CN103317820A - Bonding method and bonding device for substrates - Google Patents
Bonding method and bonding device for substrates Download PDFInfo
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- CN103317820A CN103317820A CN2013100897101A CN201310089710A CN103317820A CN 103317820 A CN103317820 A CN 103317820A CN 2013100897101 A CN2013100897101 A CN 2013100897101A CN 201310089710 A CN201310089710 A CN 201310089710A CN 103317820 A CN103317820 A CN 103317820A
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Abstract
A bonding method and a bonding device for substrates are provided. Nonuniformity of thickness can be eliminated by removing stress caused by bonder. After the substrates (1, 2) are superposed with the bonder (3) therebetween, by enabling one substrate (1) and the other substrate (2) to move in a relative rotation or linear way, the bonder (3) expands between the substrates (1, 2), so that the thickness of the bonder (3) is uniform.
Description
Technical field
The applying method of the substrate that uses when the present invention relates to fit a plurality of substrate and laminating apparatus.
Background technology
Installation constitution about the Clairvoyant type touch sensor keyboard plate of record in the following patent documentation 1, a surface at touch panel arranges clear adhesive, by described touch panel is bonded on the liquid crystal display cells across described clear adhesive, eliminate light reflection, the interference colours of display surface, improve the quality (for example with reference to patent documentation 1) of display.
[patent documentation 1] Japanese kokai publication sho 61-131314 communique
When making the touch sensor keyboard plate of described prior art, use the light-cured type bonding agent to make touch panel and liquid crystal display cells (installing component) when overlapping when replacing clear adhesive, sometimes thicker regional the and thinner zone (uneven thickness) of generation bonding agent in the face that overlaps.Particularly thinner at the substrate with touch panel and hold in the yielding situation, the uneven thickness of bonding agent still exists, owing to having the bonding agent of uneven gauge, a part that has a touch panel is with respect to the problem of liquid crystal display cells inclination etc.
Summary of the invention
One example of problem of the present invention is to tackle this problem.That is, the object of the invention is to, remove the stress that bonding agent brings and eliminate uneven thickness etc.
In order to reach this purpose, the present invention has following structure at least.
A kind of applying method of substrate is used for fitting a plurality of substrates, it is characterized in that, the applying method of described substrate has following steps: bonding agent application step, coating adhesive on the composition surface of a substrate in described a plurality of substrates; Overlap step, make described a plurality of substrates while stacking across described bonding agent; And substrate shift step, make the relative position displacement of a described substrate and another substrate, described bonding agent between described a plurality of substrates spreads towards periphery from the central authorities on described composition surface, in described substrate shift step, the direction of displacement of described substrate be described substrate radially, circumferentially or the thickness direction of substrate.
A kind of laminating apparatus is used for fitting a plurality of substrates, it is characterized in that, described laminating apparatus has: the 1st maintaining part, and it remains on assigned position with a substrate in described a plurality of substrates; The 2nd maintaining part, it remains on assigned position with another substrate; The bonding agent apparatus for coating, coating adhesive on the composition surface of its substrate in described a plurality of substrates; And substrates while stacking device, it makes described a plurality of substrates while stacking, described substrates while stacking device makes a described substrate and described another substrates while stacking that is coated with described bonding agent, described bonding agent between the described a plurality of substrates after the described coincidence spreads towards periphery from the central authorities on described composition surface, and described the 1st maintaining part or described the 2nd maintaining part have makes described substrate at the mobile drive division that circumferentially or directly makes progress.
Description of drawings
Fig. 1 is the key diagram (plane) that all structures of the applying method of substrate of embodiments of the present invention and laminating apparatus are shown.
Fig. 2 illustrates the partial front figure that overlaps step.
Fig. 3 is the key diagram that the bonding agent application step is shown, the partial front figure when (a) being ionization, the partial front figure when (b) being the bonding agent coating.
Fig. 4 is the key diagram that the aging step of bonding agent is shown, and (a) is that cross-sectional plane is amplified in all parts, (b) is its front elevation.
Fig. 5 is the key diagram that the bonding agent curing schedule is shown, and (a) is inert gas when spraying and the local cross-sectional plane during the air suction, (b) is the stereogram of bonding agent solidification equipment.
Fig. 6 is the key diagram that light intensity is shown.
Fig. 7 is the key diagram that the variation of installing component is shown.
Fig. 8 is the key diagram of object lesson that the laminating apparatus of embodiments of the present invention is shown.
Label declaration
1: substrate (substrate); 1a: composition surface; 2: substrate (another substrate); 2b: bight; 2c: pars intermedia; 3: bonding agent; 3a: the 1st bonding agent; 3b: the 2nd bonding agent; 3c: outer lateral side; 3s: gap; 10: the bonding agent apparatus for coating; 11: ionization apparatus; 12: frame section; 14: the bonding agent discharger; 15: storage section; 20: the substrates while stacking device; 21: the 1 maintaining parts; 21a: maintenance face; 22: the 2 maintaining parts; 24: drive division; 26: positioning unit; 30: the bonding agent solidification equipment; 30a: basket; 30b: side; 31: spray-hole; 31a: pipeline; 32,32a: SS; 32b: pipeline; 33: exit wound of bullet; 33a: optical fiber; 40: holding unit; G: inert gas; L: light; T: conveying device; U1: Unit the 1st; U2: Unit the 2nd; U3: Unit the 3rd; U4: Unit the 4th; U5: Unit the 5th.
The specific embodiment
Below, with reference to accompanying drawing embodiments of the present invention are described.Embodiments of the present invention comprise illustrated content, but are not limited to this.Fig. 1 is the key diagram that the laminating apparatus A that the applying method and be used for of the substrate of an embodiment of the invention uses in the enforcement of the method is shown, and Fig. 1 illustrates all planes.Fig. 2 illustrates the partial front figure that overlaps step.The primary structure of the applying method of the substrate of embodiments of the present invention has: the application step of bonding agent, the bonding agent 3 of the composition surface 1a coating regulation shape of a substrate in a plurality of substrates 1 respect to one another, 2; And the coincidence step, a plurality of substrates 1,2 are overlapped across bonding agent 3.
