CN103290345B - Rolled copper foil - Google Patents
Rolled copper foil Download PDFInfo
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- CN103290345B CN103290345B CN201310139482.4A CN201310139482A CN103290345B CN 103290345 B CN103290345 B CN 103290345B CN 201310139482 A CN201310139482 A CN 201310139482A CN 103290345 B CN103290345 B CN 103290345B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2202/00—Physical properties
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- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Metal Rolling (AREA)
- Non-Insulated Conductors (AREA)
Abstract
The invention provides a rolled copper coil which is excellent in both etching and bending properties and applicable to FPCs(flexible printed circuits) and the like. Copper accounts for, by quality ratio, more than 99.9% of the rolled copper coil. A calculation X-ray diffracted intensity from a {112} plane of a rolled plane is set to be I{112}, and a calculation X-ray diffracted intensity from a {110} plane is set to be I{110}, wherein 2.5<=I{110}/I{112}<=6.0.
Description
Technical field
The present invention relates to and be applicable to FPC(flexible print wiring board) etc. rolled copper foil.
Background technology
As FPC(flexible print wiring board) use the copper foil composite of laminated copper foil and resin layer, this Copper Foil requires etching when forming circuit and considers the bendability of use of FPC.
But FPC uses under the state of having carried out recrystallize at Copper Foil.When rolling processing Copper Foil, crystallization rotates, and forms rolling set tissue, it is believed that { 112 } < 111 > being called as Copper orientation of the rolling set tissue of fine copper is main orientation.And, if anneal after by rolled copper foil rolling, or until be processed into end article operation, namely form FPC operation in apply heat, then can there is recrystallize.Below by the recrystallized structure after this formation rolled copper foil referred to as " recrystallized structure ", by the rolling structure before heating referred to as " rolling structure ".In addition, recrystallized structure affects by rolling structure to a great extent, is organized also can control recrystallized structure by controlled rolling.
By above-mentioned situation, propose a kind ofly after the recrystallize of rolled copper foil, make the Cube orientation of { 001 } < 100 > flourishing and improve the technology (such as, patent documentation 1,2) of bendability.
Patent documentation
Patent documentation 1: Japanese Patent No. 3856616 publication
Patent documentation 2: Japanese Patent No. 4716520 publication
Summary of the invention
But, if the Cube orientation of Copper Foil is excessively flourishing, then there is the problem that etching reduces.Think this is because, even if the prosperity of Cube set tissue neither single crystal, become the mixed granular state of the little crystal grain that there is other orientation in the large crystal grain of Cube orientation, etching speed changes because of the particle of each orientation.Especially the L/S width of circuit becomes narrower (micro-pitch), and etching is more a problem.In addition, if Cube orientation is excessively flourishing, then Copper Foil becomes too soft, and treatability is deteriorated.
Should illustrate, in order to adjust the flourishing degree of Cube orientation, have the method for controlled rolling tissue after recrystallize in final rolling, but there is the undeveloped or excessive prosperity of Cube orientation and the problem of the adjustment of the flourishing degree of Cube orientation and so on can not be carried out fully.
Therefore, the object of the invention is to, a kind of etching and the equal excellent rolled copper foil of bendability are provided.
The discoveries such as the present inventor, on the rolling surface of rolling structure, the ratio that the ratio that { 110 } face exists exists compared with { 112 } face is more, then the rolling set of Copper Foil is organized and reached all the more, and when recrystallization annealing, Cube orientation reaches all the more.Thus, in order to suitably adjustment makes bendability improve but the flourishing degree of the Cube orientation making etching reduce, the ratio of { 112 } face of control and the prosperity of { 110 } face on the rolling surface of Copper Foil, makes the etching of rolled copper foil and bendability improve simultaneously and succeeds.
Namely, rolled copper foil of the present invention in quality ratio containing more than 99.9% copper, the calculating X-ray diffraction intensity from { 112 } face of rolling surface is being set to I { 112 }, when calculating X-ray diffraction intensity from { 110 } face is set to I { 110 }, meet 2.5≤I { 110 }/I { 112 }≤6.0.
Rolled copper foil of the present invention preferably containing total 10 ~ 300 quality ppm be selected from the group of Ag, Sn, Mg, In, B, Ti, Zr and Au one or more, remainder by Cu and inevitably impurity form.
The oxygen of rolled copper foil of the present invention preferably containing 2 ~ 50 quality ppm.
