CN103238076B - Test pin assembly with electrostatic discharge (ESD) protection - Google Patents
Test pin assembly with electrostatic discharge (ESD) protection Download PDFInfo
- Publication number
- CN103238076B CN103238076B CN201180049144.0A CN201180049144A CN103238076B CN 103238076 B CN103238076 B CN 103238076B CN 201180049144 A CN201180049144 A CN 201180049144A CN 103238076 B CN103238076 B CN 103238076B
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- China
- Prior art keywords
- socket
- elastic component
- test
- testing needle
- conductive pin
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/36—Overload-protection arrangements or circuits for electric measuring instruments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
A test pin assembly with electrostatic discharge (ESD) protection comprising a tubular barrel which includes a crimp (14) separating said barrel into a first portion (11a) and a second portion (11b), a first resilient means (15) contained within said first portion (11a), a second resilient means (18) contained within said second portion (11b), a conductive plunger (13) inserted into said first portion (11a), a conductive insert (17) inserted into said second portion (11b), and a static dissipative receptacle (19) with a pointed tip (19a) facing outward and a cavity section (19b) facing inward, wherein said cavity section is filled with static dissipative material (19b) and attached to the tip end (17b) thereby forming a gap (20) between said receptacle (19) and plunger (13) to compel static charge flow through the static dissipative material (19b) first prior to closing of the gap (20); when said resilient means (15, 18) are unstressed for slowing down the transfer of static charge at the moment said receptacle (19) touches a test point of a device to be tested to minimize the creation of microspark.
Description
Technical field
The present invention relates to testing needle array, more particularly, relate to a kind of testing needle array that can eliminate or reduce electrostatic charge.
Background technology
At modern microelectronics technology, the importance that static discharge (electrostatic discharge, ESD) is controlled has been well-known, and therefore obtains all microchip fabricators' first concern.Most concern concentrates on eliminates the manufacture of static discharge sensitive element and the static discharge in processing procedure.Thereby human body, equipment and raw material all need ground connection release suitably may be trapped in the harmful electrostatic charge on each human body, equipment and raw material.
In modern tester machine, usually can find that increasing ion generator is designed for eliminating ESD and threatens.In microchip test point, one or several ion generator be conventionally arranged on strategic critical positions with in and before test, hide and pick up and round region (pick-up shuttle) neutralization is trapped in the electrostatic charge in microchip main body.
Although conventionally use such ionization technique in esd protection, then still face many defects in typical semiconductor fabrication environment.
First, in large-scale application, use ionization technique to need very high input.Not only need to spend the ion generator that substantial contribution is bought dependable performance, also need the very high expense of cost making regular check on, aspect period regulation, maintenance (particularly after the guarantee period) and other stealthy expense such as cost keepings, human resources and production space provide.
The second, also there is following performance deficiency in the ion generator that the test point of use test instrument machine (Test Handler) is installed around.
A) in the tester machine of modern high speed high-throughput, in ion and needed overlong time.Due to the nitrogen (N existing in air
2) and water vapor (H
2o), the amino-compound that is deposited on the needle point of ion generator inevitably gathers, and makes the static fall time of ion generator along with significantly decline service time.If needle point loses acutance, generator of aeroion will lose effect.Therefore, in the tester machine design of highly compact today, the needle point in regularly clean tester machine is the devil and bothers to maintain the unfailing performance of ion generator.
B) production and application of ion generator needs the technical ability of certain level, such as on the good understanding of air currents characteristic, location ion generator, reorientation in maintenance after ion generator and along the impact of the conductive material of the flow path of ionized air etc.These will directly affect the performance of ion generator.In fact, need investment training to there is the technician of good technical ability and practical knowledge or slip-stick artist effectively to operate generator of aeroion.
PCT application PCT/MY2009/00072 provide the microchip guard method of not using ion generator.
Yet there is following defect in this technical scheme in a lot of realistic situations.
The mar proof of commercially available static dissipative material (being actually nonmetal) is obviously lower than metal on the market.Therefore compare with original metallic test syringe needle, this static dissipative material can not be kept out a large amount of repeated test circulations.