As a plurality of substrates 1 respect to one another, 2, such as adopting the substrate that can be out of shape that is consisted of by resin molding etc. that in touch panel etc., uses, the glass substrate of use in liquid crystal panel or liquid crystal panel module etc. etc.A substrate in a plurality of substrates 1,2 has the shape larger than another substrate, and flat shape separately for example forms rectangle.In the situation of the example shown in (a) of Fig. 1, as a substrate 1,10 supplies of bonding agent apparatus for coating from from its supply source (not shown) to laminating apparatus A are than the touch panel of large rectangle successively, as another substrate 2, the substrates while stacking device from its supply source (not shown) to laminating apparatus A 20 is supplied with the liquid crystal panel of less rectangle successively.
As bonding agent 3, use light-cured type bonding agent etc.By the light of irradiation such as ultraviolet ray or infrared ray etc., this light-cured type bonding agent begins to solidify.In the bonding agent application step, discharge bonding agent 3 by bonding agent apparatus for coating 10 towards the composition surface of a substrate 1 1a, with its coating established practice setting shape.
[bonding agent application step] Fig. 3 is the key diagram that the bonding agent application step in the applying method of substrate of embodiments of the present invention is shown.In this example, (a) of Fig. 3 is the partial front figure when before bonding agent 3 coating the composition surface 1a of a substrate 1 being carried out ionization, and (b) of Fig. 3 is the partial front figure during coating adhesive 3 after ionization.That is, in the bonding agent application step, on the composition surface 1a of a substrate 1 after the bonding agent 3 of ground connection is coated on ionization on electric directly or via other parts.
Become the method (ionization step) on Ionized composition surface as the composition surface 1a that makes a substrate 1, shown in Fig. 3 (a), as bonding agent apparatus for coating 10, can use the ionization apparatus 11 that can blow out ion etc.As ionization apparatus 11, such as enumerating ion generator etc., has the blow-off outlet 11a of the Ionized air of plus or minus.Blow-off outlet 11a for example forms than the length of side of a substrate 1.At first, make the composition surface of blow-off outlet 11a and the composition surface 1a(coating adhesive 3 of a substrate 1) relative.Then, relatively move with respect to a substrate 1 by making blow-off outlet 11a, the composition surface 1a of a substrate 1 is all blown out the Ionized air of plus or minus.At this moment, be provided with the frame section 12 of the peripheral part that surrounds a substrate 1.This frame section 12 retains ion in the inboard of the A1 of frame section.Frame section 12 is arranged on the upper surface of the supporting station 13 on the chassis of a substrate 1 of mounting etc. with the state of the peripheral part that surrounds a substrate 1, make the ion retardation of the plus or minus that the composition surface 1a to a substrate 1 blows out on the 1a of composition surface.
And in the example shown in (a) of Fig. 3, the blow-off outlet 11a of ionization apparatus 11 forms than the length of side of a substrate 1.And, move to the direction along the another side of a substrate 1 that is fixed on assigned position by making blow-off outlet 11a, the composition surface 1a of a substrate 1 is all blown out the air of positively ionized.Substrate 1 also can be fixed and can not move.In addition, as other example, although do not illustrate, but also can change, the composition surface 1a that for example makes a substrate 1 moves with respect to the blow-off outlet 11a of the ionization apparatus 11 that is fixed on assigned position and changes relative position, the blow-off outlet 11a of ionization apparatus 11 and substrate 1 both sides are moved and change relative position, perhaps blow out the air of negative ionization from the blow-off outlet 11a of ionization apparatus 11, perhaps the composition surface 2a of another substrate 2 and the composition surface 1a of a substrate 1 are blown out the air of different ions and produce potential difference etc. between another substrate 2 and a substrate 1.And, in the example of Fig. 3 (a), the composition surface 1a of a substrate 1 is blown out Ionized air, but is not limited to this.For example, can be by forming hole sections in frame section 3, from as this hole section of blow-off outlet air to the inboard ejected ion of frame section 3, thereby the composition surface 1a of a substrate 1 is carried out ionization.
About coating adhesive 3 methods, shown in Fig. 3 (b), such as using the bonding agent dischargers 14 such as dispenser.Bonding agent discharger 14 has the storage section 15 of storage bonding agent 3, makes storage section 15 ground connection on electric.About coating adhesive 3 shapes, shown in Fig. 1 (a), the composition surface 1a of a substrate 1 is arranged to a plurality of wire, between these a plurality of bonding agents 3, for example be provided with the gap 3s that extends toward the outer side from the inboard of a substrate 1.And an end from bonding agent 3 between a plurality of bonding agents 3 forms gap 3s continuously to another end.The axle that the 1st bonding agent 3a in a plurality of bonding agents 3 has along a substrate 1 (being the axle of length direction in illustrative example) configuration, the 2nd bonding agent 3b is configured to radial from the 1st bonding agent 3a towards the outside of a substrate 1.And then, supply with a substrate 1 being finished bonding agent 3 coatings by bonding agent apparatus for coating 10 to substrates while stacking device 20 successively.
In the example shown in (a) of Fig. 1, near central authorities, configure the 1st bonding agent 3a along the axle of the length direction of a substrate 1, be towards the outside of a substrate 1 from the 1st bonding agent 3a and configure respectively radially many articles of the 2nd bonding agent 3b.In addition, as other example, although do not illustrate,, the size of the 1st bonding agent 3a and the 2nd bonding agent 3b, quantity, configuration can be changed according to the size and dimension of a substrate 1 and another substrate 2.
In the applying method and laminating apparatus A of the substrate of this embodiments of the present invention, be coated on the bonding agent 3 of electric upper ground connection by the composition surface 1a to an Ionized substrate 1, between bonding agent 3 and substrate 1, produce Coulomb force (state that bonding agent 3 and substrate 1 draw mutually or utilize current potential official post bonding agent 3 and the state that substrate 1 draws mutually), do not cut off bonding agent 3 and continuously coating.By continuous coating adhesive 3, sneak into bubble in the time that coating adhesive 3 can being suppressed at.Its result can improve the substrate 1 of applying, 2 quality.
