CN103268056A - Flexible mask plate and making method thereof - Google Patents
Flexible mask plate and making method thereof Download PDFInfo
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- CN103268056A CN103268056A CN2013101699057A CN201310169905A CN103268056A CN 103268056 A CN103268056 A CN 103268056A CN 2013101699057 A CN2013101699057 A CN 2013101699057A CN 201310169905 A CN201310169905 A CN 201310169905A CN 103268056 A CN103268056 A CN 103268056A
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Abstract
The invention discloses a flexible mask plate. The flexible mask plate comprises a flexible substrate, and a bonding layer, a metal pattern structure layer and a flexible encapsulation layer are sequentially arranged on the flexible substrate; the flexible substrate is made of a transparent flexible material; the material of the flexible substrate is polycarbonate or polydimethylsiloxane; the material of the bonding layer is an epoxy resin adhesive; the material of the metal pattern structure layer is aluminum or copper; and the material of the flexible encapsulation layer is polydimethylsiloxane. The invention provides the flexible mask plate and a making method thereof. The flexible mask plate can photo-etch a curved surface substrate and can be naturally adsorbed to the substrate to realize close contact without a traditional vacuum-pumping treatment, so the flexible mask plate is suitable for the large-area substrate photo-etching.
Description
[technical field]
The invention belongs to electronic product and micro-nano manufacturing technology field, particularly a kind of flexible mask plate and preparation method thereof.
[background technology]
At present, optical lithography techniques has obtained using widely in field of microelectronic fabrication.The mask plate that optical lithography adopts normally glass substrate adds what crome metal coating constituted, because glass substrate hardness is big, shortage is flexible, thereby optical lithography techniques can only be applicable to the lithography process of planar substrates, can't carry out lithography process to the curved surface substrate.In order to guarantee the tight contact of hard mask plate isoplanar substrate, also need hard mask plate and planar substrates are vacuumized processing, so photoetching technique also is unwell to the lithography process of carrying out large-area substrates in addition.
[summary of the invention]
The object of the present invention is to provide a kind of flexible mask plate and preparation method thereof, to solve the problems of the technologies described above; Its substrate adopts transparent flexible material, utilizes bonding or shifting process that patterned structured metal layer is fixed on the flexible base, board then, thereby forms flexible mask plate.
To achieve these goals, the present invention takes following technical scheme:
A kind of flexible mask plate comprises flexible base, board, and the flexible base, board top is provided with tack coat, metal pattern configuration layer and flexible package layer successively.
The present invention further improves and is: be provided with one deck medium layer between described metal pattern configuration layer and the flexible package layer.
The present invention further improves and is: flexible base, board adopts transparent flexible material to make.
The present invention further improves and is: the material of flexible base, board is polycarbonate or dimethyl silicone polymer; The material of tack coat is epoxyn; The material of metal pattern configuration layer is aluminium or copper; The material of flexible package layer is dimethyl silicone polymer.
The present invention further improves and is: the material of medium layer is polymethylmethacrylate.
The preparation method of flexible mask plate may further comprise the steps:
(1) adopts centrifugal shop glue, glue spraying or method for printing screen that the photoresist material of liquid state is coated on the silicon dioxide insulating layer surface at the bottom of the silicon wafer-based, and on the silicon dioxide insulating layer surface, evenly distribute;
(2) adopt photoetching or imprint process, the suprabasil photoresist of silicon chip is graphically processed, form the photoresist graphic structure;
(3) adopt the physical vapor deposition method, deposit layer of metal material on the photoresist graphic structure adopts then and peels off method stripping photoresist graphic structure, and the silicon dioxide insulating layer surface at the bottom of silicon wafer-based forms the metal pattern configuration layer;
(4) adopt centrifugal shop glue, glue spraying or method for printing screen that bonding layer material evenly is coated on the metal pattern configuration layer, form tack coat at the metal pattern configuration layer;
(5) flexible base, board is covered on the tack coat, remove silicon dioxide layer then, thereby obtain having the flexible base, board of metal pattern configuration layer;
(6) cover the flexible package layer at the metal pattern configuration layer, finish the making of flexible mask plate.
The present invention further improves and is: remove silicon dioxide insulating layer by wet etching in the step.
