CN103328682A - Bonding composition for a rotary target for sputtering and bonding method of a rotary target using same - Google Patents
Bonding composition for a rotary target for sputtering and bonding method of a rotary target using same Download PDFInfo
- Publication number
- CN103328682A CN103328682A CN2011800659009A CN201180065900A CN103328682A CN 103328682 A CN103328682 A CN 103328682A CN 2011800659009 A CN2011800659009 A CN 2011800659009A CN 201180065900 A CN201180065900 A CN 201180065900A CN 103328682 A CN103328682 A CN 103328682A
- Authority
- CN
- China
- Prior art keywords
- target
- penstock
- titanium
- weight
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
Abstract
The present invention relates to a bonding composition for a rotary target for a sputtering and bonding method of a rotary target using the same. According to the present invention, the bonding composition for a rotary target for sputtering bonds a cylindrical target to an outer peripheral surface of a cylindrical backing tube of the rotary target for sputtering, wherein the rotary target is rotatably installed in a chamber for sputtering to apply high voltage while being rotated by a driving motor, wherein the bonding composition for sputtering, for bonding the target to the outer peripheral surface of the backing tube comprises a mixture of 50 to 54 wt% of Bismuth and 46 to 50 wt% of tin (Sn). In addition, provided is a method for bonding a rotary target for sputtering, using the bonding composition for a rotary target. According to the present invention, production cost for a rotary target for sputtering is significantly reduced.
Description
Technical field
The present invention relates to for sputter with its method of joining of the joint composition (bonding composition) of rotary target and use.More specifically, the present invention relates to comprise easily obtaining and cheap component being used for sputter with the joint composition of rotary target and using the method for joining of said composition with the outer surface that target joined to penstock (backing pipe, backing tube) of specified proportion.
Background technology
Sputter typically refers to for target material is attached to technology on the workpiece surface with the form of film.This sputter is used for that for example pottery or semiconductor material form electronic circuit at base material to form film or thick film by vaporizing solid under high vacuum.
Particularly, sputter is such method: wherein introduce under vacuum in the rare gas element (mainly being argon (Ar) gas), between base material and target (material to be adhered to, for example Cr or Ti), apply volts DS so that ionized inert gas and make the rare gas element of this ionization and the target collision to form the target material of form membrane at base material.When with a small amount of O
2Or N
2When gas is introduced with argon gas, can carry out reactive sputtering (for example ITO or TiN sputter).
Sputter is (to cover, plate) and be not exposed to the dry type shikishima plating process of the gas of liquid or heat for material to be coated being carried out plating.Therefore, sputter is suitable for forming electrode, shield and blindage on the plate of being made by different base mateiral (for example, resin, glass and stupalith) and moulded product.
On the other hand, rotary target applies high-tension electrode in the sputtering system that for example forms coating or film for the plating processing with acting on.This sputter is comprised of cylindrical penstock and the cylindrical target that is attached to the outer surface of penstock with rotary target.This target is the whole outer surface that joins penstock to by the fusion bond of indium.
Indium is the yttrium of the 13rd family (boron family) of periodictable.Indium has bright, argenteous gloss, and is found when they study the zinc ore sample by Ferdinand Reich and Theodor Richter in 1863.This title has been advised in the existence of the spectral line of dominant indigo.
Indium has in when fusing and is attached to the glass of (wetting) cleaning and abnormal character on other surface.This makes it is valuable for produce gas-tight seal between glass, metal, quartz, pottery and marble.Indium is used for applying the aircraft engine bearing, because it improves erosion resistance and makes the surface can keep the oil film of more adhering.
The indium that is used for cylindrical target is joined to the outer surface of penstock in sputter in the structure of rotary target is the rare metal of high price.Therefore, use indium to relate to the increase of manufacturing cost in sputter in the manufacturing of rotary target.
In addition, the rare property of indium makes its market value very unstable, causes the problem of supply and demand aspect.
Summary of the invention
In the process of the problem of making great efforts the solution prior art, realized the present invention, and a target of the present invention provides for the joint composition of sputter with rotary target, its use the specific blend ratio two or more easily obtain and cheap metal as the sub of indium so that the target melt is engaged (melt bond) to the outer surface of penstock, the minimizing of the manufacturing cost of rotary target and the stable supply and demand of material are contributed.
Another target of the present invention provides the method for joining that uses this joint composition.
According to an aspect of the present invention, be provided for sputter is joined to the cylindrical target of rotary target the composition of the outer surface of cylindrical penstock, this rotary target be installed in revolvably sputter with in the chamber to apply high voltage by in the CD-ROM drive motor rotation, wherein said composition comprises the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight.
According to an aspect of the present invention, be provided for sputter is joined to the cylindrical target of rotary target the composition of the outer surface of cylindrical penstock, this rotary target be installed in revolvably sputter with in the chamber to apply high voltage by in the CD-ROM drive motor rotation, wherein said composition comprises the bismuth (Bi) of 49 to 54 % by weight, the tin (Sn) of 45 to 50 % by weight and indium (In) or the silver (Ag) of 1 to 6 % by weight.
When using joint composition of the present invention that target is adhered to the outer surface of penstock, preferably penstock and target are heated to 271.3 ℃ or higher, so that should engage the composition fusing.
Penstock can be made by titanium (Ti) or stainless steel (S/S).When penstock by titanium (Ti) when making, target by the stupalith that is selected from ITO, AZO and ZNO or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and the metal with low thermal expansivity of silicon (Si) make.Simultaneously, when penstock by stainless steel (S/S) when making, target is by being selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and the metal with high thermal expansivity of chromium (Cr) is made.
According to a further aspect in the invention, the method of joining that uses this joint composition is provided, the method comprises: (a) sputter is heated to preset temperature or higher with penstock and the target of rotary target, (b) apply separately the surface treatment agent of powder type to the interior perimeter surface of the outer surface of penstock and target, and this surface treatment agent is rubbed wiping with brush or supersound process equipment between melting period (embrocate, rub), so that the outer surface of penstock and the interior perimeter surface of target are processed, (c) after surface treatment, cool off penstock and target, (d) target is positioned on the outer surface of penstock and target and penstock are placed on appropriate position on the platen vertically, (e) penstock and target are heated to preset temperature or higher, (f) in heating, make penstock and target vibration, (g) in heating and vibration, the joint composition of melted state is supplied in the space between the interior perimeter surface of the outer surface of penstock and target, with the even distribution of the joint composition of allowing fusing, and (h) stopped heating and vibration to allow the joint composition cools.
