CN103313574A - heat sink - Google Patents
heat sink Download PDFInfo
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- CN103313574A CN103313574A CN2012100583701A CN201210058370A CN103313574A CN 103313574 A CN103313574 A CN 103313574A CN 2012100583701 A CN2012100583701 A CN 2012100583701A CN 201210058370 A CN201210058370 A CN 201210058370A CN 103313574 A CN103313574 A CN 103313574A
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- Prior art keywords
- heat
- heat dissipation
- dissipation device
- heat sink
- curved portion
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 238000005452 bending Methods 0.000 claims abstract description 22
- 239000012530 fluid Substances 0.000 claims abstract description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
技术领域 technical field
本发明涉及一种散热装置,特别涉及一种具有热管的散热装置。The invention relates to a heat dissipation device, in particular to a heat dissipation device with a heat pipe.
背景技术 Background technique
随着电子装置的迅速发展,电子组件对于散热效率的要求也越来越高,为了取得足够的散热效率,现有电子装置常使用热管(heat pipes)与鳍片(fin)的组合,从而将热逸散至外界。With the rapid development of electronic devices, the requirements for heat dissipation efficiency of electronic components are getting higher and higher. In order to obtain sufficient heat dissipation efficiency, existing electronic devices often use a combination of heat pipes and fins, so that the The heat escapes to the outside.
但是此公知的散热装置将会多一道热管以及鳍片组合的工艺,不仅制作流程较为复杂,也使得成本上升。However, this known heat sink requires an additional process of combining heat pipes and fins, which not only complicates the manufacturing process, but also increases the cost.
发明内容 Contents of the invention
本发明的一实施例提供一种散热装置,包含一本体、一第一弯曲部、多个热管以及一工作流体。前述本体具有一中心线,第一弯曲部连接本体,且第一弯曲部的一切线方向与前述中心线形成一第一夹角θ1,其中0°<θ1<180°。前述热管形成于本体内部,其中前述多个(复数个)热管至少其中之一由本体延伸至前述第一弯曲处,其中工作流体储存于热管内用以传递热量。An embodiment of the present invention provides a heat dissipation device, which includes a body, a first curved portion, a plurality of heat pipes, and a working fluid. The aforementioned body has a centerline, the first curved portion is connected to the body, and the tangential direction of the first curved portion forms a first included angle θ1 with the aforementioned centerline, wherein 0°<θ1<180°. The heat pipe is formed inside the body, wherein at least one of the plurality (plurality) of heat pipes extends from the body to the first bend, wherein the working fluid is stored in the heat pipe to transfer heat.
在一实施例中,前述散热装置还包含一第二弯曲部,前述第二弯曲部连接本体,其中第二弯曲部与第一弯曲部分别位于该中心线的相反侧,且第二弯曲部的一切线方向与该中心线形成一第二夹角θ2,其中0°<θ2<180°。其中,前述多个热管分别由该本体延伸至该第一、第二弯曲部。In one embodiment, the aforementioned heat dissipation device further includes a second bent portion, the aforementioned second bent portion is connected to the main body, wherein the second bent portion and the first bent portion are respectively located on opposite sides of the center line, and the second bent portion The tangent direction forms a second included angle θ2 with the central line, where 0°<θ2<180°. Wherein, the plurality of heat pipes respectively extend from the body to the first and second bending parts.
在一实施例中,前述本体具有一第一端以及第二端,前述第一弯曲部以及前述第二弯曲部形成于前述第一端以及前述第二端之间。In one embodiment, the aforementioned body has a first end and a second end, and the aforementioned first bent portion and the aforementioned second bent portion are formed between the aforementioned first end and the aforementioned second end.
在一实施例中,前述本体与前述第一、第二弯曲部为一体成型。In one embodiment, the aforementioned body and the aforementioned first and second bending portions are integrally formed.
在一实施例中,前述本体与前述第一、第二弯曲部含有铝材质。In one embodiment, the aforementioned body and the aforementioned first and second bent portions are made of aluminum.
在一实施例中,前述热装置还具有多个第一弯曲部以及多个第二弯曲部。In an embodiment, the aforementioned thermal device further has a plurality of first curved portions and a plurality of second curved portions.
在一实施例中,前述第一弯曲部以及前述第二弯曲部形成于前述第一端以及前述第二端。In one embodiment, the first curved portion and the second curved portion are formed at the first end and the second end.
