CN103259499A - Method for designing rectangular AT cut type piezoelectric quartz crystal wafer reducing force frequency effect - Google Patents
Method for designing rectangular AT cut type piezoelectric quartz crystal wafer reducing force frequency effect Download PDFInfo
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- CN103259499A CN103259499A CN2013101827549A CN201310182754A CN103259499A CN 103259499 A CN103259499 A CN 103259499A CN 2013101827549 A CN2013101827549 A CN 2013101827549A CN 201310182754 A CN201310182754 A CN 201310182754A CN 103259499 A CN103259499 A CN 103259499A
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Abstract
The invention discloses a method for designing a rectangular AT cut type piezoelectric quartz crystal wafer reducing the force frequency effect. According to the method for designing the rectangular AT cut type piezoelectric quartz crystal wafer reducing the force frequency effect, when the AT cut type piezoelectric quartz crystal wafer is designed and manufactured, a needed dispensing fixation direction of the wafer of a quartz crystal component is made to be in the Z-axis direction of a coordinate system of a piezoelectric quartz crystal, so that the problem that a quartz crystal made of an existing rectangular AT cut type piezoelectric quartz crystal wafer is unstable in frequency due to a large force frequency effect is solved. The method for designing the rectangular AT cut type piezoelectric quartz crystal wafer reducing the force frequency effect has the advantages that in the process of manufacturing, test and use of the quartz crystal component made of the rectangular AT cut type piezoelectric quartz crystal wafer manufactured through the method, when changes such as a change of external stress happen to the quartz crystal component, stableness of the frequency can be ensured, result errors of repeating tests are kept in the system error range, frequency reliability of a product is guaranteed, and therefore the problem that the frequency shifts when changes such as the change of the external force happen to the quartz crystal made of the rectangular AT cut type piezoelectric quartz crystal wafer manufactured through traditional direction selection is solved. The method for designing the rectangular AT cut type piezoelectric quartz crystal wafer reducing the force frequency effect is not rigorous in technological requirements and easy to popularize.
Description
Technical field
What the present invention relates to is a kind of power of reduction rectangle AT cut type piezoelectric quartz chip design method of effect frequently, belongs to components and parts and makes the field.
Background technology
Some have the rectangle AT cut type piezoelectric quartz wafer of high reliability request to make the quartz crystal components and parts, for satisfying reliability requirement, need be at wafer two-end-point glue, and traditional rectangle AT cut type piezoelectric quartz wafer point glue direction is selected in the X-direction of piezoelectric quartz crystal crystal coordinates system, effect is bigger frequently because of power for the quartz crystal components and parts of making, when variations such as components and parts environment for use, the stress that wafer forms because glue point is fixing causes the bigger variation of components and parts frequency, therefore causes producing and the bad more appearance of components and parts of frequency when using.
Summary of the invention
What the present invention proposed is a kind of power of reduction rectangle AT cut type piezoelectric quartz chip design method of effect frequently, its objective is that changing wafer need put the fixing direction of glue, it is not influenced because of the stress that a glue forms to reduce quartz crystal components and parts frequency, improve the frequency stability of product, reduce the scrappage of product.
Technical solution of the present invention: a kind of power of reduction is the rectangle AT cut type piezoelectric quartz chip design method of effect frequently, when AT cut type piezoelectric quartz chip design is made, the wafer of quartz crystal components and parts need be put the Z-direction that the fixing direction of glue is selected in the piezoelectric quartz crystal coordinate system, improve frequency stability.
Advantage of the present invention: the rectangle AT cut type piezoelectric quartz wafer that the present invention makes, for the manufacture of the quartz crystal components and parts, in making, test and using, when the quartz crystal components and parts are subjected to external stress etc. and change, can guarantee frequency stabilization, repeatedly Ce Shi resultant error remains in the systematic error scope, guaranteed the natural frequency reliability of product, thus frequency drifting problem when the quartz crystal components and parts that solved the manufacturing of tradition rectangle AT cut type piezoelectric quartz wafer are changed by external stress etc.Technological requirement is not harsh, is easy to promote.
Description of drawings
Fig. 1 is piezoelectric quartz wafer point glue schematic diagram, and wafer point glue direction is the L direction.
Fig. 2 is rectangle AT cut type piezoelectric quartz wafer orientation schematic diagram, and wafer L direction is Z-direction.
Among the figure 1 is electrode, the 2nd, wafer W limit, the 3rd, wafer L limit, the 4th, pedestal, the 5th, glue point, the 6th, PAD, the 7th, wafer.