Penstock can be made by titanium (Ti) or stainless steel (S/S).When penstock by titanium (Ti) when making, target can by the stupalith that is selected from ITO, AZO and ZNO or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and the metal with low thermal expansivity of silicon (Si) make.Simultaneously, when penstock by stainless steel (S/S) when making, target can be by being selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and the metal with high thermal expansivity of chromium (Cr) is made.
In method of joining of the present invention, when will be joined to by the penstock that titanium (Ti) makes by the stupalith that is selected from ITO, AZO and ZNO or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and silicon (Si) have the metal target of low thermal expansivity the time, can carry out first and secondary treatment to the interior perimeter surface of target, and can process for the first time the outer surface of penstock.
In step (b), can be undertaken by following the first processing of the interior perimeter surface of target: apply the surface treatment agent of powder type to the interior perimeter surface of target, and between melting period, rub with brush or supersound process equipment and wipe this surface treatment agent; Can be undertaken by following with the secondary treatment to the interior perimeter surface of target: apply the surface treatment agent of powder type to the interior perimeter surface through the first target of processing, and between melting period, rub with brush or supersound process equipment and wipe this surface treatment agent.
Be used for the mixture that the first surface treatment agent of processing can be tin (Sn) and indium (In) powder, wherein the amount of indium (In) is no more than 40 % by weight with respect to the gross weight of this mixture, and the surface treatment agent that is used for secondary treatment can be the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver-colored (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of this mixture.Can be the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder for the treatment of the surface treatment agent of the outer surface of penstock, wherein the total amount of silver-colored (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of this mixture.
When will be joined to by the penstock that stainless steel (S/S) makes by be selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and chromium (Cr) have the metal target of high thermal expansivity the time, can process for the first time separately the outer surface of penstock and the interior perimeter surface of target.Be used for the surface treatment agent that the interior perimeter surface of the outer surface of penstock and target is processed separately be can be the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, wherein the total amount of silver-colored (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of this mixture.
In step (a), preferably penstock and target are heated to the fusing point (231.9 ℃) of tin (Sn) or higher.
In step (g), engage composition and can comprise the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight, perhaps can comprise the bismuth (Bi) of 49 to 54 % by weight, the tin (Sn) of 45 to 50 % by weight and indium (In) or the silver (Ag) of 1 to 6 % by weight.
In step (e), preferably penstock and target are heated to 271.3 ℃ or higher, remain on melted state so that engage composition.
According to the present invention, two or more that engage that composition uses the specific blend ratio easily obtain and cheap metal as the sub of indium, the target melt is joined to the outer surface of penstock.
Therefore, utilize this joint composition to contribute with the remarkable reduction of the manufacturing cost of rotary target to sputter, and realize the stable supply and demand of material.
Description of drawings
By the following description of the embodiment of considering by reference to the accompanying drawings, these and/or other side of the present invention and advantage will become distinct and be more readily understood, wherein:
Fig. 1 is the assembling view that the structure of rotary target is used in application sputter of the present invention;
Fig. 2 is the cross-sectional view that the structure of rotary target is used in application sputter of the present invention;
Fig. 3 illustrates according to use of the present invention for the schema of sputter with the method for joining of the joint composition of rotary target; With
Fig. 4 illustrates in use according to the present invention for the schema of sputter with the surface treatment step of the method for joining of the joint composition of rotary target.
Embodiment
The method of joining that sputter is used the joint composition of rotary target and used this joint composition that is used for according to preferred implementation of the present invention will be described now in more detail.
Fig. 1 is the assembling view that the structure of rotary target is used in application sputter of the present invention, Fig. 2 is the cross-sectional view that the structure of rotary target is used in application sputter of the present invention, to be explanation be used for sputter with the schema of the method for joining of the joint composition of rotary target according to use of the present invention to Fig. 3, and Fig. 4 to be explanation be used for sputter with the schema of the surface treatment step of the method for joining of the joint composition of rotary target in use according to the present invention.
As illustrated among Fig. 1 to 4, joint composition 130 of the present invention comprises bismuth (Bi) and the tin (Sn) of specific blend ratio.The rotary target 100 of using joint composition 130 of the present invention is comprised of the target 120 that applies high voltage to it and penstock 110.Joint composition 130 of the present invention is used for target 120 is joined to the outer surface of penstock 110.
Particularly, engage composition 130 and comprise the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight.The joint composition 130 of melted state is supplied in the space between the interior perimeter surface of the outer surface of penstock 110 and target 120.
Particularly, joint composition 130 of the present invention can comprise the bismuth (Bi) of 49 to 54 % by weight, the tin (Sn) of 45 to 50 % by weight and indium (In) or the silver (Ag) of 1 to 6 % by weight.The joint composition 130 of melted state is supplied in the space between the interior perimeter surface of the outer surface of penstock 110 and target 120.
Then, with the tin (Sn) of the bismuth that comprises 50 to 54 % by weight (Bi) of melted state and 46 to 50 % by weight or can comprise the tin (Sn) of bismuth (Bi), 45 to 50 % by weight of 49 to 54 % by weight and the joint composition 130 of the indium (In) of 1 to 6 % by weight or silver (Ag) supplies in the space between the interior perimeter surface of the outer surface of penstock 110 and target 120, and by vibration it is distributed equably.Stopped heating and vibration engage composition 130 coolings to allow, so that target 120 can join the outer surface of penstock 110 to.
Bismuth (Bi) according to a kind of component of joint composition 130 of the present invention, is the element that tool is metallic and abundance is minimum in the nitrogen family (the 15th family of periodictable).Bismuth is diamagnetism maximum in all metals, and has minimum thermal conductivity in all elements outside the removal of mercury.Bismuth is hard, fragility, glossiness and coarse-grain.
