CN110895305A - Chip test connecting device and chip test system - Google Patents

Chip test connecting device and chip test system Download PDF

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Publication number
CN110895305A
CN110895305A CN201811069678.XA CN201811069678A CN110895305A CN 110895305 A CN110895305 A CN 110895305A CN 201811069678 A CN201811069678 A CN 201811069678A CN 110895305 A CN110895305 A CN 110895305A
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CN
China
Prior art keywords
chip
circuit board
sleeve
chip test
loading circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811069678.XA
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Chinese (zh)
Inventor
陆玉斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changxin Memory Technologies Inc
Original Assignee
Changxin Memory Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changxin Memory Technologies Inc filed Critical Changxin Memory Technologies Inc
Priority to CN201811069678.XA priority Critical patent/CN110895305A/en
Publication of CN110895305A publication Critical patent/CN110895305A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2884Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]

Abstract

The invention relates to the technical field of semiconductors and provides a chip test connecting device.A plurality of connectors are provided with a first end and a second end which are arranged oppositely, the first end is fixed on a loading circuit board, and the second end is an elastic contact used for connecting a chip; and the guide plates are fixed on the loading circuit board and used for bearing the chip. The connector is directly connected with the loading circuit board, compared with the prior art, the chip testing connection device cancels the chip testing seat device, and can achieve the effects of being convenient to disassemble and assemble, reducing the maintenance difficulty, improving the testing efficiency, reducing the hardware cost and the like.

