unit 20 and the imaging unit 18. As shown in FIG. The mounting system 10 is, for example, a system that executes a process of mounting a component P as an object to be imaged on a substrate S as a base material. The mounting system 10 includes a mounting device 11, a management device 40, and a printing device, a printing inspection device, a mounting inspection device, a conveying device, a reflow device, and the like (not shown). The mounting system 10 is configured as a mounting line in which a plurality of mounting apparatuses 11 that perform a mounting process of mounting a component P on a board S are arranged from upstream to downstream. In this embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS. Parts P1, Pa (see FIG. 2) and the like are collectively referred to as parts P.

The mounting apparatus 11 includes a substrate processing section 12, a component supply section 14, an imaging section 18, a mounting section 20, and a control device 30, as shown in FIG. The substrate processing section 12 is a unit that carries in, transports, fixes at a mounting position, and carries out the substrate S as a base material. The substrate includes a plate-shaped substrate S, a member having a three-dimensional shape, and the like.

The component supply unit 14 is a unit that supplies components P to the mounting unit 20 . A plurality of feeders 15 having tapes holding the components P are mounted on the component supply section 14 . This feeder 15 feeds the parts P held on the tape to a picking position. The component supply section 14 may include a tray unit having a tray 16 on which a plurality of components are arranged and placed. The components P used in the mounting apparatus 11 include components P1, Pa, etc., as shown in FIG. Here, the part P1 and the part Pa are collectively referred to as the part P. As shown in FIG. The part P1 is a fine chip part. The component Pa is, for example, a component having a size larger than that of the component P1, and has a plate-like body portion 37 and bumps 38, which are fine portions. The body portion 37 is a plate-like member that incorporates the function of the component Pa. A large number of bumps 38 are electrodes arranged on the lower portion of the body portion 37 . For this component Pa, it is necessary to confirm the shape and presence of the bumps 38 during the mounting process.

The imaging unit 18 is a device that captures an image, and is a parts camera that captures an image of one or more components P picked and held by the mounting head 22 . The imaging section 18 is arranged between the component supply section 14 and the substrate processing section 12 . The imaging range of the imaging unit 18 is above the imaging unit 18 . The imaging unit 18 includes an illumination unit, an imaging device, and an image processing unit. The illumination unit is configured to irradiate light upward and irradiate the component P held by the mounting head 22 with the light. An imaging device is a device that generates electric charge by receiving light and outputs the generated electric charge. The imaging device may be a CMOS image sensor capable of performing high-speed continuous capture processing by overlapping charge transfer processing after exposure and exposure processing for the next image. The image processing unit performs processing for generating image data based on the input charges. When the mounting head 22 holding the component P passes above the imaging section 18, the imaging section 18 captures one or more images while the mounting head 22 is moving or in a state where the mounting head 22 is stopped. and outputs the captured image data to the control device 30 .

The mounting section 20 is a unit that picks up the component P from the component supply section 14 and places it on the substrate S fixed to the substrate processing section 12 . The mounting section 20 includes a head moving section 21 , a mounting head 22 and a picking member 23 . The head moving unit 21 includes a slider that is guided by guide rails and moves in the XY directions, and a motor that drives the slider. The mounting head 22 picks up a plurality of components and moves them in the XY directions by the head moving section 21 . The mounting head 22 is detachably attached to the slider. One or more sampling members 23 are detachably attached to the lower surface of the mounting head 22 . In the mounting head 22, a plurality of picking members 23 for picking up the component P are arranged on the circumference (see FIG. 2). The picking member 23 may be a nozzle that picks up a component using negative pressure. The sampling member 23 may be a nozzle or a mechanical chuck that mechanically holds the component P.

