CN103328682B - The method of joining of sputtering rotary target - Google Patents
The method of joining of sputtering rotary target Download PDFInfo
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- CN103328682B CN103328682B CN201180065900.9A CN201180065900A CN103328682B CN 103328682 B CN103328682 B CN 103328682B CN 201180065900 A CN201180065900 A CN 201180065900A CN 103328682 B CN103328682 B CN 103328682B
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- target
- penstock
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- silver
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
Abstract
The present invention relates to for sputtering rotary target joint composition and use its method for joining of rotary target.According to the present invention, the cylindrical target of sputtering rotary target is joined to the outer surface of cylindrical penstock by this joint composition being used for sputtering rotary target, wherein said rotary target is arranged on to apply high voltage while being rotated by CD-ROM drive motor in sputtering chamber revolvably, and the joint composition being used for sputtering of the wherein said outer surface for target being joined to penstock comprises the mixture of the bismuth of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight.In addition, the method using the described joint composition for rotary target to engage sputtering rotary target is provided.According to the present invention, the production cost of sputtering rotary target significantly reduces.
Description
Technical field
The present invention relates to for sputtering rotary target joint composition (bondingcomposition) and use its method of joining.More specifically, the present invention relates to comprise specified proportion easily obtain and cheap component target joined to the joint composition for sputtering rotary target of the outer surface of penstock (backing pipe, backingtube) and to use the method for joining of said composition.
Background technology
Sputter the technology typically referred to for being attached in membrane form by target material on workpiece surface.This sputtering for forming electronic circuit to form film or thick film by vaporizing solid under a high vacuum on base material such as pottery or semiconductor material.
Particularly, sputtering is such method: while wherein introducing rare gas element (mainly argon (Ar) gas) under vacuo, between base material and target (material to be attached, Cr or Ti), such as, apply volts DS to make ionized inert gas and to make the rare gas element of this ionization and target collide target material to form form membrane on base material.When by a small amount of O
2or N
2when gas is introduced together with argon gas, reactive sputtering (such as ITO or TiN sputtering) can be carried out.
Sputtering is the dry type shikishima plating process not being exposed to the gas of liquid or heat for carrying out plating (covering, plate) to material to be coated.Therefore, sputtering is suitable for forming electrode, shield and blindage on the plate be made up of different base mateirals (such as, resin, glass and stupalith) and moulded product.
On the other hand, rotary target for plating processing example as the sputtering system forming coating or film in be used as and apply high-tension electrode.This sputtering rotary target is made up of the cylindrical target of cylindrical penstock with the outer surface being attached to penstock.By the fusion bond of indium, entirety joins the outer surface of penstock to this target.
Indium is the yttrium of the 13rd race (boron family) of periodictable.Indium has bright, argenteous gloss, and is found when they study zinc ore sample by FerdinandReich and TheodorRichter in 1863.The existence of the spectral line of dominant indigo suggested this title.
Indium has the abnormal character being attached to (soaking) clean glass and other surface when melting.This make its at glass, metal, quartz, to produce gas-tight seal between pottery and marble be valuable.Indium is for applying aircraft engine bearing, because it improves erosion resistance and enables surface keep the oil film of more adhering.
For cylindrical target being joined to the rare metal that the indium of the outer surface of penstock is high price in the structure of sputtering rotary target.Therefore, in the manufacture of sputtering rotary target, indium is used to relate to the increase of manufacturing cost.
In addition, rarity its market value that makes of indium is very unstable, causes the problem of supply and demand aspect.
Summary of the invention
In the process of making great efforts the problem solving prior art, achieve the present invention, and a target of the present invention is to provide the joint composition for sputtering rotary target, its use specific blend ratio two or more easily obtain and cheap metal as the sub of indium so that target melt is engaged (meltbond) to the outer surface of penstock, the supply and demand of the minimizing of the manufacturing cost of rotary target and the stable of material is contributed.
Another target of the present invention is to provide the method for joining using this joint composition.
According to an aspect of the present invention, be provided for the composition of the outer surface cylindrical target of sputtering rotary target being joined to cylindrical penstock, this rotary target is arranged on to apply high voltage while being rotated by CD-ROM drive motor in sputtering chamber revolvably, and wherein said composition comprises the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight.
According to an aspect of the present invention, be provided for the composition of the outer surface cylindrical target of sputtering rotary target being joined to cylindrical penstock, this rotary target is arranged on to apply high voltage while being rotated by CD-ROM drive motor in sputtering chamber revolvably, wherein said composition comprise the bismuth (Bi) of 49 to 54 % by weight, the tin (Sn) of 45 to 50 % by weight and 1 to 6 % by weight indium (In) or silver (Ag).
