CN103329186A - Heat sink, circuit board, and image display apparatus - Google Patents
Heat sink, circuit board, and image display apparatus Download PDFInfo
- Publication number
- CN103329186A CN103329186A CN2012800053050A CN201280005305A CN103329186A CN 103329186 A CN103329186 A CN 103329186A CN 2012800053050 A CN2012800053050 A CN 2012800053050A CN 201280005305 A CN201280005305 A CN 201280005305A CN 103329186 A CN103329186 A CN 103329186A
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- Prior art keywords
- heat sink
- circuit substrate
- bonding region
- electronic unit
- scolder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
In order to provide a heat sink, which suppresses increase of cost and steps needed to manufacture an image display apparatus, and which can be more stably attached to a circuit board, the heat sink to be mounted on the circuit board is provided with an opening, and solder bonding regions that are provided on both the sides of the opening. The heat sink has such a shape that the opening is surrounded by the circuit board and by the heat sink when the solder bonding regions are bonded to the circuit board, and that a ventilation tunnel having one end portion and the other end portion opened is formed.
Description
Technical field
The present invention relates to heat sink, the circuit substrate of installing on the surface of circuit substrate and the image display device that utilizes these.
Background technology
Image display device has housing, and this housing comprises front framework and back cover.In the inside of housing, take in the chassis component of image display being installed, having been driven the driving circuit of this image display.
As image display, representational have a Plasmia indicating panel.And the thickness of this image display is about several mm.
But, even if the thinner thickness of these image displays, but the thickness of image display device is decided by the size of electronic unit or miscellaneous part, the heat sink that must arrange for the heating of tackling electronic unit etc.
For example, for the plasma display system that has utilized Plasmia indicating panel, its thickness is about 10cm.
Proposed so that utilized the technology (for example with reference to patent documentation 1 reference) of the image display device slimming of image display.Disclose following structure in the patent documentation 1: the electronic unit of the insert type of heating is installed on the heat sink of special shape in the time of will working, and this heat sink is installed on circuit substrate with electronic unit.
Moreover, the electronic unit of so-called insert type, thus the through hole that to be the pin of electronic unit or lead-in wire etc. be arranged on circuit substrate by insertion is installed in the electronic unit of circuit substrate.
In order to make the further slimming of image display device, as long as the electronic unit of insert type is changed to the electronic unit of surface installing type.
Moreover the electronic unit of so-called surface installing type is to be adhered to the assembly area on the surface that is arranged on circuit substrate, to be installed in the electronic unit on the surface of circuit substrate in the mode that does not adopt through hole by scolder etc.
But the electronic unit of heating need to assemble heat sink during for work on the electronic unit on the surface that is installed on circuit substrate.And this heat sink utilizes the parts of splicing tape, bonding agent or screw etc. to be assemblied in electronic unit.
But, the reason that the manufacturing correlative charges that utilizes these parts can become image display device rises.In addition, when making image display device, also can produce the operation that heat sink is assemblied in electronic unit.In addition, when using splicing tape for heat sink is assemblied in electronic unit, although can realize the minimizing of operation than the situation that adopts screw or bonding agent etc., sometimes there is this problem that heat sink comes off when carrying out other operations.
For this reason, the Charges that relates to when seeking to be suppressed at the manufacturing image display device uses, the increase in man-hour, can more stably be assemblied in the heat sink of circuit substrate.
[formerly Ji Intraoperative document]
[patent documentation]
[patent documentation 1] TOHKEMY 2011-13596 communique
Summary of the invention
The present invention relates to be installed in the heat sink on the surface of circuit substrate, this heat sink has following shape.The scolder bonding region that this heat sink has peristome and arranges in the both sides of peristome.And this heat sink forms peristome by circuit substrate and the encirclement of this heat sink and an end and another open-ended ventiduct at circuit substrate when the scolder bonding region is adhered to circuit substrate.
By this structure, can suppress the related expense of the manufacturing of image display device, the increase in man-hour, can realize more stably being assemblied in the heat sink of circuit substrate.
The present invention relates to install the circuit substrate of heat sink and electronic unit.At this circuit substrate, the distance that separates regulation with the electronic unit that dispels the heat by this heat sink is installed heat sink, the scolder bonding region that this heat sink has peristome and arranges in the both sides of peristome, when the scolder bonding region is adhered to this circuit substrate, form by this circuit substrate and heat sink encirclement and an end and another open-ended ventiduct at this circuit substrate.And this circuit substrate has the heat sink bonding region of bonding heat sink, allows it be configured in and connects heat sink and the line of the electronic unit that becomes the heat radiation object and the position that derivative line intersects on the bearing of trend of ventiduct.
Zone at the scolder bonding region that is used for bonding heat sink of circuit substrate setting can be that a plurality of zones with the rectangular shape of extending are in one direction formed by configured in parallel.
Also can become unidirectional mode according to ventiduct, with a plurality of region divisions of the scolder bonding region of bonding heat sink at circuit substrate.
The present invention relates to possess image display and the driving circuit that is used for driving image display has been installed and the image display device of the circuit substrate of heat sink.The scolder bonding region that heat sink has peristome and arranges in the both sides of peristome has the formation peristome by circuit substrate when the scolder bonding region is adhered to circuit substrate and heat sink surrounds and the shape of an end and another open-ended ventiduct.In the circuit substrate, the distance that separates regulation with the electronic unit that is dispelled the heat by heat sink is installed heat sink, the position configuration heat sink that intersects at the line that connects heat sink and electronic unit and the line of drawing at the bearing of trend of ventiduct.
Description of drawings
Fig. 1 is the exploded perspective view that is illustrated in the structure of the panel that uses in the plasma display system of embodiments of the present invention 1.
Fig. 2 is the electrode spread figure of the panel of the use in the plasma display system of embodiments of the present invention 1.
Fig. 3 is the figure of an example of the driving voltage waveform that applies of each electrode of the panel that uses in the plasma display system that schematically represents embodiments of the present invention 1.
Fig. 4 is the figure of an example of circuit module that schematically represents to consist of the plasma display system of embodiments of the present invention 1.
Fig. 5 is the circuit diagram that schematically represents the configuration example of keeping pulse generating circuit used in the plasma display system of embodiments of the present invention 1.
Fig. 6 is the figure that schematically is illustrated in the part of the circuit substrate that uses in the plasma display system of embodiments of the present invention 1.
Fig. 7 is the figure of an example of measured value of temperature that is illustrated in the circuit substrate of the electronic unit that heating has been installed in the plasma display system of embodiments of the present invention 1.
Fig. 8 is the figure of an example that is illustrated in the shape of the heat sink that uses in the plasma display system of embodiments of the present invention 1.
Fig. 9 is the stereographic map that the heat sink that arranges on the circuit substrate of expression to embodiments of the present invention 1 carries out an example in bonding zone.
Figure 10 is the stereographic map of an example that is illustrated in the allocation position of the heat sink installed on the circuit substrate of embodiments of the present invention 1 and electronic unit.
Figure 11 is the figure of an example that is illustrated in the shape of the heat sink that uses in the plasma display system of embodiments of the present invention 2.