The control device 30 is configured as a microprocessor centered on a control section 31 including a CPU, and includes a storage section 32 for storing various data. The control device 30 outputs control signals to the substrate processing section 12 , the component supply section 14 , the imaging section 18 and the mounting section 20 and receives signals from the component supply section 14 , the imaging section 18 and the mounting section 20 . The storage unit 32 stores mounting condition information 33 including the arrangement order and arrangement position of the components P to be mounted on the board S. FIG. The mounting condition information 33 includes the picking order, arrangement order, identification information (ID) of the parts P, super-resolution processing conditions, imaging conditions, and arrangement positions (coordinates) on the board S when the parts P are mounted. including information. Note that super-resolution processing refers to processing for generating a high-quality image from a plurality of captured images (for example, multi-frame super-resolution processing, etc.). Further, the high-quality image obtained by this super-resolution processing is used for detection of the picking deviation amount of the component P when it is picked by the mounting head 22 and for abnormality inspection of the parts of the component P (such as the bumps 38). be done. Here, the "high-quality image" refers to an image from which a correct position result can be obtained with a higher probability, such as an image with less noise or an image with a higher resolution. The defect position information 34 includes information specifying an image pickup device having a defective pixel among the image pickup devices of the imaging unit 18 . The defect position information 34 includes, for example, the number (identifier) of the image sensor and the position of the image sensor as information for specifying the position of the defective pixel.

The management device 40 is a computer that manages information on each device of the mounting system 10 . The management device 40 includes, as shown in FIG. 1, a control section 41, a storage section 42, a display section, and an input device. The control unit 41 is configured as a microprocessor centering on a CPU. The storage unit 42 is a device such as an HDD that stores various data such as processing programs. The display unit is a liquid crystal screen that displays various information. The input device includes a keyboard, mouse, etc., through which the operator inputs various commands.

Next, the operation of the mounting system 10 of this embodiment configured in this manner, particularly the mounting process for placing the component P on the board S, will be described. FIG. 5 is a flowchart showing an example of a mounting processing routine executed by the control section 31 of the mounting apparatus 11. As shown in FIG. This routine is stored in the storage unit 32 and executed based on the operator's input to start mounting. Here, a process in which the control device 30 performs super-resolution processing on a part Pa having bumps 38 will be described as an example. When this routine is started, the control unit 31 first reads and acquires the mounting condition information 33 from the storage unit 32 (S100), and causes the substrate processing unit 12 to carry out the processing of transporting and fixing the substrate S (S110). . Next, the control unit 31 sets the components P to be picked up by the picking member 23 based on the arrangement order of the mounting condition information 33 (S120). Next, the control unit 31 mounts or replaces the picking member 23 as necessary, and causes the mounting unit 20 to pick up and move one or more components P (S130). At this time, the control unit 31 moves the mounting head 22 so as to pass over the imaging unit 18 .

Next, the control unit 31 determines whether or not there is a component P that requires super-resolution processing among the components picked up by the mounting head 22 (S140). For example, when a specific component P such as a component Pa is collected by the mounting head 22, the control unit 31 determines that there is a component P that requires super-resolution processing. When there is no component P that requires super-resolution, the control unit 31 causes the imaging unit 18 to process the captured image of the component P (S150), and detects the deviation amount of the component P from the captured image (S210). . Here, the position of the component P is determined from the picked-up image, and the picking position deviation amount and angle deviation amount of the component P are detected using the result.

On the other hand, when there is a component P having super-resolution processing in S140, the control unit 31 causes the imaging unit 18 to process images at a plurality of imaging positions shifted by more than one pixel (S170). For example, the control unit 31 captures the first image and the second image at positions shifted by 5 pixels or more or 10 pixels or more in the X-axis direction and/or the Y-axis direction. At this time, the mounting head 22 may be stopped each time the imaging process is performed, or the imaging process may be performed multiple times while moving the mounting head 22 . Note that here, a case of obtaining captured images at two imaging positions will be mainly described.