Bismuth can be distinguished with the canescence color of blush tone and all other metallographic phase by it.Bismuth is found to be free at occurring in nature usually.Its spontaneous compound mainly is sulfide (copper bismuth mineral or bismuth brightness ore deposit, Bi
2S
3) and oxide compound (bismite or bismuth ochre, Bi
2O
3).Commercial bismuth as the melting of plumbous, tin and copper mine and refining in byproduct produce in a large number.Pure bismuth also can be by the reduction with carbon oxide compound or by in the presence of charcoal and metallic iron the sulfide roasting being obtained to remove desulfuration.Bismuth has 271.3 ℃ fusing point and the proportion of 9.747g/cc (20 ℃).
Tin (Sn) according to another component of joint composition 130 of the present invention, is the chemical element that belongs to carbon family (the 14th family of periodictable).It is silvery white metal soft, that have light blue tone, known to bronze in (with the alloy of copper) is ancients.Tin is widely used for plating as the cylinder of steel of foodstuff container, is used in for the metal of bearing and is used in the scolder.Tin has 232 ℃ fusing point.
Indium (In) according to another component of joint composition 130 of the present invention, has bright, argenteous gloss, and when they study the zinc ore sample (1863) are found by Ferdinand Reich and Theodor Richter.This title has been advised in the existence of dominant indigo spectral line.Indium is softer than plumbous, and is unusual plasticity.Indium can be swiped with nail, and can experience almost unconfined distortion.As tin, pure metal sends when being bent in alt " sound (cry) ".Indium is roughly rare as silver.The shell of the earth on average comprises the approximately indium of 0.1ppm weight.This element is neither exist with uncombined form, neither be present in independently in the mineral (ore), but exist as the trace thing in many mineral, especially zinc and plumbous mineral, and this element obtains as byproduct from described mineral.
Indium metal is not subjected to air impact at normal temperatures, but in red heat, its burning has bluish voilet flame, forms oxide yellow thing In
2O
3It is dissolved in the mineral acid, but is not subjected to the impact of potassium hydroxide or boiling water.When heating in the presence of halogen or sulphur, direct chemical combination occurs.Some are real, wherein element is the indium compound (for example, halogenide) of+1 oxidation state although prepared, and indium shows+3 attitudes usually in its compound.Indium and the 15th main group element form the compound (indium phosphide, arsenide, stibnide) with semiconductor property.Indium has 156.61 ℃ fusing point.
In joint composition 130 according to the present invention, can use silver to replace indium (In).Silver (Ag) is the same as gold, iridium, palladium and platinum, is known metallic element as one of precious metal.Reviewing discovery snow cover jewelry and ornament in B.C. 4000 imperial mausoleum.May be before B.C. 800 years, in the All Countries between Indus and the Nile, both all are used as currency gold and silver.Afterwards, the Roman has advanced skill and the science of silver-colored smelting, and sets up silver-colored smeltery in many places, wherein obtains silver or production snow cover jewelry by the dry type smelting technology.After several centuries, find that some Gold Ores and silver ore and mercury form the fact of mercury alloys.Based on this discovery, developed amalgamate and reclaimed the gold and silver method.Silver (Ag) has 961.3 ℃ fusing point.
When comprising bismuth (Bi) and tin (Sn) or can comprise bismuth (Bi), tin (Sn) and indium (In) or the joint composition of silver (Ag) when being used for that with melted state target 120 adhered to the outer surface of penstock 110 of the present invention, preferably penstock 110 and target 120 are heated to 271.3 ℃ or higher.
Why penstock 110 and target 120 are heated to 271.3 ℃ or higher reason and are in order to comprise bismuth (Bi) and tin (Sn) or can to comprise bismuth (Bi), tin (Sn) and indium (In) or the joint composition 130 of silver (Ag) supplies in the space between penstock 110 and target 120 with melted state.The Heating temperature of penstock 110 and target 120 (271.3 ℃) is corresponding to the fusing point of bismuth (Bi).
Penstock 110 is made by titanium (Ti) or stainless steel (S/S).The material of target 120 depends on the material of penstock 110.For example, in the situation that penstock 110 is made by titanium (Ti), target 120 by the stupalith that is selected from ITO, AZO and ZNO or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and the metal with low thermal expansivity of silicon (Si) make.Perhaps, in the situation that penstock 110 is made by stainless steel (S/S), target 120 is by being selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and the metal with high thermal expansivity of chromium (Cr) is made.
Use comprises according to the method for joining of joint composition of the present invention: (a) sputter is heated to preset temperature or higher (S100) with penstock 110 and the target 120 of rotary target 100, (b) apply separately the surface treatment agent (not shown) of powder type to the interior perimeter surface of the outer surface of penstock 110 and target 120, and between melting period, rub this surface treatment agent of wiping with brush or supersound process equipment, with the outer surface of processing penstock 110 and the interior perimeter surface (S110) of target 120, (c) after surface treatment, cool off penstock 110 and target 120 (S120), (d) target 120 is positioned on the outer surface of penstock 110 and target 120 and penstock 110 are placed on appropriate position (S130) on the platen vertically, (e) penstock 110 and target 120 are heated to preset temperature or higher (S140), (f) in heating, make penstock 110 and target 120 vibrations (S150), (g) in heating and vibration, the joint composition 130 of melted state is supplied in the space between the interior perimeter surface of the outer surface of penstock 110 and target 120, even distribution (S160) with the joint composition 130 of allowing fusing, (h) stopped heating and vibration engage composition 130 coolings (S170) to allow.
In method of joining of the present invention, the kind of surface treatment agent depends on the material of penstock 110 and target 120 and changes.As previously mentioned, penstock 110 is made by titanium (Ti) or stainless steel (S/S).For example, in the situation that penstock 110 is made by titanium (Ti), target 120 by the stupalith that is selected from ITO, AZO and ZNO or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and the metal with low thermal expansivity of silicon (Si) make.Perhaps, in the situation that penstock 110 is made by stainless steel (S/S), target 120 is by being selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and the metal with high thermal expansivity of chromium (Cr) is made.
