JPH06209178A - Cooling apparatus for electronic machinery and apparatus - Google Patents
Cooling apparatus for electronic machinery and apparatusInfo
- Publication number
- JPH06209178A JPH06209178A JP5003046A JP304693A JPH06209178A JP H06209178 A JPH06209178 A JP H06209178A JP 5003046 A JP5003046 A JP 5003046A JP 304693 A JP304693 A JP 304693A JP H06209178 A JPH06209178 A JP H06209178A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- plates
- heat
- cooling plate
- air duct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子部品や機器の冷却の
ために使用される電子機器用冷却装置の改良に関する。
特に、冷却効果を改善した改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a cooling device for electronic equipment used for cooling electronic parts and equipment.
In particular, it relates to an improvement in which the cooling effect is improved.
【０００２】[0002]
【従来の技術】発熱体である電子部品や機器は、冷却の
ために金属板に取り付けられ、放熱面を広くして、空間
に放熱されて冷却される。さらに冷却したい場合は、平
板に放熱フィンを取り付ける。また、この放熱フィンを
ファンにより強制風冷するなどが行われる。しかし、電
子機器の小型化が進展して、さらに冷却効率の向上が望
まれるようになった。2. Description of the Related Art Electronic parts and devices, which are heating elements, are attached to a metal plate for cooling, have a wide heat radiation surface, and are radiated into a space to be cooled. If you want to cool more, attach a heat radiation fin to the flat plate. Further, the heat radiation fins are forcedly cooled by a fan. However, with the progress of miniaturization of electronic devices, further improvement in cooling efficiency has been desired.
【０００３】図４参照 図４は従来技術に係る電子機器用冷却装置である。図４
において、１１は２枚の金属板であり、相互に部分的に
貼り合わされている。１２は２枚の板１１の間に貼着さ
れないでできた自閉した通路であり、自閉した通路１２
には揮発性の液体よりなる作動液が封入されていて、１
種のヒートパイプを形成している。１点鎖線で囲まれた
部分１４は２枚の板１１の上部で放熱を司る放熱部分で
あり、この放熱部分１４に放熱フィン４が溶接されて、
さらに、放熱フィン４は放熱ファン３により強制風冷さ
れている。FIG. 4 is a cooling device for electronic equipment according to the prior art. Figure 4
In the figure, reference numeral 11 denotes two metal plates, which are partially bonded to each other. Reference numeral 12 is a self-closing passage that is not attached between the two plates 11, and is a self-closing passage 12
Is filled with a working liquid consisting of a volatile liquid.
Forming the heat pipe of the seed. A portion 14 surrounded by a one-dot chain line is a heat radiating portion that controls heat radiation in the upper part of the two plates 11, and the heat radiating fin 4 is welded to this heat radiating portion 14 to
Further, the radiation fins 4 are forcedly cooled by the radiation fan 3.
【０００４】従来技術に係る電子機器用冷却装置は上記
のような構成になっている。５は電子機器等の発熱体で
あり、２枚の板１１の下部に取り付けられている。The cooling device for electronic equipment according to the prior art is constructed as described above. Reference numeral 5 denotes a heating element of an electronic device or the like, which is attached to the lower part of the two plates 11.
【０００５】電子機器等の発熱体５が発熱すると、２枚
の金属板１１により上部の冷却部分１４に熱を伝導する
と同時に、自閉した通路１２中の作動液は潜熱を奪って
気体となり上部の冷却部分１４に対流し、上部の冷却部
分１４にて冷却されて液体になり下部の発熱部分に戻
る。以下このサイクルを繰り返すので、金属中を熱が伝
導するよりも効率よく下部の発熱を上部の冷却部分に伝
えることができる。When the heating element 5 of an electronic device or the like generates heat, the heat is conducted to the upper cooling portion 14 by the two metal plates 11 and, at the same time, the working liquid in the self-closing passage 12 deprives latent heat and becomes a gas. To the cooling portion 14 of the above, and is cooled in the upper cooling portion 14 to become a liquid and returns to the lower heat generating portion. Since this cycle is repeated thereafter, the heat generation of the lower part can be more efficiently transmitted to the cooling part of the upper part than the heat conduction in the metal.