Figure 12 is the front view of an example of the shape of the heat sink of expression in the embodiments of the present invention 3.
Figure 13 is another routine front view of the shape of the heat sink in the expression embodiments of the present invention 3.
Figure 14 is the front view of an example of the shape of the heat sink of expression in the embodiments of the present invention 4.
Figure 15 A is another routine front view of the shape of the heat sink in the expression embodiments of the present invention 4.
Figure 15 B is the front view of another example of the shape of the heat sink of expression in the embodiments of the present invention 4.
Figure 15 C is the again front view of an example of the shape of the heat sink in the expression embodiments of the present invention 4.
Figure 16 A is the front view of an example of the shape of the heat sink of expression in the embodiments of the present invention 5.
Figure 16 B is another routine front view of the shape of the heat sink in the expression embodiments of the present invention 5.
Figure 16 C is the front view of another example of the shape of the heat sink of expression in the embodiments of the present invention 5.
Figure 16 D is the again front view of an example of the shape of the heat sink in the expression embodiments of the present invention 5.
Embodiment
Below, heat sink, the circuit substrate in the embodiments of the present invention and the image display device that utilizes these are described.Moreover, below, as image display, describe as example take the plasma display system that for example uses Plasmia indicating panel (following brief note is as " panel ") by reference to the accompanying drawings.
(embodiment 1)
Fig. 1 is the exploded perspective view of the structure of the panel 10 that uses in the plasma display system of expression embodiments of the present invention 1.
In front on the substrate 11, form a plurality of by scan electrode 12 with keep show electrode that electrode 13 consists of to 14.And, form dielectric layer 15 to cover scan electrode 12 with the mode of keeping electrode 13, form protective seams 16 at this dielectric layer 15.
For the discharge in the discharge cell easily occurs, protective seam 16 forms as the material of major component by emit the high material of performance with electronics be magnesium oxide (MgO).
Form overleaf a plurality of data electrodes 22 on the substrate 21, form dielectric layer 23 in the mode of covers data electrode 22, and then form the next door 24 of groined type shapes at dielectric layer 23.Then, the luminescent coating 25 of each color of light of sending redness (R), green (G) and blue (B) is set on the side of next door 24 and the dielectric layer 23.
With these front substrates 11 and back substrate 21 relative configurations so that show electrode to 14 and data electrode 22 clip small discharge space and intersect, the gap of substrate 11 and back substrate 21 arranges discharge space in front.And, seal its peripheral part by the encapsulant of frit etc.Then, enclose the mixed gas of for example neon (Ne) and xenon (Xe) within it in the discharge space of section as discharge gas.
Discharge space is divided into a plurality of zones by next door 24, at show electrode 14 parts of intersecting with data electrode 22 is formed the discharge cell that consists of pixel.And, by making these discharge cell discharge, luminous (lighting), at the image of panel 10 display colors.
Like this, panel 10 will form a plurality of show electrodes to 14 front substrate 11 and the back substrate 21 relative configurations that formed a plurality of data electrodes 22 so that show electrode to 14 and data electrode 22 intersect.
Moreover, in panel 10, by continuous 3 discharge cells of 14 directions of extending being arranged at show electrode, namely send the discharge cell of redness (R) light, 3 discharge cells that send the discharge cell of green (G) light and send the discharge cell of blueness (B) light consist of 1 pixel.
Moreover the structure of panel 10 is not limited to foregoing, for example also can possess the next door of striated.In addition, the mixture ratio of discharge gas for example can be set as 10% with the xenon dividing potential drop, but for the luminescence efficiency that improves in the discharge cell also can further improve the xenon dividing potential drop, also can be other mixture ratio.
Fig. 2 is the electrode spread figure of the panel 10 that uses in the plasma display system of embodiments of the present invention 1.
In panel 10, arrange n root scan electrode 12 and the n root that in the horizontal direction (line direction, line direction) extend and kept electrode 13, arranged the m single data electrode 22 that in the vertical direction (column direction) extends.
And, at 1 pair scan electrode 12 and keep electrode 13 and zone that 1 data electrode 22 intersects forms a discharge cell.That is, 1 pair show electrode to 14 on, form m discharge cell, form m/3 pixel.And, in discharge space, forming m * n discharge cell, m * n discharge cell forms the image display area that rectangular zone becomes panel 10.For example, in pixel count is 1920 * 1080 panel, m=1920 * 3, n=1080.Moreover, in the present embodiment, suppose n=1080, but the present invention is not limited to this numerical value.
Fig. 3 is the figure of an example of the driving voltage waveform that applies of each electrode of the panel 10 that uses in the plasma display system that schematically represents embodiments of the present invention 1.
Among Fig. 3 expression to scan electrode 12, keep the driving voltage waveform that each electrode of electrode 13 and data electrode 22 applies.As the driving voltage waveform that scan electrode 12 is applied, represent as example the scan electrode 12 that carries out at first write activity in the during writing, the 2nd are carried out the scan electrode 12 of write activity and carry out at last driving voltage waveform that each electrode of the scan electrode 12 of write activity applies.
1 a plurality of subfield that differed from one another by luminosity (luminance weights) (for example subfield SF1 is to 8 subfields of subfield SF8) consist of.Each subfield has Ti, during writing Tw during the initialization, maintenance period Ts, at each discharge cell, based on picture signal, carries out luminous/non-luminous control by each subfield.Thus, each discharge cell is to carry out luminous with the corresponding lightness of picture signal.Moreover, represent as an example of the driving voltage waveform of 3 subfields of subfield SF1, subfield SF2, subfield SF3 example among Fig. 3.
Ti during the initialization of subfield SF1 is to data electrode 22 and keep electrode 13 and apply voltage 0 (V).Scan electrode 12 is applied the after-applied voltage Vi1 of voltage 0 (V), applied the waveform voltage that is inclined upwardly (acclivity voltage) that gently rises from voltage Vi1 to voltage Vi2.Voltage Vi1 is set as the voltage that is lower than discharge ionization voltage with respect to keeping electrode 13, and voltage Vi2 is set as the voltage above discharge ionization voltage.
During this acclivity voltage rising, continue to occur faint initialization discharge at each discharge cell.
Next, apply positive voltage Ve to keeping electrode 13, data electrode 22 is applied voltage 0 (V).Scan electrode 12 is applied the downward-sloping waveform voltage (ramp voltage downwards) that gently descends to negative voltage Vi4 from voltage Vi3.Voltage Vi3 is set as the voltage that is lower than discharge ionization voltage with respect to keeping electrode 13, and voltage Vi4 is set as the voltage above discharge ionization voltage.
During this downward ramp voltage decline, at each discharge cell faint initialization discharge occurs constantly.
Like this, the initialization action during the initialization of subfield SF1 finishes, and forms the required wall electric charge of write activity of ensuing during writing Tw at each electrode.
Moreover, shown in Ti during the initialization of subfield SF2 and subfield SF3, as the action of Ti during the initialization, can only downward ramp voltage be put on scan electrode 12.
At during writing Tw, apply voltage Ve to keeping electrode 13, data electrode 22 is applied voltage 0 (V), scan electrode 12 is applied voltage Vc.