When using joint composition of the present invention target to be adhered to the outer surface of penstock, preferably penstock and target being heated to 271.3 DEG C or higher, melting to make this joint composition.
Penstock can be made up of titanium (Ti) or stainless steel (S/S).When penstock is made up of titanium (Ti), target by be selected from ITO, AZO and ZNO stupalith or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and silicon (Si) the metal with low thermal expansivity make.Simultaneously, when penstock is made up of stainless steel (S/S), target by be selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and chromium (Cr) the metal with high thermal expansivity make.
According to a further aspect in the invention, the method of joining using this joint composition is provided, the method comprises: the penstock of sputtering rotary target and target are heated to preset temperature or higher by (a), b () applies the surface treatment agent of powder type separately to the outer surface of penstock and the inner peripheral surface of target, and this surface treatment agent is carried out rubbing (embrocating with brush or ultrasound processing equipment between melting period, rub), to process the outer surface of penstock and the inner peripheral surface of target, c () cools penstock and target after the surface treatment, on d outer surface that target is positioned at penstock by () and appropriate position target and penstock are placed on vertically on platen, e penstock and target are heated to preset temperature or higher by (), f () makes penstock and target vibration while heating, g () is while heating and vibration, the joint composition of melted state is supplied in the space between the outer surface and the inner peripheral surface of target of penstock, to allow being uniformly distributed of the joint composition of fusing, (h) stop heating and vibration to allow joint composition cools.
Penstock can be made up of titanium (Ti) or stainless steel (S/S).When penstock is made up of titanium (Ti), target can by be selected from ITO, AZO and ZNO stupalith or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and silicon (Si) the metal with low thermal expansivity make.Simultaneously, when penstock is made up of stainless steel (S/S), target can by be selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and chromium (Cr) the metal with high thermal expansivity make.
In method of joining of the present invention, when the penstock be made up of titanium (Ti) is joined to by be selected from ITO, AZO and ZNO stupalith or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and silicon (Si) there is the metal target of low thermal expansivity time, first and secondary treatment can be carried out to the inner peripheral surface of target, and can process for the first time the outer surface of penstock.
In step (b), to the first process of the inner peripheral surface of target by carrying out as follows: the inner peripheral surface to target applies the surface treatment agent of powder type, and rubs this surface treatment agent with brush or ultrasound processing equipment between melting period; With the secondary treatment of the inner peripheral surface to target by carrying out as follows: the inner peripheral surface to the target through first process applies the surface treatment agent of powder type, and rubs this surface treatment agent with brush or ultrasound processing equipment between melting period.
Surface treatment agent for processing for the first time can be the mixture of tin (Sn) and indium (In) powder, wherein the amount of indium (In) is no more than 40 % by weight relative to the gross weight of this mixture, and the surface treatment agent for secondary treatment can be the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, wherein the total amount of silver (Ag) and titanium (Ti) is 5 % by weight or less relative to the gross weight of this mixture.Surface treatment agent for the treatment of the outer surface of penstock can be the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver (Ag) and titanium (Ti) is 5 % by weight or less relative to the gross weight of this mixture.
When the penstock be made up of stainless steel (S/S) is joined to by be selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and chromium (Cr) there is the metal target of high thermal expansivity time, can process for the first time separately the inner peripheral surface of the outer surface of penstock and target.Surface treatment agent for processing separately the outer surface of penstock and the inner peripheral surface of target can be the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver (Ag) and titanium (Ti) is 5 % by weight or less relative to the gross weight of this mixture.
In step (a), preferably penstock and target are heated to the fusing point (231.9 DEG C) or higher of tin (Sn).
In step (g), engage composition and can comprise the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight, or can comprise the bismuth (Bi) of 49 to 54 % by weight, the tin (Sn) of 45 to 50 % by weight and 1 to 6 % by weight indium (In) or silver-colored (Ag).
In step (e), preferably penstock and target are heated to 271.3 DEG C or higher, remain on melted state to make joint composition.
According to the present invention, engage that composition uses specific blend ratio two or more easily obtain and cheap metal as the sub of indium, target melt to be joined to the outer surface of penstock.
Therefore, utilize this joint composition can contribute to the remarkable reduction of the manufacturing cost of sputtering rotary target, and realize the stable supply and demand of material.
Accompanying drawing explanation
By the following description of the embodiment considered by reference to the accompanying drawings, these and/or other side of the present invention and advantage will become distinct and be easier to understand, wherein:
Fig. 1 is the assembling view of the structure of application sputtering rotary target of the present invention;
Fig. 2 is the cross-sectional view of the structure of application sputtering rotary target of the present invention;
Fig. 3 illustrates the schema of use according to the present invention for the method for joining of the joint composition of sputtering rotary target; With
Fig. 4 is the schema of the surface treatment step illustrated in the method for joining of use according to the present invention for the joint composition of sputtering rotary target.
