CN202473899U

CN202473899U - Heat radiation module

Info

Publication number: CN202473899U
Application number: CN2012200308146U
Authority: CN
Inventors: 沈志烨
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-01-31
Filing date: 2012-01-31
Publication date: 2012-10-03
Anticipated expiration: 2022-01-31

Abstract

A heat radiation module comprises a plurality of heat radiation fins and a plurality of heat pipes. The plurality of heat pipes are equipped with heated segments and heat release segments which are tightly combined with the heat radiation fins, and heated surfaces of the heated segments are tightly combined side by side to be applied to a surface of a heating element. The heat radiation module is characterized in that protruding platforms are disposed on the heated surfaces of the heated segments of the plurality of heat pipes; and when the plurality of heated surfaces are tightly arranged side by side, all platforms are spliced to be a contact platform to be jointed with the surface of the heating element. When protruding anti-press elements are disposed around the heating element, the effect of each heat pipe can be fully utilized, so that the heat pipes are directly contacted with the heating element one hundred percent and heat conduction performance is fully utilized.

Description

Radiating module

Technical field

The utility model relates to a kind of radiating module, particularly a kind of radiating module to the heat-generating electronic elements heat radiation.

Background technology

Most important two hot biography mechanism are heat conduction and thermal convection in the radiating module.Heat conduction is meant intermolecular energy exchange, and the less molecule of energy contacts the back and obtains energy (through the direct contact of physical property) with the more molecule of energy, if there is not the temperature difference (like a slice independence fin) between the two, then can't realize heat conduction.Traditional radiating module can increase the higher thermal interface material of a conductive coefficient usually between fin and thermal source (semiconductor integrated component); Be TIM (Thermal Interface Material), the heat energy that the semiconductor integrated component is produced more effectively is transmitted on the fin.

Thermal convection is meant through the motion of matter and realizes heat transmission; Heat energy comes from the thermal source that is surrounded by gas or liquid; And move through molecule and to realize that thermal energy transfer is in radiating module; The heat that the semiconductor integrated component is produced finally can be delivered in the air through fin, relies on flow phenomenon is taken away heat energy.

Heat radiation device of thermal conduction tube is except a plurality of heat pipes; Its formation still comprises a plurality of fin and a holder; Fin adopts aluminium matter or copper material usually, and heat pipe then is the metal tube of two ends sealing, and its inside is filled with working solution; Holder is adopted aluminium matter or copper material, therefore is commonly called as again in " at the bottom of the aluminium " or " at the bottom of the copper ".

The heat radiation device of thermal conduction tube design mainly is to paste with the heat radiation position of holder and semiconductor element to touch; The hot temperature of semiconductor element is conducted to holder earlier, conduct to heat pipe and fin by holder again, and reach the heat radiation purpose; Therefore; Its heat temperature conduction is to adopt indirect mode, is passed to heat pipe and fin again through holder earlier, so efficient is comparatively slow.

Therefore; The heat radiation device of thermal conduction tube design that improves the existing high efficiency heat radiation in back is that the heat radiation position subsides of and semiconductor element direct by heat pipe are touched, and heat pipe forms one than flat heating surface on the heating section of pipe shaft, can make direct face with the heat dissipation region of semiconductor component surfaces and contact with face; Heat release section then is formed at the holder top; And fin closely contacts with the heat release section of heat pipe, transfers heat in the air through fin, and reaches the heat radiation purpose.Wherein, the open shape caulking groove that a plurality of and heat pipe are mutual coupling is offered in the bottom surface that the combination of holder and heat pipe ties up to holder, makes heat pipe coupling embedding caulking groove; Be to use pressing element that the mode that heat pipe flattens is embedded caulking groove in the enforcement; The heat pipe semi-nudity is coated on holder, makes the heating surface of heat pipe be exposed to the holder bottom surface, the direct subsides at the heat radiation position through heating surface and semiconductor element are touched; So do not need the indirect transfer heat radiation, its radiating efficiency is very quick.

