CN102082557A - Design method for performing multi-point adhesive dispensing on surface mount type quartz crystal resonator - Google Patents

Design method for performing multi-point adhesive dispensing on surface mount type quartz crystal resonator Download PDF

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Publication number
CN102082557A
CN102082557A CN2010105631295A CN201010563129A CN102082557A CN 102082557 A CN102082557 A CN 102082557A CN 2010105631295 A CN2010105631295 A CN 2010105631295A CN 201010563129 A CN201010563129 A CN 201010563129A CN 102082557 A CN102082557 A CN 102082557A
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CN
China
Prior art keywords
quartz crystal
crystal wafer
supported
design method
quartz
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Pending
Application number
CN2010105631295A
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Chinese (zh)
Inventor
李坡
高志祥
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NANJING CHINA ELECTRONICS PANDA CRYSTAL TECHNOLOGY Corp
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NANJING CHINA ELECTRONICS PANDA CRYSTAL TECHNOLOGY Corp
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Application filed by NANJING CHINA ELECTRONICS PANDA CRYSTAL TECHNOLOGY Corp filed Critical NANJING CHINA ELECTRONICS PANDA CRYSTAL TECHNOLOGY Corp
Priority to CN2010105631295A priority Critical patent/CN102082557A/en
Publication of CN102082557A publication Critical patent/CN102082557A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a design method for performing multi-point adhesive dispensing on a surface mount type quartz crystal resonator. The design method is characterized in that: the two sides of a long side of a quartz crystal wafer are supported by a conductive adhesive [4], so that the conventional design that one side of the quartz crystal wafer is supported and the other side of the quartz crystal wafer is suspended is changed into the design that the two sides of the quartz crystal wafer are supported, and the vibration resistance of the product is improved. The design method has the advantage that: in the industries at present, the surface mount type quartz crystal resonators adopt the adhesive dispensing mode that one side of the quartz crystal wafer is supported by the conductive adhesive, and the other side of the quartz crystal wafer is suspended and does not have any supporting points, so that when the product is subjected to external strong vibration, one side, which is not supported, of the quartz crystal wafer touches a ceramic base easily to cause damage, and the product loses efficacy. In the design method, the other side of the quartz crystal wafer is supported by the conductive adhesive, so that the quartz crystal wafer is fixed, the possibility of the quartz crystal wafer touching the ceramic base is avoided, and the vibration resistance of the product is improved.

Description

The method for designing of surface attaching type quartz-crystal resonator multiple spot point glue
Technical field
What the present invention relates to is some glue method for designing in a kind of surface attaching type quartz-crystal resonator work flow, belongs to surface attaching type quartz crystal processing technique field.
Technical background
In some application of quartz-crystal resonator, the vibration resistance of relevant components and parts there is the higher requirement of ratio.For quartz-crystal resonator, the quartzy quartz plate of its inner core, because itself material and and the relation of base of ceramic assembling, easily in vibration, occur damaging in impacting, also become more and more important so improve the quartz-crystal resonator resistance to shock.Because the material characteristic of quartz water wafer itself can't change, improving the topmost task of quartz crystal resistance to shock so is exactly how to improve the reliability of the assembling of quartz water wafer and base of ceramic.And the present invention has solved this problem well by increasing the glue number of spots.
Summary of the invention
The present invention proposes a kind of method for designing of surface attaching type quartz-crystal resonator multiple spot point glue, is intended to solve because quartz water wafer and base of ceramic are fitted to each other the power deficiency cause resistance to shock can not satisfy some harsh application requirement.
Technical solution of the present invention: it is characterized in that all using conducting resinl to support in the both sides, long limit of quartz water wafer, make the quartz water wafer by conventional design while support, unsettled design changes into the design that both sides are supported, and greatly improved the resistance to shock of product.
Advantage of the present invention: the surface attaching type quartz-crystal resonator that is adopted in the present stage industry all adopts the some glue mode that supports with conducting resinl on one side of quartz water wafer, so just cause the quartz water wafer unsettled in addition on one side, without any the strong point, like this when product is subjected to outside judder, the not supported side of quartz water wafer easily touches base of ceramic and produces breakage, causes product failure.Advantage of the present invention is that increasing the point-supported mode of conducting resinl at the quartz wafer opposite side comes the quartz water wafer is fixed, and has avoided the quartz water wafer to touch the possibility of base of ceramic, has improved the resistance to shock of product.
Description of drawings
Accompanying drawing 1 is existing surface attaching type quartz-crystal resonator point glue schematic diagram.
Accompanying drawing 2 is surface attaching type quartz-crystal resonator point glue schematic diagrames of the present invention.
The 1st, base of ceramic, the 2nd, quartz water wafer, the 3rd, electrode, the 4th, conducting resinl.
Embodiment
Contrast accompanying drawing 2, its structure are all to use conducting resinl 4 to support in the both sides, long limit of quartz water wafer 2, while make quartz water wafer 2 by the supporting of conventional design, design that the both sides support is changed in unsettled design, have greatly improved the resistance to shock of product.