The preparation method of flexible mask plate may further comprise the steps:
(1) adopts centrifugal shop glue, glue spraying or method for printing screen that the photoresist material of liquid state is coated on the silicon dioxide insulating layer surface at the bottom of the silicon wafer-based, and on the silicon dioxide insulating layer surface, evenly distribute;
(2) adopt photoetching or imprint process, the suprabasil photoresist of silicon chip is graphically processed, form the photoresist graphic structure;
(3) adopt the physical vapor deposition method, deposit layer of metal material on the photoresist graphic structure adopts then and peels off method stripping photoresist graphic structure, and the silica surface at the bottom of silicon wafer-based forms the metal pattern configuration layer;
(4) adopt centrifugal shop glue, glue spraying or method for printing screen that the medium layer material evenly is coated to the suprabasil metal pattern configuration laminar surface of silicon chip, form the medium layer of clad metal structure;
(5) adopt centrifugal shop glue, glue spraying or method for printing screen that bonding layer material evenly is coated on the flexible base, board, form tack coat at flexible base, board;
(6) remove the suprabasil silicon dioxide insulating layer of silicon chip, thereby obtain the medium layer of clad metal graphic structure layer;
(7) medium layer is transferred on the flexible base, board that has tack coat, the metal pattern configuration layer is bonded on the tack coat;
(8) last, cover the flexible package layer in medium layer, finish the making of flexible mask plate.
The present invention further improves and is: remove silicon dioxide insulating layer by wet etching in the step (6).
With respect to prior art, the present invention has following beneficial effect: the invention provides a kind of flexible mask plate and preparation method thereof, this flexibility mask plate can carry out lithography process to the curved surface substrate, and it can be adsorbed onto closely contact of realization in the substrate naturally, do not need to carry out traditional processing that vacuumizes, this makes flexible mask plate of the present invention be suitable for carrying out the lithography process of large-area substrates.
[description of drawings]
Fig. 1 is the structural stratification synoptic diagram of flexible mask plate shown in the embodiment 1 (four-layer structure);
Fig. 2 is the structural stratification synoptic diagram of flexible mask plate shown in the embodiment 2 (five-layer structure);
Wherein, 1 be flexible base, board (as commercially available polycarbonate, PC or dimethyl silicone polymer, PDMS), 2 is tack coat (as commercially available epoxyn), 3 be structured metal layer (as aluminium or copper, Al, Cu), 4 is that the flexible package layer is (as commercially available dimethyl silicone polymer, PDMS), 5 is that medium layer is (as commercially available polymethylmethacrylate, PMMA).
[embodiment]
See also shown in Figure 1ly, the flexible mask plate of the present invention comprises flexible base, board 1, is provided with tack coat 2, metal pattern configuration layer 3 and flexible package layer 4 above flexible base, board 1 successively.Flexible base, board 1 is that transparent flexible material constitutes, and can select polycarbonate (PC) or dimethyl silicone polymer (PDMS) for use; Tack coat 2 is selected epoxyn for use; Metal pattern configuration layer 3 aluminium or copper; Flexible package layer 4 is selected dimethyl silicone polymer for use.
The preparation method of the flexible mask plate of this four-layer structure comprises the following steps:
(1) adopts centrifugal shop glue, glue spraying or method for printing screen that the photoresist material (as commercially available AZ1500) of liquid state is coated on the silicon dioxide insulating layer surface at the bottom of the silicon wafer-based, and on the silicon dioxide insulating layer surface, evenly distribute;
(2) adopt photoetching or imprint process, suprabasil photoresist is graphically processed, form the photoresist graphic structure;
(3) adopt physical vapor deposition PVD equipment and technology, deposit layer of metal material on the photoresist graphic structure (as aluminium or copper, Al, Cu), adopt then and peel off method stripping photoresist graphic structure, the silicon dioxide insulating layer surface at the bottom of silicon wafer-based forms metal pattern configuration layer 3;
(4) adopt centrifugal shop glue, glue spraying or method for printing screen that bonding layer material (as commercially available epoxyn) evenly is coated on the metal pattern configuration layer 3, form tack coat 2 at metal pattern configuration layer 3;
(5) (as commercially available polycarbonate, PC or dimethyl silicone polymer PDMS) cover on the tack coat 2, and wet etching is removed silicon dioxide insulating layer then, thereby obtain having the flexible base, board 1 of metal pattern configuration layer 3 with flexible base, board 1;
(6) cover flexible package layer 4 at metal pattern configuration layer 3 and (as commercially available dimethyl silicone polymer, PDMS), finish the making of flexible mask plate.
See also shown in Figure 1ly, the flexible mask plate of the present invention comprises flexible base, board 1, is provided with tack coat 2, structured metal layer 3, medium layer 5 and flexible package layer 4 above flexible base, board 1 successively.Flexible base, board 1 is that transparent flexible material constitutes, and can select polycarbonate (PC) or dimethyl silicone polymer (PDMS) for use; Tack coat 2 is selected epoxyn for use; Metal pattern configuration layer 3 aluminium or copper; Flexible package layer 4 is selected dimethyl silicone polymer for use; Medium layer 5 is selected polymethylmethacrylate for use.