Embodiment
The method of joining of the joint composition being used for sputtering rotary target according to the preferred embodiment of the present invention with this joint composition of use will be described in more detail now.
Fig. 1 is the assembling view of the structure of application sputtering rotary target of the present invention, Fig. 2 is the cross-sectional view of the structure of application sputtering rotary target of the present invention, Fig. 3 illustrates the schema of use according to the present invention for the method for joining of the joint composition of sputtering rotary target, and Fig. 4 is the schema of the surface treatment step illustrated in the method for joining of use according to the present invention for the joint composition of sputtering rotary target.
As illustrated in Fig. 1 to 4, joint composition 130 of the present invention comprises bismuth (Bi) and the tin (Sn) of specific blend ratio.The rotary target 100 applying joint composition 130 of the present invention is made up of the target 120 and penstock 110 applying high voltage to it.Joint composition 130 of the present invention is for joining the outer surface of penstock 110 to by target 120.
Particularly, engage composition 130 and comprise the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight.The joint composition 130 of melted state is supplied in the space between the outer surface and the inner peripheral surface of target 120 of penstock 110.
Joint composition 130 of the present invention can comprise the bismuth (Bi) of specific blend ratio, tin (Sn) and indium (In) or silver (Ag).
Particularly, joint composition 130 of the present invention can comprise the bismuth (Bi) of 49 to 54 % by weight, the tin (Sn) of 45 to 50 % by weight and 1 to 6 % by weight indium (In) or silver (Ag).The joint composition 130 of melted state is supplied in the space between the outer surface and the inner peripheral surface of target 120 of penstock 110.
Joint composition 130 of the present invention will be for applying high-tension target 120 and join to the outer surface of penstock 110 to it.This joint realizes as follows.First, penstock 110 is placed on vertically the appropriate position on the platen (not shown) of horizontal equilibrium.Target 120 is positioned on the outer surface of penstock 110, and is placed in appropriate position, make to produce space between the outer surface and the inner peripheral surface of target 120 of penstock 110.
Then, comprising melted state the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight or the bismuth (Bi) of 49 to 54 % by weight, the tin (Sn) of 45 to 50 % by weight and the indium (In) of 1 to 6 % by weight can be comprised or the joint composition 130 of silver (Ag) is supplied in the space between the outer surface and the inner peripheral surface of target 120 of penstock 110, and make it distribute equably by vibration.Stop heating and vibration, to allow that engaging composition 130 cools, and makes target 120 can join the outer surface of penstock 110 to.
Bismuth (Bi), according to a kind of component of joint composition 130 of the present invention, the metallic and element that abundance is minimum of most in Shi Dan race (the 15th race of periodictable).Bismuth is that in all metals, diamagnetism is maximum, and has minimum thermal conductivity in all elements outside the removal of mercury.Bismuth is hard, fragility, glossiness and coarse-grain.
Bismuth is distinguished by its canescence color with blush tone and other metallographic phase all.Bismuth is found to be free at occurring in nature usually.Its spontaneous compound is sulfide (copper bismuth mineral or bismuth brightness ore deposit, Bi mainly
2s
3) and oxide compound (bismite or bismuth ochre, Bi
2o
3).The bismuth of business produces in a large number as in the melting of lead, tin and copper mine and the byproduct in refining.Pure bismuth is also by reduction with carbon oxide compound or by sulfide roasting being obtained to remove desulfuration under the existence of charcoal and metallic iron.Bismuth has the fusing point of 271.3 DEG C and the proportion (20 DEG C) of 9.747g/cc.
Tin (Sn), according to another component of joint composition 130 of the present invention, is the chemical element belonging to carbon family (the 14th race of periodictable).It is silvery white metal that is soft, that have bluish shades, in bronze (with the alloy of copper) known to ancients.Tin is widely used for the cylinder of steel that plating is used as foodstuff container, is used in the metal for bearing and is used in solder.Tin has the fusing point of 232 DEG C.
Indium (In), according to another component of joint composition 130 of the present invention, has bright, argenteous gloss, and (1863) discovery when they study zinc ore sample by FerdinandReich and TheodorRichter.The existence of dominant indigo spectral line suggested this title.Indium is softer than plumbous, and is unusual plasticity.Indium can be swiped with nail, and can experience almost unconfined distortion.As tin, pure metal sends when being bent in alt " sound (cry) ".Indium is roughly rare as silver.The shell average packet of the earth contains the indium of about 0.1ppm weight.This element, neither exist with uncombined form, neither be present in independently in mineral (ore), but exists as trace thing in the mineral of many mineral, especially zinc and lead, and this element obtains from described mineral as byproduct.