【０００６】[0006]
【発明が解決しようとする課題】図４に示すような従来
技術に係る電子機器用冷却装置は、平板に放熱フィンと
放熱ファンが取り付けられた構成と比較すると放熱効果
は格段に向上している。しかし、図４に示す構成では、
放熱フィン４を溶接すると言う工程が必要であり、溶接
に不具合があるとせっかくの放熱フィン４の表面積が生
かせないことになる。また、放熱フィン４のコストと溶
接のためのコストも看過できない。In the cooling device for electronic equipment according to the prior art as shown in FIG. 4, the heat radiation effect is remarkably improved as compared with the structure in which the radiation fins and the radiation fan are attached to the flat plate. . However, in the configuration shown in FIG.
A step of welding the radiation fins 4 is required, and if the welding is defective, the surface area of the radiation fins 4 cannot be fully utilized. Further, the cost of the radiation fin 4 and the cost for welding cannot be overlooked.
【０００７】本発明の目的はこの欠点を解消することに
あり、さらに放熱効果を向上して、放熱フィン４をなく
しても十分冷却を可能にすることができる電子機器用冷
却装置を提供することにある。An object of the present invention is to eliminate this drawback, and further to provide a cooling device for electronic equipment which is capable of further improving the heat radiation effect and enabling sufficient cooling without the radiation fins 4. It is in.
【０００８】[0008]
【課題を解決するための手段】上記の目的は、電子機器
が取り付けられる電子機器用冷却装置において、２枚の
板（１１）が相互に部分的に粘着されており、粘着され
ていない隙間でできた自閉した通路（１２）に作動液
（１３）が封入されていて、前記の２枚の板（１１）の
放熱部分（１４）は切り込まれて区分された部分（１
５）とされ、この区分された部分（１５）はランダムに
曲げられている冷却板（１）と、前記の冷却板（１）の
前記の放熱部分（１４）を覆い、前記の冷却板（１）の
長手方向に開口を有するエアーダクト（２）と、前記の
エアーダクト（２）の中の前記の放熱部分（１４）を風
冷する冷却ファン（３）とよりなる電子機器用冷却装置
によって達成される。SUMMARY OF THE INVENTION The above object is to provide a cooling device for electronic equipment to which an electronic equipment is attached, in which two plates (11) are partially adhered to each other, and in a gap which is not adhered. The working fluid (13) is enclosed in the self-closing passage (12) thus formed, and the heat radiating portion (14) of the two plates (11) is cut and divided (1).
5), the divided portion (15) covers the randomly bent cooling plate (1) and the heat dissipation portion (14) of the cooling plate (1), and the cooling plate (1) 1) A cooling device for electronic equipment comprising an air duct (2) having an opening in the longitudinal direction, and a cooling fan (3) for air-cooling the heat radiating portion (14) in the air duct (2). Achieved by
【０００９】[0009]
【作用】本発明に係る電子機器用冷却装置は、冷却板１
の２枚の板１１の間の自閉した通路１２に揮発性の液体
よりなる作動液１３が封入されているので、通路１２は
１種のヒートパイプとして働くから、冷却板１は非常に
熱伝導率の良い板となっており、冷却板１での熱勾配は
僅かである。そして、冷却板１の冷却部分は切り込まれ
て、区分された部分１５はランダムに曲げられてエアー
ダクト２中に置かれているから、冷却ファン３がエアー
ダクト２の中を強制風冷すると、区分された部分１５が
ランダムに曲げられているから、空気の流れは乱流とな
り、甚だしくは渦流が発生する。層流に比べて渦流では
放熱が非常に良くなる。それは、渦流により区分された
部分１５の表面から熱がむしられるように奪われるから
である。このため、本発明に係る電子機器用冷却装置に
おいては、放熱面積が増大したかのように働き、ヒート
パイプの働きと相まって放熱効率のよい冷却装置として
動作する。換言すれば、図４に示す従来技術に係る電子
機器用冷却装置において、冷却フィン４の溶接部分と冷
却フィン４自身の熱抵抗が０になるので、その分、冷却
フィン４の放熱表面積が減っても全体としての放熱効果
は同じになるからである。The cooling device for electronic equipment according to the present invention includes the cooling plate 1.