For the design of small-sized DCO detailed checkout pin, also Existential Space defect in machine-building.Test macro unit makes this problem become most important towards less meticulousr trend toward miniaturization.
Therefore, require further study with development to overcome or to eliminate the above-mentioned defect of prior art.
Summary of the invention
Known in technical literature in electronic industry and practice, in microchip processing procedure, should avoid metal to contact to prevent from generating the low baking temperature flower (microspark) that can damage the modern responsive microchip of a lot of height with metal surface.The present invention is contrary with this practice and at microchip test operation, obtained the contact of comparatively safe metal-metal surprisingly, thereby and this metal-metal contact reduced the magnitude of electric current and the threat that peak value has greatly reduced the potential and bust of the responsive microchip of high ESD-.
The present invention is comprised of the testing needle of unique design, and the residual electrostatic charge that the testing needle of described unique design allows to be trapped on microchip is discharged to ground safely.This can be by greatly subduing the length of low baking temperature flower or eliminating and spend to realize from Electrostatic Discharge low baking temperature.
The needle body that this testing needle is designed to described contact pin top (plunger tip) and testing needle by static dissipative material medium, separate with " (slow down) slows down " electrostatic induced current (electrostatic charge) thus migration minimize the generation of low baking temperature flower.
Contact pin top is in conjunction with " resilience (spring back) ", and this feature allows in the higher strength test that does not affect original durability and the shelf life of testing needle.
This low baking temperature flower minimizing technology can be in the situation that partly do not make any change to the original surface in contact on the contact pin top of testing needle and realize.The initial surface contact design that retains contact pin top can guarantee that testing needle can maintain on its top identical compound substance to obtain the test loop of same number and the durability of identical shelf life of original testing needle.Specific characteristic of the present invention and design not only contribute to minimize the damage impact of esd event, also effectively reduce the quantity of this electrostatic discharge event or have eliminated electrostatic discharge event.
The change that another specific characteristic of the present invention is testing needle does not need to amplify or thereby change testing needle size can be utilized existing design space and minimize change expense.
The present invention is used as grounding apparatus in any production, manufacture or other microchip test activity processes, to adopt, subdues or eliminates Electrostatic Discharge electric spark and discharge safely electrostatic charge.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 a is the sectional view of one-sided (signal sided) of the present invention testing needle;
Fig. 1 b is the sectional view of the symmetrical testing needle of bilateral of the present invention (doublel sided);
Fig. 2 is the sectional view having around the modified contact pin top of the outside wind spring of contact pin needle body;
Fig. 3 is the sectional view on modified contact pin top with the inside wind spring of the inside that is positioned at contact pin needle body;
Fig. 4 is the sectional view of another design version without the contact pin of wind spring;
Fig. 5 is that the test without wind spring refers to the sectional view designing.
Embodiment
In following detailed description, set forth many specific details of the present invention the understanding to complete side of the present invention is provided.Yet it will be understood by a person skilled in the art that the present invention can implement in the situation that not possessing these details.In other examples, do not describe some well-known methods, step and/or parts in detail, in order to avoid fuzzy theme of the present invention.Can, in detail with reference to preferential embodiment of the present invention, wherein show by reference to the accompanying drawings example of the present invention now.
Fig. 1 a shows the testing needle assembly 10 with Electrostatic Discharge protection according to a preferred embodiment of the invention.This testing needle assembly 100 comprises socket (tubular barrel) 11 and conductive pin 13.This socket 11 has the pressure pleat 14 that described socket 11 is divided into two parts (being the 11a of first and second portion 11b) in its approximate mid-section, every one end of said socket 11 has limit 12a, the 12b of narrow diameter.Described conductive pin 13 has the top 13a of the opposite end that is positioned at described conductive pin 13 and amplifies cardinal extremity 13b.When described the first spring element 15 is not when stressed, described conductive pin 13 is setovered by the inner edge of the 11a of first of the relatively described socket 11 of the first spring element 15.Described the first spring element 15 is included in the 11a of first, and its one end rests on a surface of pressing pleat 14, and its other end is positioned on the amplification cardinal extremity 13b of described conductive pin 13.Described conductive pin 13 comprises the passage 16 along its whole length.