Indium metal is not at normal temperatures by air impact, but in red heat, its burning, has bluish voilet flame, forms oxide yellow thing In
2o
3.It is dissolved in mineral acid, but not by potassium hydroxide or the water mitigation that boils.When heating under the existence at halogen or sulphur, there is direct chemical combination.Although prepared that some are real, wherein element be the indium compound (such as, halogenide) of+1 oxidation state, indium usually shows+3 states in its compound.Indium and the 15th main group element form the compound (indium phosphide, arsenide, stibnide) with semiconductor property.Indium has the fusing point of 156.61 DEG C.
Silver can be used in joint composition 130 according to the present invention to replace indium (In).Silver (Ag) is the same with platinum as gold, iridium, palladium, is the known metallic element as one of precious metal.In the imperial mausoleum of B.C. 4000, find snow cover jewelry and ornament reviewing.May before B.C. 800 years, in the All Countries between Indus and the Nile, gold and silver are all used as currency.Afterwards, Roman advances skill and the science of the smelting of silver, and sets up silver-colored smeltery in many places, wherein obtains silver or production snow cover jewelry by dry type smelting technology.After several century, find that some Gold Ores and silver ore and mercury form the fact of mercury alloys.Based on this discovery, develop amalgamate and reclaim gold and silver method.Silver (Ag) has the fusing point of 961.3 DEG C.
When being used for target 120 to adhere to the outer surface of penstock 110 with melted state by the joint composition comprising bismuth (Bi) and tin (Sn) or can comprise bismuth (Bi), tin (Sn) and indium (In) or silver (Ag) of the present invention, preferably penstock 110 and target 120 are heated to 271.3 DEG C or higher.
Why penstock 110 and target 120 being heated to 271.3 DEG C or higher reason is that joint composition 130 in order to comprise bismuth (Bi) and tin (Sn) or can comprise bismuth (Bi), tin (Sn) and indium (In) or silver (Ag) is supplied in the space between penstock 110 and target 120 with melted state.The Heating temperature (271.3 DEG C) of penstock 110 and target 120 is corresponding to the fusing point of bismuth (Bi).
Penstock 110 is made up of titanium (Ti) or stainless steel (S/S).The material of target 120 depends on the material of penstock 110.Such as, when penstock 110 is made up of titanium (Ti), target 120 by be selected from ITO, AZO and ZNO stupalith or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and silicon (Si) the metal with low thermal expansivity make.Or, when penstock 110 is made up of stainless steel (S/S), target 120 by be selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and chromium (Cr) the metal with high thermal expansivity make.
Use and comprise according to the method for joining of joint composition of the present invention: the penstock 110 of sputtering rotary target 100 and target 120 are heated to preset temperature or higher (S100) by (a), b () applies the surface treatment agent (not shown) of powder type separately to the outer surface of penstock 110 and the inner peripheral surface of target 120, and between melting period, rub this surface treatment agent with brush or ultrasound processing equipment, with the inner peripheral surface (S110) of the outer surface and target 120 that process penstock 110, c () cools penstock 110 and target 120 (S120) after the surface treatment, d target 120 is positioned at the appropriate position (S130) be placed on vertically on the outer surface of penstock 110 and by target 120 and penstock 110 on platen by (), e penstock 110 and target 120 are heated to preset temperature or higher (S140) by (), f () makes penstock 110 and target 120 vibrate (S150) while heating, g () is while heating and vibration, the joint composition 130 of melted state is supplied in the space between the outer surface and the inner peripheral surface of target 120 of penstock 110, to allow being uniformly distributed (S160) of the joint composition 130 of fusing, (h) heating and vibration is stopped, to allow that engaging composition 130 cools (S170).
In method of joining of the present invention, the kind of surface treatment agent depends on the material of penstock 110 and target 120 and changes.As previously mentioned, penstock 110 is made up of titanium (Ti) or stainless steel (S/S).Such as, when penstock 110 is made up of titanium (Ti), target 120 by be selected from ITO, AZO and ZNO stupalith or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and silicon (Si) the metal with low thermal expansivity make.Or, when penstock 110 is made up of stainless steel (S/S), target 120 by be selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and chromium (Cr) the metal with high thermal expansivity make.
In method of joining of the present invention, when the penstock 110 manufactured by titanium (Ti) is joined to by be selected from ITO, AZO and ZNO stupalith or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and silicon (Si) there is the metal target 120 of low thermal expansivity time, first and secondary treatment are carried out to the inner peripheral surface of target 120, and the outer surface of penstock 110 is processed for the first time.That is, by the inner peripheral surface process twice of target 120, and the outer surface of penstock 110 is only processed once.