After rolled copper foil of the present invention preferably carries out the heating of 30 minutes at 200 DEG C, in rolling surface, meet I { 112 }≤1.0.
Rolled copper foil of the present invention is set to I { 200 } at the X-ray diffraction intensity in { 200 } face of the rolling surface by described rolled copper foil, the X-ray diffraction intensity in { 200 } face of fine copper powdered sample is set to I after preferably heating for 1 second at 350 DEG C
0{ 200 }, time, 5.0≤1 { 200 }/I are met
0{ 200 }≤27.0, preferably meet 13.0≤1 { 200 }/I
0{ 200 }≤27.0.
Rolled copper foil preferred thickness of the present invention is 4 ~ 70 μm.
Invention effect
According to the present invention, etching can be obtained and bendability is all excellent, can FPC(flexible print wiring board be applicable to) etc. rolled copper foil.
Accompanying drawing explanation
Fig. 1: be schematically show for increase on the rolling surface of Copper Foil { 112 } face, the figure of the relation of Ag amount in the tension force that puts on Copper Foil in final recrystallization annealing and Copper Foil;
Fig. 2: the figure being the optical microphotograph mirror image of the etching face representing embodiment 5, comparative example 2 respectively;
Fig. 3: the figure being the correspondence of the evaluation representing benchmark image and etching.
Embodiment
Below, the rolled copper foil that embodiments of the present invention relate to is described.Should illustrate, in the present invention, so-called % then represents quality % as long as no special explanation.
< forms >
Rolled copper foil in quality ratio containing more than 99.9% copper.As this composition, can JIS-H3510(C1011 be enumerated) or JIS-H3100(C1020) in the oxygen free copper that is standardized or JIS-H3100(C1100) in the tough pitch copper that is standardized.In addition, preferably the oxygen level of rolled copper foil is set as 2 ~ 50 quality ppm.When oxygen level in rolled copper foil is less than 2 ~ 50 quality ppm, then in rolled copper foil, there is Red copper oxide hardly.Therefore, when bending rolled copper foil, the accumulation of the deformation almost not having Red copper oxide to cause, is difficult to crack, and bendability improves.Should illustrate, the upper limit of the oxygen level contained in copper is not particularly limited, but is generally below 500 quality PPm, is generally below 320 quality PPm further.
And then, also can containing total 10 ~ 300 quality ppm be selected from the group of Ag, Sn, Mg, In, B, Ti, Zr and Au one or more.If add these elements, then there is { 110 } face on rolling surface and become many tendencies, therefore, easily adjustment I described later { 110 }/I { 112 } value.If the total quantity not sufficient 10 quality ppm of above-mentioned element, then make { 110 } face few in the effect of rolling surface prosperity, if more than 300 quality ppm, electric conductivity reduces, recrystallization temperature rises simultaneously, is difficult to carry out recrystallize in the annealing sometimes after final rolling while the surface oxidation suppressing Copper Foil.
< thickness G reatT.GreaT.GT
The thickness of Copper Foil preferably 4 ~ 100 μm, more preferably 5 ~ 70 μm.If thickness is less than 4 μm, then the treatability of Copper Foil is deteriorated sometimes, if thickness is more than 100 μm, then the bendability of Copper Foil is deteriorated sometimes.
{ 112 } face of < Copper Foil rolling surface and { 110 } face >
The strength definition that exists of each of the Copper Foil rolling surface calculated by the X-ray diffraction intensity by { 200 }, { 220 }, { 111 } face is calculate X-ray diffraction intensity.And, the calculating X-ray diffraction intensity in { 112 } face is set to I { 112 }, when the calculating X-ray diffraction intensity from { 110 } face is set to I { 110 }, meets 2.5≤I { 110 }/I { 112 }≤6.0.Preferred scope is 4.0≤I { 110 }/I { 112 }≤5.6.
Should illustrate, because in X-ray diffraction, its wavelength is longer, therefore { 200 }, { 220 } of Copper Foil, the diffracted intensity in { 111 } face can measure, but can not get the diffraction peak in { 422 } face (i.e. { 112 } face).So, according to the X-ray diffraction result of { 200 }, { 220 }, { 111 } based on positive limit assay method, utilize the geometric relation of crystalline orientation, obtain the calculating X-ray diffraction intensity in { 110 } face and { 112 } face.Should illustrate, { 110 } diffracted intensity in face also can be set as equal with the diffracted intensity in { 220 } face and directly measure, but the calculating X-ray diffraction intensity that the diffracted intensity in the present invention, application basis { 200 }, { 220 }, { 111 } face calculates.