Claims (1)

1. the method for designing of surface attaching type quartz-crystal resonator multiple spot point glue, it is characterized in that all using conducting resinl [4] to support in the both sides, long limit of quartz water wafer [2], make quartz water wafer [2] by conventional design while support, unsettled design changes into the design that both sides are supported, and improves the resistance to shock of product.
CN2010105631295A 2010-11-29 2010-11-29 Design method for performing multi-point adhesive dispensing on surface mount type quartz crystal resonator Pending CN102082557A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010105631295A CN102082557A (en) 2010-11-29 2010-11-29 Design method for performing multi-point adhesive dispensing on surface mount type quartz crystal resonator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010105631295A CN102082557A (en) 2010-11-29 2010-11-29 Design method for performing multi-point adhesive dispensing on surface mount type quartz crystal resonator

Publications (1)

Publication Number Publication Date
CN102082557A true CN102082557A (en) 2011-06-01

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CN2010105631295A Pending CN102082557A (en) 2010-11-29 2010-11-29 Design method for performing multi-point adhesive dispensing on surface mount type quartz crystal resonator

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103259499A (en) * 2013-05-17 2013-08-21 廊坊中电熊猫晶体科技有限公司 Method for designing rectangular AT cut type piezoelectric quartz crystal wafer reducing force frequency effect
CN105811916A (en) * 2016-05-06 2016-07-27 唐山国芯晶源电子有限公司 Vibration-proof quartz crystal oscillator and processing method thereof
CN116809348A (en) * 2023-06-28 2023-09-29 鸿星科技(集团)股份有限公司 Dispensing method for suspending crystal oscillator wafer and quartz crystal oscillator

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201260152Y (en) * 2008-09-08 2009-06-17 北京康特电子股份有限公司 Drop impact resistant SMD quartz resonator
CN201601659U (en) * 2010-01-26 2010-10-06 台晶(宁波)电子有限公司 On-vehicle special glass encapsulated ceramic quartz crystal resonator
CN201608693U (en) * 2010-01-26 2010-10-13 台晶(宁波)电子有限公司 Special glass packaging ceramic quartz crystal resonator for novel vehicle

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201260152Y (en) * 2008-09-08 2009-06-17 北京康特电子股份有限公司 Drop impact resistant SMD quartz resonator
CN201601659U (en) * 2010-01-26 2010-10-06 台晶(宁波)电子有限公司 On-vehicle special glass encapsulated ceramic quartz crystal resonator
CN201608693U (en) * 2010-01-26 2010-10-13 台晶(宁波)电子有限公司 Special glass packaging ceramic quartz crystal resonator for novel vehicle

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103259499A (en) * 2013-05-17 2013-08-21 廊坊中电熊猫晶体科技有限公司 Method for designing rectangular AT cut type piezoelectric quartz crystal wafer reducing force frequency effect
CN105811916A (en) * 2016-05-06 2016-07-27 唐山国芯晶源电子有限公司 Vibration-proof quartz crystal oscillator and processing method thereof
CN105811916B (en) * 2016-05-06 2018-12-21 唐山国芯晶源电子有限公司 Antivibration quartz oscillator and its processing method
CN116809348A (en) * 2023-06-28 2023-09-29 鸿星科技(集团)股份有限公司 Dispensing method for suspending crystal oscillator wafer and quartz crystal oscillator

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