To the first process of the inner peripheral surface of target 120 by carrying out as follows: the inner peripheral surface to target 120 applies the surface treatment agent of powder type, and rubs this surface treatment agent (S110-1) with brush or ultrasound processing equipment between melting period; Pass through to carry out as follows with the secondary treatment of the inner peripheral surface to target 120: the inner peripheral surface to the target through first process applies the surface treatment agent of powder type, and rubs this surface treatment agent (S110-2) with brush or ultrasound processing equipment between melting period.
For the surface-treated surface treatment agent of target 120 with above-mentioned those are identical.Particularly, surface treatment agent for processing for the first time is the mixture of tin (Sn) and indium (In) powder, wherein the amount of indium (In) is no more than 40 % by weight relative to the gross weight of this mixture, can be the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder with the surface treatment agent for secondary treatment, wherein the total amount of silver (Ag) and titanium (Ti) is 5 total amount % or less relative to the gross weight of this mixture.
Surface treatment agent for the treatment of the outer surface of penstock 110 is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver (Ag) and titanium (Ti) is 5 % by weight or less relative to the gross weight of this mixture.
On the other hand, when the penstock 110 be made up of stainless steel (S/S) is joined to by be selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and chromium (Cr) there is the metal target 120 of high thermal expansivity time, the outer surface of penstock 110 and the inner peripheral surface of target 120 are processed separately for the first time.Surface treatment agent for processing separately the outer surface of penstock 110 and the inner peripheral surface of target 120 is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver (Ag) and titanium (Ti) is 5 % by weight or less relative to the gross weight of this mixture.
The method with reference to Fig. 3, target 120 being joined by use joint composition 130 according to the present invention to the outer surface of penstock 110 is explained in more detail.First, in step (a), the penstock 110 of sputtering rotary target 100 and target 120 are heated to preset temperature or higher (S100).Carry out this heating steps, to make to be applied to the surface treatment agent fusing of penstock 110 and target 120 in step (b) subsequently.
In step (a), penstock 110 and target 120 are heated to the fusing point (231.9 DEG C) or higher of tin (Sn), the surface treatment agent fusing will applied in step (b) subsequently can be made at such a temperature.Why Here it is is heated to the fusing point (231.9 DEG C) of tin (Sn) or higher reason by penstock 110 and target 120, because the fusing point of tin (Sn) is higher than the fusing point of indium (In).
Even when using the surface treatment agent be made up of tin (Sn), silver (Ag) and titanium (Ti), penstock 110 and target 120 are heated to the fusing point (231.9 DEG C) or higher of tin (Sn), surface treatment agent can be made at such a temperature to melt.
In step (b), the surface treatment agent of powder type is applied to the outer surface of penstock 110 and the inner peripheral surface of target 120, and between melting period, rub this surface treatment agent with brush or ultrasound processing equipment, with the inner peripheral surface (S110) of the outer surface and target 120 that process penstock 110, as illustrated in figs. 3 and 4.
In intention, the penstock 110 be made up of titanium (Ti) is joined to by being selected from ITO, the stupalith of AZO and ZNO or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and silicon (Si) have in the situation of metal target 120 of low thermal expansivity, the inner peripheral surface that step (b) comprises to target 120 applies the surface treatment agent of powder type and between melting period, rubs this surface treatment agent with brush or ultrasound processing equipment (process for the first time, S110-1), and apply the surface treatment agent of powder type to the inner peripheral surface of the target through first process and rub this surface treatment agent (secondary treatment with brush or ultrasound processing equipment between melting period, S110-2).
Surface treatment agent for processing for the first time is the mixture of tin (Sn) and indium (In) powder, and wherein the amount of indium (In) is no more than 40 % by weight relative to the gross weight of this mixture.Surface treatment agent for secondary treatment is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver (Ag) and titanium (Ti) is 5 % by weight or less relative to the gross weight of this mixture.
When the penstock 110 be made up of titanium (Ti) being joined to by when there is the metal target 120 of low thermal expansivity, the outer surface of penstock 110 is processed for the first time.Surface treatment agent for processing for the first time is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver (Ag) and titanium (Ti) is 5 % by weight or less relative to the gross weight of this mixture.
On the other hand, when the penstock 110 be made up of stainless steel (S/S) is joined to by be selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and chromium (Cr) there is the metal target 120 of high thermal expansivity time, the outer surface of penstock 110 and the inner peripheral surface of target 120 are processed separately for the first time.Surface treatment agent for processing separately the outer surface of penstock 110 and the inner peripheral surface of target 120 is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver (Ag) and titanium (Ti) is 5 % by weight or less relative to the gross weight of this mixture.