In method of joining of the present invention, when will be joined to by the penstock 110 that titanium (Ti) is made by the stupalith that is selected from ITO, AZO and ZNO or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and silicon (Si) have the metal target 120 of low thermal expansivity the time, the interior perimeter surface of target 120 is carried out first and secondary treatment, and the outer surface of penstock 110 is processed for the first time.That is, the interior perimeter surface of target 120 is processed twice, and the outer surface of penstock 110 is only processed once.
First processing to the interior perimeter surface of target 120 is undertaken by following: apply the surface treatment agent of powder type to the interior perimeter surface of target 120, and rub with brush or supersound process equipment between melting period and wipe this surface treatment agent (S110-1); Undertaken by following with the secondary treatment to the interior perimeter surface of target 120: apply the surface treatment agent of powder type to the interior perimeter surface through the first target of processing, and between melting period, rub with brush or supersound process equipment and wipe this surface treatment agent (S110-2).
The surface-treated surface treatment agent that is used for target 120 is with above-mentioned those are identical.Particularly, being used for the first surface treatment agent of processing is the mixture of tin (Sn) and indium (In) powder, wherein the amount of indium (In) is no more than 40 % by weight with respect to the gross weight of this mixture, can be the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder with the surface treatment agent that is used for secondary treatment, wherein the total amount of silver-colored (Ag) and titanium (Ti) is 5 total amount % or still less with respect to the gross weight of this mixture.
Surface treatment agent for the treatment of the outer surface of penstock 110 is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver-colored (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of this mixture.
On the other hand, when will be joined to by the penstock 110 that stainless steel (S/S) makes by be selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and chromium (Cr) have the metal target 120 of high thermal expansivity the time, the outer surface of penstock 110 and the interior perimeter surface of target 120 are processed separately for the first time.The surface treatment agent that is used for the interior perimeter surface of the outer surface of penstock 110 and target 120 is processed separately is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver-colored (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of this mixture.
With reference to Fig. 3 use according to the present invention being engaged composition 130 is explained in more detail the method that target 120 joins the outer surface of penstock 110 to.At first, in step (a), sputter is heated to preset temperature or higher (S100) with penstock 110 and the target 120 of rotary target 100.Carry out this heating steps, so that will in step (b) subsequently, be applied to the surface treatment agent fusing of penstock 110 and target 120, as the part of the program of removing the oxide film that forms on the surface of penstock 110 and target 120.
In step (a), penstock 110 and target 120 are heated to the fusing point (231.9 ℃) of tin (Sn) or higher, can make the surface treatment agent fusing that will in step (b) subsequently, apply under this temperature.Why Here it is is heated to penstock 110 and target 120 fusing point (231.9 ℃) or the higher reason of tin (Sn), because the fusing point of tin (Sn) is higher than the fusing point of indium (In).
Even in the situation of using the surface treatment agent that is formed by tin (Sn), silver (Ag) and titanium (Ti), penstock 110 and target 120 are heated to the fusing point (231.9 ℃) of tin (Sn) or higher, under this temperature, can make the surface treatment agent fusing.
In step (b), apply the surface treatment agent of powder type to the interior perimeter surface of the outer surface of penstock 110 and target 120, and between melting period, rub this surface treatment agent of wiping with brush or supersound process equipment, with the outer surface of processing penstock 110 and the interior perimeter surface (S110) of target 120, as illustrated in Fig. 3 and 4.
To be joined to by the penstock 110 that titanium (Ti) makes by being selected from ITO in intention, the stupalith of AZO and ZNO or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) is (MoW) and in the situation of the metal target 120 with low thermal expansivity of silicon (Si), step (b) comprises to the interior perimeter surface of target 120 and applies the surface treatment agent of powder type and rub with brush or supersound process equipment between melting period and wipe this surface treatment agent (first processing, S110-1), and to the interior perimeter surface through the first target of processing apply the surface treatment agent of powder type and between melting period with brush or supersound process equipment rub wipe this surface treatment agent (secondary treatment, S110-2).
Being used for the first surface treatment agent of processing is the mixture of tin (Sn) and indium (In) powder, and wherein the amount of indium (In) is no more than 40 % by weight with respect to the gross weight of this mixture.The surface treatment agent that is used for secondary treatment is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver-colored (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of this mixture.
When being joined to by the penstock 110 that titanium (Ti) makes when having the metal target 120 of low thermal expansivity, the outer surface of penstock 110 is processed for the first time.Be used for the mixture that the first surface treatment agent of processing is tin (Sn), silver (Ag) and titanium (Ti) powder, wherein the total amount of silver-colored (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of this mixture.
On the other hand, when will be joined to by the penstock 110 that stainless steel (S/S) makes by be selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and chromium (Cr) have the metal target 120 of high thermal expansivity the time, the outer surface of penstock 110 and the interior perimeter surface of target 120 are processed separately for the first time.The surface treatment agent that is used for the interior perimeter surface of the outer surface of penstock 110 and target 120 is processed separately is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver-colored (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of this mixture.
By using brush or supersound process equipment, the surface treatment agent of fusing anisotropically is applied to the interior perimeter surface of outer surface and the target 120 of penstock 110, and oxide film is removed from the outer surface of penstock 110 and the interior perimeter surface of target 120.
In other words, when the surface treatment agent that uses brush or supersound process equipment with fusing anisotropically was applied to the interior perimeter surface of the outer surface of penstock 110 and target 120, the oxide film that is formed on the interior perimeter surface of the outer surface of penstock 110 and target 120 was removed.
The removing of oxide film guarantees by engaging composition 130 target 120 to be joined to fully the outer surface of penstock 110 in step subsequently.
In step (c), cooling penstock 110 and target 120 (S120).As the result of this cooling, the surface treatment agent of fusing securely (regularly) adhere to the interior perimeter surface of outer surface and the target 120 of penstock 110.
The safety of the worker in the step that penstock 110 is joined to target 120 is subsequently guaranteed in the cooling of penstock 110 and target 120, so that the worker can finish this engagement step and have no problem.
Preferably allow at room temperature naturally cooling of penstock 110 and target 120.This naturally cooling prevents the unexpected temperature variation of the surface treatment agent that melts.
Then, in step (d), target 120 is positioned on the outer surface of penstock 110, and target 120 and penstock 110 are placed on appropriate position (S130) on the platen (not shown) vertically.