The preparation method of the flexible mask plate of this five-layer structure comprises the following steps:
(1) adopts centrifugal shop glue, glue spraying or method for printing screen that the photoresist material (as commercially available AZ1500) of liquid state is coated on the silicon dioxide insulating layer surface at the bottom of the silicon wafer-based, and on the silicon dioxide insulating layer surface, evenly distribute;
(2) adopt photoetching or imprint process, suprabasil photoresist is graphically processed, form the photoresist graphic structure;
(3) adopt physical vapor deposition PVD equipment and technology, deposit layer of metal material on the photoresist graphic structure (as aluminium or copper, Al, Cu), adopt then and peel off method stripping photoresist graphic structure, the silicon dioxide insulating layer surface at the bottom of silicon wafer-based forms metal pattern configuration layer 3;
(4) adopt centrifugal shop glue, glue spraying or method for printing screen that the medium layer material (as commercially available polymethylmethacrylate, PMMA) evenly is coated to suprabasil metal pattern configuration layer 3 surface, forms the medium layer 5 of clad metal structural sheet 3;
(5) adopt centrifugal shop glue, glue spraying or method for printing screen that bonding layer material (as commercially available epoxyn) evenly is coated to flexible base, board 1 (as commercially available polycarbonate, PC or dimethyl silicone polymer, PDMS) on, form tack coat 2 at flexible base, board 1;
(6) use wet etching, remove the suprabasil silicon dioxide insulating layer of silicon chip, thereby obtain the medium layer 5 of clad metal graphic structure layer 3;
(7) medium layer 5 is transferred on the flexible base, board 1 that has tack coat 2, metal pattern configuration layer 3 is bonded on the tack coat 2;
(8) last, cover flexible package layer 4 in medium layer 5 and (as commercially available dimethyl silicone polymer, PDMS), finish the making of flexible mask plate.
Claims (9)
1. a flexible mask plate is characterized in that, comprises flexible base, board (1), and flexible base, board (1) top is provided with tack coat (2), metal pattern configuration layer (3) and flexible package layer (4) successively.
2. flexible mask plate according to claim 1 is characterized in that, is provided with one deck medium layer (5) between described metal pattern configuration layer (3) and the flexible package layer (4).
3. flexible mask plate according to claim 1 and 2 is characterized in that, flexible base, board (1) adopts transparent flexible material to make.
4. flexible mask plate according to claim 3 is characterized in that, the material of flexible base, board (1) is polycarbonate or dimethyl silicone polymer; The material of tack coat (2) is epoxyn; The material of metal pattern configuration layer (3) is aluminium or copper; The material of flexible package layer (4) is dimethyl silicone polymer.
5. flexible mask plate according to claim 2 is characterized in that, the material of medium layer (5) is polymethylmethacrylate.
6. the preparation method of claim 1,3 or 4 described flexible mask plates is characterized in that, may further comprise the steps:
(1) adopts centrifugal shop glue, glue spraying or method for printing screen that the photoresist material of liquid state is coated on the silicon dioxide insulating layer surface at the bottom of the silicon wafer-based, and on the silicon dioxide insulating layer surface, evenly distribute;
(2) adopt photoetching or imprint process, the suprabasil photoresist of silicon chip is graphically processed, form the photoresist graphic structure;
(3) adopt the physical vapor deposition method, deposit layer of metal material on the photoresist graphic structure adopts then and peels off method stripping photoresist graphic structure, and the silicon dioxide insulating layer surface at the bottom of silicon wafer-based forms metal pattern configuration layer (3);
(4) adopt centrifugal shop glue, glue spraying or method for printing screen that bonding layer material evenly is coated on the metal pattern configuration layer (3), form tack coat (2) at metal pattern configuration layer (3);
(5) flexible base, board (1) is covered on the tack coat (2), remove silicon dioxide layer then, thereby obtain having the flexible base, board (1) of metal pattern configuration layer (3);
(6) cover flexible package layer (4) at metal pattern configuration layer (3), finish the making of flexible mask plate.
7. the described preparation method of claim 6 is characterized in that, removes silicon dioxide insulating layer by wet etching in the step (5).
8. the preparation method of claim 2 or 5 described flexible mask plates is characterized in that, may further comprise the steps:
(1) adopts centrifugal shop glue, glue spraying or method for printing screen that the photoresist material of liquid state is coated on the silicon dioxide insulating layer surface at the bottom of the silicon wafer-based, and on the silicon dioxide insulating layer surface, evenly distribute;
(2) adopt photoetching or imprint process, the suprabasil photoresist of silicon chip is graphically processed, form the photoresist graphic structure;
(3) adopt the physical vapor deposition method, deposit layer of metal material on the photoresist graphic structure adopts then and peels off method stripping photoresist graphic structure, and the silica surface at the bottom of silicon wafer-based forms metal pattern configuration layer (3);
(4) adopt centrifugal shop glue, glue spraying or method for printing screen that the medium layer material evenly is coated to the suprabasil metal pattern configuration layer of silicon chip (3) surface, form the medium layer (5) of clad metal structure;
(5) adopt centrifugal shop glue, glue spraying or method for printing screen that bonding layer material evenly is coated on the flexible base, board (1), form tack coat (2) at flexible base, board (1);
(6) remove the suprabasil silicon dioxide insulating layer of silicon chip, thereby obtain the medium layer (5) of clad metal graphic structure layer (3);
(7) medium layer (5) is transferred on the flexible base, board (1) that has tack coat (2), metal pattern configuration layer (3) is bonded on the tack coat (2);
(8) last, cover flexible package layer (4) in medium layer (5), finish the making of flexible mask plate.