And, be provided with the frame section 12 that surrounds a substrate 1, in ionization step, in the situation of the air of the inboard ejected ion of frame section 12, make ion retardation on a substrate 1 by frame section 12, therefore, can be to a continuous coating adhesive 3 of substrate.Therefore, sneak into bubble in the time of can further being suppressed at coating adhesive 3.Its result can further improve the substrate 1 of applying, 2 quality.
And, be provided with the frame section 12 of the peripheral part that covers a substrate 1, blow out in the inboard to frame section 12 in the situation of (injection) ion, make ion retardation on a substrate 1 by frame section 12, therefore, can be to a continuous coating adhesive 3 of substrate.Therefore, sneak into bubble in the time of can further being suppressed at coating adhesive 3.Its result can further improve the substrate 1 of applying, 2 quality.
And then the bonding agent 3 that is coated on the composition surface 1a of a substrate 1 is arranged to a plurality of wire, is provided with the gap 3s that extends toward the outer side from the inboard of a substrate 1 between a plurality of bonding agent 3b.When a substrate 1 is overlapped with another substrate 2, bonding agent 3a, 3b expansion.Because the expansion of bonding agent 3, the gap 3s between a plurality of bonding agent 3b is closed.But 3s is closed along with the gap, and air overflows to the outside of a substrate 1 by gap 3s.Therefore, sneak into bubble in the time of can being suppressed at the coincidence of bonding agent 3.Its result can further improve the substrate 1 of applying, 2 quality.
[coincidence step] as shown in Figure 2, overlap the substrates while stacking device 20 that uses in the step have to load and unload freely mode with a substrate 1 in a plurality of substrates 1,2 remain on assigned position the 1st maintaining part 21, in loading and unloading mode freely another substrate 2 is remained on the 2nd maintaining part 22, pedestal 28 of assigned position, supports the support 27 of the 1st maintaining part 21 and the 2nd maintaining part 22 in mobile mode freely.Support 27 is extending towards the direction of another substrate 2 from a substrate 1.The 1st maintaining part 21 is arranged to moving freely with the direction of separating relative to the direction that approaches at least with the 2nd maintaining part 22.Here, also can be, the side in the 1st maintaining part 21 or the 2nd maintaining part 22 fixes, and the opposing party can move with respect to a side.And, also can be that the both sides of the 1st maintaining part 21 and the 2nd maintaining part 22 can move.In overlapping step, a substrate 1 remains on the 1st maintaining part 21, and another substrate 2 remains on the 2nd maintaining part 22.In the bonding agent application step, coating adhesive 3 on a substrate 1.The composition surface 2a that makes another substrate 2 relatively approaches with respect to a substrate 1 and it is overlapped with the composition surface 1a of this substrate 1.When this overlaps, for example, with the mode of almost parallel all pressurizeing to composition surface 1a, 2a equably in the composition surface is all.By this pressurization, bonding agent 3 is from the outward perimembranous expansion of central authorities of the composition surface 1a of a substrate 1.In addition, when overlapping, composition surface 2a is tilted with respect to composition surface 1a and overlap.And, also can be by making the pressurization in the prescribed limit larger, further expand bonding agent 3 and overlap.At length say, when the composition surface of a substrate 1 1a overlapped with the composition surface 2a of another substrate 2, the 1st bonding agent 3a and the 2nd bonding agent 3b were by conquassation and close to each other.By the 1st bonding agent 3a and the 2nd bonding agent 3b are approached, release the air that is arranged in gap 3s to the outside of another substrate 2.By releasing laterally air, the 1st bonding agent 3a connects with the 2nd bonding agent 3b, towards the peripheral part expansion of another less substrate 2, forms the layer of the bonding agent 3 that forms continuously.
In example shown in Figure 2, the position of the 1st maintaining part 21 is fixed.At first, approach substrates 1 that remain on the 1st maintaining part 21 by being located at the action of the lifting usefulness drive division 23 on the 2nd maintaining part 22, making another substrate 2 that remains on the 2nd maintaining part 22.Then, the composition surface 2a of another substrate 2 is overlapped with the composition surface 1a of a substrate 1 that is coated with bonding agent 3.Then, make composition surface 1a, 2a all maintenance almost parallels and all on the composition surface in pressurize equably.In addition, as other example, also can by being located at the action of the lifting usefulness drive division 23 on the 1st maintaining part 21, make a substrate 1 that remains on the 1st maintaining part 21 approach another substrate 2 that remains on the 2nd maintaining part 22.
And the applying method of the substrate of embodiments of the present invention can have the bonding agent curing schedule of bonding agent 3 curing that make between a plurality of substrates 1,2 after overlapping step.And then, can overlap have a plurality of substrates 1 of expansion between step and the bonding agent curing schedule, 2 and the aging step of the contact area of bonding agent 3.
[aging step] Fig. 4 is the key diagram that the aging step of the bonding agent 3 in the applying method of substrate of embodiments of the present invention is shown, and (a) of Fig. 4 illustrates all parts and amplify cross-sectional plane, and Fig. 4 (b) illustrates its front elevation.The aging step of bonding agent 3 has the substrate shift step of the relative position displacement that makes a substrate 1 and another substrate 2.In this substrate shift step, about the direction of displacement of substrate 1,2 relative position, for example can enumerate the axle of the central authorities by a substrate 1 or another substrate 2 as the regulation direction of rotation (θ direction) of rotating shaft or along the rectilinear direction (directions X or Y-direction) on one side of a substrate 1 and another substrate 2.And, as required, also can make substrate 1,2 relative position displacement at substrate 1,2 thickness direction.In addition, the center of direction of rotation is not limited to substrate 1,2 central authorities, as long as at substrate, and can be with the optional position as the center.And, establish during rectilinear direction is included in radially.This radially for example refers to the direction of the mode of straight line or curve the 1st position from the substrate towards 2nd position different from the 1st position.Thus, direction of rotation comprises the regulation direction of rotation of other position beyond substrate 1,2 the central authorities as rotating shaft.Except rectilinear direction, Yi Bian radially also comprise and the direction of intersecting.In substrates while stacking device 20, the 1st maintaining part 21 and the 2nd maintaining part 22 are arranged to relatively move freely with respect to directions such as described direction of rotation or rectilinear directions.And, also can be, the position of the side in the 1st maintaining part and the 2nd maintaining part is fixed, and the opposing party is arranged to move freely.Can make a substrate 1 that remains on the 1st maintaining part 21 and remain in another substrate 2 on the 2nd maintaining part 22 one or both move to the θ direction rotation, perhaps move to directions such as directions X or Y-directions.And then, can keep the state of the bonding agent 3 after aging, and make the relative position (returning step) before the relative position of a substrate 1 and another substrate 2 after the aging step returns aging step.And substrates while stacking device 20 has the drive division 24 that makes this substrate 1, the displacement of 2 relative position.