In this step, between the interior perimeter surface of the outer surface of penstock 110 and target 120, produce the space.In step (g) subsequently, will engage composition 130 and supply in this space.
Particularly, when target 120 being designed to have internal diameter than the about 2mm of external diameter of penstock 110, being located on the outer surface of penstock 110 and it is placed on appropriate position with penstock 110, between the interior perimeter surface of the outer surface of penstock 110 and target 120, produce and have the approximately space of the width of 1mm.
In step (e), penstock 110 and target 120 are heated to preset temperature or higher (S140).Because this heating makes joint composition 130 remain on melted state in step subsequently.
Preferably will be placed on the penstock 110 of the appropriate position on the platen and the temperature that target 120 is heated to the fusing point (271.3 ℃) that is equal to or higher than the component bismuth (Bi) that engages composition 130.
Then, in step (f), make penstock 110 and target 120 vibrations (S150).Directly vibration or the indirect vibration by platen are feasible.This vibration penstock 110 and target 120 are heated to preset temperature or higher in carry out.
Vibration and heating be combined in the even distribution of allowing fusion bond composition 130 when composition 130 remains on melted state with engaging.
In this step, can use pneumatic vibrator to vibrate.Perhaps, can make penstock 110 and target 120 vibrations with ultrasonic vibrator.Penstock 110 and target 120 can rotate by the rotation of platen, replace being vibrated.
In step (g), in heating and vibration (or rotation), the joint composition 130 of fusing is supplied in the space between the interior perimeter surface of the outer surface of penstock 110 and target 120 (S160).
The even distribution in the space of joint composition 130 between penstock 110 and target 120 of melting is allowed in heating in step (e) and the vibration in step (f) (or rotation) in step (g).
The joint composition 130 that is used for step (g) can be the mixture of bismuth (Bi) and tin (Sn), perhaps can be the mixture of bismuth (Bi), tin (Sn) and indium (In) (or silver (Ag)).Particularly, engage composition 130 and can comprise the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight, perhaps can comprise the bismuth (Bi) of 49 to 54 % by weight, the tin (Sn) of 45 to 50 % by weight and indium (In) or the silver (Ag) of 1 to 6 % by weight.The joint composition 130 of melted state is supplied in the space between the interior perimeter surface of the outer surface of penstock 110 and target 120.
When the bismuth of the fusing that engages composition 130 solidified, it expanded approximately 3 to approximately 3.5%.Method of the present invention utilizes the bulging force of bismuth (Bi) when solidifying to make the joint between penstock 110 and the target 120 better.
Then, in step (h), the joint composition 130 of fusing is evenly distributed in stopped heating and vibration (or rotation) under the state in the space between penstock 110 and the target 120 therein, engages composition 130 coolings (S170) to allow.
As the result who cools off after stopped heating and vibration in step (h), the joint composition 130 of fusing solidifies in the space between penstock 110 and target 120, finishes engaging of penstock 110 and target 120.
In this step, the joint composition 130 of preferably allowing fusing is naturally cooling at room temperature.Because this naturally cooling, the joint composition 130 of fusing adheres to the interior perimeter surface of outer surface and the target 120 of penstock 110 securely, and does not experience unexpected temperature variation.
As from above distinct, joint composition 130 of the present invention can be used for engaging penstock 110 and target 120, and no matter whether there is the rare indium of the costliness of reduction.Therefore, the use of this joint composition can be contributed to the reduction of the manufacturing cost of rotary target, and realizes the supply and demand that it is stable.
Although described the present invention with reference to aforementioned embodiments in this article, it is not limited to described embodiment and can the multiple different form in its technical spirit scope embodies.
The present invention can be used for sputter with the joint composition of rotary target and use its method of joining to use.
Claims (according to the modification of the 19th of treaty)
1. be used for sputter is joined to the cylindrical target of rotary target the composition of the outer surface of cylindrical penstock, described rotary target be installed in revolvably sputter with in the chamber to apply high voltage by in the CD-ROM drive motor rotation, wherein said composition comprises the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight, carries out firm engagement between described penstock and the described target by the bulging force of bismuth (Bi) when solidifying thus.
2. be used for sputter is joined to the cylindrical target of rotary target the composition of the outer surface of cylindrical penstock, described rotary target be installed in revolvably sputter with in the chamber to apply high voltage by in the CD-ROM drive motor rotation, wherein said composition comprises the tin (Sn) of bismuth (Bi), 45 to 50 % by weight of 49 to 54 % by weight and indium (In) or the silver (Ag) of 1 to 6 % by weight, carries out firm engagement between described penstock and the described target by the bulging force of bismuth (Bi) when solidifying thus.
3. according to claim 1 and 2 composition, wherein when the composition of the composition of described Bi and Sn or described Bi, Sn and In or Ag is used so that described target is attached to the outer surface of described penstock with melted state, described penstock and described target are heated to 271.3 ℃ or higher so that described joint composition fusing.
4. according to claim 3 composition, wherein when described penstock by titanium (Ti) when making, described target by the stupalith that is selected from ITO, AZO and ZNO or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and the metal with low thermal expansivity of silicon (Si) make; With when described penstock by stainless steel (S/S) when making, described target is by being selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and the metal with high thermal expansivity of chromium (Cr) is made.
5. sputter is with the method for joining of rotary target, and the method comprises:
(a) sputter is heated to preset temperature or higher with penstock and the target of rotary target,
(b) apply separately the surface treatment agent of powder type to the interior perimeter surface of the outer surface of described penstock and described target, and between melting period, rub the described surface treatment agent of wiping with brush or supersound process equipment, so that the outer surface of described penstock and the interior perimeter surface of described target are processed
(c) after surface treatment, cool off described penstock and described target,
(d) described target is positioned on the outer surface of described penstock and described target and described penstock is placed on appropriate position on the platen vertically,
(e) described penstock and described target are heated to preset temperature or higher,
(f) in heating, make described penstock and the vibration of described target,
(g) in heating and vibration, the joint composition of melted state is supplied in the space between the interior perimeter surface of the outer surface of described penstock and described target, with the even distribution of the described joint composition of allowing fusing, and
(h) stop described heating and vibration to allow described joint composition cools.