Next, the scan electrode 12 of the 1st row that carries out at first write activity is applied the scanning impulse of the negative polarity of negative voltage Va.Meanwhile, to the 1st row in should be luminous data electrode 22 corresponding to discharge cell apply the write pulse of the positive polarity of positive voltage Vd.
Apply at the same time in the discharge cell (discharge cell that should be luminous) of scanning impulse and write pulse, write discharge, keep the required wall electric charge of action what each electrode formed ensuing maintenance period Ts.In the discharge cell that does not apply write pulse, do not write discharge.
Like this, the write activity in the discharge cell of the 1st row finishes.
Carry out successively same write activity, until till the discharge cell of final row, the during writing of subfield SF1 finishes.
At maintenance period Ts, apply voltage 0 (V) to keeping electrode 13, scan electrode 12 is applied the pulse of keeping of positive voltage Vs.
Thus, in the discharge cell of discharge has occured to write sustain discharge occurs.And, by the ultraviolet ray that produced by this sustain discharge so that luminescent coating 25 is luminous.In addition, by this sustain discharge, keeping after each electrode forms at once moved required wall electric charge.Sustain discharge does not occur in during writing has the discharge cell of the discharge of writing.
Next, scan electrode 12 is applied voltage 0 (V), apply the pulse of keeping of voltage Vs to keeping electrode 13.Occured in the discharge cell of sustain discharge sustain discharge to occur again before just, luminescent coating 25 carries out luminous.In addition, by this sustain discharge, keeping after each electrode forms at once moved required wall electric charge.
Later on same, to scan electrode 12 with keep electrode 13 and alternately apply the pulse of keeping with the corresponding number of luminance weights.Like this, the discharge cell of discharge has occured to write to carry out luminous with the corresponding brightness of luminance weights in during writing.
Then, maintenance period keep pulse generation after, apply in the situation of voltage 0 (V) keeping electrode 13 and data electrode 22, scan electrode 12 is applied the tilt waveform voltage (cancellation ramp voltage) that gently rises from voltage 0 (V) to voltage Vr.
Thus, faint cancellation discharge occurs in the discharge cell that sustain discharge has occured, the unwanted wall electric charge in the discharge cell is eliminated.
So far, subfield SF1 finishes.Moreover the driving voltage waveform of other subfields is not counted the difference except Ti during initialization does not produce the generation of keeping pulse in acclivity voltage, the maintenance period, and roughly same with the driving voltage waveform of subfield SF1, therefore the description thereof will be omitted.
Moreover the value of each voltage in the present embodiment for example is voltage Vi2=440 (V), voltage Vi4=-80 (V), voltage Va=-85 (V), voltage Vs=voltage Vr=200 (V), voltage Ve=150 (V).
But above-mentioned magnitude of voltage is an example only, wishes to carry out according to the flash-over characteristic of panel, the specification of plasma display system etc. the best setting of each magnitude of voltage.
Moreover in maintenance period, along with the generation of sustain discharge, moment surpasses tens amperes very large electric current and flows through and keep electrode 13.And, in the electronic unit of this large electric current of control, produce larger heat.
Fig. 4 is the figure of an example that schematically represents to consist of the circuit module of the plasma display system 30 in the embodiments of the present invention 1.
The power circuit (not shown) that driving circuit possesses imaging signal processing circuit 31, data electrode driver circuit 32, scan electrode driving circuit 33, keeps electrode drive circuit 34, timing generating circuit 35 and the required power supply of each circuit module is provided.
Imaging signal processing circuit 31 is based on the picture signal of inputting, each discharge cell is distributed gray-scale value, with this gray-scale value be transformed to each subfield of expression luminous/non-luminous view data (making luminous/not luminous data corresponding with " 1 ", " 0 " of digital signal).
Timing generating circuit 35 produces the various timing signals that the action of each circuit module is controlled based on horizontal-drive signal, vertical synchronizing signal.And, the timing signal that produces is offered each circuit module.
Data electrode driver circuit 32 is based on from the view data of imaging signal processing circuit 31 output and the timing signal of supplying with from timing generating circuit 35, produces the write pulse corresponding with each data electrode 22, and imposes on each data electrode 22.
Scan electrode driving circuit 33 possesses the pulse generating circuit of keeping, slope voltage generating circuit and scanning impulse circuit for generating (Fig. 4 is not shown), generate driving voltage waveform based on the timing signal of supplying with from timing generating circuit 35, put on each scan electrode 12.Keep pulse generating circuit and keep pulse based on timing signal in the maintenance period generation, put on scan electrode 12.
Keep electrode drive circuit 34 and possess the circuit (not shown among Fig. 4) of keeping pulse generating circuit and producing voltage Ve, generate driving voltage waveform based on the timing signal of supplying with from timing generating circuit 35, and put on and respectively keep electrode 13.Keep pulse generating circuit and produce in maintenance period based on timing signal and keep pulse, and put on and keep electrode 13.
Fig. 5 is the circuit diagram that schematically represents the configuration example of keeping pulse generating circuit 40 used in the plasma display system 30 of embodiments of the present invention 1.Keeping pulse generating circuit 40 is arranged on respectively scan electrode 12 sides and keeps electrode 13 sides.And the lead-out terminal of keeping pulse generating circuit 40 of scan electrode 12 sides is connected with scan electrode 12, the lead-out terminal of keeping pulse generating circuit 40 of keeping electrode 13 sides with keep electrode 13 and be connected.Moreover each on-off element of keeping pulse generating circuit 40 is controlled by the timing signal of supplying with from timing generating circuit 35, but has omitted the detailed content of the signal path of timing signal among Fig. 5.
Moreover, below describe as example take the pulse generating circuit 40 of keeping of scan electrode 12 sides, but keep electrode 13 sides keep pulse generating circuit 40 be with scan electrode 12 sides keep the same structure of pulse generating circuit 40, and carry out same action, therefore the description thereof will be omitted.Keep pulse generating circuit 40 for what keep electrode 13 sides, keep electrode 13 as long as following scan electrode 12 is replaced into.
Keep pulse generating circuit 40 and possess power recovery section 41 and clamper section 45, produce at maintenance period Ts and keep pulse to what scan electrode 12 applied.
And, keep pulse generating circuit 40 and switch each on-off element based on the timing signal from timing generating circuit 35 output and generate and keep pulse.
Make when keeping pulse and rising, thereby only make on-off element Q42 conducting make equivalent capacity Cp and inductor L41 as the scan electrode 12 of capacitive load carry out LC resonance, the electric charge accumulated in the power recovery electricity consumption container C 41 is moved to equivalent capacity Cp via on-off element Q42, diode D42 and inductor L41.And, after the voltage of scan electrode 12 is close to voltage Vs, thus make on-off element Q46 conducting with scan electrode 12 clampers in voltage Vs.
Make when keeping pulse and descending, thereby only make on-off element Q43 conducting equivalent capacity Cp and inductor L41 carry out LC resonance, the electric charge accumulated in the scan electrode 12 is recycled to power recovery electricity consumption container C 41 via inductor L41, diode D43 and on-off element Q43.And, at the voltage of scan electrode 12 near voltage 0 (V) afterwards, thus make on-off element Q47 conducting with scan electrode 12 clampers in voltage 0 (V).