In the example shown in (a) of Fig. 4, the position of the 2nd maintaining part 22 is fixed, by be located at the mobile units such as track or XY turntable 25 in the 1st maintaining part 21 and move horizontally the action of the drive division 24 of usefulness, make keep a substrate 1 the 1st maintaining part 21 with respect to another substrate 2 to the θ direction rotation or to directions X or Y-direction traveling priority.In addition, as other example, shown in Fig. 4 (b), also can mobile unit 25 and the drive division 24 that moves horizontally usefulness be set in the 2nd maintaining part 22, make another substrate 2 of remaining on the 2nd maintaining part 22 by their action with respect to remaining on a substrate 1 on the 1st maintaining part 21 to the θ direction rotation, or to directions X or Y-direction traveling priority, perhaps, both sides in the 1st maintaining part 21 and the 2nd maintaining part 22 arrange respectively the drive division that moves horizontally usefulness, by their action the 1st maintaining part 21 and the 2nd maintaining part 22 are moved mutually to the θ direction rotation, or to directions X or Y-direction traveling priority.
And the aging step of bonding agent 3 can have the placement step of carrying out after the substrate shift step, in this places step, supports another substrate 2 that is configured in the top in a plurality of substrates 1,2 to move up and down freely mode.In placing step, within specified time limit, about (Z) direction and the substrate 1,2 that overlaps is remained on assigned position with XY θ direction that above-below direction intersects.As this specified time limit, such as enumerating until described bonding agent 3 becomes time of stable state (such as the state of the dimensionally stable of bonding agent 3) etc.In order to place step, substrates while stacking device 20 has on XY θ direction the substrate 1,2 that overlaps is positioned at the positioning unit 26 of assigned position and removes the 2nd maintaining part 22 to the control part of the maintenance of another substrate 2.This control part for example through after placing step, makes the 2nd maintaining part 22 decontrol another substrate 2, discharges another substrate 2.And, in placing step, also can keep a substrate 1, the 2 maintaining part 22 to keep under the state of another substrates 2 in the 1st maintaining part 21, the deadweight by the 1st maintaining part 21 or the 2nd maintaining part 22 continues bonding agent 3 is pressurizeed.And, in placing step, also can remove the 2nd maintaining part from another substrate 2, the deadweight by a substrate 1 or another substrate 2 continues bonding agent 3 is pressurizeed.
In the example shown in the (a) and (b) of Fig. 4, as positioning unit 26, the positioning and guiding spare that can carry out position adjustment corresponding with each limit of another substrate 2 is shown.This positioning and guiding spare can be wholely set with the 2nd maintaining part 22 or arrange separately.And the 2nd maintaining part 22 supports another substrate 2 along the inner surface of positioning and guiding spare in the mode that (Z) direction up and down moves.In addition, as other example, although do not illustrate,, as positioning unit 26, can positioning and guiding spare be set integratedly with the 2nd maintaining part 22.And, as positioning unit 26, also can utilize the visuognosis of CCD camera to position at the datum line mark that another substrate 2 forms.
In the applying method and laminating apparatus A of the substrate of this embodiments of the present invention, at a plurality of substrates 1,2 after bonding agent 3 overlaps, by making a substrate 1 and another substrate 2 relative rotation or traveling priorities, the even thickness of the bonding agent 3 after the coincidence can be made, the expansion of bonding agent 3 can be enlarged.Therefore, in the substrate 1 of fitting, 2 composition surface, the thickness that can eliminate bonding agent 3 produces the situation (uneven thickness) of gradient.And, can control the thickness of bonding agent 3 and realize the homogenising in the gap between the substrate 1,2.
Especially, in aging step, by returning step, bonding agent 3 is sometimes because its surface tension or internal stress and will return shape before the aging step.But the expanding area that returns the expanding area of the bonding agent 3 after the step bonding agent 3 more front than aging step is large.Therefore, can make simply the even thickness of bonding agent 3.Its result can eliminate the substrate 1 of applying, 2 uneven thickness.And, can control the thickness of bonding agent 3 and realize the homogenising in the gap between the substrate 1,2.
[bonding agent curing schedule] Fig. 5 is the key diagram that the bonding agent curing schedule in the applying method of substrate of embodiments of the present invention is shown, (a) of Fig. 5 is inert gas when spraying and the local cross-sectional plane during the air suction, and (b) of Fig. 5 is the stereogram of bonding agent solidification equipment 30.The bonding agent curing schedule has across a substrate 1 or another substrate 2 and makes bonding agent 3 expand the pressurization steps of the peripheral part of the peripheral part of a substrate 1 or another substrate 2 to.And the bonding agent curing schedule has the irradiation step towards the light L of outer lateral side 3c irradiation ultraviolet radiation of the bonding agent 3 between a plurality of substrates 1,2 etc.The ejaculation direction of light L is configured to the direction that the composition surface 1a with respect to a substrate 1 of facing mutually with another substrate 2 tilts.That is, the ejaculation direction of light L be with respect to the 2nd maintaining part 22 mutually in the face of and the direction that keeps the maintenance face 21a of the 1st maintaining part 21 of a substrate 1 to tilt.And then the bonding agent curing schedule has towards the outer lateral side 3c of bonding agent 3 and sprays the gas injecting step of inert gas G and the air drawing step that the air in the outside of bonding agent 3 is aspirated.