4A and 4B are explanatory diagrams of captured images, in which FIG. 4A is an explanatory diagram of an example of the first image 51 and FIG. 4B is an explanatory diagram of an example of the second image 61. FIG. FIG. 4 shows an example in which the mounting head 22 is imaged at a position shifted by about 5.5 pixels in the XY axis direction. Note that the order in which the first image 51 and the second image 61 are captured is not particularly limited, and either one may be captured first. Here, the terms "first" and "second" do not indicate the acquisition order, but are used to specify each image. The first image 51 includes a component area 52 , bumps 53 and defective pixels 55 . The bumps 53 are included inside the component area 52 . A defective pixel 55 appears at the location of the imager having a defect. The control unit 31 may set the reference pattern 54 in the component region 52 based on the shape of the body portion 37 such as the central position of the body portion 37 . The reference pattern 54 is arranged in the center of the component area 52 and used as a reference point for the relative position with respect to the defective pixel 55 . Similarly, the second image 61 includes a component area 62 , bumps 63 , reference patterns 64 and defective pixels 65 . As shown in FIG. 4, the controller 30 largely shifts the position of the mounting head 22 to greatly change the position of the defective pixel existing in the captured image.

Next, the control unit 31 performs defect correction by replacing the defective pixel 55 of the first image 51 with the value of the pixel at the same position of the second image 61 (S180), and the defective pixel 65 of the second image 61 is corrected. is replaced with the value of the pixel at the same position in the first image 51 (S190). Note that when there is no defective pixel in the imaging element of the imaging unit 18, the control unit 31 can omit the processes of S180 and S190. 5A and 5B are explanatory diagrams showing an example of defect correction processing and super-resolution processing of a captured image. FIG. 5A is a diagram of defect pixel correction processing, and FIG. A diagram of the corrected image 68, and FIG. 5C is an explanatory diagram of the high-resolution image 70. FIG. FIG. 5 shows the parts area 52 and the parts area 62 of the first image 51 and the parts area 52 . As shown in FIG. 5A, the control unit 31 replaces the defective pixel 55 of the first image 51 with the pixel value corresponding to the same position of the second image 61, and likewise replaces the defective pixel 65 of the second image 61 with the pixel value of the first image 51. are replaced with pixel values corresponding to the same positions, and restored as a first corrected image 58 and a second corrected image 68, respectively, as shown in FIG. 5B.

Subsequently, the control unit 31 uses the first corrected image 58 and the second corrected image 68 in which the defective pixels 55 and 65 have been corrected to obtain a higher resolution than the first image 51 and the second image 61, which are captured images. A super-resolution process for generating a high-resolution image 70 with high resolution is executed (S200). In this super-resolution processing, the control unit 31 uses a plurality of images to obtain an accurate amount of movement between the first corrected image 58 and the second corrected image 68, generates a provisional high-quality image, and generates a provisional high-quality image. A blur estimation process and a reconstruction process are performed on the image to generate an image with a higher resolution than the captured image. FIGS. 6A and 6B are explanatory diagrams of super-resolution processing, FIG. 6A being a conceptual diagram of a low-quality image, and FIG. 6B being a conceptual diagram of a high-resolution image 70 obtained by superimposing the low-quality images. As shown in FIG. 6B, when the low-quality images are superimposed by shifting the pixel pitch range other than an integer (for example, 0.5 pixels, 1.5 pixels, etc.), the information between pixels is increased. be able to. In addition, since an actually captured image is used, a highly reliable high-resolution image can be generated compared to simply estimating and interpolating information between pixels (see FIG. 5C).

After obtaining the high-resolution image 70 in S200, the control unit 31 detects the deviation amount of the component P from the high-resolution image 70 in S210. Further, the control unit 31 may use the high-resolution image 70 to check the shapes and positions of the main body 37 and the bumps 38 . The control unit 31 can obtain either the displacement amount of the component P based on the high-resolution image through S160 to S200 or the displacement amount of the component P based on the captured image through S150. After S210, the control unit 31 arranges the part P at the position where the detected deviation amount is corrected (S220). After S220, the control unit 31 determines whether or not the mounting process for the current board has been completed (S230), and if not completed, executes the processes after S120. That is, the control unit 31 sets the component P to be picked next, replaces the picking member 23 as necessary, picks up an image of the component P, corrects the deviation amount, and arranges it on the substrate S. FIG. On the other hand, when the mounting process of the current board is completed in S230, the control section 31 causes the board processing section 12 to discharge the board S that has been mounted (S240), and determines whether or not the production is completed (S250). If the production has not been completed, the control unit 31 executes the processing from S110 onwards, while if the production has been completed, the routine ends as it is. In this manner, the mounting apparatus 11 performs the mounting process while obtaining the position determination result of the component P using the high resolution image 70 with high image quality.