Keep pulse generating circuit 40 such generations and keep pulse, and put on scan electrode 12.
As above-mentioned, power recovery section 41 has discharging and recharging of jumbo equivalent capacity Cp via on-off element Q42, Q43, diode D42, D43, inductor L41.In addition, the large discharge current that is produced by sustain discharge is flow through in clamper section 45 via on-off element Q46, Q47.Therefore, instantaneously in these electronic unit flow through very large electric current, follow in this and produce larger heat.
Therefore, generally speaking, then the heat sink that these electronic units are assembled cooling usefulness is installed on circuit substrate.Moreover, thereby suppressing heating in order to reduce the electric current that flows through in the electronic unit one by one, the electronic unit that a plurality of electronic units is connected in parallel to consist of on-off element Q42, Q43, diode D42, D43 etc. gets final product.But the restriction that the number of the electronic unit that can arrange on the circuit substrate is subject to the size of circuit substrate, make related expense etc.The number of the electronic unit that therefore, can be connected in parallel is restricted.
Fig. 6 is the figure that schematically represents the part of the circuit substrate 60 that uses in the plasma display system 30 of embodiments of the present invention 1.Expression electronic unit 62 that thermal value is relatively large and the heat sink 64 corresponding with electronic unit 62 are installed on the situation of circuit substrate 60 among Fig. 6.
In the present embodiment, these electronic unit 62 is enclosed the packaging part of surface installing type.Be used for the electrode terminal section of heat sink in the rear side setting of this packaging part, this electrode terminal section is directly welded in the surperficial set Copper Foil of circuit substrate 60.Therefore, the heat that produces of electronic unit 62 conducts to the Copper Foil on the circuit substrate 60 via the electrode terminal section of packaging part rear side.
And, in the present embodiment, be not heat sink 64 directly to be assemblied in the electronic unit 62 of heating, but be installed on the Copper Foil that arranges on the surface of circuit substrate 60.
In other words, heat sink 64 Copper Foil that is installed in the electrode terminal section of the rear side that makes the packaging part that has welded electronic unit 62 prolongs and the Copper Foil that arranges upper.
And the heat that 64 pairs of heat sinks produce at electronic unit 62, conduct via the Copper Foil on the circuit substrate 60 from the electrode terminal section that is also used as heat sink of the rear side of the packaging part that is arranged on electronic unit 62 dispels the heat.
At this moment, at circuit substrate 60 configuration heat sink 64 and electronic units 62, so that become the position that the electronic unit 62 of the object that is dispelled the heat by heat sink 64 is configured in the bearing of trend of the ventiduct that is not that heat sink 64 and circuit substrate 60 form.That is, heat sink 64 and electronic unit 62 are configured on the circuit substrate 60 so that heat sink 64 is connected the bearing of trend of the ventiduct that forms with electronic unit on derivative line, intersect with the line that is connected heat sink 64 and electronic unit 62.
And, according to the distance between electronic unit 62 and the heat sink 64 interval of heat sink 64 (electronic unit 62 with) for 10mm with interior, be preferably 5mm in interior mode, heat sink 64 and electronic unit 62 are configured on the circuit substrate 60.
Fig. 7 is the figure of an example of measured value of temperature that is illustrated in the circuit substrate 60 of the electronic unit 62 that heating has been installed in the plasma display system 30 of embodiments of the present invention 1.
In Fig. 7, transverse axis represents electronic unit 62 to the distance of temperature measuring point, the temperature of the copper foil surface at the temperature measuring point place of longitudinal axis indication circuit substrate 60.In addition, represent among Fig. 7 that sample 1 is to the measurement result at 4 sample places of sample 4.
As shown in Figure 7, along with away from electronic unit 62, the drop in temperature of copper foil surface.Therefore, the allocation position of heat sink 64 is away from electronic unit 62, and the radiating effect that is then produced by heat sink 64 is less.
If according to the described experimental result of Fig. 7, hope is that 10mm is with interior position configuration heat sink 64 in the distance of heat sink 64 and electronic unit 62, if obtain larger radiating effect, wish that then the distance at heat sink 64 and electronic unit 62 is that 5mm is with interior position configuration heat sink 64.
Moreover, in the present embodiment, shown in Figure 10 as described later, with enclosed in the packaging part of electronic unit 62 be in one side of the nearest position of heat sink 64 and heat sink 64 in be in distance with one side of the nearest position of electronic unit 62, as the distance of electronic unit 62 with heat sink 64.
Fig. 8 is the figure of an example of the shape of the heat sink 64 that uses in the plasma display system 30 of expression embodiments of the present invention 1.Among Fig. 8 expression from three directions observe heat sinks 64 figure (vertical view, below vertical view for front view, be side view on the next door of vertical view).In addition, the height indicator with heat sink 64 among Fig. 8 is shown h1, and the width means that will comprise scolder bonding region 65 is w1, is w2 with the width means except scolder bonding region 65, and lengths table is shown d1, and thickness table is shown t1.
The scolder bonding region 65 that heat sink 64 has peristome 67 and arranges in the both sides of peristome 67.Peristome 67 is surrounded and is formed by 2 side plates 166 and top 167.And scolder bonding region 65 is connected with side plate 166 and arranges.
Moreover scolder bonding region 65 is not limited to shape shown in Figure 8.As long as the scolder bonding region 65 that has of heat sink 64 can be fixed on circuit substrate 60 with heat sink 64, it then can be shape arbitrarily.For example, also can through hole be set at circuit substrate 60, make scolder bonding region 65 become the shape that runs through this through hole, in this through hole, run through after the scolder bonding region 65, by solder heat sink 64 is fixed in circuit substrate 60.
Fig. 9 is an example of bonding heat sink bonding region 69 is carried out in expression to the heat sink 64 that arranges on the circuit substrate 60 of embodiments of the present invention 1 stereographic map.
By solder the surperficial set Copper Foil 70 of circuit substrate 60 and scolder bonding region 65 are carried out bonding, thereby heat sink 64 is installed on the circuit substrate 60.Therefore, be provided for the heat sink bonding region 69 of bonding scolder bonding region 65 at this Copper Foil 70.
In the present embodiment, set heat sink bonding region 69 has that a plurality of (being 2 for example) of the rectangular shape of extending in one direction is regional to be formed by configured in parallel as shown in Figure 9 on the Copper Foil 70 of circuit substrate 60 for 1 heat sink 64 for.
Figure 10 is the stereographic map of an example that is illustrated in the embodiments of the present invention 1 allocation position of the heat sink 64 installed on the circuit substrate 60 and electronic unit 62.
Moreover the distance table with heat sink 64 and electronic unit 62 among Figure 10 is shown " L ".
The heat sink 64 of shape shown in Figure 8 is arranged on the circuit substrate 60, so that clog the peristome 67 of " U " font with circuit substrate 60, the heat sink bonding region 69 that scolder bonding region 65 solders of heat sink 64 are arranged on the Copper Foil 70 of circuit substrate 60.Thus, surrounded by heat sink 64 (2 side plate 166 and top 167) and circuit substrate 60 and the ventiduct 66 that obtains is formed on the circuit substrate 60.