In addition, because heat pipe is different with the holder material, so electronickelling is in advance handled before the weldering knot; So that whole processed complex, cost increase, assembling inconvenience, also are not inconsistent environmental protection, and the holder of especially said radiating module is a solid metal block; So not only heavy, volume are big, and cause metal consumption big, cause manufacturing cost high always, so existing procucts save holder; And, form the heat abstractor of no base directly with heat pipe and fin combination.

Yet no matter be the radiator structure of heat pipe coupling holder caulking groove, or heat pipe does combination with fin, in the reality use, still has the following problems point.Modal heater element such as shows wafer (VGA) and central processing unit (CPU) on the computer; Because the commerce of the progress of processing procedure and material cost is considered; Heater element is more and more thinner, so when heater element is arranged at circuit board, be provided with convexity on every side and around the anti-pressure element of this heater element.Yet, be a flat heating surface like the heating section of heat pipe in the existing radiating module noted earlier, so, the heating surface of heating section will can't directly contact with heater element because of this anti-pass of element of pressing on this heat pipe.As contact with the heater element surface earlier through meeting this anti-heat-conducting block of shape that element centers on of pressing again; Contact with the heating surface of heat pipe by this heat-conducting block again; Will paste to touch with holder and heater element as previous radiating module design and be as good as; Adopt indirect mode and be passed to heat pipe and fin again through holder earlier, cause heat conduction usefulness unclear, make radiating efficiency slow.

Summary of the invention

So; For solving the aforesaid drawbacks; The main purpose of the utility model is to provide a kind of radiating module, and when the anti-pressure element that is provided with convexity around the heater element centered on, every heat pipe can both be given full play to benefit; Reach the purpose that hundred of heat pipe percentage directly contacts with heater element, give full play to heat conducting usefulness.

For reaching above-mentioned purpose, the utility model provides a kind of radiating module, and it comprises a plurality of radiating fins and a plurality of heat pipe at least; These a plurality of heat pipes have heating section and heat release section; Its heat release section and radiating fin are combined closely, and the closely combination side by side of the heating surface of heating section, wherein; The heating surface surface of the heating section of these a plurality of heat pipes forms a platform of protrusion respectively; Closely side by side the time, all platforms piece together into a contact platform at these a plurality of heating surfaces, and it is surperficial to fit in a heater element through this contact platform.

Wherein, the surface configuration of the contact platform that these a plurality of platforms piece together is identical with said heater element surface configuration, and the surface area of the contact platform that these a plurality of platforms piece together equals said heater element surface area, or said heater element surface area.

Wherein, the contact platform that these a plurality of platforms piece together said heater element should around be provided with protruding anti-pressure element the time, the surface area of this contact platform is less than said anti-pressure area that element encloses.

The advantage of the utility model is; Form a platform of protrusion respectively through the heating surface surface; And all platforms piece together into a contact platform and a said heater element surface engagement, and when the anti-pressure element that is provided with convexity around the heater element centered on, every heat pipe can both be given full play to benefit; Reach the purpose that hundred of heat pipe percentage directly contacts with heater element, give full play to heat conducting usefulness.

Description of drawings

Fig. 1 is the sketch map of the utility model embodiment;

Fig. 2 is the sketch map of another embodiment of the utility model;

The generalized section that Fig. 3 implements for the utility model.

Description of reference numerals: 100-radiating module; The 110-radiating fin; The 120-heat pipe; The 121-heating section; The 122-heat release section; The 123-heating surface; The 1231-platform; 124-contacts platform; The 130-holder; The 200-heater element; The 300-circuit board; The anti-element of pressing of 310-.