By using brush or ultrasound processing equipment, the surface treatment agent of fusing is anisotropically applied to the inner peripheral surface of the outer surface of penstock 110 and target 120, and the outer surface of oxide film from penstock 110 and the inner peripheral surface removing of target 120.
In other words, when using brush or ultrasound processing equipment the surface treatment agent of fusing to be anisotropically applied to the inner peripheral surface of the outer surface of penstock 110 and target 120, the oxide film be formed in the outer surface of penstock 110 and the inner peripheral surface of target 120 is removed.
The outer surface by engaging composition 130, target 120 being joined fully to penstock 110 is in a subsequent step guaranteed in the removing of oxide film.
In step (c), cooling penstock 110 and target 120 (S120).As the result of this cooling, the surface treatment agent of fusing can securely (regularly) adhere to the outer surface of penstock 110 and the inner peripheral surface of target 120.
The cooling of penstock 110 and target 120 is guaranteed, in the safety of the worker in the step of target 120 that penstock 110 joined to subsequently, to make worker can complete this engagement step and have no problem.
Preferably allow penstock 110 and target 120 at room temperature naturally cooling.This naturally cooling prevents the unexpected temperature variation of the surface treatment agent melted.
Then, in step (d), target 120 is positioned on the outer surface of penstock 110, and target 120 and penstock 110 are placed on the appropriate position (S130) in platen (not shown) vertically.
In this step, between the outer surface and the inner peripheral surface of target 120 of penstock 110, space is produced.In step (g) subsequently, joint composition 130 is supplied in this space.
Particularly, when target 120 is designed to have than the about 2mm of the external diameter of penstock 110 internal diameter, be located at penstock 110 outer surface on and it is placed on together with penstock 110 appropriate position time, between the outer surface and the inner peripheral surface of target 120 of penstock 110, produce the space with the width of about 1mm.
In step (e), penstock 110 and target 120 are heated to preset temperature or higher (S140).Due to this heating, joint composition 130 is made to remain on melted state in a subsequent step.
Preferably the penstock 110 of the appropriate position be placed on platen and target 120 are heated to the temperature of the fusing point (271.3 DEG C) being equal to or higher than the component bismuth (Bi) engaging composition 130.
Then, in step (f), penstock 110 and target 120 are vibrated (S150).Direct vibration or be feasible by the indirect vibration of platen.This vibration penstock 110 and target 120 are heated to preset temperature or higher while carry out.
Vibration and being combined in of heating allow being uniformly distributed of fusion bond composition 130 by engaging while composition 130 remains on melted state.
In this step, pneumatic vibrator can be used to vibrate.Or, ultrasonic vibrator can be used to vibrate to make penstock 110 and target 120.Penstock 110 and target 120 rotate by the rotation of platen, replace being vibrated.
In step (g), while heating and vibration (or rotation), the joint composition 130 of fusing is supplied in the space between the outer surface and the inner peripheral surface of target 120 of penstock 110 (S160).
Being uniformly distributed in the space of the joint composition 130 of fusing in step (g) between penstock 110 and target 120 is allowed in heating in step (e) and the vibration in step (f) (or rotation).
Joint composition 130 for step (g) can be the mixture of bismuth (Bi) and tin (Sn), or can be the mixture of bismuth (Bi), tin (Sn) and indium (In) (or silver (Ag)).Particularly, engage composition 130 and can comprise the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight, or can comprise the bismuth (Bi) of 49 to 54 % by weight, the tin (Sn) of 45 to 50 % by weight and 1 to 6 % by weight indium (In) or silver-colored (Ag).The joint composition 130 of melted state is supplied in the space between the outer surface and the inner peripheral surface of target 120 of penstock 110.
When the bismuth of the fusing engaging composition 130 solidifies, it expands about 3 to about 3.5%.Method of the present invention utilizes bismuth (Bi) bulging force when solidifying to make the joint between penstock 110 and target 120 better.
Then, in step (h), the joint composition 130 melted wherein stops heating and vibration (or rotation) under being evenly distributed in the state in the space between penstock 110 and target 120, to allow that engaging composition 130 cools (S170).
As the result of cooling after stopping heating and vibration in step (h), the joint composition 130 of fusing solidifies in the space between penstock 110 and target 120, completes the joint of penstock 110 and target 120.
In this step, the joint composition 130 at room temperature naturally cooling of fusing is preferably allowed.Due to this naturally cooling, the joint composition 130 of fusing adheres to the outer surface of penstock 110 and the inner peripheral surface of target 120 securely, and does not experience unexpected temperature variation.