Specifically, the value of the calculating X-ray diffraction intensity in acquisition as described below { 110 } face and { 112 } face.
First, the positive pole graph mensuration in { 200 }, { 220 } of Copper Foil, { 111 } face is carried out.Positive pole graph assay method is the rotating mechanism arranging twin shaft (α, β) on the angle gauge being fixed with sample, changes the method that these angles measure X-ray diffraction.Then, according to X-ray diffraction positive limit measurement result ({ 200 }, { 220 } of Copper Foil, the positive pole graph in { 111 } face), geometric relation can be utilized, by calculating the aggregation degree obtaining { 110 } face and { 112 } face.This calculating can use commercially available software (such as, StandardODF(Co., Ltd. standard engineering system) to be converted to the performance of inverse limit to carry out.
Should illustrate, for the aggregation degree in { 110 } face and { 112 } face, first carry out the positive limit mensuration in { 200 }, { 220 }, { 111 } face, secondly similarly carry out the positive limit mensuration in { 200 }, { 220 } of fine copper powder standard test specimen, { 111 } face.Then, the aggregation degree in { 200 }, { 220 }, { 111 } face is used { 200 }, { 220 } of fine copper powder standard test specimen, the aggregation degree stdn in { 111 } face respectively.Then, according to the positive pole graph in normalized like this { 200 }, { 220 }, { 111 } face, be converted to inverse limit by above-mentioned software, calculate the aggregation degree (calculating X-ray diffraction intensity) in { 110 } face and { 112 } face.
Rolled copper foil of the present invention after hot rolling and building up by welding, can repeat cold rolling and annealing (usually, about twice) for several times, then, carries out finally cold rolling and manufacture after final recrystallization annealing usually.
At this, so-called " final recrystallization annealing " refers to once annealing last in the annealing before finally cold rolling.In addition, in order to distinguish with above-mentioned " recrystallized structure " (becoming the recrystallized structure after rolled copper foil), the recrystallized structure after final recrystallization annealing is called " intermediate recrystallization tissue ".First, as the method adjusting intermediate recrystallization tissue simply, the method changing annealing temperature can be enumerated.But, when only improving final recrystallization annealing temperature, if the recrystal grain growth of random orientation, recrystal grain becomes mixed grain (Tile Width of the size of crystallization particle diameter becomes large), then become the reason of the surface imperfection such as the texture after final rolling, therefore not preferred, be therefore difficult to the value of suitably control I { 110 }/I { 112 }.
On the other hand, in final recrystallization annealing, if improve the tension force putting on Copper Foil, then this tension force can become motivating force and the crystallization particle diameter of intermediate recrystallization tissue be increased, and makes rolling surface exists { 112 } face in a large number.But if tension force becomes too high, then on the rolling surface after final rolling, { 110 } face is reduced, therefore, as long as adjust the scope of tension force in the mode of value in above-mentioned scope of I { 110 }/I { 112 }.In addition, tension value changes according to the amount of final recrystallization annealing temperature and above-mentioned Addition ofelements, therefore, as long as according to the amount adjustment tension value of final recrystallization annealing temperature and above-mentioned Addition ofelements.Should illustrate, so-called tension force points to carry out when loading copper bar material in the atmosphere of final recrystallization annealing, final tension force between the inlet side of recrystallization annealing atmosphere and each roller of outlet side.The desired value (absolute value) of tension force with annealing temperature and copper bar material composition and change, therefore, preferably the nondimensional value that tension force obtains divided by the endurance of the material under annealing temperature is managed.
Should illustrate, in the past in order to prevent the objects such as the deterioration of conveying roller, the value of the tension force in continuous annealing furnace was set in the scope of 0.1 ~ 0.15 usually.
Fig. 1 represent on the rolling surface of Copper Foil, increase { 112 } face, an example being put on the tension force of Copper Foil by final recrystallization annealing adjustment.As mentioned above, if improve tension force, then on rolling surface, { 112 } face becomes many, if but the amount of Addition ofelements (above-mentioned Ag etc.) increases, then on rolling surface, { 110 } face becomes many, if therefore do not apply higher tension force, then on rolling surface, the ratio in { 112 } face can not increase.Therefore, the region surrounded by two lines of Fig. 1 becomes preferred scope.