Conduction insertion section 17 has the extension body 17a of the opposite end that is positioned at conduction insertion section 17 and amplifies cardinal extremity 17c.This extension body 17a has top 17b.This conduction insertion section 17 is amplified cardinal extremity 17c from described second portion 11b with it and is inserted.This amplifies cardinal extremity 17c surface biasing towards the opposite side of pressure pleat 14 with the second spring element 18.When described the second spring element 18 is not when stressed, described the second spring element 18 is included in second portion 11b, and it is upper that its one end rests in the inner edge 12b of second portion 11b of described socket 11, and the other end rests on the amplification cardinal extremity 17c of this conduction insertion section 17.Extension body 17a is by the passage 16 of the first spring element 15 and described conductive pin 13, and the top 17b of conduction insertion section 17 is in the top of conductive pin 13 13a slight convex.
Described the first spring element 15 preferably has than the stronger tension force of the second spring element 18, and spring element is preferably Microspring.
Electrostatic dissipation socket 19 has export-oriented pointed tip electrode 19a and the introversive 19b of chamber portion.In this chamber portion, 19b is filled with static dissipative material, and the top 17b that is connected to conduction insertion section 17 is usingd when the test point of the frequent charging electric charge of equipment that will be detected when socket 19 contact as the medium of the transfer of slow down electrostatic induced current or electrostatic charge, thereby minimizes the colored generation of low baking temperature.
During test operation, when the pointed tip electrode 19a of the electrostatic dissipation socket 19 of testing needle assembly 10 contact will be detected equipment time, conduction insertion section 17 move in together with electrostatic dissipation socket 19 make to conduct electricity insertion section 17 amplification cardinal extremity 17c due to lighter pressure inwardly insert second place 11b with towards and be offset a little the second elastic component 18.This inwardly moves the gap between automatic closed electrostatic dissipation socket 19 and the top 13a of conductive pin 13.The closure in this gap 20 will make testing needle assembly 10 act on and move as original unaltered testing needle assembly.
The symmetric double contact pin design with identical principle of work has been shown in Fig. 1 b.On socket 11, provide the additional pleat 14 ' of pressing and socket 11 has been partitioned into three parts with additional third part 11c.
In an embodiment of the present invention, separable contact pin top 30 is fixed to the top of socket 11.Contact pin top 30 is connected in series to elastic component 32 and forms integral type connecting portion 30 through electrostatic dissipation part 31 electricity.Then, connecting portion 30 is assembled to the needle body of conductive pin 13.The openend of the elastic component 32 of connecting portion inserts its metal wire by the hole 33 that a site of the wheel rim of the open end of socket 11 provides shown in figure 2 and is connected to socket 11.
When 30 contacts of contact pin top will be detected the test point of equipment time, this contact pin top 30 is by the gap 35 moving inwardly between closed contact pin top 30 and conductive pin 13.The closure in this gap 35 will make testing needle assembly 10 act on and move as original unaltered testing needle assembly.Then carry out the normal mechanical motion of testing needle array.
While discharging from equipment after testing needle array is testing equipment as shown in Figure 2,30 biasing of contact pin top are got back on the top of testing needle array protruding a little.Like this, compare with original testing needle array, except this conductive pin 13 because of the additional small cap on contact pin top become longer a little, even if in fact the testing needle array that this part changes has the coiling elastic component 32(coiled resilient around conductive pin 13) do not occupy additional space yet, this is because the diameter of coiling elastic component 32 is equal to or less than the diameter of the main body of socket 11.
In another embodiment, as shown in Figure 3, contact pin top 30 is fixed on the top of socket 11 of testing needle assembly 10.This contact pin top 30 has the top that is connected to electrostatic dissipation part 31 and is connected in series with elastic component 32 41.Wherein, elastic component 32 is inserted in hollow circuit cylinder contact pin 42.Compare with the embodiment shown in Fig. 2, this design has advantages of only needs minimum space.