In the pressurization steps of bonding agent curing schedule, can use and the described identical or different device of the substrates while stacking device 20 that uses in the step that overlaps.Below, use described Fig. 2 to be documented in the situation of using substrates while stacking device 20 in the pressurization steps.Substrate pressue device and substrates while stacking device 20 are same, and the mode that has to load and unload freely remains on the 1st maintaining part 21 of assigned position and the 2nd maintaining part 22 that another substrate 2 is remained on assigned position in loading and unloading mode freely with a substrate 1 in a plurality of substrates 1,2.The 1st maintaining part 21 is arranged to moving freely with the direction of separating relative to the direction that approaches at least with the 2nd maintaining part 22.Here, also can be, the side in the 1st maintaining part 21 or the 2nd maintaining part 22 fixes, and the opposing party can move with respect to a side.And, also can be that the both sides of the 1st maintaining part 21 and the 2nd maintaining part 22 can move.In pressurization steps, a substrate 1 remains on the 1st maintaining part 21, and another substrate 2 remains on the 2nd maintaining part 22.Make the composition surface 1a of a substrate 1 relative approaching with the composition surface 2a of another substrate 2, bonding agent 3 is pressurizeed and makes it expand the peripheral part of a substrate 1 or another substrate 2 to.In this pressurization steps, for example, with the mode of almost parallel all pressurizeing to composition surface 1a, 2a equably in the composition surface is all.By this pressurization, bonding agent 3 is outward perimembranous expansion further.At this moment, bonding agent 3 arrives the peripheral part of a substrate 1 or the peripheral part of another substrate 2.
The bonding agent solidification equipment 30 of the laminating apparatus A that uses in the bonding agent curing schedule has injection unit and the pump unit of inert gas G.A plurality of spray-holes 31 from injection unit spray inert gas G to the peripheral part of another substrate 2.The air in SS 32 suction bonding agents 3 outsides from pump unit.A plurality of spray-holes 31 and a plurality of SS 32 configure side by side along the peripheral part of another substrate 2.Spray-hole 31 also can be configured between a plurality of SSs 32.At length say, with 2 bight 2b that another substrate 2 has between the relative mode of pars intermedia 2c configure more a plurality of spray-holes 31.Central portion between 2 bight 2b that have with respect to another substrate 2 is at the more a plurality of SSs 32 of bight 2b side configuration.And then, pump unit preferably with the bight 2b of another substrate 2 near relative position configuration SS 32a.
Spray-hole 31 is made of the pipeline 31a that is connected with injection unit.The upstream side of a plurality of spray-holes 31 be pipeline 31a be connected with respectively flow rate regulating valve 31b midway, by controller (not shown) flow rate regulating valve 31b is carried out action control, thus, constitute the emitted dose that can adjust separately inert gas G.SS 32,32a are made of the pipeline 32b that is connected with pump unit.The upstream side of a plurality of SSs 32,32a be pipeline 32b be connected with respectively flow rate regulating valve 32c midway, by controller (not shown) flow rate regulating valve 32c is carried out action control, thus, constitute the aspiration of the emitted dose that to adjust separately inert gas G and SS 32,32a.
And then, the exit wound of bullet 33 that bonding agent solidification equipment 30 has basket 30a and penetrates the light L of light source (not shown) from the inside of basket 30a to the outside, in the irradiation step, arrive the outer lateral side 3c irradiation light L of bonding agent 3 of the peripheral part of the peripheral part of a substrate 1 or another substrate 2 from 33 pairs of exits wound of bullet.Solidify in the part zone from outer lateral side 3c to the inboard of the bonding agent 3 that is shone by light L, becomes interim solid state, and bonding agent 3 is difficult to flow.Light L can be scattered light, also can be the light that uses lens etc. to assemble.The opportunity of irradiation light L can Set arbitrarily, arrives before the peripheral part of another substrates 2 such as bonding agent 3 or when arriving etc.And substrate (substrate 1 or another substrate 2) can arbitrary decision with the ejaculation direction angulation of light L.
Arrive the time point of peripheral part of another substrates 2 at bonding agent 3 in the identical situation of the position of the peripheral part of another substrate 2 essence, if angle is 0 ° or 90 °, shine light L by the time point that arrives the peripheral part of another substrate 2 at bonding agent 3, bonding agent 3 is difficult to flow more.Arrive the time point of peripheral part of another substrates 2 at bonding agent 3 in the different situation in the position of the peripheral part of another substrate 2, also can be before bonding agent 3 arrives the peripheral part of another substrates 2 irradiation light L.In this situation, owing to arriving the time point of the peripheral part of another substrate 2 at bonding agent 3 bonding agent 3 is shone light L, therefore, bonding agent 3 is difficult to flow more.In addition, if angle is 0 °, the time point that arrives the peripheral part of another substrate 2 at bonding agent 3 shines in the situation of light L, and the bonding agent 3 that does not arrive the peripheral part of another substrate 2 is subject to the irradiation of light L, therefore, this bonding agent 3 does not arrive the peripheral part of another substrate 2 sometimes.And, be 90 ° in the situation that establish angle, in the position of the peripheral part of another substrate 2 that makes progress in week, bonding agent 3 arrives in advance the peripheral part of another substrate 2 or lags behind and arrives the peripheral part of another substrate 2, therefore, sometimes be difficult to realize shining the opportunity of light L.And, in the larger situation of the thickness of bonding agent 3, about the intensity of light L, to compare with the intensity of light L in the bonding agent of another substrate 2 sides, the intensity of the light L in the bonding agent 3 of substrate 1 side is less, sometimes can't fully reduce the flowability of bonding agent.