Like this, heat sink 64 is installed on circuit substrate 60, forms ventiduct 66 at circuit substrate 60 thus.And, thereby in this ventiduct 66, flow through the radiating effect that air improves heat sink 64.That is, the heat that produces of electronic unit 62 conducts to the heat sink 64 with high radiating effect via the Copper Foil 70 on the circuit substrate 60 and dispels the heat.
Moreover, in the present embodiment, thereby flow through the radiating effect that air improves heat sink 64 in the ventiduct 66.Therefore, it is outbalance that the air that flows through in the ventiduct 66 is not blocked by barrier.Therefore, in the present embodiment, do not block the air that flows through in the ventiduct 66 for electronic unit 62, on the direction that ventiduct 66 extends, do not configure electronic unit 62.That is the line of, drawing by the direction of extending at ventiduct 66, configure electronic unit 62 with mode that the line that is connected heat sink 64 and electronic unit 62 intersects.
The direction of preferably extending according to ventiduct 66 in addition, is configured in heat sink 64 on the circuit substrate 60 in the mode that the enclosure interior of image display device becomes vertical direction.Thus, because laminar flow (updraft) from the below upward flows through in ventiduct 66, so the mobile smoothness that becomes of the air in the ventiduct 66, can further improve the radiating effect in the heat sink 64.
In addition, when circuit substrate 60 is installed a plurality of heat sink 64, preferably configure heat sink 64 according to ventiduct 66 in the upwardly extending mode in mutually the same side.Thus, the air that passes through in a plurality of ventiducts 66 can flow through more glibly.And further preferred this direction is vertical direction.
Moreover, in the heat sink 64 of present embodiment, height h1 being set as 10mm, the width w1 that will comprise scolder bonding region 65 is set as 10mm, will be set as except the width w2 of scolder bonding region 65 8mm, and length d 1 is set as 15mm.At this moment, the volume that is surrounded by heat sink 64 is 1200mm
3, the surface area of heat sink 64 is 840mm
2
In addition, in order to improve the radiating effect of heat sink 64, preferably make the further thickening of thickness of heat sink 64.But, if the thickness of heat sink 64 is blocked up, with heat sink 64 with the reflux type solder during in circuit substrate 60, the temperature of solder paste can't fully rise, and might occur bad in the operation of solder.Therefore, consider that preferably the method for radiating effect, solder sets the thickness of heat sink 64.In the present embodiment, the solder when carrying out to circuit substrate 60 assembling heat sink 64 according to reflux type is as prerequisite, and the thickness t 1 of heat sink 64 is set as 0.3mm.
But each size of the heat sink 64 among the present invention is not limited to these numerical value.Preferably according to the operation of making, the size of circuit substrate 60, the thermal value of electronic unit etc. each size of heat sink 64 being carried out the best sets.
In addition, for the material that forms heat sink 64, preferred pyroconductivity is high, price is low and the material of handling ease.In the present embodiment, the materials'use pyroconductivity of heat sink 64 is high, price is low and the aluminium sheet of handling ease.And the cementability when considering to carry out solder carries out the gold-plated of nickel and tin on the surface of aluminium sheet.But among the present invention, the material of heat sink 64 is not limited to above-mentioned material, for example also can be iron plate or copper coin.In addition, also can be as required with the surperficial painted black of heat sink 64.
Moreover, for border (2 place) that scolder bonding region 65 and side plate 166 are set, top 167 border (2 place) with side plate 166, this sheet metal is implemented 4 times bending process, thereby formed heat sink 64.
Next, the method that heat sink 64 is installed on circuit substrate 60 is described.
At first, the mounting electronic parts 62 on circuit substrate 60 and the zone of heat sink 64 are by coating solder pastes such as silk screen print methods.For the zone that heat sink 64 is installed, as long as the part that contacts with circuit substrate 60 at scolder bonding region 65 is coated with solder paste.
Next, on the circuit substrate 60 that has been coated with solder paste, utilize such as assembler (mounter) device of NC control (Numerical Control) etc. electronic unit 62 and heat sink 64 are set.For heat sink 64, for example utilize the vacuum suction head to adsorb heat sink 64, be arranged on the position of regulation.
Next, the circuit substrate 60 that has carried electronic unit 62 and heat sink 64 is put among the reflow ovens, preparation is heated to 180 ℃.Next, with circuit substrate 60 instant heatings to 260 ℃, make the solder paste fusing.Then, circuit substrate 60 is cooled off rapidly, electronic unit 62 and heat sink 64 are adhered to circuit substrate 60.Like this, with electronic unit 62 and heat sink 64 solders on circuit substrate 60.
Moreover the heat sink bonding region 69 on the Copper Foil 70 of the scolder bonding region 65 of bonding heat sink 64 is unconnected 2 rectangular zones each other.Therefore, heat sink 64 is narrow with the contact area of circuit substrate 60, heat sink 64 and other electronic units can be welded on circuit substrate 60 with reflux type simultaneously.Like this, the heat sink 64 in the present embodiment does not increase the man-hour in the manufacturing process, can be cheap and be installed in reliably circuit substrate 60.
(embodiment 2)
In the embodiment 1, the example that is set as " U " font with the shape of the peristome 67 of heat sink 64 is illustrated, but the shape of the peristome of heat sink is not defined as " U " font among the present invention.
Figure 11 is the figure of an example of the shape of the heat sink 74 that uses in the plasma display system 30 of expression embodiments of the present invention 2.The figure (below of vertical view, vertical view is that the next door of front view, vertical view is side view) of heat sink 74 is observed in expression among Figure 11 from three directions.In addition, among Figure 11, the height indicator of heat sink 74 is shown h1, the width means that will comprise scolder bonding region 75 is w1, is w2 with the width means of having removed scolder bonding region 75, is w3 with the width means that forms the zone of 1 peristome, lengths table is shown d1, thickness table is shown t1.
Heat sink 74 shown in the present embodiment has following this shape.
The shape that is shaped as " M " font (shown in the front view of Figure 11) of the peristome when heat sink 74 has from the direction observation of heat sink 74 extensions.That is, heat sink 74 have 2 peristomes 78,2 scolder bonding regions 75 that arrange in the both sides of 2 peristomes 78 and 1 scolder bonding region 77 being clipped by 2 peristomes 78 amount to 3 scolder bonding regions 75,77.
2 peristomes 78 are surrounded and are formed by inboard board 176, outside board 178 and top 177 respectively.Therefore, heat sink 74 has 2 inboard boards 176,2 outside boards 178 and 2 tops 177.And scolder bonding region 75 is connected with outside board 178 and arranges, and scolder bonding region 77 is connected with inboard board 176 and arranges.
These 3 scolder bonding regions 75,77 are adhered to the Copper Foil 70 of circuit substrate 60 by solder, thereby 2 peristomes 78 are covered by circuit substrate 60 respectively.Thus, at 2 ventiducts 76 of circuit substrate 60 formation by the channel-like of 2 place's openings of circuit substrate 60 and heat sink 74 (inboard board 176, outside board 178 and top 177) encirclement and an end and another end.