As from distinct above, joint composition 130 of the present invention can be used for engaging penstock 110 and target 120, and no matter whether there is the rare indium of the costliness of reduction.Therefore, the use of this joint composition can be contributed to the reduction of the manufacturing cost of rotary target, and realizes its stable supply and demand.
Although describe the present invention with reference to aforementioned embodiments in this article, it is not limited to described embodiment and can the multiple different form within the scope of its technical spirit embodies.
The present invention can use at the joint composition and using in its method of joining for sputtering rotary target.
Claims (11)
1. the method for joining of sputtering rotary target, the method comprises:
A the penstock of sputtering rotary target and target are heated to preset temperature or higher by (),
B () applies the surface treatment agent of powder type separately to the outer surface of described penstock and the inner peripheral surface of described target, and between melting period, rub described surface treatment agent with brush or ultrasound processing equipment, to process the outer surface of described penstock and the inner peripheral surface of described target
C () cools described penstock and described target after the surface treatment,
D described target is positioned at the appropriate position be placed on vertically on the outer surface of described penstock and by described target and described penstock on platen by (),
E described penstock and described target are heated to preset temperature or higher by (),
F () makes described penstock and the vibration of described target while heating,
G the joint composition of melted state, while heating and vibration, is supplied in the space between the outer surface and the inner peripheral surface of described target of described penstock by (), to allow being uniformly distributed of the described joint composition of fusing, and
H () stops described heating and vibration to allow described joint composition cools,
Wherein in step (g), described joint composition comprises the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight, or comprise the bismuth (Bi) of 49 to 54 % by weight, the tin (Sn) of 45 to 50 % by weight and 1 to 6 % by weight indium (In) or silver (Ag), thus by firm engagement that the bulging force of bismuth (Bi) when solidifying carries out between described penstock and described target.
2. method according to claim 1, wherein when described penstock is made up of titanium (Ti), described target is made up of the stupalith being selected from ITO, AZO and ZNO or the metal with low thermal expansivity that is selected from molybdenum (Mo), molybdenum titanium (MoTi), titanium tungsten (TiW), molybdenum tungsten (MoW) and silicon (Si); With when described penstock is made up of stainless steel (S/S), described target is made up of the metal with high thermal expansivity being selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (AlSi) and chromium (Cr).
3. method according to claim 2, wherein when the described penstock manufactured by titanium (Ti) is joined to described by be selected from ITO, AZO and ZNO stupalith or be selected from molybdenum (Mo), molybdenum titanium (MoTi), titanium tungsten (TiW), molybdenum tungsten (MoW) and silicon (Si) there is the metal target of low thermal expansivity time, first and secondary treatment are carried out to the inner peripheral surface of described target, and the outer surface of described penstock is processed for the first time.
4. method according to claim 3, wherein in step (b), for the first process of the inner peripheral surface of described target by carrying out as follows: the inner peripheral surface to described target applies the surface treatment agent of powder type, and rubs described surface treatment agent with brush or ultrasound processing equipment between melting period; Pass through to carry out as follows with the secondary treatment of the inner peripheral surface for described target: the inner peripheral surface to the described target through first process applies the surface treatment agent of powder type, and rubs described surface treatment agent with brush or ultrasound processing equipment between melting period.
5. method according to claim 4, described surface treatment agent wherein for processing for the first time is the mixture of tin (Sn) and indium (In) powder, and wherein the amount of indium (In) is no more than 40 % by weight relative to the gross weight of described mixture.
6. method according to claim 5, be wherein the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder for the described surface treatment agent of secondary treatment, wherein the total amount of silver (Ag) and titanium (Ti) is 5 % by weight or less relative to the gross weight of described mixture.
7. method according to claim 6, surface treatment agent wherein for processing the outer surface of described penstock is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and the total amount of wherein said silver (Ag) and titanium (Ti) is 5 % by weight or less relative to the gross weight of described mixture.
8. method according to claim 2, wherein when the described penstock be made up of stainless steel (S/S) is joined to described by be selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (AlSi) and chromium (Cr) there is the metal target of high thermal expansivity time, the outer surface of described penstock and the inner peripheral surface of described target are processed separately for the first time.
9. method according to claim 8, surface treatment agent wherein for processing separately the outer surface of described penstock and the inner peripheral surface of described target is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver (Ag) and titanium (Ti) is 5 % by weight or less relative to the gross weight of described mixture.
10. the method any one of claim 1 to 9, wherein in step (a), is heated to the fusing point 231.9 DEG C or higher of tin (Sn) by described penstock and described target.