In Fig. 6, be illustrated in the week relation of the intensity of the irradiating angle of the light L of bonding agent 3 in the different situation in the position of another peripheral part and light L upwards.Light L is scattered light.As shown in Figure 6, from the outer lateral side 3c of bonding agent 3 towards the predetermined distance X of inboard with interior zone in, light L has prescribed strength.Be that distance X for example is approximately 1mm in the about 30 °～situation of about 40 ° (acute angles) at the irradiating angle of establishing light L.By being made as this angle, can make the intensity of light L of bonding agent 3 inboards larger, bonding agent 3 is difficult to flow more.And, can make bonding agent 3 near the peripheral part of another substrate 2, become interim solid state.In addition, the irradiating angle of light L can be according to the thickness of bonding agent 3 and suitably change.On the thickness direction of bonding agent 3, the exit wound of bullet 33 among the basket 30a is with respect to the position of the SS 32 of the position of the spray-hole 31 of injection unit or pump unit and difference, above or below being configured in.At length say, the position of the spray-hole 31 on the thickness direction of bonding agent 3, the position of SS 32 are configured in substrate 1 side with respect to exit wound of bullet 33.The position of the position of spray-hole 31 and SS 32 is between the position of the position of exit wound of bullet 33 and a substrate 1.Basket 30a has side 30b, and this side 30b has spray-hole 31, SS 32 and exit wound of bullet 33.The side 30b of this basket 30a forms the regulation shape by minor axis and major axis.And, on the long axis direction of side 30b, at the more spray-hole 31 of central portion side configuration of side 30b, with respect to spray-hole 31, at the more SS 32 of end side configuration of side 30b.Exit wound of bullet 33 is made of the optical fiber 33a that is connected with light source.
In the example shown in (b) of Fig. 5, exit wound of bullet 33 extends along the direction that is arranged with a plurality of spray-holes 31 or a plurality of SS 32.And the direction that is arranged with a plurality of spray-holes 31 or a plurality of SS 32 is and the direction of intersecting towards the direction of spray-hole 31 or SS 32 from exit wound of bullet 33.In addition, as other example, although do not illustrate,, also can configure side by side a plurality of exits wound of bullet 33 along the direction that is arranged with a plurality of spray-holes 31 or a plurality of SS 32.
In the applying method and laminating apparatus A of the substrate of this embodiments of the present invention, by overlapping step, the central authorities of the composition surface 1a of the substrate of the bonding agent 3 of the light-cured type between a plurality of substrates 1,2 from a plurality of substrates 1,2 expand towards periphery, in the bonding agent curing schedule, pressurize across a substrate 1 or 2 pairs of bonding agents 3 of another substrate, bonding agent 3 arrives the peripheral part of a substrate 1 or the peripheral part of another substrate 2.By the irradiation step, towards the outer lateral side 3c of this bonding agent 3 irradiation light L, thus, can reduce as much as possible the spill-out of the bonding agent 3 that overflows from the peripheral part of the peripheral part of substrate 1 or substrate 2.Therefore, can make bonding agent 3 overflowing at Rack from the peripheral part of the peripheral part of substrate 1 or substrate 2.Its result can suppress bonding agent and overflow from the peripheral part of touch panel or liquid crystal display cells etc., therefore, can suppress to produce the problem of the position skew etc. of other installing component beyond the liquid crystal display cells that is configured on the touch panel.
Fig. 7 is the key diagram that the variation of installing component is shown.Sometimes disposed adjacent is as the liquid crystal display cells of installing component 2A and other installing component 2B beyond the liquid crystal display cells.Between adjacent installing component 2A and other installing component 2B, be provided with than the size of installing component 2A or the large slight gap 2C of other installing component 2B.As required, also this gap 2C can be set.In the situation that bonding agent overflows from the substrate 1 of substrate 2 or installing component, with respect to other installing component of installing component 2A disposed adjacent 2B the time, need to make other installing component 2B along the spill-out of the surperficial mobile bonding agent of substrate 2.But the wiring in conjunction with forming on the substrate 2 contacts the wiring of other installing component sometimes.When making other installing component move the spill-out of bonding agent, be difficult to sometimes realize that it electrically contacts.And, when configuring installing component 2A, other installing component 2B in the surface on substrate 2, moving the spill-out of bonding agent by making other installing component 2B, other installing component 2B overflows from substrate 2 sometimes.But, by suppressing overflowing of described bonding agent, for example can realize electrically contacting, and can suppress bonding agent and overflow from installing component.In the situation that installing component 2A has wiring, also can realize equally electrically contacting with other installing component 2B.
And in described example, bonding agent can use the bonding agent with electric conductivity of the wiring that the wiring that is electrically connected on the substrate 2 and installing component 2A, 2B have.For example, the bonding agent that has electric conductivity by inhibition overflows from installing component 2A, 2B, can suppress to be electrically connected with the wiring of other installing component 2B from the bonding agent with electric conductivity that the installing component 2A with wiring overflows.
In the situation of the direction that tilts of the composition surface 1a with respect to a substrate 1 with less shape of facing mutually with another substrate 2 with larger shape in the ejaculation direction of light L particularly, can not see through another substrate 2 and bonding agent 3 is shone light L, thereby bonding agent 3 is solidified temporarily.Its result, not by making light L produce the glass substrate of scattering etc., the intensity of light L that can guarantee to arrive bonding agent 3 is larger, and bonding agent 3 is solidified.
And then, have at the bonding agent curing schedule in the situation of the air drawing step that the air to bonding agent 3 outsides aspirates, by the air in suction bonding agent 3 outsides, the atmosphere gas in bonding agent 3 outsides is inert gas G from air displacement.Therefore, can promote more energetically the curing of the outer lateral side 3c of bonding agent 3.
But, follow substrate 1,2 coincidence, the bonding agent 3 of coating spreads from substrate 1,2 mediad periphery near the central authorities of composition surface 1a.But, even make an effort at aspects such as the coating shape of bonding agent 3 and viscosity, also there is following tendency: arrive quickly respectively the central portion on limit relative substrate 1,2 the peripheral part from substrate 1,2 central authorities towards the outer lateral side 3c of the bonding agent 3 of periphery diffusion, but, need the long period near arriving substrate 1,2 bight 2b.Therefore, for example, near near the central portion on the central portion in substrate 1,2 composition surface and substrate 1, one side of 2, the thickness of bonding agent 3 is larger sometimes, and near substrate 1,2 bight 2b, the thickness of bonding agent 3 is less.In this situation, because there is deviation in the thickness of bonding agent 3 between substrate 1,2, therefore, there is the problem that produces on the whole crawling.