Here, correspondence relationships between the components of the present embodiment and the components of the present disclosure will be clarified. The control device 30 of this embodiment corresponds to the control device of the present disclosure, the control unit 31 corresponds to the control unit, the imaging unit 18 corresponds to the imaging unit, the mounting unit 20 corresponds to the mounting unit, and the mounting device 11 corresponds to the mounting apparatus, and the mounting system 10 corresponds to the mounting system. Also, the first image 51 corresponds to the first image, the second image 61 corresponds to the second image, the defective pixels 55 and 65 correspond to defective pixels, and the first corrected image 58 corresponds to the first corrected image. The second corrected image 68 corresponds to the second corrected image, the high resolution image 70 corresponds to the high resolution image, and the reference patterns 54 and 64 correspond to the reference patterns. In addition, in this embodiment, an example of the image processing method of the present disclosure is also clarified by explaining the operations of the control device 30 and the mounting device 11 .

The control device 30 of the embodiment described above captures the component P at a position where the defective pixel 55 included in the first image 51 capturing the component P as the object is shifted from the first image 51 by more than one pixel. Defect correction is performed using pixels at the same positions in the second image 61, and super-resolution processing is performed to generate a high-resolution image 70 with higher resolution using at least the first corrected image 58 after the defect correction. In this control device 30, by using the first image 51 and the second image 61 that are shifted by more than one pixel, it is possible to further suppress overlapping of defective pixels in a plurality of captured images. can be filled. Therefore, the controller 30 can more appropriately correct the defective pixels 55 and 65 when generating an image of higher quality.

Further, the control device 30 includes a storage unit 32 that stores defect position information 34 including positions of pixel defects in the imaging unit 18, and the control unit 31 acquires the position of the defective pixel from the defect position information 34 and corrects the defect. do. The control device 30 can determine the position of the defective pixel using the defect position information 34 prepared in advance. Furthermore, the control unit 31 obtains the positions of the defective pixels 55 and 65 based on the positions of the reference patterns 54 and 64 included in the first image 51 and the second image 61, respectively. The controller 30 can acquire the positions of the defective pixels 55 and 65 from the positions of the reference patterns 54 and 64 . Furthermore, the control unit 31 acquires the second image 61 at a position shifted by more than a plurality of pixels with respect to the first image 51 . In the control device 30, the first image 51 and the second image 61 are acquired at positions separated by, for example, 5 pixels or more or 10 pixels or more, so that the defective pixels 55 and 65 can be corrected more reliably. can be done.

Further, the control unit 31 does not perform interpolation processing using values of pixels adjacent to the defective pixels 55 and 65 for the defective pixels 55 and 65 . FIGS. 7A and 7B are explanatory diagrams showing an example of conventional interpolation processing for interpolating defective pixels, FIG. 7A being an explanatory diagram of the first image 51, and FIG. FIG. 7C is a diagram of a first corrected image 158 and a second corrected image 168 including interpolated pixels 155 and 165, and FIG. 7D is a diagram of a high resolution image 170 obtained from the first corrected image 158 and the second corrected image 168. is. As shown in FIG. 7, when the control unit 31 directly interpolates the defective pixels 55 and 65, these are corrected to interpolated pixels 155 and 165 having intermediate values. If this interpolated pixel exists in the component regions 52 and 62, the corrected pixel may have a large effect in some cases, such as emphasizing a pixel that does not exist in the object, such as the interpolated pixel 175 of the high-resolution image 170. As a result, even though the super-resolution processing has been performed, there is a risk that the recognition accuracy in the image processing may be lowered. This control device 30 can prevent deterioration of image recognition accuracy by not performing interpolation processing.

