CN103311163A - Inverted valve for semiconductor storage device - Google Patents
Inverted valve for semiconductor storage device Download PDFInfo
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- CN103311163A CN103311163A CN2012100617500A CN201210061750A CN103311163A CN 103311163 A CN103311163 A CN 103311163A CN 2012100617500 A CN2012100617500 A CN 2012100617500A CN 201210061750 A CN201210061750 A CN 201210061750A CN 103311163 A CN103311163 A CN 103311163A
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- return valve
- wafer cassette
- mask
- mask box
- valve
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Abstract
An inverted valve is arranged inside a semiconductor storage device. The inverted valve comprises a cylinder and an inverted member. Through opening and closing of the elastic inverted member, excessive particles are prevented from being generated so that articles in the semiconductor storage device are free of pollution.
Description
Technical field
The invention relates to a kind of semiconductor memory apparatus, particularly relevant for a kind of non-return valve that is disposed in the semiconductor memory apparatus; Wherein, semiconductor memory apparatus can be mask box or wafer cassette.
Background technology
Modern age, the semiconductor development in science and technology was rapid, and wherein optical lithography techniques (Optical Lithography) is played the part of important role, so long as about figure (pattern) definition, all need be dependent on optical lithography techniques.Optical lithography techniques is that the circuit that will design is made into the mask (photo mask) with given shape light-permeable in semi-conductive application.Utilize the exposure principle, then light source is projected to Silicon Wafer (silicon wafer) the demonstration specific pattern that can expose by mask.Because any dust granules (such as particulate, dust or organic substance) that is attached on the mask all can cause the quality deterioration of projection imaging, mask for generation of figure must keep absolute cleaning, and the Silicon Wafer that is throwed or other semiconductor projectiles also must keep absolute quietness, therefore in general wafer process, all provide the environment of dust free room (clean room) to avoid airborne particle contamination.Yet present dust free room also can't reach absolute dustless state.
Therefore, modern semiconductor technology all utilizes resistant to pollution memory device to carry out preservation and the transportation of mask and wafer, so that mask and wafer keep clean; Also utilize resistant to pollution semiconductor element memory device to carry out preservation and the transportation of semiconductor element, so that semiconductor element keeps clean.
The semiconductor element memory device is to be used for depositing semiconductor element in semiconductor technology, in order to carrying and the transmission of semiconductor element between board, and the contacting of isolated semiconductor element and atmosphere, avoid semiconductor element to be changed by contaminating impurity.Therefore, in advanced person's semiconductor element factory, usually can require the cleanliness factor of mask memory device and semiconductor element memory device will meet machinery standard interface (Standard Mechanical Interface; SMIF), that is to say and keep cleanliness factor at Class below 1.Therefore being filled with gas in mask memory device and semiconductor element memory device is one of means that solve at present.
Generally can come action that memory device is inflated and bled via non-return valve, as shown in Figure 1, valve body usually has a valve body a and is disposed in the valve body admission extinguisher b, one clinching c, one elastic construction d is sandwiched between valve body a and the elastic construction d, and a filter e, is disposed at clinching c rear; In the time will inflating non-return valve, can press valve body a, make valve body a break away from valve body admission extinguisher b and form a passage, gas just passes through valve body admission extinguisher b via passage, enters in the memory device at the filter e via clinching c and rear; And when stopping to inflate, stop to press valve body a, by elastic construction d with the valve body a valve body admission extinguisher b that rebounds, to form closed state.
Yet, after the running via valve body a many times, can produce repeatedly friction with a plurality of elements of non-return valve, therefore easily produce many particulates (Particle), and particulate just can pollute mask and the wafer of depositing in the memory device, meeting causes and can't re-use and beyond economic repair awkward situation so that mask or wafer are subjected to pollute, so that manufacturing cost increases.Therefore providing a charger that can not produce pollutant, is an important subject under discussion.
In view of this, the non-return valve of mask memory device provided by the present invention and wafer memory device is improved for prior art.
Summary of the invention
In order to address the above problem, a main purpose of the present invention is to provide a kind of non-return valve to be disposed in the wafer cassette, by having the folding of flexible single element itself, prevents that multiparticulates from producing, to avoid the wafer in the polluting wafer box.