Moreover scolder bonding region 75 is not limited to shape shown in Figure 11.As long as the scolder bonding region 75 that has of heat sink 74 can be fixed on circuit substrate 60 with heat sink 74, it then can be shape arbitrarily.For example, can through hole be set at circuit substrate 60, scolder bonding region 75 be set as the shape that runs through this through hole, in this through hole, run through after the scolder bonding region 75, by solder heat sink 74 is fixed on the circuit substrate 60.
Moreover, in the heat sink 74 in the present embodiment, height h1 is set as 10mm, the width w1 that will comprise scolder bonding region 75 is set as 10mm, the width w2 that removes scolder bonding region 75 is set as 8mm, the width w3 that forms the zone of 1 peristome is set as 2.5mm, length d 1 is set as 15mm, thickness t 1 is set as 0.3mm.At this moment, the volume that is surrounded by heat sink 74 is 1200mm
3, the surface area of heat sink 74 is 1410mm
2
In addition, the material of heat sink 74 and heat sink 64 are same, utilize the gold-plated aluminium sheet that has carried out nickel and tin.
And, for border (2 place) that scolder bonding region 75 and outside board 178 are set, scolder bonding region 77 border (2 place), the top 177 and the border of inboard board 176 and the border (2 places * 2) of outside board 178 with inboard board 176, thereby being implemented 8 times bending process, this sheet metal forms heat sink 74.
But each size of heat sink 74 of the present invention is not limited to these numerical value.Preferably according to the operation of making, the size of circuit substrate 60, the thermal value of electronic unit etc., each size of heat sink 74 is carried out the best set.In addition, the material of heat sink 74 is not limited to above-mentioned material, for example also can be iron plate or copper coin.In addition, as required also can be with the surperficial painted black of heat sink 74.
Moreover because it is identical with the method that the heat sink 64 shown in the embodiment 1 is installed on circuit substrate 60 that heat sink 74 is installed on the method for circuit substrate 60, therefore description thereof is omitted.
Heat sink 74 in the present embodiment is than the heat sink 64 shown in the embodiment 1, because crooked place is many, so surface area is large, and radiating effect is high.In addition, because heat sink 74 is adhered to circuit substrate 60 at 3 scolder bonding regions 75,77, therefore when heat sink 64 is adhered to circuit substrate 60, has this stronger feature of the bonding physical strength of locking.
(embodiment 3)
Figure 12 is the front view of an example of shape of the heat sink 84 of expression embodiments of the present invention 3.Front view when the direction that expression is extended from heat sink 84 among Figure 12 is observed heat sink 84.In addition, among Figure 12, the height indicator of heat sink 84 is shown h1, the width means that will comprise scolder bonding region 85 is w1, being w2 with the width means of having removed scolder bonding region 85, is w3 with the width means that forms the zone of 1 little peristome, and lengths table is shown d1, the height indicator that will arrive little peristome 81 is shown h2, and thickness table is shown t1.
Heat sink 84 shown in the present embodiment has following this shape.
The shape that is shaped as " M " font of the peristome when heat sink 84 has from the direction observation of heat sink 84 extensions as shown in Figure 12.
Wherein, heat sink 84 is different from the heat sink 74 shown in the embodiment 2, the front end in the zone that will be clipped by 2 peristomes be formed on than with the bonding plane of circuit substrate 60 high position also, will be herein as the scolder bonding region, and as inner top 87.For this reason, in the present embodiment, these 2 peristomes are called " little peristome ".That is, heat sink 84 becomes the shape that has 2 little peristomes 81 above 1 peristome 83.
2 little peristomes 81 are respectively to be surrounded and formed by inboard board 186, outside board 188 and outer top 187.Therefore, the peristome 83 that has 2 little peristomes 81 is surrounded and forms by 2 inboard boards 186,2 outside boards 188,2 outer tops 187 and 1 inner top 87.Therefore, heat sink 84 has 2 inboard boards 186,2 outside boards 188,2 outer tops 187 and 1 inner top 87.And scolder bonding region 85 is connected with outside board 188 and arranges.
Therefore, the scolder bonding region 85 that has of heat sink 84 becomes 2 places of both sides of the peristome 83 of " M " font.
These 2 scolder bonding regions 85 are adhered to the Copper Foil 70 of circuit substrate 60 by solder, thereby peristome 83 is covered by circuit substrate 60.Thus, on circuit substrate 60, form by 2 ventiducts 86 of circuit substrate 60 with 2 place's openings of heat sink 84 (2 inboard boards 186,2 outside boards 188,2 outer tops 187 and 1 inner top 87) encirclement and an end and another end.And this ventiduct 86 becomes the channel-like of " C " font as shown in Figure 12.
Moreover scolder bonding region 85 is not limited to shape shown in Figure 12.As long as the scolder bonding region 85 that has of heat sink 84 can be fixed in circuit substrate 60 with heat sink 84, it then can be shape arbitrarily.For example, also can through hole be set at circuit substrate 60, make scolder bonding region 85 form the shape that runs through this through hole, in this through hole, run through after the scolder bonding region 85, by solder heat sink 84 is fixed on the circuit substrate 60.
Moreover, in the heat sink 84 in the present embodiment, for example height h1 is set as 10mm, the width w1 that will comprise scolder bonding region 85 is set as 10mm, to be set as 8mm except the width w2 of scolder bonding region 85, the width w3 that forms the zone of 1 little peristome is set as 2.5mm, the height h2 that will arrive little peristome 81 is set as 5mm, length d 1 is set as 15mm, thickness t 1 is set as 0.3mm.At this moment, the volume that is surrounded by heat sink 84 is 1200mm
3, the surface area of heat sink 84 is 1140mm
2
In addition, the material of heat sink 84 can similarly use the gold-plated aluminium sheet that has carried out nickel and tin with heat sink 64.
And, for border (2 place), the inner top 87 and the border (2 place) of inboard board 186, outer top 187 and the border of inboard board 186 and the border (2 places * 2) of outside board 188 that scolder bonding region 85 and outside board 188 are set, by this sheet metal being implemented 8 times bending process, thereby form heat sink 84.
But each size of heat sink 84 of the present invention is not limited to these numerical value.Preferably according to the operation of making, the size of circuit substrate 60, the thermal value of electronic unit etc. each size of heat sink 84 being carried out the best sets.In addition, the material of heat sink 84 also is not limited to above-mentioned material, for example also can be iron plate or copper coin.In addition, as required also can be with the surperficial painted black of heat sink 84.
Moreover because it is identical with the method that the heat sink 64 shown in the embodiment 1 is installed on circuit substrate 60 that heat sink 84 is installed on the method for circuit substrate 60, therefore the description thereof will be omitted.
Heat sink 84 in the present embodiment is than the heat sink 64 shown in the embodiment 1, because crooked place is many, so surface area is large, and radiating effect is high.
In addition, because heat sink 84 is bonding with circuit substrate 60 by 2 scolder bonding regions 85, as long as therefore make face and 1 planar registration of 2 scolder bonding regions 85.Therefore, heat sink 84 can easily form scolder bonding region 85 than heat sink 74.