Description

Chip test connecting device and chip test system
Technical Field
The invention relates to the technical field of semiconductors, in particular to a chip test connection device and a chip test system provided with the chip test connection device.
Background
The chip is required to be tested after being produced, and in the final testing stage, the chip is required to be placed on a chip testing seat, the testing seat is connected with a loading circuit board, and finally the chip is connected to a testing machine through the loading circuit board.
In the prior art, various devices are worn and damaged frequently in the test process, and during maintenance, the chip test socket needs to be dismantled and then maintained, so that the maintenance time is increased, and the test efficiency is influenced.
Therefore, it is necessary to design a new chip test connection device and a test system for mounting the chip test connection device.
The above information disclosed in this background section is only for enhancement of understanding of the background of the invention and therefore it may contain information that does not constitute prior art that is already known to a person of ordinary skill in the art.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a chip test connection device which is convenient to disassemble and assemble, convenient to maintain and high in test efficiency and a test system provided with the chip test connection device.
Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
According to an aspect of the present invention, a chip test connection apparatus includes:
loading the circuit board;
the connectors are provided with a first end and a second end which are oppositely arranged, the first end is fixed on the loading circuit board, and the second end is an elastic contact used for connecting a chip;
and the guide plates are fixed on the loading circuit board and used for bearing the chip.
In an exemplary embodiment of the present disclosure, the connector includes:
the sleeve is provided with a first sleeve end and a second sleeve end which are oppositely arranged, the first sleeve end is closed, and the second sleeve end is opened;
the elastic structure is arranged in the sleeve;
and the contact is connected with the elastic structure and protrudes out of the second sleeve end.
In an exemplary embodiment of the present disclosure, the elastic structure is a coil spring.
In an exemplary embodiment of the disclosure, the first sleeve end is fixed on the loading circuit board, and the contact is used for connecting with the chip.
In an exemplary embodiment of the disclosure, a groove is provided on the loading circuit board, and the first end of the connector is fixed in the groove.
In an exemplary embodiment of the present disclosure, the plurality of guide plates enclose a shape that fits an outer frame of the chip.
In an exemplary embodiment of the disclosure, a surface of the guide plate close to the chip is provided with a boss protruding to one side of the chip, and the boss is used for bearing the chip.
In an exemplary embodiment of the present disclosure, a height of a face of the boss carrying the chip is lower than a height of the connector.
According to an aspect of the present disclosure, there is provided a chip test system including:
the chip test connection device of any one of the above.
In an exemplary embodiment of the present disclosure, further comprising:
the tester is provided with a test head, and the loading circuit board is connected to the test head.
According to the technical scheme, the invention has at least one of the following advantages and positive effects:
the invention relates to a chip test connection device and a test system provided with the chip test connection device. Compared with the prior art, the connector is directly connected with the loading circuit board, and on one hand, a chip test seat is not arranged, so that the effects of reducing the maintenance difficulty and reducing the hardware cost are achieved; on the other hand, the maintenance difficulty is reduced, and the required maintenance time is short, so that the time of the test system in a working state is long, and the test efficiency is improved.
Drawings
The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.
FIG. 1 is a simplified diagram of a chip connected to a tester according to the related art;
fig. 2 is a schematic view of a structure of a connector in the related art;
FIG. 3 is a simplified schematic diagram of the chip of the present invention connected to a tester;
fig. 4 is a schematic view of the structure of the connector of the present invention.
The reference numerals of the main elements in the figures are explained as follows:
1. a chip; 101. a spherical connecting portion;
2. a connector; 201. a sleeve; 202. an elastic structure; 203. a contact;
3. a guide plate; 301. a boss;
4. loading the circuit board; 5. a testing machine.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
After the chip is produced, the chip needs to be tested to determine whether the chip meets the working requirement, and in the final stage of chip testing, the chip is firstly placed on a chip testing seat, then the chip is connected with a loading circuit board, and finally the loading circuit board is installed on a chip testing machine to test the chip.
Referring to fig. 1 and 2, the elastic structure 202 has a long length, which may generate a large resistance, affecting the test accuracy, and during the production process, the elastic structure 202 and the contact 203 may be worn and broken, or the guide plate 3 may be worn. The chip test socket needs to be removed at the time of maintenance, and the chip test socket is mounted back on the loading circuit board 4 after the connector is replaced. The maintenance time is increased, and the production efficiency is greatly influenced.
The present invention firstly provides a chip 1 test connection device, which can include a loading circuit board 4, a plurality of connectors 2 and a plurality of guide plates 3, as shown in fig. 3 and 4; each connector 2 has a first end and a second end which are oppositely arranged, the first end is fixed on the loading circuit board 4, and the second end is a contact 203 used for connecting the chip 1; a plurality of guide plates 3 are fixed to the loading circuit board 4 for carrying the chip 1.
Referring to fig. 1 and 3, the connector is directly connected with the loading circuit board 4, and a chip 1 test seat is not arranged, so that the effects of reducing the maintenance difficulty and reducing the hardware cost are achieved; because the maintenance difficulty is reduced and the time required by maintenance is short, the time of the test system in a working state is long, and the test efficiency is improved; in the invention, only one end of the elastic component is provided with the contact 203, the other end of the elastic structure 202 is directly connected with the loading circuit board 4, and the lengths of the contact 203 and the elastic structure 202 are greatly shortened compared with the related art, namely, the resistance generated by the contact 203 and the elastic structure 202 is greatly reduced, so that the detection accuracy of the chip 1 can be improved.
The shape of the chip 1 may be circular, rectangular, triangular, or the like. A plurality of ball-shaped connection portions 101 for connection to the connector 2 are provided on one surface of the chip adjacent to the connector.