在一实施例中,前述第一弯曲部以及该第二弯曲部形成一树枝状结构。In one embodiment, the aforementioned first curved portion and the second curved portion form a dendritic structure.
在一实施例中,前述热管大致平行于前述中心线。In one embodiment, the aforementioned heat pipe is substantially parallel to the aforementioned central line.
在一实施例中,前述本体形成有一弧状的转折部。In one embodiment, the aforementioned body forms an arc-shaped turning portion.
附图说明 Description of drawings
图1表示本发明一实施例的散热装置加工前的示意图;Fig. 1 shows the schematic diagram before processing of the cooling device of an embodiment of the present invention;
图2表示本发明一实施例的散热装置与热源连接的示意图;FIG. 2 shows a schematic diagram of the connection between a heat sink and a heat source according to an embodiment of the present invention;
图3表示本发明一实施例的散热装置的立体图;3 shows a perspective view of a heat sink according to an embodiment of the present invention;
图4表示本发明另一实施例的散热装置的示意图;Fig. 4 shows the schematic diagram of the heat dissipation device of another embodiment of the present invention;
图5表示本发明另一实施例的散热装置加工前的示意图;以及Fig. 5 shows the schematic diagram of the heat sink of another embodiment of the present invention before processing; and
图6表示图5的散热装置加工后的示意图。FIG. 6 is a schematic view of the heat sink shown in FIG. 5 after processing.
其中,附图标记说明如下:Wherein, the reference signs are explained as follows:
散热装置100; 第一端101;
第二端102; 本体10;
肋11; 切割线12;
转折部13; 第一弯曲部20;turning
第二弯曲部21; 热管30;The second bending
热源50; 中心线C;
第一角度θ1; 第二角度θ2。The first angle θ1; the second angle θ2.
具体实施方式 Detailed ways
以下配合图式详细说明本发明的实施方式。首先请参阅图1,本发明一实施例的散热装置100主要由一矩形的金属板加工制作而成,该金属可为铝或铜,其中在金属板的内部形成有多个中空且平行排列的热管30,前述热管30之间则是以长条形的肋11相互间隔,此外在热管30内部则可填入工作流体用以传递热能。Embodiments of the present invention will be described in detail below with reference to the drawings. Please refer to Fig. 1 first, the
需特别说明的是,当散热装置材料为铝时,工作流体为丙酮。当散热装置材料为铜时,工作流体为水,如此可达最佳效果,但本领域技术人员应当可了解其他种搭配效果良好的装置材料及工作流体,在此不再赘述。It should be noted that when the heat sink material is aluminum, the working fluid is acetone. When the material of the cooling device is copper, the working fluid is water, which can achieve the best effect. However, those skilled in the art should know other device materials and working fluids with good matching effects, and will not repeat them here.
再请一并参阅图1~图3,前述散热装置100的一端可沿着切割线12切割并朝不同方向弯折后形成至少一个第一弯曲部20以及至少一个第二弯曲部21(如图2、图3所示),其中切割线12可配置于热管30之间的肋11上,由此可避免切割时造成热管30破裂而导致工作流体外泄。应了解的是,前述热管30在配置上相互平行排列,且在各切割线12之间可包含一条或多条热管30。Please refer to FIGS. 1 to 3 together. One end of the
由图2、图3可以看出,本实施例的散热装置100在切割与弯折加工后形成有一本体10以及多个自本体10延伸而出的第一、第二弯曲部20、21,其中前述热管30自本体10内部延伸到第一、第二弯曲部20、21,且前述本体10与第一、第二弯曲部20、21为一体成形的结构,因而可有效地将热能传递至散热装置100的末端。It can be seen from Fig. 2 and Fig. 3 that the
如图2所示,前述本体10具有一中心线C,且本体10形成有一弧状的转折部13,其中第一弯曲部20与第二弯曲部21分别位于中心线C的相反侧。在本实施例中,前述第一弯曲部20的一切线方向与中心线C形成有第一夹角θ1,且0°<θ1<180°;此外,第二弯曲部21的一切线方向与中心线C形成有第二夹角θ2,且0°<θ2<180°。As shown in FIG. 2 , the
由此,第一、第二弯曲部20、21可在散热装置100末端形成树枝状结构,进而可提升散热效能。举例而言,前述本体10的一侧可与热源50相互接触,当热管30内的工作流体受热汽化后可将热能传递至第一、第二弯曲部20、21,接着当工作流体在第一、第二弯曲部20、21冷却液化后则可回到热源50处继续吸收热能,如此反复循环以达到持续散热的效果。Thus, the first and second