Since the working liquid 13 made of a volatile liquid is sealed in the self-closing passage 12 between the two plates 11 of the above, the passage 12 works as a kind of heat pipe, so that the cooling plate 1 is very heat-resistant. The plate has good conductivity, and the thermal gradient in the cooling plate 1 is small. Since the cooling portion of the cooling plate 1 is cut and the divided portion 15 is randomly bent and placed in the air duct 2, when the cooling fan 3 forcibly cools the inside of the air duct 2. Since the divided portions 15 are bent at random, the air flow becomes a turbulent flow, and a vortex flow is generated. Heat dissipation is much better with vortex flow than with laminar flow. This is because heat is taken away from the surface of the portion 15 divided by the eddy current so as to be dissipated. Therefore, in the electronic device cooling device according to the present invention, the cooling device works as if the heat radiation area is increased, and works as a cooling device with high heat radiation efficiency in combination with the function of the heat pipe. In other words, in the electronic device cooling device according to the related art shown in FIG. 4, since the thermal resistance of the welded portion of the cooling fin 4 and the cooling fin 4 itself becomes 0, the heat radiation surface area of the cooling fin 4 decreases accordingly. However, the overall heat dissipation effect is the same.
【００１０】[0010]
【実施例】以下、図面を参照して、本発明に係る電子機
器用冷却装置についてさらに詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A cooling device for electronic equipment according to the present invention will be described in more detail below with reference to the drawings.
【００１１】図１参照 図１は本発明の一実施例に係る電子機器用冷却装置の斜
視図である。図１において、１は冷却板である。冷却板
１の各部は下記のように構成されている。１１は２枚の
アルミ板等の熱伝導率の高い材料でできた板であり、２
枚の板は相互に部分的に粘着されている。１２は２枚の
板１１の間に粘着されないでできた自閉した通路で、冷
却板１の隅々にまで通されており、この自閉した通路１
２にはフロンＲ12等の揮発性の液体よりなる作動液が封
入されていて、１種のヒートパイプを形成している。１
点鎖線で囲まれた部分の１４は冷却板１の上部の放熱を
司る放熱部分であり、この放熱部分１４には上下方向に
切り込みが入れられている。１５は切り込まれて区分さ
れた部分であり、ランダムに曲げられている。FIG. 1 is a perspective view of a cooling device for electronic equipment according to an embodiment of the present invention. In FIG. 1, 1 is a cooling plate. Each part of the cooling plate 1 is configured as follows. Reference numeral 11 denotes a plate made of a material having a high thermal conductivity such as two aluminum plates.
The plates are partially adhered to each other. Reference numeral 12 is a self-closing passage that is formed between the two plates 11 without being adhered, and is passed through every corner of the cooling plate 1.
A working fluid made of a volatile liquid such as Freon R 12 is enclosed in 2 to form one type of heat pipe. 1
A portion 14 surrounded by a dotted chain line is a heat radiating portion that controls heat radiation in the upper part of the cooling plate 1, and the heat radiating portion 14 has a notch in a vertical direction. Reference numeral 15 is a cut and divided portion, which is bent at random.
【００１２】２は冷却板１の放熱部分１４、すなわち、
区分された部分１５全体を覆うエアーダクトであり、こ
のエアーダクト２（１点鎖線にて示す。）の一端には冷
却ファン３が取り付けられている。冷却板１とエアーダ
クト２と冷却ファン３（１点鎖線にて示す。）とにより
電子機器用冷却装置が構成されている。５は電子機器等
の発熱体であり、冷却板１の下部に取り付けられてい
る。Reference numeral 2 denotes a heat radiating portion 14 of the cooling plate 1, that is,
This is an air duct that covers the entire sectioned portion 15, and a cooling fan 3 is attached to one end of this air duct 2 (shown by the one-dot chain line). The cooling plate 1, the air duct 2, and the cooling fan 3 (shown by the chain line) constitute a cooling device for electronic equipment. Reference numeral 5 is a heating element of an electronic device or the like, which is attached to the lower portion of the cooling plate 1.