When contact pin contact will be detected the test point of equipment time, this contact pin top 30 is by the gap 45 moving inwardly between closed contact pin top 30 and the needle body of conductive pin 13.The closure in this gap 45 will make testing needle assembly 10 act on and move as original unaltered testing needle assembly.Then carry out the normal mechanical motion of testing needle array.
While discharging from equipment after testing needle array is testing equipment as shown in Figure 3, the 30 ' biasing of contact pin top is got back on the top of testing needle array protruding a little.Like this, compare with former testing needle array, except this conductive pin become now longer a little, the testing needle array that this part changes does not in fact occupy additional space yet.
Improved conductive pin 13 ' is as shown in Figure 4 provided in another embodiment of the present invention.It is included in the non-coiled piece 51 that produces gap 52 between electrostatic dissipation socket 19 and improved conductive pin 13 '.The bend 51b that hook-shaped conduction insertion section 51 comprises the main body 51a of the passage 16 that is inserted through conductive pin 13 ' and is passed in another passage 53 that amplifies cardinal extremity 13b setting.When electrostatic dissipation socket 19 contacts the test point of the device that will detect, electrostatic dissipation socket 19 is by the gap 52 between mobile closed electrostatic dissipation socket 19 and conductive pin 13.The closure in this gap 52 will make testing needle assembly 10 act on and move as original unaltered testing needle assembly.While discharging from equipment after testing needle array 10 is testing equipment as shown in Figure 4,19 biasings of electrostatic dissipation socket are got back on the top of testing needle array protruding a little.Like this, compare with former testing needle array, except this conductive pin become now longer a little, the testing needle array that this part changes does not in fact occupy additional space yet.
The test macro that refers to type for use test, test refers to that top 60 can be by elastic component metal wire 61 controls shown in Fig. 5.The curved design of elastic component metal wire 61 becomes it always in test, to refer to that top and its test refer to leave between body gap.When test refers to the test point of the equipment that top 60 contacts will detect, test refers to that 60 refer to top 60 and test the small gap between the finger body 62 referring to moving to closed test.The closure in this gap will make testing needle assembly 10 act on and move as original unaltered testing needle assembly.While discharging from equipment after test refers to the equipment that testing as shown in Figure 5, it is protruding a little that the top referring in test is got back in the biasing of top head spring.Like this, refer to that with former test row compare, except this conductive pin become now longer a little, the test that this part changes refers to that row in fact do not occupy additional space yet.
For a person skilled in the art, it is evident that, can, without departing from the scope of the invention, with other particular form, easily implement the present invention.Therefore can think that current embodiment is only used as and sets forth, be not to limit the invention, and scope of the present invention is limited by claim rather than description above, and therefore all variations all will be included in claim.
Claims (10)
1. a testing needle array with static discharge (ESD) protection, is characterized in that, comprising:
Socket (11), every one end of described socket (11) has the limit (12a, 12b) of narrow diameter, and wherein said socket (11) has the pressure pleat (14) that described socket (11) is divided into first (11a) and second portion (11b) in its approximate mid-section;
Be included in the first elastic component (15) in described first (11a);
Be included in the second elastic component (18) in described second portion (11b);
Conductive pin (13), described conductive pin (13) is inserted into the first (11a) of described socket (11) and has top (13a) and the first amplification cardinal extremity (13b), and described the first amplification cardinal extremity (13b) protrudes by described the first elastic component (15) towards inner edge (12a) and described top (13a) of described first (11a) from described socket (11);
Conduction insertion section (17), described conduction insertion section (17) is inserted the second portion (11b) of described socket (11) and is had extension body (17a) and the second amplification cardinal extremity (17c), described extension body (17a) has top (17b), described second amplifies cardinal extremity (17c) towards a surface biasing of described pressure pleat (14), described extension body (17a) is by described the first elastic component (15) and the passage (16) that provides along the total length of described conductive pin (13), and the top (17b) of described extension body (17a) is in described conductive pin (13) slight convex, and
Electrostatic dissipation socket (19), described electrostatic dissipation socket (19) has export-oriented pointed tip electrode (19a) and introversive chamber portion, the top (17b) that wherein said chamber portion is filled with static dissipative material (19b) and is connected to described conduction insertion section (17) is to form gap (20) between described electrostatic dissipation socket (19) and described conductive pin (13) thereby when described the first and second elastic components (15, 18) when not stressed, before described gap (20) is closed, first make the electrostatic charge described static dissipative material (19b) of flowing through, thereby thereby the test point of the equipment that contact will detect slows down before, electrostatic charge shifts the generation that minimizes low baking temperature flower at described electrostatic dissipation socket (19).