Embodiment
Point glue is fixed on the quartz crystal components and parts that the rectangle AT cut type piezoelectric quartz wafer of Z direction is made, and in use effect is little frequently can improve frequency stability because of power.The present invention need put the Z-direction that the fixing direction of glue is selected in piezoelectric quartz crystal crystal coordinates system with the wafer of quartz crystal components and parts when AT cut type piezoelectric quartz chip design is made, compare the wafer of present employing and need put the X-direction that the fixing direction of glue is selected in piezoelectric quartz crystal crystal coordinates system, the quartz crystal components and parts that efficiently solve rectangle AT cut type piezoelectric quartz wafer manufacturing in the past are because of the power frequency problem of unstable that causes greatly of effect frequently, the value that popularization is arranged that the like product frequency stability is improved.
During enforcement, the fixing size of design point glue when assembling according to rectangle AT cut type piezoelectric quartz wafer is chosen in the Z-direction that the piezoelectric quartz crystal crystal coordinates is with this size orientation when chip design and manufacturing.For avoiding rectangle AT cut type piezoelectric quartz wafer orientation mistake, need be before wafer length and width dimensioned, sign also confirms that wafer point glue fixed-direction is the Z-direction that is chosen in piezoelectric quartz crystal crystal coordinates system.In wafer manufacturing process, compare the traditional design wafer, processing technology does not need other adjustment.
Make rectangle AT cut type piezoelectric quartz wafer when being assembled into the quartz crystal components and parts, compare the traditional design wafer, using method is the same.
Claims (1)
1. one kind is reduced the power rectangle AT cut type piezoelectric quartz chip design method of effect frequently, it is characterized in that when AT cut type piezoelectric quartz chip design is made, the wafer of quartz crystal components and parts need being put the Z-direction that the fixing direction of glue is selected in the piezoelectric quartz crystal coordinate system, improve frequency stability.
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CN2013101827549A CN103259499A (en) | 2013-05-17 | 2013-05-17 | Method for designing rectangular AT cut type piezoelectric quartz crystal wafer reducing force frequency effect |
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CN2013101827549A CN103259499A (en) | 2013-05-17 | 2013-05-17 | Method for designing rectangular AT cut type piezoelectric quartz crystal wafer reducing force frequency effect |
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CN2013101827549A Pending CN103259499A (en) | 2013-05-17 | 2013-05-17 | Method for designing rectangular AT cut type piezoelectric quartz crystal wafer reducing force frequency effect |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1207620A2 (en) * | 2000-11-17 | 2002-05-22 | Piedek Technical Laboratory | Lame mode quartz crystal resonator |
CN201260152Y (en) * | 2008-09-08 | 2009-06-17 | 北京康特电子股份有限公司 | Drop impact resistant SMD quartz resonator |
CN201345640Y (en) * | 2008-11-20 | 2009-11-11 | 浙江东晶电子股份有限公司 | Wide-temperature SMD (surface mount technology) quartz-crystal resonator |
CN101986562A (en) * | 2010-11-03 | 2011-03-16 | 李斌 | Reed of quartz crystal resonator and processing method |
CN102082557A (en) * | 2010-11-29 | 2011-06-01 | 南京中电熊猫晶体科技有限公司 | Design method for performing multi-point adhesive dispensing on surface mount type quartz crystal resonator |
CN202261194U (en) * | 2011-09-29 | 2012-05-30 | 广东惠伦晶体科技股份有限公司 | Quartz crystal resonator having coating resins connected in overlapping manner |
-
2013
- 2013-05-17 CN CN2013101827549A patent/CN103259499A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1207620A2 (en) * | 2000-11-17 | 2002-05-22 | Piedek Technical Laboratory | Lame mode quartz crystal resonator |
CN201260152Y (en) * | 2008-09-08 | 2009-06-17 | 北京康特电子股份有限公司 | Drop impact resistant SMD quartz resonator |
CN201345640Y (en) * | 2008-11-20 | 2009-11-11 | 浙江东晶电子股份有限公司 | Wide-temperature SMD (surface mount technology) quartz-crystal resonator |
CN101986562A (en) * | 2010-11-03 | 2011-03-16 | 李斌 | Reed of quartz crystal resonator and processing method |
CN102082557A (en) * | 2010-11-29 | 2011-06-01 | 南京中电熊猫晶体科技有限公司 | Design method for performing multi-point adhesive dispensing on surface mount type quartz crystal resonator |
CN202261194U (en) * | 2011-09-29 | 2012-05-30 | 广东惠伦晶体科技股份有限公司 | Quartz crystal resonator having coating resins connected in overlapping manner |
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Application publication date: 20130821 |