【００１３】図２参照 図２は冷却板１を冷却板１に直角に切った断面図であ
る。通路１２が２枚の板１１の間に形成されている様子
を示している。１３はフロンＲ12等の揮発性の液体より
なる作動液であり、通路１２中に注入されている。常温
においては、作動液１３は冷却板１の下部の通路１２内
では液体であり、上部の通路１２では気体となってい
る。FIG. 2 is a sectional view of the cooling plate 1 cut at a right angle to the cooling plate 1. It is shown that the passage 12 is formed between the two plates 11. A working fluid 13 is made of a volatile liquid such as Freon R 12 , and is injected into the passage 12. At room temperature, the hydraulic fluid 13 is a liquid in the lower passage 12 of the cooling plate 1 and a gas in the upper passage 12.
【００１４】図３参照 図３は本発明の一実施例に係る電子機器用冷却装置の側
面図である。図２により判るように、区分された部分１
５は冷却板１の下部に対してランダムな角度で曲げられ
ているだけでなく、捩じるように曲げられたものもあ
る。FIG. 3 is a side view of a cooling device for electronic equipment according to an embodiment of the present invention. As can be seen in FIG. 2, the segmented portion 1
Not only 5 is bent at a random angle with respect to the lower part of the cooling plate 1, but also some are bent so as to be twisted.
【００１５】本発明の一実施例に係る電子機器用冷却装
置はこのように構成されているので、冷却ファン３がエ
アーダクト２の中を強制風冷すると、区分された部分１
５がランダムに曲げられているから、区分された部分１
５の端面より空気の流れは乱流となり、渦流が発生す
る。このため、区分された部分１５の表面から熱がむし
られるように奪われ冷却されることになる。本発明に係
る電子機器用冷却装置においては、放熱面積が増大した
かのように働き、通路１２に注入されている作動液の作
用によるヒートパイプ的働きと相まって放熱効率は２０
％も向上した。Since the electronic device cooling apparatus according to the embodiment of the present invention is constructed in this way, when the cooling fan 3 forcibly cools the inside of the air duct 2, the section 1 is divided.
Since 5 is bent at random, it is a divided part 1
From the end surface of 5, the air flow becomes turbulent and a vortex is generated. For this reason, heat is taken away from the surface of the divided portion 15 so that it is cooled and cooled. In the electronic device cooling device according to the present invention, the heat radiation area acts as if it increased, and the heat radiation efficiency is 20 due to the action of the working liquid injected into the passage 12 like a heat pipe.
% Has also improved.
【００１６】[0016]
【発明の効果】以上説明したとおり、本発明に係る電子
機器用冷却装置は、２枚の板１１により形成された通路
１２中の作動液１３によるヒートパイプ効果と、ランダ
ムに曲げられた複数の区分された部分１５で生ずる空気
の渦流に基づく対流効果とが相まって、効率のよい冷却
効果を得ることができる。このため、放熱フィンを使用
せずとも電子機器の放熱が可能となる。As described above, in the cooling device for electronic equipment according to the present invention, the heat pipe effect due to the hydraulic fluid 13 in the passage 12 formed by the two plates 11 and the plurality of randomly bent pipes are provided. An efficient cooling effect can be obtained in combination with the convection effect due to the vortex flow of the air generated in the divided portion 15. Therefore, it is possible to dissipate heat from the electronic device without using a heat dissipation fin.
【図１】本発明の一実施例に係る電子機器用冷却装置の
斜視図である。FIG. 1 is a perspective view of a cooling device for an electronic device according to an embodiment of the present invention.
【図２】冷却板の断面図である。FIG. 2 is a sectional view of a cooling plate.
【図３】本発明の一実施例に係る電子機器用冷却装置の
側面図である。FIG. 3 is a side view of the electronic device cooling apparatus according to the embodiment of the present invention.
【図４】従来技術に係る電子機器用冷却装置の斜視図で
ある。FIG. 4 is a perspective view of a cooling device for an electronic device according to a conventional technique.