According to above-mentioned purpose, the invention provides a kind of wafer cassette, mainly comprise a box body, to form an opening in a side of box body, and body, the door body is to combine with opening, and form an accommodation space, provide wafer to place, wherein wafer cassette is characterised in that: at least one pair of non-return valve of configuration in box body, and each non-return valve comprises a circular columns and a check spare, circular columns is a hollow cylinder, and check spare is embedded in the circular columns, wherein check spare comprises: a circular domes has protuberance top and a rounded bottom; One annulus forms and is surrounded on rounded bottom; And at least one line of cut, extended toward rounded bottom by the centre on protuberance top.
Another main purpose of the present invention is to provide a kind of non-return valve to be disposed in the mask box, by the folding of single element itself, prevents that multiparticulates from producing, to avoid polluting the mask in the mask box.
According to above-mentioned purpose, the invention provides a kind of mask box, mainly comprise a loam cake and a lower cover, loam cake is to combine with lower cover, and form an accommodation space, provide mask to place, wherein mask box is characterised in that: at least one pair of non-return valve of configuration in mask box, and each non-return valve comprises a circular columns and a check spare, circular columns is a hollow cylinder, and check spare is embedded in the circular columns, wherein check spare comprises: a circular domes has protuberance top and a rounded bottom; One annulus forms and is surrounded on rounded bottom; And at least one line of cut, extended toward rounded bottom by the centre on protuberance top.
Via design provided by the present invention, make wafer cassette and mask box when the action of inflating and bleeding, can prevent that multiparticulates from producing, to avoid polluting the semiconductor element in the memory device.
Description of drawings
For being illustrated more clearly in the present invention, below enumerate preferred embodiment and cooperate accompanying drawing to be described in detail as follows, wherein:
Fig. 1 is known non-return valve schematic diagram;
Fig. 2 is non-return valve schematic diagram of the present invention;
Fig. 3 A is check spare inflation schematic diagram of the present invention;
Fig. 3 B stops to inflate schematic diagram for check spare of the present invention;
Fig. 4 is the non-return valve schematic diagram that is installed on wafer cassette for the present invention;
Fig. 5 is the non-return valve cut-away view that is installed on mask box for the present invention.
Embodiment
Because the present invention discloses a kind of non-return valve, particularly is disposed at the non-return valve of wafer cassette and mask box; Some that wherein use are to utilize prior art to reach about elastic material, filter membrane, therefore in following explanation, do not do complete description.In addition, the accompanying drawing in following interior literary composition, also not according to the actual complete drafting of relative dimensions, its effect is only being expressed the schematic diagram relevant with feature of the present invention.
At first, seeing also Fig. 2, is to be non-return valve schematic diagram of the present invention.As shown in Figure 2, non-return valve 1 comprises a circular columns 10 and a check spare 20, circular columns 10 is a hollow cylinder, and check spare 20 is embedded in the circular columns 10, and wherein check spare 20 comprises: a circular domes 201 has protuberance top 2011 and a rounded bottom 2013; One annulus 203 forms and is surrounded on rounded bottom 2013; At least one line of cut 205 is extended toward rounded bottom 2013 by the centre 2015 on protuberance top 2011; Line of cut 205 of the present invention is many rectilinear form cuttings, and for symmetrical in twos, the present embodiment has three pairs, but the present invention is not limited line of cut strip and the quantity of line of cut 205.The material of check spare 20 is elastic material, such as: Viton, silica gel or rubber etc., but the present invention is not limited elastic material.
In addition, in circular columns 10, the top of check spare 20 configures a filter membrane 30, and filter membrane 30 is microcellular structure, dust and the impurity of main filtering gas; Filter membrane 30 employed materials of the present invention are polytetrafluoroethylene (PTFE), but the present invention is not limited the material of filter membrane 30.
Then, seeing also Fig. 3 A, is to be check spare inflation schematic diagram of the present invention.As shown in Figure 3A, when to non-return valve 1 inflation, gas is entered by the A end first, the fluid pressure of gas can strut at least one line of cut 205 formed valve 207 of check spare 20, and (N can form 2N sheet valve to line of cut, the above natural number of N=1), entered by valve 207 formed passage 209 inflations that strut; Through behind the passage 209, gas filters the gas that is charged into via filter membrane 30 again, then arrives the B end of non-return valve 1, finishes the step of whole inflation.
Following, see also Fig. 3 B, is to stop to inflate schematic diagram for check spare of the present invention.Shown in Fig. 3 B, when gas stops to inflate, the elastic material that valve 207 is understood because of itself, and be returned to the state that each valve 207 is closed mutually; Owing to check spare 20 is a dome shape, add itself to have a thickness, therefore the fluid air pressure in inside can't promote valve 207, can prevent back flow of gas.