Therefore, in the bonding agent curing schedule, by bonding agent solidification equipment 30 bonding agent 3 is solidified.This bonding agent solidification equipment 30 has the injection unit of inert gas G.Spray this inert gas G from a plurality of spray-holes 31 of injection unit to another substrate 2.And, configure side by side in the situation of a plurality of described spray-holes 31 at the peripheral part along another substrate 2, in conjunction with the spread scenarios of bonding agent 3 and the distribution of thickness, by the thicker more inert gas G of area spray of, bonding agent very fast to the expansion of bonding agent 33, the outer lateral side 3c of the bonding agent 3 in the thicker zone is solidified quickly, and the outer lateral side 3c that can suppress bonding agent 3 overflows from the peripheral part of another substrate 2.That is, the curing of bonding agent 3 can be promoted more energetically, overflowing of bonding agent 3 can be suppressed.
And then in the bonding agent curing schedule, bonding agent solidification equipment 30 has pump unit.Aspirate the air in bonding agents 3 outsides from a plurality of SSs 32 of pump unit.And, configure side by side in the situation of a plurality of SSs 32 at the peripheral part along another substrate 2, stronger suction is carried out in, bonding agent 3 thinner zones slow by the diffusion from 32 pairs of bonding agents 3 of SS, and the outer lateral side 3c of the bonding agent 3 in the thinner region is pulled to the peripheral part of another substrate 2.Therefore, the even thickness of bonding agent 3 can be made, the crawling of bonding agent 3 can be suppressed.
And another substrate 2 in a plurality of substrates 1,2 has the flat shape of rectangle, is configured at the SS 32a of pump unit in the situation of bight 2b of another substrate 2, and the outer lateral side 3c of bonding agent 3 is pulled to SS 32.Therefore, can make bonding agent 3 arrive the bight 2b of substrate 2.Its result can suppress the crawling of bonding agent 3.
In addition, in example shown in Figure 1, finish the curing (interim solidify) of bonding agent 3 by bonding agent solidification equipment 30 after, the substrate 1,2 of applying is fed into the real curing schedule (not shown) of all curing that makes bonding agent 3.In real curing schedule, a substrate in substrate 1,2 heats as required to 3 whole irradiations of bonding agent light, and thus, bonding agent 3 solidifies.
[object lesson of laminating apparatus] Fig. 8 is the key diagram of object lesson that the laminating apparatus A of embodiments of the present invention is shown.Laminating apparatus A has the 1st unit U1, the 2nd unit U2, the 3rd unit U3, is provided with conveying substrate 1,2 conveying device T between the 1st unit U1, the 2nd unit U2, the 3rd unit U3.The 1st unit U1 has be used to mouthful U1a that moves into that moves into a substrate 1 moving into from the supply source of a substrate 1.The 1st unit U1 is towards from moving into the substrate 1 that mouthful U1a moves into and have bonding agent apparatus for coating 10.The 2nd unit U2 has be used to mouthful U2a that moves into that moves into another substrate 2 of moving into from the supply source of another substrate 2, has substrates while stacking device 20.That is, the 2nd unit U2 has the 1st maintaining part 21 that keeps a substrate 1 carrying from the 1st unit U1 by conveying device T and keeps from moving into the 2nd maintaining part 22 of another substrate 2 that mouthful U2a moves into.The 3rd unit U3 can have the holding unit 40 that substrate 1,2 after will overlapping on the XY θ direction remains on assigned position.And then, also can have the 4th unit U4, in the 4th unit U4, have bonding agent solidification equipment 30, this bonding agent solidification equipment 30 has be used to making bonding agent 3 solidify the light irradiation device of (interim curing).And, also can have the 5th unit U5, in the 5th unit U5, have the bonding agent solidification equipment (not shown) that bonding agent 3 whole irradiations light is made its real curing.Holding unit 40 is made of identical with positioning unit 26 positioning and guiding spare that can carry out the position adjustment corresponding to substrate 1, each limit of 2 etc., constitute with from the 2nd unit U2 towards the conveying device T of the 3rd unit U3 with from the mobile interlock of the 3rd unit U3 towards the conveying device T of the 4th unit U4.
Abovely be described in detail embodiments of the present invention with reference to accompanying drawing, still, concrete structure is not limited to these embodiments, does not break away from design alteration in the scope of purport of the present invention etc. and is also contained in the present invention.Embodiment shown in above-mentioned each figure then can make up record content each other as long as its purpose and structure etc. do not have special contradiction or problem.And the record content of each figure can become separately independently embodiment, and embodiments of the present invention are not limited to make up an embodiment of respectively scheming and obtaining.
Claims (19)
1. the applying method of a substrate is used for fitting a plurality of substrates, it is characterized in that, the applying method of described substrate has following steps:
The bonding agent application step, coating adhesive on the composition surface of a substrate in described a plurality of substrates;
Overlap step, make described a plurality of substrates while stacking across described bonding agent; And
The substrate shift step makes the relative position displacement of a described substrate and another substrate,
Described bonding agent between described a plurality of substrates spreads towards periphery from the central authorities on described composition surface,
In described substrate shift step, the direction of displacement of described substrate be described substrate radially, circumferentially or the thickness direction of substrate.
2. the applying method of substrate according to claim 1 is characterized in that,
Radially or week upwards, the relative position of the described a plurality of substrates before and after the described substrate shift step is identical in fact.
3. the applying method of substrate according to claim 1 is characterized in that,
The applying method of described substrate has the following step of returning: make this relative position before the relative position of the described a plurality of substrates after the described substrate shift step returns described substrate shift step.
4. the applying method of substrate according to claim 3 is characterized in that,
Radially or week upwards, the relative position of the described a plurality of substrates before the described substrate shift step is identical in fact with the described relative position that returns the described a plurality of substrates after the step.
5. the applying method of substrate according to claim 2 is characterized in that,
The applying method of described substrate has the placement step,
In described placement step, within specified time limit, the described a plurality of substrates after the described substrate shift step remain on assigned position.
6. the applying method of substrate according to claim 5 is characterized in that,
Described substrate in described a plurality of substrate remains on assigned position by the 1st maintaining part,
Described another substrate remains on assigned position by the 2nd maintaining part,
In described placement step, described the 1st maintaining part or described the 2nd maintaining part are pressurizeed to described bonding agent as ballast.
7. the applying method of substrate according to claim 4 is characterized in that,
The shape of the described bonding agent of the shape of the described bonding agent after the described substrate shift step before than described substrate shift step is large.
8. the applying method of substrate according to claim 7 is characterized in that,
A described substrate is the substrate that can be out of shape.