6. according to claim 5 method, wherein when described penstock by titanium (Ti) when making, described target by the stupalith that is selected from ITO, AZO and ZNO or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and the metal with low thermal expansivity of silicon (Si) make; With when described penstock by stainless steel (S/S) when making, described target is by being selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and the metal with high thermal expansivity of chromium (Cr) is made.
7. according to claim 6 method, wherein when the described penstock of being made by titanium (Ti) is joined to described by being selected from ITO, AZO and ZNO stupalith or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and silicon (Si) have the metal target of low thermal expansivity the time, the interior perimeter surface of described target is carried out first and secondary treatment, and the outer surface of described penstock is processed for the first time.
8. according to claim 7 method, wherein in step (b), the first processing that is used for the interior perimeter surface of described target is undertaken by following: apply the surface treatment agent of powder type to the interior perimeter surface of described target, and rub the described surface treatment agent of wiping with brush or supersound process equipment between melting period; Undertaken by following with the secondary treatment of the interior perimeter surface that is used for described target: apply the surface treatment agent of powder type to the interior perimeter surface through the first described target of processing, and between melting period, rub the described surface treatment agent of wiping with brush or supersound process equipment.
9. according to claim 8 method, wherein being used for the first described surface treatment agent of processing is the mixture of tin (Sn) and indium (In) powder, wherein the amount of indium (In) is no more than 40 % by weight with respect to the gross weight of described mixture.
10. according to claim 9 method, the described surface treatment agent that wherein is used for secondary treatment is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver-colored (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of described mixture.
11. method according to claim 10, wherein being used for the surface treatment agent that the outer surface of described penstock is processed is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and the total amount of wherein said silver (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of described mixture.
12. method according to claim 6, wherein when the described penstock of being made by stainless steel (S/S) is joined to described by be selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and chromium (Cr) have the metal target of high thermal expansivity the time, the outer surface of described penstock and the interior perimeter surface of described target are processed separately for the first time.
13. method according to claim 12, the surface treatment agent that wherein is used for the interior perimeter surface of the outer surface of described penstock and described target is processed separately is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver-colored (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of described mixture.
14. each method in 13 according to claim 5 wherein in step (a), is heated to the fusing point (231.9 ℃) of tin (Sn) or higher with described penstock and described target.
15. method according to claim 14, wherein in step (g), described joint composition comprises the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight, perhaps comprise the tin (Sn) of bismuth (Bi), 45 to 50 % by weight of 49 to 54 % by weight and indium (In) or the silver (Ag) of 1 to 6 % by weight, carry out firm engagement between described penstock and the described target by the bulging force of bismuth (Bi) when solidifying thus.
16. method according to claim 15 wherein in step (e), is heated to 271.3 ℃ or higher with described penstock and described target, so that described joint composition is remained on melted state.
Illustrate or state (according to the modification of the 19th of treaty)
Statement according to the 1st section of the 19th article
The present invention has feature " bismuth of the composition by use to be used for engaging rotary target carries out firm engagement between penstock and the target by the bulging force of bismuth (Bi) when solidifying ".
In claim 1 and 2, define above feature according to the 19th by modification and " carry out firm engagement between described penstock and the described target by the bulging force of bismuth (Bi) when solidifying ", to distinguish mutually with D1 (EP0787819A1) and D3 (US2007-0062809A1), D1 and D3 be unexposed above feature both.
Above restriction has obtained the abundant support of the following content set forth in [85] section of the specific embodiment of the invention: " when the bismuth of the fusing that engages composition 130 solidified, it expanded approximately 3 to approximately 3.5%.Method of the present invention utilizes the bulging force of bismuth (Bi) when solidifying to make the joint between penstock 110 and the target 120 better.”
In this, be explained as follows in more detail.The joint composition of D1 is used in the free-ended flat type target that is fixed to backboard, so that the bismuth that has bulging force when solidifying in the described joint composition makes target move away backboard.Therefore, bismuth is inoperative aspect the firm engagement of carrying out between penstock and the target.Simultaneously, according to claim 1 with 2 invention in, bismuth expands, and then is securely fixed in the predetermined space between penstock and the rotary target, has thus the effect of carrying out the firm engagement between penstock and the target.
Because the above characteristic of bismuth, if the composition with D1 pointed such as the auditor is used among the D3, then will there be mould pipe 30 fixed problems, because disclose " grafting material of some fusings can solidify " in last sentence of [0027] section of D3 between mould pipe 30 and target material 36, therefore, think that it is impossible that the joint composition of D1 is used among the D3.
Claims (16)
1. be used for sputter is joined to the cylindrical target of rotary target the composition of the outer surface of cylindrical penstock, described rotary target be installed in revolvably sputter with in the chamber to apply high voltage by in the CD-ROM drive motor rotation, wherein said composition comprises the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight.
2. be used for sputter is joined to the cylindrical target of rotary target the composition of the outer surface of cylindrical penstock, described rotary target be installed in revolvably sputter with in the chamber to apply high voltage by in the CD-ROM drive motor rotation, wherein said composition comprises the bismuth (Bi) of 49 to 54 % by weight, the tin (Sn) of 45 to 50 % by weight and indium (In) or the silver (Ag) of 1 to 6 % by weight.
3. according to claim 1 and 2 composition, wherein when the composition of the composition that uses described Bi and Sn or described Bi, Sn and In or Ag is attached to the outer surface of described penstock with described target, described penstock and described target are heated to 271.3 ℃ or higher so that described joint composition fusing.
4. according to claim 3 composition, wherein when described penstock by titanium (Ti) when making, described target by the stupalith that is selected from ITO, AZO and ZNO or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and the metal with low thermal expansivity of silicon (Si) make; With when described penstock by stainless steel (S/S) when making, described target is by being selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and the metal with high thermal expansivity of chromium (Cr) is made.