11. methods according to claim 1, wherein in step (e), are heated to 271.3 DEG C or higher by described penstock and described target, so that described joint composition is remained on melted state.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100117463A KR101341705B1 (en) | 2010-11-24 | 2010-11-24 | Method for bonding rotary target for sputtering |
| KR10-2010-0117463 | 2010-11-24 | ||
| PCT/KR2011/009016 WO2012070882A2 (en) | 2010-11-24 | 2011-11-24 | Bonding composition for a rotary target for sputtering and bonding method of a rotary target using same |
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| Publication Number | Publication Date |
|---|---|
| CN103328682A CN103328682A (en) | 2013-09-25 |
| CN103328682B true CN103328682B (en) | 2016-04-06 |
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| CN201180065900.9A Active CN103328682B (en) | 2010-11-24 | 2011-11-24 | The method of joining of sputtering rotary target |
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| Country | Link |
|---|---|
| KR (1) | KR101341705B1 (en) |
| CN (1) | CN103328682B (en) |
| TW (1) | TWI561654B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015169393A1 (en) * | 2014-05-09 | 2015-11-12 | Applied Materials, Inc. | Shielding device for rotatable cathode assembly and method for shielding a dark space in a deposition apparatus |
| CN105331937B (en) * | 2014-07-30 | 2018-04-13 | 合肥江丰电子材料有限公司 | Target processing unit (plant) and processing method |
| CN105624627B (en) * | 2016-03-14 | 2018-08-31 | 无锡舒玛天科新能源技术有限公司 | Binding formula magnetron sputtering rotary target material and preparation method thereof |
| JP2018168417A (en) * | 2017-03-29 | 2018-11-01 | 三菱マテリアル株式会社 | Method for manufacturing cylindrical sputtering target and cylindrical sputtering target |
| CN109440065B (en) * | 2018-11-09 | 2020-07-14 | 南昌大学 | Preparation method of nano-scale corrosion-resistant molybdenum-tungsten film on surface of magnesium alloy |
| CN110408901B (en) * | 2019-08-21 | 2020-06-26 | 东莞市欧莱溅射靶材有限公司 | Method for pretreating inner wall of whole target tube bound by long tube rotating target by brush plating |
| CN113523239A (en) * | 2021-06-29 | 2021-10-22 | 芜湖映日科技股份有限公司 | Target binding process using indium-tin mixed material |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0787818A1 (en) * | 1996-01-31 | 1997-08-06 | LEYBOLD MATERIALS GmbH | Tin or tin base alloy sputtering target |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0787819B1 (en) * | 1996-01-31 | 1999-12-22 | LEYBOLD MATERIALS GmbH | Tin or tin base alloy sputtering target |
| DE102004060423B4 (en) * | 2004-12-14 | 2016-10-27 | Heraeus Deutschland GmbH & Co. KG | Pipe target and its use |
| US7922066B2 (en) * | 2005-09-21 | 2011-04-12 | Soleras, LTd. | Method of manufacturing a rotary sputtering target using a mold |
| CN101313083A (en) * | 2005-09-28 | 2008-11-26 | 卡伯特公司 | Inertial bonding method of forming a sputtering target assembly and assembly made therefrom |
| EP1960565A4 (en) * | 2005-10-03 | 2010-06-02 | Thermal Conductive Bonding Inc | Very long cylindrical sputtering target and method for manufacturing |
| JP5467735B2 (en) * | 2007-07-02 | 2014-04-09 | 東ソー株式会社 | Cylindrical sputtering target |
| JP5387118B2 (en) * | 2008-06-10 | 2014-01-15 | 東ソー株式会社 | Cylindrical sputtering target and manufacturing method thereof |
-
2010
- 2010-11-24 KR KR1020100117463A patent/KR101341705B1/en active IP Right Grant
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2011
- 2011-11-24 CN CN201180065900.9A patent/CN103328682B/en active Active
- 2011-11-24 WO PCT/KR2011/009016 patent/WO2012070882A2/en active Application Filing
- 2011-11-24 TW TW100143157A patent/TWI561654B/en active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0787818A1 (en) * | 1996-01-31 | 1997-08-06 | LEYBOLD MATERIALS GmbH | Tin or tin base alloy sputtering target |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103328682A (en) | 2013-09-25 |
| WO2012070882A4 (en) | 2012-11-15 |
| KR20120055979A (en) | 2012-06-01 |
| KR101341705B1 (en) | 2013-12-16 |
| WO2012070882A3 (en) | 2012-09-27 |
| TWI561654B (en) | 2016-12-11 |
| TW201231703A (en) | 2012-08-01 |
| WO2012070882A2 (en) | 2012-05-31 |
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