9. the applying method of substrate according to claim 8 is characterized in that,
A described substrate is made of resin molding,
Described another substrate has than a described rigidity that substrate is high,
In described substrate shift step, make a described substrate with respect to described another substrate displacement.
10. the applying method of substrate according to claim 9 is characterized in that,
In described placement step, across described another substrate described bonding agent is pressurizeed.
11. the applying method of substrate according to claim 3 is characterized in that,
The applying method of described substrate has following bonding agent curing schedule: the described bonding agent between a plurality of substrates after the described coincidence is solidified,
Between described coincidence step and described bonding agent curing schedule, carry out described substrate shift step.
12. the applying method of substrate according to claim 1 is characterized in that,
A described substrate is resin molding,
Described another substrate is glass substrate.
13. a laminating apparatus is used for fitting a plurality of substrates, it is characterized in that, described laminating apparatus has:
The 1st maintaining part, it remains on assigned position with a substrate in described a plurality of substrates;
The 2nd maintaining part, it remains on assigned position with another substrate;
The bonding agent apparatus for coating, coating adhesive on the composition surface of its substrate in described a plurality of substrates; And
The substrates while stacking device, it makes described a plurality of substrates while stacking,
Described substrates while stacking device makes a described substrate and described another substrates while stacking that is coated with described bonding agent,
Described bonding agent between the described a plurality of substrates after the described coincidence spreads towards periphery from the central authorities on described composition surface,
Described the 1st maintaining part or described the 2nd maintaining part have makes described substrate at the mobile drive division that circumferentially or directly makes progress.
14. laminating apparatus according to claim 13 is characterized in that,
Described the 1st maintaining part or described the 2nd maintaining part have the positioning unit of described substrate orientation at assigned position.
15. laminating apparatus according to claim 14 is characterized in that,
Described the 1st maintaining part or described the 2nd maintaining part have the control part that discharges described substrate from described the 1st maintaining part or described the 2nd maintaining part.
16. laminating apparatus according to claim 13 is characterized in that,
Described laminating apparatus has Unit the 1st, Unit the 2nd, Unit the 3rd,
Between described Unit the 1st, described Unit the 2nd, described Unit the 3rd, be provided with the conveying device of carrying described a plurality of substrates,
Described Unit the 1st has described bonding agent apparatus for coating,
Described Unit the 2nd has described substrates while stacking device,
Described Unit the 3rd has the holding unit that described a plurality of substrates is remained on assigned position.
17. laminating apparatus according to claim 16 is characterized in that,
Described laminating apparatus has Unit the 4th,
Described Unit the 4th possesses the bonding agent solidification equipment with light irradiation device.
18. laminating apparatus according to claim 17 is characterized in that,
Described laminating apparatus has Unit the 5th,
Described Unit the 5th possesses the bonding agent solidification equipment.
19. laminating apparatus according to claim 13 is characterized in that,
A described substrate is resin molding,
Described another substrate is glass substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-068427 | 2012-03-23 | ||
| JP2012068427A JP5902525B2 (en) | 2012-03-23 | 2012-03-23 | Substrate bonding method and bonding apparatus |
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| CN103317820A true CN103317820A (en) | 2013-09-25 |
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| JP (1) | JP5902525B2 (en) |
| CN (1) | CN103317820A (en) |
| TW (1) | TW201344293A (en) |
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| CN107229091A (en) * | 2016-03-24 | 2017-10-03 | 深超光电（深圳）有限公司 | Polaroid, display panel and display |
| CN113732989A (en) * | 2020-05-28 | 2021-12-03 | 胜美达电机（香港）有限公司 | Bonding method, bonding device and component assembly system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104626720B (en) * | 2013-11-07 | 2017-02-15 | 宸鸿科技(厦门)有限公司 | Panel laminating structure and laminating method thereof |
| CN104859265B (en) * | 2015-05-20 | 2017-04-12 | 江苏比微曼智能科技有限公司 | Aligning and attaching equipment |
| JP6346224B2 (en) * | 2016-06-17 | 2018-06-20 | 株式会社フジクラ | Method and apparatus for adjusting thickness of resin material |
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| CN101142033A (en) * | 2005-03-18 | 2008-03-12 | 富士胶片株式会社 | Method and apparatus for curing coated film |
| JP2011133774A (en) * | 2009-12-25 | 2011-07-07 | Toshiba Mobile Display Co Ltd | Method of manufacturing flat display device and sticking device for the same |
| JP2012058417A (en) * | 2010-09-07 | 2012-03-22 | Hitachi Plant Technologies Ltd | Assembly system of 3d display panel device with touch panel |
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| JP5475255B2 (en) * | 2008-07-17 | 2014-04-16 | オリジン電気株式会社 | Bonding member manufacturing method and bonding member manufacturing apparatus |
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- 2012-03-23 JP JP2012068427A patent/JP5902525B2/en not_active Expired - Fee Related
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| CN101142033A (en) * | 2005-03-18 | 2008-03-12 | 富士胶片株式会社 | Method and apparatus for curing coated film |
| JP2011133774A (en) * | 2009-12-25 | 2011-07-07 | Toshiba Mobile Display Co Ltd | Method of manufacturing flat display device and sticking device for the same |
| JP2012058417A (en) * | 2010-09-07 | 2012-03-22 | Hitachi Plant Technologies Ltd | Assembly system of 3d display panel device with touch panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107229091A (en) * | 2016-03-24 | 2017-10-03 | 深超光电（深圳）有限公司 | Polaroid, display panel and display |
| CN107229091B (en) * | 2016-03-24 | 2020-10-13 | 深超光电（深圳）有限公司 | Polaroid, display panel and display |
| CN113732989A (en) * | 2020-05-28 | 2021-12-03 | 胜美达电机（香港）有限公司 | Bonding method, bonding device and component assembly system |
| CN113732989B (en) * | 2020-05-28 | 2023-10-10 | 胜美达电机（香港）有限公司 | Bonding method, bonding device and component mounting system |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201344293A (en) | 2013-11-01 |
| JP2013199042A (en) | 2013-10-03 |
| JP5902525B2 (en) | 2016-04-13 |
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