Embodiments of the invention, in the situation that check spare 20 its diameter are 13 millimeters, the thickness of valve 207 (being check spare) is 1.5 millimeters; And relative its thickness parliament increases relatively when check spare 20 is larger, but the present invention is not limited the relative scale of diameter and thickness; Non-return valve 1 of the present invention also can be used for liquid in addition, or other fluid, and the present invention is not also limited the fluid type of processing.
Seeing also Fig. 4, is the non-return valve schematic diagram that is installed on wafer cassette for the present invention.As shown in Figure 4, wafer cassette 4 mainly comprises a box body 40, in a side of box body 40 be to form an opening 401, and a body 42, door body 42 is to combine with opening 401, and forms an accommodation space, provides wafer to place; At a pair of non-return valve 1 of the bottom of wafer cassette 4 403 configurations, this is a charge valve 4031 and an extraction valve 4033 to non-return valve 1; Because non-return valve 1 is the single direction air inlet, so the check spare 20 of non-return valve 1 inside of charge valve 4031 and extraction valve 4033 is the configuration of mutually turning upside down.
Generally in wafer cassette 4, the wafer that inert gas is protected the inside can be filled with inside, therefore over time, the gas of the inside can be needed to replace; Therefore, in the time will replacing gas, to charge valve 4031 inflations, again extraction valve 4033 is bled simultaneously first, make inner gas replace to new gas.Will emphasize at this, the present invention does not limit charge valve 4031 and extraction valve 4033 allocation positions, does not also limit configurable number, as long as enforcement effect according to the invention is all practical range of the present invention.
Seeing also Fig. 5, is the non-return valve cut-away view that is installed on mask box for the present invention.As shown in Figure 5, mask box 5 mainly comprises a loam cake 50 and a lower cover 52, and loam cake 50 is to combine with lower cover 52, and forms an accommodation space, provides mask to place; At a pair of non-return valve 1 of lower cover 52 configurations of mask box 5, this is a charge valve 521 and an extraction valve 523 to non-return valve 1; Because non-return valve 1 is the single direction air inlet, so the check spare 20 of non-return valve 1 inside of charge valve 521 and extraction valve 523 is the configuration of mutually turning upside down.
Generally in mask box 5, the mask that inert gas is protected the inside can be filled with inside, therefore over time, the gas of the inside can be needed to replace; Therefore, in the time will replacing gas, to charge valve 521 inflations, again extraction valve 523 is bled simultaneously first, make inner gas replace to new gas.Will emphasize at this, the present invention does not limit charge valve 521 and extraction valve 523 allocation positions, does not also limit configurable number, as long as enforcement effect according to the invention is all practical range of the present invention.
Although the present invention discloses as above with aforesaid preferred embodiment; so it is not to limit the present invention; anyly have the knack of alike operator; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, therefore scope of patent protection of the present invention must be looked being as the criterion that claim scope of the present invention defines.
Claims (18)
1. a wafer cassette comprises a box body, forms an opening in a side of this box body, and a body, and this opening of this Men Tiyu combines, and forms an accommodation space, provides wafer to place, and wherein this wafer cassette is characterised in that:
At least one pair of non-return valve of configuration in this box body, each this non-return valve comprises a circular columns and a check spare, and this circular columns is a hollow cylinder, and this check spare is embedded in this circular columns, and wherein this check spare comprises:
One circular domes has protuberance top and a rounded bottom; And
At least one line of cut is extended toward this rounded bottom by the centre on this protuberance top.
2. wafer cassette according to claim 1 wherein in this circular columns of this non-return valve, further configures a filter membrane.
3. wafer cassette according to claim 1, wherein this is to be disposed in the bottom of this box body to non-return valve.
4. wafer cassette according to claim 1, wherein this is to take out non-return valve and to fill non-return valve to non-return valve.
5. wafer cassette according to claim 1 wherein should the circle domes have a thickness.
6. wafer cassette according to claim 1, it further comprises an annulus, is surrounded on this rounded bottom.
7. wafer cassette according to claim 1, wherein this line of cut is many and symmetrical in twos.
8. wafer cassette according to claim 1, wherein the material of this non-return valve is an elastic material.
9. wafer cassette according to claim 8, wherein this elastic material is Viton, silica gel or rubber.