5. sputter is with the method for joining of rotary target, and the method comprises:
(a) sputter is heated to preset temperature or higher with penstock and the target of rotary target,
(b) apply separately the surface treatment agent of powder type to the interior perimeter surface of the outer surface of described penstock and described target, and between melting period, rub the described surface treatment agent of wiping with brush or supersound process equipment, so that the outer surface of described penstock and the interior perimeter surface of described target are processed
(c) after surface treatment, cool off described penstock and described target,
(d) described target is positioned on the outer surface of described penstock and described target and described penstock is placed on appropriate position on the platen vertically,
(e) described penstock and described target are heated to preset temperature or higher,
(f) in heating, make described penstock and the vibration of described target,
(g) in heating and vibration, the joint composition of melted state is supplied in the space between the interior perimeter surface of the outer surface of described penstock and described target, with the even distribution of the described joint composition of allowing fusing, and
(h) stop described heating and vibration to allow described joint composition cools.
6. according to claim 5 method, wherein when described penstock by titanium (Ti) when making, described target by the stupalith that is selected from ITO, AZO and ZNO or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and the metal with low thermal expansivity of silicon (Si) make; With when described penstock by stainless steel (S/S) when making, described target is by being selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and the metal with high thermal expansivity of chromium (Cr) is made.
7. according to claim 6 method, wherein when the described penstock of being made by titanium (Ti) is joined to described by being selected from ITO, AZO and ZNO stupalith or be selected from molybdenum (Mo), molybdenum titanium (alloy) (MoTi), titanium tungsten (alloy) (TiW), molybdenum tungsten (alloy) (MoW) and silicon (Si) have the metal target of low thermal expansivity the time, the interior perimeter surface of described target is carried out first and secondary treatment, and the outer surface of described penstock is processed for the first time.
8. according to claim 7 method, wherein in step (b), the first processing that is used for the interior perimeter surface of described target is undertaken by following: apply the surface treatment agent of powder type to the interior perimeter surface of described target, and rub the described surface treatment agent of wiping with brush or supersound process equipment between melting period; Undertaken by following with the secondary treatment of the interior perimeter surface that is used for described target: apply the surface treatment agent of powder type to the interior perimeter surface through the first described target of processing, and between melting period, rub the described surface treatment agent of wiping with brush or supersound process equipment.
9. according to claim 8 method, wherein being used for the first described surface treatment agent of processing is the mixture of tin (Sn) and indium (In) powder, wherein the amount of indium (In) is no more than 40 % by weight with respect to the gross weight of described mixture.
10. according to claim 9 method, the described surface treatment agent that wherein is used for secondary treatment is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver-colored (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of described mixture.
11. method according to claim 10, wherein being used for the surface treatment agent that the outer surface of described penstock is processed is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and the total amount of wherein said silver (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of described mixture.
12. method according to claim 6, wherein when the described penstock of being made by stainless steel (S/S) is joined to described by be selected from titanium (Ti), aluminium (Al), copper (Cu), silver (Ag), aluminium silicon (alloy) (AlSi) and chromium (Cr) have the metal target of high thermal expansivity the time, the outer surface of described penstock and the interior perimeter surface of described target are processed separately for the first time.
13. method according to claim 12, the surface treatment agent that wherein is used for the interior perimeter surface of the outer surface of described penstock and described target is processed separately is the mixture of tin (Sn), silver (Ag) and titanium (Ti) powder, and wherein the total amount of silver-colored (Ag) and titanium (Ti) is 5 % by weight or still less with respect to the gross weight of described mixture.
14. each method in 13 according to claim 5 wherein in step (a), is heated to the fusing point (231.9 ℃) of tin (Sn) or higher with described penstock and described target.
15. composition according to claim 14, wherein in step (g), described joint composition comprises the bismuth (Bi) of 50 to 54 % by weight and the tin (Sn) of 46 to 50 % by weight, perhaps comprises the bismuth (Bi) of 49 to 54 % by weight, the tin (Sn) of 45 to 50 % by weight and indium (In) or the silver (Ag) of 1 to 6 % by weight.
16. method according to claim 15 wherein in step (e), is heated to 271.3 ℃ or higher with described penstock and described target, so that described joint composition is remained on melted state.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2010-0117463 | 2010-11-24 | ||
| KR1020100117463A KR101341705B1 (en) | 2010-11-24 | 2010-11-24 | Method for bonding rotary target for sputtering |
| PCT/KR2011/009016 WO2012070882A2 (en) | 2010-11-24 | 2011-11-24 | Bonding composition for a rotary target for sputtering and bonding method of a rotary target using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103328682A true CN103328682A (en) | 2013-09-25 |
| CN103328682B CN103328682B (en) | 2016-04-06 |
Family
ID=46146314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180065900.9A Active CN103328682B (en) | 2010-11-24 | 2011-11-24 | The method of joining of sputtering rotary target |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101341705B1 (en) |
| CN (1) | CN103328682B (en) |
| TW (1) | TWI561654B (en) |
| WO (1) | WO2012070882A2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105624627A (en) * | 2016-03-14 | 2016-06-01 | 无锡舒玛天科新能源技术有限公司 | Binding type magnetron sputtering rotary target material and preparation method thereof |