Moreover the shape of the heat sink in the present embodiment is not limited to shape shown in Figure 12.The front end that heat sink in the present embodiment needs only the zone that is clipped by 2 little peristomes is formed on the position higher with the bonding plane of heat sink than circuit substrate 60.
Figure 13 is another routine front view of the shape of the heat sink in the expression embodiments of the present invention 3.
For example, in the present embodiment, as among Figure 13 as shown in the heat sink 94 like that, also can have heat sink 94 inner top 87 is not set and by the zone that 2 little peristomes 82 clip become " V " font (that is, by being shaped as of forming of 2 inboard boards 182 " V " and font) shape.Even if the heat sink of this shape 94 also can obtain and heat sink shown in Figure 12 84 same effect roughly.
(embodiment 4)
Figure 14 is the front view of an example of the shape of the heat sink of expression in the embodiments of the present invention 4.The front view of expression heat sink 104 among Figure 14, and the part enlarged drawing of the scolder bonding region 105 of expression heat sink 104 when being welded in circuit substrate 60.
As shown in figure 14, in the heat sink 104 in the present embodiment, in the end of scolder bonding region 105 reflex part 106 is set.Thus, so that the section 107 of leading section that is in reflex part 106 away from the circuit substrate 60 scolder adhesive portion with scolder bonding region 105.
Do not have gold-platedly at the section of sheet metal, scolder comparatively is difficult to welding sometimes.Therefore, in the present embodiment, at the scolder bonding region 105 of heat sink 104 reflex part 106 is set.Like this, so that the section 107 of sheet metal is away from the scolder adhesive portion, heat sink 104 solders during in circuit substrate 60, can be easy to flow into scolder between the Copper Foil 70 on heat sink 104 and the circuit substrate 60.Thus, shown in the part enlarged drawing of Figure 14, can between scolder bonding region 105 and circuit substrate 60, form level and smooth leg 108, can carry out colory solder.
Figure 15 A is the front view of another example of the shape of the heat sink of expression in the embodiments of the present invention 4.
Figure 15 B is another routine front view of the shape of the heat sink in the expression embodiments of the present invention 4.
Figure 15 C is the front view of another example of the shape of the heat sink of expression in the embodiments of the present invention 4.
In these the heat sink, also same with heat sink 104, can between scolder bonding region and circuit substrate 60, form level and smooth leg 108, can carry out colory solder.
Moreover in each above-mentioned heat sink, reflex part 106,116,126,136 height h3 separately is 1mm.
But the size of reflex part of the present invention is not limited to this numerical value.Preferably according to the operation of making, the size of heat sink, the material of heat sink etc. the size of reflex part being carried out the best sets.
Moreover each above-mentioned heat sink and heat sink 64 are formed by the gold-plated aluminium sheet that has carried out nickel and tin equally, but such as also can being formed by the other materials of iron plate, copper coin etc.
Moreover because it is same with the method that the heat sink 64 shown in the embodiment 1 is installed on circuit substrate 60 heat sink shown in the present embodiment to be installed on the method for circuit substrate 60, therefore the description thereof will be omitted.
(embodiment 5)
In each above-mentioned embodiment, said the example that the scolder bonding region is arranged on the outside of ventiduct, but the position that the present invention is not limited to the scolder bonding region to be set is limited to the outside of ventiduct.In the present embodiment, the example that the scolder bonding region is arranged on the inside of ventiduct is described.
Figure 16 A is the front view of an example of the shape of the heat sink of expression in the embodiments of the present invention 5.
By making heat sink 144 become such shape, can so that " volume that is surrounded by heat sink the surface area of heat sink (perhaps) " with respect to the ratio of " when heat sink is installed on circuit substrate required area ", increase than heat sink shown in Figure 8 64 (scolder bonding region 65 being arranged on the heat sink 64 of the outside of ventiduct 66).
For example, required area is length d 1 * width w1, i.e. 15mm * 10mm when heat sink shown in Figure 8 64 is installed on circuit substrate 60.And, as above-mentioned, be that the volume that the heat sink 64 of 10mm surrounds is 1200mm by height h1
3, the surface area of heat sink 64 is 840mm
2
On the other hand, height h1 is set as the 10mm identical with heat sink 64, and the mode according to the heat sink 144 shown in Figure 16 A being installed in the zone of the 15mm * 10mm on the circuit substrate 60 is set as 10mm with width w1, and length d 1 is set as 15mm.At this moment, the volume that is surrounded by heat sink 144 is 1500mm
3, the surface area of heat sink 144 is 900mm
2These numeric ratio heat sink 64 shown in Figure 8 is large.Therefore, if " when heat sink is installed on circuit substrate required area " is identical, then by making heat sink 144 become the shape shown in Figure 16 A, thereby can make surface area ratio heat sink shown in Figure 8 64 want large, can improve radiating effect.
Figure 16 B is the front view of another example of the shape of the heat sink of expression in the embodiments of the present invention 5.
Therefore, if " when heat sink is installed on circuit substrate required area " is identical, then the surface area ratio of heat sink 154 heat sink 74 shown in Figure 11 is large, can improve radiating effect.
Figure 16 C is the front view of another example of the shape of the heat sink of expression in the embodiments of the present invention 5.
Therefore, if " when heat sink is installed on circuit substrate required area " is identical, then the surface area of the surface area ratio of heat sink 164 heat sink 84 shown in Figure 12 is large, can improve radiating effect.
Figure 16 D is the front view of another example of the shape of the heat sink of expression in the embodiments of the present invention 5.
Therefore, if " when heat sink is installed on circuit substrate required area " is identical, then the surface area of the surface ratio of heat sink 174 heat sink 94 shown in Figure 13 is large, can improve radiating effect.
Moreover in each above-mentioned heat sink, scolder bonding region 145,155,165,175 width w4 separately is 2mm.
But the size of scolder bonding region of the present invention is not limited to this numerical value.Preferably according to the material of size, heat sink and the scolder of the operation of making, heat sink etc. the size of scolder bonding region is carried out the best setting.
Moreover above-mentioned each heat sink and heat sink 64 are same, formed by the gold-plated aluminium sheet that has carried out nickel and tin, but such as also can being formed by the other materials of iron plate, copper coin etc.
Moreover because it is same with the method that the heat sink 64 shown in the embodiment 1 is installed on circuit substrate 60 heat sink shown in the present embodiment to be installed on the method for circuit substrate 60, therefore the description thereof will be omitted.
Moreover, in embodiments of the present invention 1,2,3,4,5, be illustrated as an example of Plasmia indicating panel example as image display, but image display of the present invention is not limited to Plasmia indicating panel.As image display, except Plasmia indicating panel, can also list such as display panels (Liquid Crystal Display Panel), EL display panel (Electro Luminescence Display Panel) etc.And, in the image display device that has used this image display, using the present invention, also can obtain and above-mentioned same effect.
Moreover, in embodiments of the present invention, illustrated on the surface of circuit substrate the structure that Copper Foil is installed heat sink is set, but the material of formation paper tinsel is not limited to copper, also can be the high material of heat conductivity of aluminium or gold etc.