2. testing needle array according to claim 1, is characterized in that, described the first elastic component (15) has than the stronger tension force of the second elastic component (18).
3. testing needle array according to claim 2, is characterized in that, described the first elastic component (15) and described the second elastic component (18) are Microspring.
4. testing needle array according to claim 3, it is characterized in that, described the first elastic component (15) is placed on the described first (11a) of described socket (11), one end of described the first elastic component (15) rests on the surface of described pressure pleat (14), and the other end rests in the described first amplification cardinal extremity (13b) of described conductive pin (13).
5. testing needle array according to claim 3, it is characterized in that, described the second elastic component (18) is placed on the described second portion (11b) of described socket (11), one end of described the second elastic component (18) rests in the inner edge (12b) of described second portion (11b), and the other end rests in the second amplification cardinal extremity (17c) of described conduction insertion section (17).
6. testing needle array according to claim 1, it is characterized in that, described socket (11) further comprises the additional pleat (14 ') of pressing, described additional pressure pleat (14 ') by described socket (11) be partitioned into have additional third part (11c) for accommodating phase described the first and second elastic components (15,18), described conduction insertion section (17) and described electrostatic dissipation socket (19) on the same group to form symmetrical contact pin structure.
7. testing needle array according to claim 1, it is characterized in that, described electrostatic dissipation socket (19) is connected to non-coiled piece (51), described non-coiled piece (51) comprise the main body (51a) of the described passage (16) that is inserted through described conductive pin (13) and be passed in described first amplify the bend (51b) of another passage (53) that cardinal extremity (13b) arranges thus between described electrostatic dissipation socket (19) and described conductive pin (13), leave gap.
8. a testing needle array with static discharge (ESD) protection, is characterized in that, comprising:
Socket (11), every one end of described socket (11) has the limit of narrow diameter (12a, 12b),
The conductive pin (13) of slidably assembling in described socket (11);
With the fixing contact pin top head (30) of electrostatic dissipation part (31), described contact pin top head (30) is electrically connected to one end of elastic component (32) and forms integral type connecting portion, by the hole (33) providing on the described limit at described socket (11), insert the free end of described elastic component (32), described connecting portion is connected to described conductive pin (13), make described elastic component (32) around described conductive pin (13) and between described contact pin top head (30) and described conductive pin (13), leave gap first to make the electrostatic charge described electrostatic dissipation part (31) of flowing through before closed in described gap (20), thereby thereby the test point of the equipment that contact will detect slows down before, electrostatic charge shifts the generation that minimizes low baking temperature flower at described contact pin top head (30).
9. testing needle array according to claim 8, is characterized in that, the described free end of the described elastic component of described contact pin top head (30) can be inserted in hollow circuit cylinder contact pin (42).