9. the described preparation method of claim 8 is characterized in that, removes silicon dioxide insulating layer by wet etching in the step (6).
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| CN2013101699057A CN103268056A (en) | 2013-05-10 | 2013-05-10 | Flexible mask plate and making method thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104865791A (en) * | 2015-04-17 | 2015-08-26 | 京东方科技集团股份有限公司 | Preparation method of mask plate and mask plate |
| CN105259733A (en) * | 2015-10-30 | 2016-01-20 | 上海交通大学 | Preparation method for flexible mask plate used for patterning curved surface |
| CN105807557A (en) * | 2016-05-23 | 2016-07-27 | 中国科学院光电技术研究所 | High-resolution flexible composite mask plate used for optical exposure and preparation method therefor |
| CN106784196A (en) * | 2017-01-24 | 2017-05-31 | 安徽三安光电有限公司 | A kind of etching mask and the method that LED is made using the etching mask |
| CN107665816A (en) * | 2017-09-11 | 2018-02-06 | 中国科学院微电子研究所 | A kind of graph transfer method |
| CN108681207A (en) * | 2018-05-14 | 2018-10-19 | 华中科技大学 | A kind of curved surface photoetching process based on transparent flexible thin-film material |
| CN109202297A (en) * | 2018-08-01 | 2019-01-15 | 南京理工大学 | A kind of laser wet etch process suitable for arbitrary surface transparent dielectric material |
| CN109407462A (en) * | 2018-10-25 | 2019-03-01 | 宁波微迅新材料科技有限公司 | A kind of mask plate manufacture craft |
| CN110148761A (en) * | 2019-05-31 | 2019-08-20 | 苏州天际创新纳米技术有限公司 | The production method of fuel cell membrane electrode assembly |
| CN112346298A (en) * | 2019-08-06 | 2021-02-09 | 上海量子绘景电子股份有限公司 | Large-size imprinting mold and preparation method thereof |
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| CN102621624A (en) * | 2012-04-24 | 2012-08-01 | 丹阳博昱科技有限公司 | Light guide sheet including optical micro structure and making method |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104865791A (en) * | 2015-04-17 | 2015-08-26 | 京东方科技集团股份有限公司 | Preparation method of mask plate and mask plate |
| CN104865791B (en) * | 2015-04-17 | 2019-08-30 | 京东方科技集团股份有限公司 | The preparation method and mask plate of mask plate |
| CN105259733A (en) * | 2015-10-30 | 2016-01-20 | 上海交通大学 | Preparation method for flexible mask plate used for patterning curved surface |
| CN105807557A (en) * | 2016-05-23 | 2016-07-27 | 中国科学院光电技术研究所 | High-resolution flexible composite mask plate used for optical exposure and preparation method therefor |
| CN106784196A (en) * | 2017-01-24 | 2017-05-31 | 安徽三安光电有限公司 | A kind of etching mask and the method that LED is made using the etching mask |
| CN106784196B (en) * | 2017-01-24 | 2019-01-29 | 安徽三安光电有限公司 | A kind of etching mask and the method using etching mask production LED |
| CN107665816A (en) * | 2017-09-11 | 2018-02-06 | 中国科学院微电子研究所 | A kind of graph transfer method |
| CN108681207A (en) * | 2018-05-14 | 2018-10-19 | 华中科技大学 | A kind of curved surface photoetching process based on transparent flexible thin-film material |
| CN109202297A (en) * | 2018-08-01 | 2019-01-15 | 南京理工大学 | A kind of laser wet etch process suitable for arbitrary surface transparent dielectric material |
| CN109407462A (en) * | 2018-10-25 | 2019-03-01 | 宁波微迅新材料科技有限公司 | A kind of mask plate manufacture craft |
| CN110148761A (en) * | 2019-05-31 | 2019-08-20 | 苏州天际创新纳米技术有限公司 | The production method of fuel cell membrane electrode assembly |
| CN112346298A (en) * | 2019-08-06 | 2021-02-09 | 上海量子绘景电子股份有限公司 | Large-size imprinting mold and preparation method thereof |
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Application publication date: 20130828 |