Embodiment

Now about the detailed description and the technology contents of the utility model, existing conjunction with figs. is explained as follows:

See also Fig. 1 and Fig. 2, the sketch map of the utility model embodiment.The radiating module 100 of the utility model; At least comprise a plurality of radiating fins 110 and a plurality of heat pipe 120; These a plurality of heat pipes 120 have heating section 121 and heat release section 122; Its heat release section 122 is combined closely with radiating fin 110, and the heating surface 123 of heating section 121 closely side by side, in order to a heater element (not shown) is carried out heat conduction.Wherein heating section 121 can directly be fixed on these a plurality of radiating fins arranged side by side 110 (as shown in Figure 1); A plurality of radiating fin 110 is adjacent to be formed side by side; Usually adopt aluminium matter or copper material in the enforcement, the shaping recess is installed with this a plurality of heating sections 121 to these a plurality of radiating fins 110 in the bottom side; Heating section 121 also can be fixed in the recess of a holder 130, and these a plurality of radiating fins 110 are connected with this holder 130 (as shown in Figure 2).And heat release section 122 and radiating fin 110 combine closely mode and method; Reach heating section 121 and be fixed on these a plurality of radiating fins arranged side by side 110, or be fixed in mode and the method on the holder 130, be known technology; And non-this patent emphasis is not added to give unnecessary details at this.

The utility model is characterised in that heating surface 123 surfaces of the heating section 121 of these a plurality of heat pipes 120 form a platform 1231 of protrusion respectively; Closely side by side the time, all platforms 1231 piece together into a contact platform 124 and said heater element surface engagement at these a plurality of heating surfaces 123.

Please refer again to Fig. 3, radiating module 100 when said heater element 200 is arranged at circuit board 300, in order to protect heater element 200, is provided with protruding anti-pressure element 310 around this heater element 200 in practical application.Form the platform 1231 of protrusion respectively through heating surface 123 surfaces of the utility model; And the contact platform 124 and said heater element 200 surface engagement that piece together through all platforms 1231; When the anti-pressure element that is provided with convexity around the heater element 200 310 centers on; No matter it is much that heating section 121 heating surface 123 after side by side has, through this contact platform 124, every heat pipe 120 can both be given full play to benefit; Reach the purpose that hundred of heat pipe percentage directly contacts with heater element, give full play to heat conducting usefulness.

In the application; Contact platform 124 surface configurations that these a plurality of platforms 1231 piece together are identical with said heater element surface configuration; And the surface area of the contact platform 124 that these a plurality of platforms 1231 piece together equals said heater element 200 surface areas; Or the surface area of the contact platform 124 that pieces together of these a plurality of platforms 1231 is greater than said heater element 200 surface areas, but the surface area of this contact platform 124 encloses area less than 310 of said anti-pressure elements.

The utility model discloses with preferred embodiment hereinbefore, yet it will be understood by those skilled in the art that this embodiment only is used to describe the utility model, and should not be read as the scope of restriction the utility model.It should be noted that equivalent with this embodiment such as variation and displacement all should be made as in the category that is covered by the utility model.Therefore, the protection range of the utility model when with the claim of hereinafter the person of being defined be as the criterion.

Claims

1. radiating module, it comprises a plurality of radiating fins and a plurality of heat pipe at least, and these a plurality of heat pipes have heating section and heat release section, and this heat release section and radiating fin are combined closely, and the closely combination side by side of the heating surface of heating section, it is characterized in that:

The heating surface surface of the heating section of these a plurality of heat pipes forms a platform of protrusion respectively, and all platforms piece together into a contact platform, through this a contact platform and a heater element surface engagement.

2. radiating module as claimed in claim 1 is characterized in that, the surface configuration of the contact platform that these a plurality of platforms piece together is identical with said heater element surface configuration.

3. radiating module as claimed in claim 1 is characterized in that, the surface area of the contact platform that these a plurality of platforms piece together equals said heater element surface area.

4. radiating module as claimed in claim 1 is characterized in that, the surface area of the contact platform that these a plurality of platforms piece together is greater than said heater element surface area.

5. radiating module as claimed in claim 1 is characterized in that, the contact platform that these a plurality of platforms piece together should be provided with protruding anti-pressure element on every side at said heater element, and the surface area of this contact platform is less than said anti-pressure area that element encloses.