10. a test with static discharge (ESD) protection refers to, it is characterized in that, comprising:
Test refers to body (62); With
Test refers to top (60), described test refers to that top (60) comprises the chamber portion that is filled with static dissipative material, wherein said test refers to that top (60) is connected to described test through elastic component metal wire (61) and refers to body (62), the curved design of described elastic component metal wire (61) becomes it in described test, to refer to that top (60) and described test refer to leave between body (62) gap first to make the electrostatic charge described static dissipative material of flowing through before the closure of described gap, thereby electrostatic charge shifts the generation that minimizes low baking temperature flower thereby the test point of the equipment that contact will detect slows down before in described test, to refer to top (60).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI2010004975 | 2010-10-22 | ||
| MYPI2010004975A MY154684A (en) | 2010-10-22 | 2010-10-22 | Test pin assembly with electrostatic discharge (esd) protection |
| PCT/CN2011/001750 WO2012051801A1 (en) | 2010-10-22 | 2011-10-21 | Test pin assembly with electrostatic discharge (esd) protection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103238076A CN103238076A (en) | 2013-08-07 |
| CN103238076B true CN103238076B (en) | 2014-12-10 |
Family
ID=45974640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180049144.0A Active CN103238076B (en) | 2010-10-22 | 2011-10-21 | Test pin assembly with electrostatic discharge (ESD) protection |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103238076B (en) |
| MY (1) | MY154684A (en) |
| WO (1) | WO2012051801A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9213048B2 (en) * | 2012-08-02 | 2015-12-15 | Texas Instruments Incorporated | System and method for testing an electronic device |
| CN107525953A (en) * | 2017-09-25 | 2017-12-29 | 惠科股份有限公司 | A kind of probe unit |
| CN111899679B (en) * | 2020-07-03 | 2022-05-20 | 厦门强力巨彩光电科技有限公司 | ESD test method of LED display module chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3577208A (en) * | 1969-07-03 | 1971-05-04 | John T Petrick | Electrostatic grounding probe for use in explosive atmospheres |
| DE4234461A1 (en) * | 1992-10-13 | 1994-04-14 | Sachsenwerk Ag | Test adaptor esp. for gas-insulated medium-voltage switchgear - has recessed insulating sleeve fitted replaceably into hollowed end of tubular polymeric plug with coaxial conductor |
| CN1573338A (en) * | 2003-06-09 | 2005-02-02 | 阿尔卑斯电气株式会社 | Contact probe, probe socket, electrical characteristic measuring device, and method for pushing the contact probe against object to be measured |
| CN1858597A (en) * | 2005-05-05 | 2006-11-08 | 安捷伦科技有限公司 | Micro gap method and ESD protection device |
| CN1869713A (en) * | 2005-05-27 | 2006-11-29 | 特克特朗尼克公司 | Differential measurement probe having retractable double cushioned variable spacing probing tips with EOS/ESD protection capabilities |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5663655A (en) * | 1995-09-22 | 1997-09-02 | Everett Charles Technologies, Inc. | ESD protection for universal grid type test fixtures |
| JP2001296320A (en) * | 2000-04-14 | 2001-10-26 | Oht Inc | Probe unit and measuring device |
| US6905350B1 (en) * | 2002-04-05 | 2005-06-14 | Maxtor Corporation | Two-step electrical connector and method using high resistance path for electrostatic discharge |
| CN100452551C (en) * | 2004-07-09 | 2009-01-14 | 新科实业有限公司 | 'Two-step contact' clamping mechanism of flexible printing circuit for magnetic-head suspending assembly |
-
2010
- 2010-10-22 MY MYPI2010004975A patent/MY154684A/en unknown
-
2011
- 2011-10-21 CN CN201180049144.0A patent/CN103238076B/en active Active
- 2011-10-21 WO PCT/CN2011/001750 patent/WO2012051801A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3577208A (en) * | 1969-07-03 | 1971-05-04 | John T Petrick | Electrostatic grounding probe for use in explosive atmospheres |
| DE4234461A1 (en) * | 1992-10-13 | 1994-04-14 | Sachsenwerk Ag | Test adaptor esp. for gas-insulated medium-voltage switchgear - has recessed insulating sleeve fitted replaceably into hollowed end of tubular polymeric plug with coaxial conductor |
| CN1573338A (en) * | 2003-06-09 | 2005-02-02 | 阿尔卑斯电气株式会社 | Contact probe, probe socket, electrical characteristic measuring device, and method for pushing the contact probe against object to be measured |
| CN1858597A (en) * | 2005-05-05 | 2006-11-08 | 安捷伦科技有限公司 | Micro gap method and ESD protection device |
| CN1869713A (en) * | 2005-05-27 | 2006-11-29 | 特克特朗尼克公司 | Differential measurement probe having retractable double cushioned variable spacing probing tips with EOS/ESD protection capabilities |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012051801A1 (en) | 2012-04-26 |
| CN103238076A (en) | 2013-08-07 |
| MY154684A (en) | 2015-07-15 |
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