接着请参阅图4,本发明另一实施例的散热装置主要是在本体10的第一端101以及第二端102皆设有第一、第二弯曲部20、21,从而可在本体10两端形成树枝状结构,以进一步地强化散热效能。在本实施例当中,第一弯曲部20以及第二弯曲部21可形成的散热面积较前一实施例为多,因此可以有更好的散热效果。Next, please refer to FIG. 4 , the heat dissipation device according to another embodiment of the present invention is mainly provided with first and second
接着请一并参阅图5和图6,如图5所示,本发明另一实施例的散热装置主要是将切割线12设置于本体10的第一端101与第二端102之间,可以在切割完成后,朝上、下弯折出至少一个第一弯曲部20和/或至少一个第二弯曲部21。其中切割线12可配置于热管30之间的肋11上,由此可避免切割时造成热管30破裂而导致工作流体外泄。应了解的是,前述热管30在配置上系相互平行排列,且在各切割线12之间可包含一条或多条热管30。Next, please refer to FIG. 5 and FIG. 6 together. As shown in FIG. 5 , in another embodiment of the heat dissipation device of the present invention, the
虽然通过前述实施例对本发明做出以上说明,然其并非用以限定本发明。本发明所属技术领域中的技术人员,在不脱离本发明的精神和范围内,当可做些许的更动与润饰。因此本发明的保护范围当视随附的权利要求书所界定的范围为准。Although the present invention has been described above through the foregoing embodiments, they are not intended to limit the present invention. Those skilled in the technical field of the present invention may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope defined by the appended claims.
Claims (10)
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CN201210058370.1A CN103313574B (en) | 2012-03-06 | 2012-03-06 | heat sink |
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CN201210058370.1A CN103313574B (en) | 2012-03-06 | 2012-03-06 | heat sink |
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CN103313574A true CN103313574A (en) | 2013-09-18 |
CN103313574B CN103313574B (en) | 2016-03-30 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104600188A (en) * | 2014-12-30 | 2015-05-06 | 东莞市高能磁电技术有限公司 | Combined effective cooling device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06209178A (en) * | 1993-01-12 | 1994-07-26 | Fanuc Ltd | Cooling apparatus for electronic machinery and apparatus |
JPH1147960A (en) * | 1997-08-04 | 1999-02-23 | Showa Alum Corp | Heat exchanger |
CN1759284A (en) * | 2003-01-24 | 2006-04-12 | 伊库瑞莱伯控股有限公司 | Cooling device of hybrid-type |
CN2833888Y (en) * | 2005-05-16 | 2006-11-01 | 杨开艳 | Improved structure of heat pipe radiator |
US20100212869A1 (en) * | 2009-02-26 | 2010-08-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
TW201040482A (en) * | 2009-04-06 | 2010-11-16 | Zalman Tech Co Ltd | Heatpipe having a base block and manufacturing method of the heatpipe |
-
2012
- 2012-03-06 CN CN201210058370.1A patent/CN103313574B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06209178A (en) * | 1993-01-12 | 1994-07-26 | Fanuc Ltd | Cooling apparatus for electronic machinery and apparatus |
JPH1147960A (en) * | 1997-08-04 | 1999-02-23 | Showa Alum Corp | Heat exchanger |
CN1759284A (en) * | 2003-01-24 | 2006-04-12 | 伊库瑞莱伯控股有限公司 | Cooling device of hybrid-type |
CN2833888Y (en) * | 2005-05-16 | 2006-11-01 | 杨开艳 | Improved structure of heat pipe radiator |
US20100212869A1 (en) * | 2009-02-26 | 2010-08-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
TW201040482A (en) * | 2009-04-06 | 2010-11-16 | Zalman Tech Co Ltd | Heatpipe having a base block and manufacturing method of the heatpipe |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104600188A (en) * | 2014-12-30 | 2015-05-06 | 东莞市高能磁电技术有限公司 | Combined effective cooling device |
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