The mounting apparatus 11 also includes an imaging unit 18 that images a component P as an object, a mounting unit 20 that arranges the component P on a substrate S as a base material, and the control device 30 described above. Since the mounting apparatus 11 includes the control device 30 described above, it is possible to more appropriately correct defective pixels when generating a higher quality image.

It goes without saying that the present disclosure is not limited to the above-described embodiments, and can be implemented in various forms as long as they fall within the technical scope of the present disclosure.

For example, in the above-described embodiment, the first corrected image 58 and the second corrected image 68 obtained by correcting the defective pixels 55 and 65 are used when super-resolution processing is performed, but the present invention is not particularly limited to this. The control unit 31 may perform super-resolution processing using the first corrected image 58 and the second image 61, or may perform super-resolution processing using the first image 51 and the second corrected image 68. may be executed. FIG. 8 is a flow chart showing an example of another implementation processing routine. This flowchart is obtained by partially modifying the mounting processing routine of FIG. 3, and the same steps as in the mounting processing routine are given the same numbers, and detailed description thereof will be omitted. In the mounting process of FIG. 8, the control unit 31 performs image processing centering on the component areas 52 and 62. FIG. After processing the captured images at a plurality of positions in S170, the control unit 31 extracts the component regions 52 and 62 (S300), and determines whether the defective pixel 55 is included in the component region 52 of the first image 51. A determination is made based on the defect position information 34 (S310). When there is a defective pixel 55 in the component region 52, the control section 31 corrects the defective pixel 55 in the first image 51 with the pixel in the same position in the second image 61 in S180. After S180, or when there is no defective pixel 55 in the component region 52 of the first image 51 in S310, the control unit 31 determines whether the defective pixel 65 is included in the component region 62 of the second image 61. 34 (S320). When there is a defective pixel 65 in the component region 62, the control unit 31 corrects the defective pixel 55 in the first image 51 with the pixel in the second image 61 at the same position in S190. After S190, or when there is no defective pixel 65 in the component area 62 in S320, super-resolution processing is executed in S200. At this time, the control unit 31 executes the super-resolution processing using the component region of the first corrected image 58 and the component region 62 of the second image 61 when there is no defective pixel 65 only in the component region 62 . On the other hand, when there is no defective pixel 55 only in the component area 52 , the control unit 31 performs super-resolution processing using the component area 52 of the first image 51 and the component area of the second corrected image 68 . In this way, when super-resolution processing is performed using a partial area of the captured image, defect correction can be omitted depending on the position of the defective pixel.

In the above-described embodiment, the control unit 31 executes the super-resolution processing using the reference patterns 54 and 64, but is not particularly limited to this, and may be omitted. The positions of the defective pixels 55 and 65 can be specified from the specific positions of the second image 61 in the first image 51 .

In the above-described embodiment, super-resolution processing is performed using two captured images, but the present invention is not particularly limited to this, and super-resolution processing may be performed using three or more captured images. . At this time, for example, the control unit 31 corrects defective pixels in the first image by using pixels at the same positions in the second image, and corrects defective pixels in the second image by using pixels at the same positions in the third image. Defect correction may be performed, and defective pixels in the third image may be corrected using pixels at the same positions in the first image. That is, the control unit 31 preferably performs defect correction using pixels that do not overlap as much as possible.

In the above-described embodiment, when the first image 51 and the second image 61 are obtained, the shift exceeds a plurality of pixels, such as 5 pixels or more, but there is no particular limitation as long as the shift exceeds 1 pixel. If it exceeds one pixel, it is rare that the positions of defective pixels overlap in a plurality of captured images, and defect correction can be performed.

In the above-described embodiment, the captured image for super-resolution processing is described as being captured by the imaging unit 18 of the mounting apparatus 11, but is not particularly limited to this. The image captured by the mark camera may be subjected to super-resolution processing, or the image captured by the imaging unit of the printing inspection device or the mounting inspection device may be subjected to super-resolution processing. Objects to be imaged include parts P used in the mounting process and the entire image of the base material, parts of the parts (for example, electrodes, leads, bumps, etc.), parts of the base material, and and a marked portion (for example, a mark).

In the above-described embodiment, the mounting apparatus 11 includes the control device 30 and performs super-resolution processing. The super-resolution processing may be performed by the control device of another device, or the super-resolution processing may be performed by performing defect correction on the captured image. Further, in the above-described embodiment, defect correction and super-resolution processing are performed when mounting processing is performed. Defect correction and super-resolution processing may be executed in processing other than mounting processing, such as during mounting inspection. Even in this way, the control device can more appropriately correct defective pixels when generating a higher quality image.

Further, in the above-described embodiment, the present disclosure has been described as the control device 30, the mounting device 11, and the mounting system 10, but for example, it may be an image processing method, or a program for executing the above-described processing by a computer.

Here, the present disclosure may be configured as follows. For example, the image processing method of the present disclosure is
An image processing method used in a mounting system including a mounting device and having an imaging unit for imaging an object,
(a) obtaining a first image of an object and a second image of the object at a position shifted from the first image by more than one pixel;
(b) using at least a first corrected image in which defective pixels included in the first image are corrected using pixels at the same positions in the second image; generating a resolution image;
includes.

This image processing method can fill in defective pixels by using the first image and the second image that are shifted by more than one pixel, as in the control device described above, and can generate an image of higher quality. In addition, defective pixels can be corrected more appropriately. In this image processing method, various aspects of the above-described control device may be employed, and steps may be added to realize each function of the above-described control device.

INDUSTRIAL APPLICABILITY The present disclosure can be used for a device that performs mounting processing for arranging components on a board.

REFERENCE SIGNS LIST 10 mounting system 11 mounting apparatus 12 substrate processing section 14 component supply section 15 feeder 16 tray 18 imaging section 20 mounting section 21 head moving section 22 mounting head 23 suction nozzle 30 control device 31 Control unit 32 Storage unit 33 Mounting condition information 34 Defect position information 37 Main unit 38 Bump 40 Host PC 41 Control unit 42 Storage unit 51 First image 52 Component area 53 Bump 54 Reference pattern, 55 defective pixel, 58 first corrected image, 61 second image, 62 component area, 63 bump, 64 reference pattern, 65 defective pixel, 68 second corrected image, 70 high resolution image, 155 interpolated pixel, 158 first corrected image, 165 interpolated pixel, 168 second corrected image, 170 high-resolution image, 175 interpolated pixel, P, P1, Pa component, S substrate.

Claims (8)

A control device used in a mounting system including a mounting device and having an imaging unit for imaging an object,
obtaining a first image of an object and a second image of the object at a position shifted by more than one pixel from the first image; A control unit that performs super-resolution processing to generate a high-resolution image having a higher resolution than the first image and the second image using at least the first corrected image in which defects are corrected using pixels at the same position in the image;
control device with 2. The control unit executes the super-resolution processing further using a second corrected image in which defective pixels included in the second image are corrected using pixels at the same positions in the first image. The control device according to . The control device according to claim 1 or 2,
a storage unit that stores defect position information including the pixel defect position of the imaging unit;
The control device, wherein the control unit acquires the position of the defective pixel from the defect position information and corrects the defect. 4. The control device according to any one of claims 1 to 3, wherein said control unit acquires the positions of said defective pixels based on the positions of reference patterns included in said first image and said second image. 5. The control device according to claim 1, wherein said control unit does not perform interpolation processing on said defective pixel using values of pixels adjacent to said defective pixel. The control device according to any one of claims 1 to 5, wherein the control unit acquires the second image at a position shifted by more than a plurality of pixels with respect to the first image. an imaging unit that images an object;
a mounting unit for arranging components on a base material;
A control device according to any one of claims 1 to 6,
Mounting equipment with An image processing method used in a mounting system including a mounting device and having an imaging unit for imaging an object,
(a) obtaining a first image of an object and a second image of the object at a position shifted from the first image by more than one pixel;
(b) using at least a first corrected image in which defective pixels included in the first image are corrected using pixels at the same positions in the second image; generating a resolution image;
An image processing method including

Images