Preferably rolled copper foil after 30 minutes, in rolling surface, is met I { 112 }/I { 100 }≤1.0 200 DEG C of heating.200 DEG C of heating 30 minutes, be simulate the heating condition with Copper Foil during so-called teeming practice manufacture FPC.And if by this heating, Copper Foil is the state of fully carrying out recrystallize and not residual recrystallize region, then I { 112 }≤1.0.When I { 112 }/I { 100 } > 1.0, residual non-recrystallization sometimes, the bendability of FPC is deteriorated.
After rolled copper foil was heated for 1 second at 350 DEG C, preferably meet 5.0≤I { 200 }/I
0{ 200 }≤27.0.If { 001 } < 100 > orientation (Cube orientation) is flourishing after recrystallize, then obtain good bendability, therefore I { 200 }/I
0{ 200 } more high better.If 5.0 > I { 200 }/I
0{ 200 }, then bendability reduces sometimes.Especially, more preferably 13.0≤I { 200 }/I
0{ 200 }≤27.0.Should illustrate, with the balance of other characteristic, I { 200 }/I be realized
0{ 200 } > 27.0 is industrially difficult, so the upper limit is set as 27.0.
Embodiment
The manufacture > of < rolled copper foil
With the addition of the tough pitch copper of the element of composition shown in table 1 or oxygen free copper for raw material, the ingot casting of cast thickness 100mm, carries out hot rolling under the condition more than 800 DEG C until thickness 10mm, and the oxide skin of effects on surface carries out building up by welding.After this, repeatedly carry out cold rolling and annealing and obtain the milled sheet coil of 0.5mm thickness.Its last cold rolling after, this copper bar material by continuous annealing furnace under the tension force shown in table 1, is carried out final recrystallization annealing at 700 DEG C.Should illustrate, tension value is to carry out standardized ({ tension force (N/mm divided by the endurance of this sample at recrystallization annealing temperature
2endurance (N/mm at)/recrystallization annealing temperature
2).In addition, the heat-up time of the copper bar material in recrystallization annealing was set as 100 ~ 200 seconds.Finally be refined to the thickness that table 1 is recorded in finally cold rolling.Rolling degree of finish in finally cold rolling is set as 86 ~ 99%.
Should illustrate, " Agl90ppmOFC " on composition one hurdle of table 1 is meant at JIS-H3510(C1011) the oxygen free copper OFC of (embodiment 10) or JIS-H3100(C1020) (beyond embodiment 10)) in the addition of the Ag of 190 quality ppm.In addition, " Ag190ppmTPC " is meant at JIS-H3100(C1100) tough pitch copper (TPC) in the addition of the Ag of 190 quality ppm.For other addition situation too.
< crystalline orientation >
For the surface (rolling surface) of the Copper Foil after finally cold rolling, use X-ray diffraction device (RINT-2500: motor system of science), carry out { 200 }, { 220 } respectively, the positive limit in { 111 } face measures (X ray reflection average intensity).According to the measurement result obtained, use StandardODF(Co., Ltd. standard engineering system) be converted to inverse limit, calculate the calculating X-ray diffraction intensity in { 110 } face and { 112 } face.
The condition determination of X-ray diffraction is set as: incident X-rays source: Cu, acceleration voltage: 30kV, tube current: 100mA, divergent slit: 0.5 degree, scatter slit: 4mm, by optical slits: 4mm, disperses vertical restriction slit: 1.2mm.In addition, be used in the value (X ray reflection average intensity) of each face having been carried out under identical conditions to the fine copper powder of X-ray diffraction, after the aggregation degree stdn in { 200 }, { 220 }, { 111 } face, be converted to inverse limit.Fine copper powder uses micro mist copper (325 order).
< crystallization particle diameter >
With the process of chopping of JIS-H0501 for standard, rolling surface to be measured after final recrystallization annealing at once to the crystallization particle diameter of the Copper Foil of (finally cold rolling before).
＜I｛200｝／I
0｛200｝＞
After Copper Foil after finally cold rolling is carried out annealing in 0.5 hour at 200 DEG C respectively and after carrying out annealing in 1 second at 350 DEG C, to the X-ray diffraction intensity in its surface measurements { 200 } face.And, carry out the value (I of the fine copper powder of X-ray diffraction under being used in identical conditions
0{ 200 }: X ray reflection average intensity) stdn is carried out.