10. a mask box comprises a loam cake and a lower cover, and this loam cake combines with this lower cover, and forms an accommodation space, provides mask to place, and wherein this mask box is characterised in that:
At least one pair of non-return valve of configuration in this mask box, each this non-return valve comprises a circular columns and a check spare, and this circular columns is a hollow cylinder, and this check spare is embedded in this circular columns, and wherein this check spare comprises:
One circular domes has protuberance top and a rounded bottom; And
At least one line of cut is extended toward this rounded bottom by the centre on this protuberance top.
11. mask box according to claim 10 wherein in this circular columns of this non-return valve, further configures a filter membrane.
12. mask box according to claim 10, wherein this to non-return valve be disposed at this lower cover in.
13. mask box according to claim 10, wherein this is to take out non-return valve and to fill non-return valve to non-return valve.
14. mask box according to claim 10 wherein should the circle domes have a thickness.
15. mask box according to claim 10, it further comprises an annulus, is surrounded on this rounded bottom.
16. mask box according to claim 10, wherein this line of cut is many and symmetrical in twos.
17. mask box according to claim 10, wherein the material of this non-return valve is an elastic material.
18. mask box according to claim 17, wherein this elastic material is Viton, silica gel or rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100617500A CN103311163A (en) | 2012-03-09 | 2012-03-09 | Inverted valve for semiconductor storage device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100617500A CN103311163A (en) | 2012-03-09 | 2012-03-09 | Inverted valve for semiconductor storage device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103311163A true CN103311163A (en) | 2013-09-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100617500A Pending CN103311163A (en) | 2012-03-09 | 2012-03-09 | Inverted valve for semiconductor storage device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103311163A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107982068A (en) * | 2018-01-02 | 2018-05-04 | 吴伟祥 | A kind of medical collection case for being used to vomit patient after drinking |
| CN108109896A (en) * | 2017-12-15 | 2018-06-01 | 上海华力微电子有限公司 | Reduce the method and device of high current implanter particle contamination |
| CN112343821A (en) * | 2019-08-06 | 2021-02-09 | 上海海立电器有限公司 | One-way conduction valve, refrigerant injection structure comprising same and compressor |
| JP2023036543A (en) * | 2021-09-02 | 2023-03-14 | 家登精密工業股▲ふん▼有限公司 | Quick exhaust valve, substrate container with quick exhaust valve, and attaching/detaching method for quick exhaust valve |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4724874A (en) * | 1986-05-01 | 1988-02-16 | Asyst Technologies | Sealable transportable container having a particle filtering system |
| US5988233A (en) * | 1998-03-27 | 1999-11-23 | Asyst Technologies, Inc. | Evacuation-driven SMIF pod purge system |
| US20040182472A1 (en) * | 2003-03-20 | 2004-09-23 | Ravinder Aggarwal | Front opening unified pod |
| CN101889163A (en) * | 2007-10-08 | 2010-11-17 | 耶斯·图戈德·格拉姆 | Elastomeric valve |
-
2012
- 2012-03-09 CN CN2012100617500A patent/CN103311163A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4724874A (en) * | 1986-05-01 | 1988-02-16 | Asyst Technologies | Sealable transportable container having a particle filtering system |
| US5988233A (en) * | 1998-03-27 | 1999-11-23 | Asyst Technologies, Inc. | Evacuation-driven SMIF pod purge system |
| US20040182472A1 (en) * | 2003-03-20 | 2004-09-23 | Ravinder Aggarwal | Front opening unified pod |
| CN101889163A (en) * | 2007-10-08 | 2010-11-17 | 耶斯·图戈德·格拉姆 | Elastomeric valve |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108109896A (en) * | 2017-12-15 | 2018-06-01 | 上海华力微电子有限公司 | Reduce the method and device of high current implanter particle contamination |
| CN107982068A (en) * | 2018-01-02 | 2018-05-04 | 吴伟祥 | A kind of medical collection case for being used to vomit patient after drinking |
| CN112343821A (en) * | 2019-08-06 | 2021-02-09 | 上海海立电器有限公司 | One-way conduction valve, refrigerant injection structure comprising same and compressor |
| JP2023036543A (en) * | 2021-09-02 | 2023-03-14 | 家登精密工業股▲ふん▼有限公司 | Quick exhaust valve, substrate container with quick exhaust valve, and attaching/detaching method for quick exhaust valve |
| JP7397929B2 (en) | 2021-09-02 | 2023-12-13 | 家登精密工業股▲ふん▼有限公司 | Quick exhaust valve, substrate container with quick exhaust valve, how to attach and remove the quick exhaust valve |
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Application publication date: 20130918 |