１ 冷却板 １１ ２枚の板 １２ 作動液通路 １３ 作動液 １４ 冷却部分 １５ 区分された部分 ２ エアーダクト ３ 冷却ファン ４ 放熱フィン ５ 電子機器用冷却装置の発熱体 DESCRIPTION OF SYMBOLS 1 Cooling plate 11 Two plates 12 Working fluid passage 13 Working fluid 14 Cooling part 15 Divided part 2 Air duct 3 Cooling fan 4 Radiating fins 5 Heating element of electronic device cooling device
Claims (1)
却装置において、 ２枚の板（１１）が相互に部分的に粘着されており、粘
着されていない隙間でできた自閉した通路（１２）に作
動液（１３）が封入されていて、前記２枚の板（１１）
の放熱部分（１４）は切り込まれて区分された部分（１
５）とされ、該区分された部分（１５）はランダムに曲
げられてなるようにされた冷却板（１）と、 前記冷却板（１）の前記放熱部分（１４）を覆い、前記
冷却板（１）の長手方向に開口を有するエアーダクト
（２）と、 前記エアーダクト（２）の中の前記放熱部分（１４）を
風冷する冷却ファン（３）とよりなることを特徴とする
電子機器用冷却装置。1. A cooling device for an electronic device to which an electronic device is attached, wherein two plates (11) are partially adhered to each other, and a self-closing passage (12) formed by a gap not adhered. A hydraulic fluid (13) is enclosed in the two plates (11)
The heat dissipating part (14) of the
5), and the divided portion (15) covers the cooling plate (1) which is bent at random and covers the heat dissipation portion (14) of the cooling plate (1), An electron comprising an air duct (2) having an opening in the longitudinal direction of (1) and a cooling fan (3) for air-cooling the heat dissipation part (14) in the air duct (2). Equipment cooling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5003046A JPH06209178A (en) | 1993-01-12 | 1993-01-12 | Cooling apparatus for electronic machinery and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5003046A JPH06209178A (en) | 1993-01-12 | 1993-01-12 | Cooling apparatus for electronic machinery and apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06209178A true JPH06209178A (en) | 1994-07-26 |
Family
ID=11546377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5003046A Pending JPH06209178A (en) | 1993-01-12 | 1993-01-12 | Cooling apparatus for electronic machinery and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06209178A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0972680A (en) * | 1995-09-05 | 1997-03-18 | Akutoronikusu Kk | Structure of porous flat tube and manufacture thereof |
| JP2002151636A (en) * | 2000-11-10 | 2002-05-24 | Ts Heatronics Co Ltd | Heat sink |
| JP2008505305A (en) * | 2004-07-03 | 2008-02-21 | テラダイン・インコーポレーテッド | Micro heat pipe with wedge capillary |
| CN103313574A (en) * | 2012-03-06 | 2013-09-18 | 宏碁股份有限公司 | Heat dissipation device |
| TWI449875B (en) * | 2012-02-29 | 2014-08-21 | Acer Inc | Heat dissipation device |
| JP5718814B2 (en) * | 2009-08-07 | 2015-05-13 | 株式会社Uacj | heatsink |
-
1993
- 1993-01-12 JP JP5003046A patent/JPH06209178A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0972680A (en) * | 1995-09-05 | 1997-03-18 | Akutoronikusu Kk | Structure of porous flat tube and manufacture thereof |
| JP2002151636A (en) * | 2000-11-10 | 2002-05-24 | Ts Heatronics Co Ltd | Heat sink |
| JP2008505305A (en) * | 2004-07-03 | 2008-02-21 | テラダイン・インコーポレーテッド | Micro heat pipe with wedge capillary |
| JP5718814B2 (en) * | 2009-08-07 | 2015-05-13 | 株式会社Uacj | heatsink |
| TWI449875B (en) * | 2012-02-29 | 2014-08-21 | Acer Inc | Heat dissipation device |
| CN103313574A (en) * | 2012-03-06 | 2013-09-18 | 宏碁股份有限公司 | Heat dissipation device |
| CN103313574B (en) * | 2012-03-06 | 2016-03-30 | 宏碁股份有限公司 | Heat abstractor |
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