The condition determination of X-ray diffraction is set as: incident X-rays source: Cu, acceleration voltage: 25kV, tube current: 20mA, divergent slit: 1 degree, scatter slit: 1 degree, by optical slits: 0.3mm, disperses vertical restriction slit: 10mm, monochromatic by optical slits 0.8mm.Fine copper powder employs micro mist copper (325 order).
< bendability >
First, coating thermoplastic polyimide adhesive make it dry on the Thermocurable polyimide film of thickness 12.5 μm.Then, the two sides of this film respectively stacked finally cold rolling after Copper Foil, then carry out thermo-compressed and make two-sided CCL.For this two-sided CCL, after two-sided Copper Foil is respectively the circuit pattern of 100 μm/100 μm by the width in etching formation pipeline/space, the overlay film of coating thickness 25 μm, is processed into FPC.
Slip pliability test is carried out for this FPC and evaluates its bendability.Specifically, use sliding test machine (application Ji Yan Industry Co., Ltd system, TK-107 type), slip radius r (mm) is set as r=4mm in embodiment 9, in other embodiment and comparative example, be set as r=0.72mm, under any circumstance all with sliding velocity 120 beats/min, FPC bent.
Compared with before test, the number of bends when resistance of the circuit of Copper Foil increases by 10% is evaluated as x less than 150,000 times, by 100,000 times ~ be evaluated as Δ less than 150,000 times, by 150,000 times ~ 300,000 times be evaluated as zero, ◎ will be evaluated as more than 300,000 times.As long as bendability is ◎ ~ Δ, be just called that bendability is good.
< etches >
Above-mentioned two-sided CCL dipping in the etching solution (the 20 quality % solution of the ProductName of ADEKA society: TechCL-8) of the liquid temperature stirred 30 DEG C is etched, with optics microscope photographing etching face for 1 minute.
In above-mentioned image, dark portion represents the uniform region of etching, and etching compares captured image and benchmark image to evaluate.Fig. 3 represents the correspondence of the evaluation of benchmark image and etching.The area occupation ratio of dark portion is higher, then etching is better, and ◎ is that etching is best.As long as etching is ◎ ~ Δ, etching just can be described as well.
Table 1, table 2 represent the result obtained.
Table 1
Table 2
As can be seen from table 1, table 2, when meeting each embodiment of 2.5≤I { 110 }/I { 112 }≤6.0, the etching of rolled copper foil and bendability are all excellent.
Should illustrate, if compare thickness and the identical embodiment 1,2 of final recrystallization annealing condition, can find out, a side of the embodiment 1 that the addition of Ag is many, (110) orientation becomes many, and the value of I { 110 }/I { 112 } also uprises.In addition, at 13.0 > I { 200 }/I
0{ 200 } embodiment 20 ~ 23 when, compared with other embodiment, bendability reduces a little, but practical no problem.
On the other hand, compared with the embodiment 6 identical with the composition of Copper Foil, the situation of the comparative example 1,4 of tension force when reducing final recrystallization annealing, (112) orientation tails off, and the value of I { 110 }/I { 112 } is more than 6.0, and etching is deteriorated.
Compared with the embodiment 5 identical with the composition of Copper Foil, the situation of the comparative example 3 of tension force when improve final recrystallization annealing compared with the situation of the comparative example 2 of tension force when improve final recrystallization annealing and the embodiment 7 identical with the composition of Copper Foil, (110) orientation all reduces, the value of I { 110 }/I { 112 } is less than 2.5, and bendability is deteriorated.
The situation of the embodiment 1,6 that manufacture method is identical, side's bendability of the embodiment 1 that the oxygen concn of Copper Foil is low is excellent.
Should illustrate, Fig. 2 (a) and (b) are optical microphotograph mirror images of etching face of each embodiment 5, comparative example 1.The situation of the embodiment 5 of known etching excellence, the ratio of dark portion is many.
Claims (6)
1. a rolled copper foil, its in quality ratio containing more than 99.9% copper, wherein,
By rolling surface from the calculating X-ray diffraction intensity in 112} face is set to I{112}, and by from when the calculating X-ray diffraction intensity in 110} face is set to I{110}, meet
2.5≤I{110}/I{112}≤6.0。
2. rolled copper foil as claimed in claim 1, wherein, containing total 10 ~ 300 quality ppm be selected from the group of Ag, Sn, Mg, In, B, Ti, Zr and Au one or more, remainder by Cu and inevitably impurity form.