| CN106463326A (en) * | 2014-05-09 | 2017-02-22 | 应用材料公司 | Shielding device for rotatable cathode assembly and method for shielding a dark space in a deposition apparatus |
| CN109440065A (en) * | 2018-11-09 | 2019-03-08 | 南昌大学 | A kind of preparation method of Mg alloy surface tungsten molybdenum nanoscale anticorrosion film |
| CN110402300A (en) * | 2017-03-29 | 2019-11-01 | 三菱综合材料株式会社 | The manufacturing method and cylinder type sputtering target of cylinder type sputtering target |
| CN110408901A (en) * | 2019-08-21 | 2019-11-05 | 东莞市欧莱溅射靶材有限公司 | A kind of target homogeneous tube inner wall pretreatment brush plating method of long tube rotary target binding |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105331937B (en) * | 2014-07-30 | 2018-04-13 | 合肥江丰电子材料有限公司 | Target processing unit (plant) and processing method |
| CN113523239A (en) * | 2021-06-29 | 2021-10-22 | 芜湖映日科技股份有限公司 | Target binding process using indium-tin mixed material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0787818A1 (en) * | 1996-01-31 | 1997-08-06 | LEYBOLD MATERIALS GmbH | Tin or tin base alloy sputtering target |
| US20070062809A1 (en) * | 2005-09-21 | 2007-03-22 | Soleras Ltd. | Rotary sputtering target, apparatus for manufacture, and method of making |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2142008T3 (en) * | 1996-01-31 | 2000-04-01 | Leybold Materials Gmbh | WHITE FOR IONIC PROJECTION CONSTITUTED BY TIN OR A TIN BASED ALLOY. |
| DE102004060423B4 (en) * | 2004-12-14 | 2016-10-27 | Heraeus Deutschland GmbH & Co. KG | Pipe target and its use |
| US20070084719A1 (en) * | 2005-09-28 | 2007-04-19 | Wickersham Charles E Jr | Inertial bonding method of forming a sputtering target assembly and assembly made therefrom |
| WO2007041425A2 (en) * | 2005-10-03 | 2007-04-12 | Thermal Conductive Bonding, Inc. | Very long cylindrical sputtering target and method for manufacturing |
| JP5467735B2 (en) * | 2007-07-02 | 2014-04-09 | 東ソー株式会社 | Cylindrical sputtering target |
| JP5387118B2 (en) * | 2008-06-10 | 2014-01-15 | 東ソー株式会社 | Cylindrical sputtering target and manufacturing method thereof |
-
2010
- 2010-11-24 KR KR1020100117463A patent/KR101341705B1/en active IP Right Grant
-
2011
- 2011-11-24 TW TW100143157A patent/TWI561654B/en active
- 2011-11-24 CN CN201180065900.9A patent/CN103328682B/en active Active
- 2011-11-24 WO PCT/KR2011/009016 patent/WO2012070882A2/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0787818A1 (en) * | 1996-01-31 | 1997-08-06 | LEYBOLD MATERIALS GmbH | Tin or tin base alloy sputtering target |
| US20070062809A1 (en) * | 2005-09-21 | 2007-03-22 | Soleras Ltd. | Rotary sputtering target, apparatus for manufacture, and method of making |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106463326A (en) * | 2014-05-09 | 2017-02-22 | 应用材料公司 | Shielding device for rotatable cathode assembly and method for shielding a dark space in a deposition apparatus |
| CN106463326B (en) * | 2014-05-09 | 2018-07-13 | 应用材料公司 | For the masking device of rotatable cathode, rotatable cathode and method for covering the dark space in depositing device |
| CN105624627A (en) * | 2016-03-14 | 2016-06-01 | 无锡舒玛天科新能源技术有限公司 | Binding type magnetron sputtering rotary target material and preparation method thereof |
| CN110402300A (en) * | 2017-03-29 | 2019-11-01 | 三菱综合材料株式会社 | The manufacturing method and cylinder type sputtering target of cylinder type sputtering target |
| CN109440065A (en) * | 2018-11-09 | 2019-03-08 | 南昌大学 | A kind of preparation method of Mg alloy surface tungsten molybdenum nanoscale anticorrosion film |
| CN109440065B (en) * | 2018-11-09 | 2020-07-14 | 南昌大学 | Preparation method of nano-scale corrosion-resistant molybdenum-tungsten film on surface of magnesium alloy |
| CN110408901A (en) * | 2019-08-21 | 2019-11-05 | 东莞市欧莱溅射靶材有限公司 | A kind of target homogeneous tube inner wall pretreatment brush plating method of long tube rotary target binding |
| CN110408901B (en) * | 2019-08-21 | 2020-06-26 | 东莞市欧莱溅射靶材有限公司 | Method for pretreating inner wall of whole target tube bound by long tube rotating target by brush plating |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012070882A2 (en) | 2012-05-31 |
| CN103328682B (en) | 2016-04-06 |
| KR20120055979A (en) | 2012-06-01 |
| WO2012070882A4 (en) | 2012-11-15 |
| KR101341705B1 (en) | 2013-12-16 |
| TW201231703A (en) | 2012-08-01 |
| WO2012070882A3 (en) | 2012-09-27 |
| TWI561654B (en) | 2016-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103328682B (en) | The method of joining of sputtering rotary target | |
| CN101591740B (en) | Method for preparing Al-Ti-B-C intermediate alloy refiner | |
| US8945296B2 (en) | Water-reactive Al-based composite material, water-reactive Al-based thermally sprayed film, process for production of such Al-based thermally sprayed film, and constituent member for film-forming chamber | |
| CN110952013B (en) | Degradable magnesium alloy downhole tool bridge plug material and preparation method thereof | |
| CN101791749A (en) | Low-sliver brazing filler metal and production method and equipment thereof | |
| CN105063409A (en) | Silver alloy and method for preparing high-temperature transparent enamel decorating silver jewelry by using silver alloy | |
| CN103189533A (en) | High-toughness cobalt-based alloy and engine valve coated with same | |
| TWI557250B (en) | Method for separating target of rotary target | |
| JP4949353B2 (en) | How to remove lead | |
| CN105543563A (en) | Zinc-copper-titanium intermediate alloy smelting method capable of reducing burning loss of titanium element | |
| WO2003089676A8 (en) | Iterative cycle process for carbon supersaturation of molten metal and solid metals obtained thereby | |
| CN107012345A (en) | A kind of preparation method of Al-Si-Cu alloy | |
| CN111172441A (en) | Cast magnesium alloy and preparation method thereof | |
| JP2009191309A (en) | Method for collecting crude indium | |
| CA2761291A1 (en) | Gold alloys | |
| US324659A (en) | Process of electric sm elting for obtaining alumilnlum | |
| CN110484765B (en) | Aluminum bronze alloy and preparation method thereof | |
| RU2180011C2 (en) | Process of digestion of junk of articles of electronics | |
| CN1162559C (en) | Anti-decolouring silver alloy and its preparing process | |
| TW483937B (en) | Recycle and reuse method of aluminum alloy sputter target material | |
| KR101817079B1 (en) | process of recovering Platinum group metal from waste sludge generated from refining process of precious metal ore | |
| JP2006348340A (en) | Method for manufacturing metal containing indium/tin | |
| CN110699586B (en) | Hard pure silver joint coating material and preparation method thereof | |
| JP2003119528A (en) | Material for metal strip | |
| Muthumariappan et al. | Precious metal content in copper concentrate and slag |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |