CN103333623B - 一种热压合胶膜及其制备方法 - Google Patents
一种热压合胶膜及其制备方法 Download PDFInfo
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- CN103333623B CN103333623B CN201310264782.5A CN201310264782A CN103333623B CN 103333623 B CN103333623 B CN 103333623B CN 201310264782 A CN201310264782 A CN 201310264782A CN 103333623 B CN103333623 B CN 103333623B
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- parts
- component
- curing agent
- adhesive film
- epoxy resin
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 58
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 40
- 239000003822 epoxy resin Substances 0.000 claims abstract description 22
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- 239000003085 diluting agent Substances 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 239000004952 Polyamide Substances 0.000 claims abstract description 8
- 229920002647 polyamide Polymers 0.000 claims abstract description 8
- 239000000945 filler Substances 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 238000007731 hot pressing Methods 0.000 claims description 19
- 238000005303 weighing Methods 0.000 claims description 19
- 238000002156 mixing Methods 0.000 claims description 11
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 150000001412 amines Chemical class 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 7
- 239000003365 glass fiber Substances 0.000 claims description 7
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 6
- 229920000570 polyether Polymers 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 150000002894 organic compounds Chemical class 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 claims description 2
- 239000004202 carbamide Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- -1 urea compound Chemical class 0.000 claims description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- 125000002883 imidazolyl group Chemical group 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 description 25
- 239000000853 adhesive Substances 0.000 description 24
- 238000012360 testing method Methods 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 3
- 241000189662 Calla Species 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310264782.5A CN103333623B (zh) | 2013-06-27 | 2013-06-27 | 一种热压合胶膜及其制备方法 |
Applications Claiming Priority (1)
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CN201310264782.5A CN103333623B (zh) | 2013-06-27 | 2013-06-27 | 一种热压合胶膜及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN103333623A CN103333623A (zh) | 2013-10-02 |
CN103333623B true CN103333623B (zh) | 2014-05-28 |
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CN201310264782.5A Expired - Fee Related CN103333623B (zh) | 2013-06-27 | 2013-06-27 | 一种热压合胶膜及其制备方法 |
Country Status (1)
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CN (1) | CN103333623B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106590453B (zh) * | 2016-12-20 | 2018-09-21 | 广东亚太新材料科技有限公司 | 一种复合材料抗分层复合胶胶膜及其制备方法 |
CN107325777B (zh) * | 2017-07-03 | 2020-07-10 | 上海都昱新材料科技有限公司 | 一种复合地板用聚氨酯胶粘剂及其制备方法 |
CN109321186B (zh) * | 2018-10-15 | 2021-03-26 | 航天材料及工艺研究所 | 一种半固化环氧胶膜及其制备方法和使用 |
CN109679290A (zh) * | 2019-01-04 | 2019-04-26 | 许飞 | 一种航标浮鼓用玻璃钢材料及其制备方法 |
CN111592849B (zh) * | 2020-07-02 | 2022-04-08 | 青岛德聚胶接技术有限公司 | 一种半固化环氧胶膜及其制备方法 |
CN113652187A (zh) * | 2021-08-20 | 2021-11-16 | 杭州固安科技有限公司 | 一种高弹性改性环氧封缝胶 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102504742A (zh) * | 2011-11-02 | 2012-06-20 | 核工业理化工程研究院 | 一种室温快速固化粘接胶 |
CN102627930A (zh) * | 2012-03-23 | 2012-08-08 | 烟台德邦科技有限公司 | 一种风轮叶片用环氧结构胶及其制备方法 |
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2013
- 2013-06-27 CN CN201310264782.5A patent/CN103333623B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102504742A (zh) * | 2011-11-02 | 2012-06-20 | 核工业理化工程研究院 | 一种室温快速固化粘接胶 |
CN102627930A (zh) * | 2012-03-23 | 2012-08-08 | 烟台德邦科技有限公司 | 一种风轮叶片用环氧结构胶及其制备方法 |
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CN103333623A (zh) | 2013-10-02 |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20131002 Assignee: WEISHIDA SEMICONDUCTOR TECHNOLOGY (ZHANGJIAGANG) CO., LTD. Assignor: Yantai Darbond Technology Co., Ltd. Contract record no.: 2014990000766 Denomination of invention: Hot-pressed adhesive film and preparation method thereof Granted publication date: 20140528 License type: Exclusive License Record date: 20140924 |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20140528 Termination date: 20200627 |