Moreover the concrete numerical value shown in the embodiments of the present invention only represents the example in the embodiment, and the present invention is not limited to these numerical value.Preferably carry out matchingly the best setting of each numerical value with the characteristic of manufacturing process, electronic unit, the specification of plasma display system etc.In addition, for these each numerical value, so long as can obtain the interior permissible variation of the scope of above-mentioned effect.
[utilizability on the industry]
Heat sink of the present invention can suppress the related expense of the making of image display device, the increase in man-hour, can more stably be assemblied in circuit substrate, is useful in circuit substrate, image display device.
[explanation of symbol]
10 panels
11 front substrates
12 scan electrodes
13 keep electrode
14 show electrodes pair
15,23 dielectric layers
16 protective seams
21 back substrates
22 data electrodes
24 next doors
25 luminescent coatings
30 plasma display systems
31 imaging signal processing circuits
32 data electrode driver circuits
33 scan electrode driving circuits
34 keep electrode drive circuit
35 timing generating circuits
40 keep pulse generating circuit
41 power recovery sections
45 clamper sections
60 circuit substrates
62 electronic units
64,74,84,94,104,114,124,134,144,154,164,174 heat sinks
65,75,77,85,105,115,125,135,145,155,165,175 scolder bonding regions
66,76,86,149,159,169,179 ventiducts
67,78,83 peristomes
69 heat sink bonding regions
70 Copper Foils
81,82 little peristomes
87 inner tops
106,116,126,136 reflex parts
107 sections
108 legs
166 side plates
167,177 tops
176,182,186 inboard boards
178,188 outside boards
187 outer tops
C41 power recovery capacitor
Q42, Q43, Q46, Q47 on-off element
D42, D43 diode
The L41 inductor
Claims (5)
1. heat sink, the scolder bonding region that has peristome and arrange in the both sides of described peristome, wherein,
When described scolder bonding region was adhered to circuit substrate, described heat sink has the described peristome of formation by described circuit substrate and this heat sink surrounds and the shape of an end and another open-ended ventiduct.
2. a circuit substrate is installed heat sink and electronic unit, wherein,
The scolder bonding region that described heat sink has peristome and arranges in the both sides of described peristome, when being bonded in described scolder bonding region on this circuit substrate, form by this circuit substrate and the encirclement of described heat sink and an end and another open-ended ventiduct at this circuit substrate
Described heat sink is installed in this circuit substrate with the distance that the electronic unit that is dispelled the heat by described heat sink separates regulation,
And described circuit substrate has the heat sink bonding region of bonding described heat sink, so that described heat sink is configured in the position that the line of drawing on the bearing of trend of the line that connects described heat sink and described electronic unit and described ventiduct intersects.
3. circuit substrate according to claim 2, wherein,
Described heat sink bonding region is the rectangular shape of extending in a direction,
A plurality of described heat sink bonding regions configure abreast.
4. circuit substrate according to claim 2, wherein,
Be in unidirectional mode according to a plurality of described ventiducts, form described heat sink bonding region.
5. image display device possesses image display and driving circuit that described image display is driven has been installed and the circuit substrate of heat sink, wherein,
Described heat sink,
The scolder bonding region that has peristome and arrange in the both sides of described peristome, when described scolder bonding region is adhered to described circuit substrate, described heat sink has the described peristome of formation by described circuit substrate and described heat sink surrounds and the shape of an end and another open-ended ventiduct
Described circuit substrate,
The distance that separates regulation with the electronic unit that is dispelled the heat by described heat sink is installed described heat sink, the described heat sink of position configuration that intersects at the line that connects described heat sink and described electronic unit and the line of drawing at the bearing of trend of described ventiduct.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011147010 | 2011-07-01 | ||
| JP2011-147010 | 2011-07-01 | ||
| PCT/JP2012/004222 WO2013005404A1 (en) | 2011-07-01 | 2012-06-29 | Heat sink, circuit board, and image display apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103329186A true CN103329186A (en) | 2013-09-25 |
Family
ID=47436769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012800053050A Pending CN103329186A (en) | 2011-07-01 | 2012-06-29 | Heat sink, circuit board, and image display apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2013005404A1 (en) |
| KR (1) | KR20130099227A (en) |
| CN (1) | CN103329186A (en) |
| WO (1) | WO2013005404A1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4254447A (en) * | 1979-04-10 | 1981-03-03 | Rca Corporation | Integrated circuit heat dissipator |
| JPH073187U (en) * | 1993-06-03 | 1995-01-17 | 太陽誘電株式会社 | Circuit board device |
| CN1530911A (en) * | 2003-03-11 | 2004-09-22 | ��ʿͨ������������ʾ���ɷ�����˾ | Circuit board assembly and disc coil |
| US20060187646A1 (en) * | 2005-02-18 | 2006-08-24 | Belson Steven A | Multi-processor module with redundant power |
| CN2909364Y (en) * | 2006-04-28 | 2007-06-06 | 高效电子股份有限公司 | Power supply device |
| WO2009108048A1 (en) * | 2008-02-27 | 2009-09-03 | Delft University Of Technology | Electric charger for an accumulator or battery |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3597004B2 (en) * | 1996-12-02 | 2004-12-02 | 株式会社ノボル電機製作所 | Heatsink mounting structure |
| JPH11233968A (en) * | 1998-02-12 | 1999-08-27 | Matsushita Electric Ind Co Ltd | Chassis and plasma display device provided therewith |
| JP2004047311A (en) * | 2002-07-12 | 2004-02-12 | Denso Trim Kk | Discharge lamp lighting device and projecting device using the same |
| JP2011013596A (en) * | 2009-07-06 | 2011-01-20 | Panasonic Corp | Plasma display |
-
2012
- 2012-06-29 CN CN2012800053050A patent/CN103329186A/en active Pending
- 2012-06-29 JP JP2013522454A patent/JPWO2013005404A1/en active Pending
- 2012-06-29 KR KR1020137020060A patent/KR20130099227A/en not_active Application Discontinuation
- 2012-06-29 WO PCT/JP2012/004222 patent/WO2013005404A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4254447A (en) * | 1979-04-10 | 1981-03-03 | Rca Corporation | Integrated circuit heat dissipator |
| JPH073187U (en) * | 1993-06-03 | 1995-01-17 | 太陽誘電株式会社 | Circuit board device |
| CN1530911A (en) * | 2003-03-11 | 2004-09-22 | ��ʿͨ������������ʾ���ɷ�����˾ | Circuit board assembly and disc coil |
| US20060187646A1 (en) * | 2005-02-18 | 2006-08-24 | Belson Steven A | Multi-processor module with redundant power |
| CN2909364Y (en) * | 2006-04-28 | 2007-06-06 | 高效电子股份有限公司 | Power supply device |
| WO2009108048A1 (en) * | 2008-02-27 | 2009-09-03 | Delft University Of Technology | Electric charger for an accumulator or battery |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2013005404A1 (en) | 2015-02-23 |
| WO2013005404A1 (en) | 2013-01-10 |
| KR20130099227A (en) | 2013-09-05 |
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Application publication date: 20130925 |