3. rolled copper foil as claimed in claim 1 or 2, wherein, the oxygen containing 2 ~ 50 quality ppm.
4. rolled copper foil as claimed in claim 1 or 2, wherein, after carrying out the heating of 30 minutes, in rolling surface, meets I{112}≤1.0 at 200 DEG C.
5. rolled copper foil as claimed in claim 1 or 2, wherein, after 350 DEG C of 1 seconds of heating, by the rolling surface of described rolled copper foil the X-ray diffraction intensity in 200} face be set to I{200}, by fine copper powdered sample { X-ray diffraction intensity in 200} face is set to I
0{ during 200}, meet
5.0≤I{200}/I
0{200}≤27.0。
6. rolled copper foil as claimed in claim 1 or 2, wherein, the thickness of described rolled copper foil is 4 ~ 70 μm.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012042550 | 2012-02-28 | ||
| JP2012-042550 | 2012-02-28 | ||
| JP2012059811 | 2012-03-16 | ||
| JP2012-059811 | 2012-03-16 | ||
| JP2013033386A JP5657043B2 (en) | 2012-02-28 | 2013-02-22 | Rolled copper foil |
| JP2013-033386 | 2013-02-22 |
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| CN103290345A CN103290345A (en) | 2013-09-11 |
| CN103290345B true CN103290345B (en) | 2015-07-01 |
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| JP2015028197A (en) * | 2013-07-30 | 2015-02-12 | 株式会社Ｓｈカッパープロダクツ | Roughened copper foil, copper-clad laminate sheet and printed wiring board |
| JP6393126B2 (en) * | 2013-10-04 | 2018-09-19 | Ｊｘ金属株式会社 | Surface-treated rolled copper foil, laminate, printed wiring board, electronic device, and printed wiring board manufacturing method |
| JP6497881B2 (en) * | 2013-10-04 | 2019-04-10 | Ｊｘ金属株式会社 | Rolled copper foil, copper-clad laminate using the same, printed wiring board, electronic equipment, circuit connecting member manufacturing method, and circuit connecting member |
| CN104511479B (en) * | 2013-10-04 | 2017-01-11 | Jx日矿日石金属株式会社 | Rolled copper foil |
| KR101721314B1 (en) * | 2015-05-21 | 2017-03-29 | 제이엑스금속주식회사 | Rolled copper foil, copper clad laminate, and flexible printed board and electronic device |
| CN106304689A (en) * | 2015-06-05 | 2017-01-04 | Jx日矿日石金属株式会社 | Rolled copper foil, copper-clad laminated board and flexible printed board and electronic equipment |
| JP6442020B1 (en) * | 2017-10-12 | 2018-12-19 | 福田金属箔粉工業株式会社 | Hard rolled copper foil and method for producing the hard rolled copper foil |
| CN111549254A (en) * | 2020-04-29 | 2020-08-18 | 铜陵有色金属集团股份有限公司金威铜业分公司 | Oxygen-free copper-based microalloy and preparation method and application thereof |
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| JP3856616B2 (en) * | 2000-03-06 | 2006-12-13 | 日鉱金属株式会社 | Rolled copper foil and method for producing the same |
| JP5263525B2 (en) * | 2006-06-23 | 2013-08-14 | 日本碍子株式会社 | Method for producing copper-based rolled alloy |
| JP4285526B2 (en) * | 2006-10-26 | 2009-06-24 | 日立電線株式会社 | Rolled copper foil and method for producing the same |
| JP4716520B2 (en) * | 2007-03-30 | 2011-07-06 | Ｊｘ日鉱日石金属株式会社 | Rolled copper foil |
| JP5245813B2 (en) * | 2008-12-25 | 2013-07-24 | 日立電線株式会社 | Rolled copper foil |
| JP4992940B2 (en) * | 2009-06-22 | 2012-08-08 | 日立電線株式会社 | Rolled copper foil |
| JP5094834B2 (en) * | 2009-12-28 | 2012-12-12 | Ｊｘ日鉱日石金属株式会社 | Copper foil manufacturing method, copper foil and copper clad laminate |
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| CN103290345A (en) | 2013-09-11 |
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