In the present exemplary embodiment, as shown with reference to fig. 3, the loader circuit board may be a PCB circuit board, i.e., a printed circuit board; the loading circuit board 4 is provided with a plurality of grooves for fixing a plurality of connectors 2, wherein one connector 2 corresponds to one groove, and a plurality of connectors 2 correspond to one groove; the shape of the loading circuit board 4 can be square, rectangle or circle; the shape of the cross section of the groove may be rectangular, arc, or the like, and only needs to play a role of fixing the connector 2, and is not particularly limited in this exemplary embodiment.
In the present exemplary embodiment, referring to fig. 3, the connector 2 is fixed in a recess on the loading circuit board 4 for connecting the chip 1 and the loading circuit board 4; the connectors may be arranged according to the required detection area of the chip 1, and may be arranged in multiple rows, and at this time, one row of the connectors 2 may correspond to one groove. In another embodiment, when the plurality of connectors 2 are disposed at different positions, one connector 2 may correspond to one groove, and in this case, the groove may be disposed as a curved groove to fix all the connectors 2 via all the connectors 2, i.e., one groove.
Referring to fig. 4, the connector 2 may include a sleeve 201, an elastic structure 202, and a contact 203; the sleeve 201 may have a first sleeve end, which may be closed, and a second sleeve end, which is open, the first sleeve end being fixed to the guide plate 3; an elastic structure 202 is arranged inside the sleeve 201, but does not protrude out of the first sleeve end of the sleeve 201; the contact 203 is connected to the resilient structure 202 and protrudes from the first sleeve end of the sleeve 201. In another embodiment, the first sleeve end may also be an opening, and when fixed on the loading circuit board 4, it is closed by means of the loading circuit board 4.
Referring to fig. 4, the sleeve 201 is fixed on the loading circuit board 4, and the sleeve 201 may be made of a conductive material for stabilizing the spring and transmitting current; the cross-sectional shape of the sleeve 201 may be circular to match the shape of the coil spring.
In the present exemplary embodiment, referring to fig. 3 and 4, the elastic structure 202 is disposed inside the sleeve 201, and does not protrude from the first sleeve end of the sleeve 201, and the elastic structure 202 may be a coil spring, which may be made of metal and has a conductive function; the coil spring can provide lateral component force, ensure the contact 203 to be stably contacted with the inner wall of the sleeve 201, and ensure the stable transmission of current.
In the present exemplary embodiment, as shown in fig. 3 and 4, the contact 203 is connected to the elastic structure 202, protrudes from the first sleeve end of the sleeve 201, the contact 203 is connected to the spherical connecting portion 101 provided on the chip 1, and the contact 203 may be provided in a cylindrical shape, and one end surface of the cylindrical shape is tangent to the spherical connecting portion 101. In another exemplary embodiment, the end of the contact 203 connected to the spherical connecting portion 101 may be provided with a hemispherical groove, the diameter of which is slightly larger than the diameter of the spherical connecting portion 101, i.e., the spherical connecting portion 101 may be embedded into the hemispherical groove, so that the connection of the connector and the chip is more secure. The contact 203 may be provided in a cylindrical shape, i.e., a circular ring in a plan view, and the inner diameter of the cylindrical shape is smaller than the diameter of the spherical connecting portion 101.
As shown in fig. 3, the guide plate 3 may be fixed on the loading circuit board 4 for carrying the chip 1; the plurality of guide plates 3 are enclosed into a shape matched with the outer frame of the chip 1 to be tested, namely the enclosed shape of the guide plates 3 can be a circle, a rectangle or a triangle; the material of the guide plate 3 may be a conductive material.
In the present exemplary embodiment, referring to fig. 3 and 4, a convex platform 301 protruding toward one side of the chip 1 may be disposed on one side of the guiding plate 3 close to the chip 1 for bearing the chip 1, the side of the convex platform 301 bearing the chip 1 is lower than the height of the connector 2, so that the chip 1 can be in good contact with the connector 2, the chip 1 compresses the elastic structure 202 through the contact 203, the contact 203 is always in contact with the sleeve 201 by a lateral component force provided by the elastic structure 202, the chip 1 compresses one end of the elastic structure 202 to be finally in contact with the convex platform 301, and the convex platform 301 bears more gravity; the current is made to communicate with the load circuit board 4 through the sleeve 201. The projection 301 may be a blocking plate protruding from the guide plate 3, or may be a plurality of projections protruding from the guide plate 3.
In another exemplary embodiment, the boss 301 may not be disposed on the guide plate 3, the chip 1 compresses the plurality of contacts 203, the plurality of contacts 203 compress and spring the plurality of elastic members, and the weight of the chip 1 and the force of the plurality of elastic structures 202 are balanced after the plurality of contacts 203 are compressed for a certain distance. When the chip 1 is not placed, the length of the contact 203 extending out of the sleeve 201 is greater than the distance of compression after the chip 1 is placed. I.e. after placing the chip 1, the chip 1 is not in contact with the sleeve 201.
Further, the present invention also provides a chip testing system, which may include the chip testing connection device, and the specific structure of the chip testing connection device has been described in detail above, and therefore, the detailed description thereof is omitted here.
In the present exemplary embodiment, the chip test system has a test head, a loading circuit board is connected to the test head, the chip is connected to the loading circuit board through a connector, and the loading circuit board is connected to the test machine through the test head; the current between the chip and the tester is conducted to complete the test of the chip.
The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments, and the features discussed in connection with the embodiments are interchangeable, if possible. In the above description, numerous specific details are provided to give a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the invention may be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention.
Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". Other relative terms, such as "high", "low", "top", "bottom", "front", "back", "left", "right", etc., are also intended to have similar meanings. When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.
In this specification, the terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising," "including," and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first," "second," and "third," etc. are used merely as labels, and are not limiting on the number of their objects.
It is to be understood that the invention is not limited in its application to the details of construction and the arrangement of components set forth in the description. The invention is capable of other embodiments and of being practiced and carried out in various ways. The foregoing variations and modifications fall within the scope of the present invention. It will be understood that the invention disclosed and defined in this specification extends to all alternative combinations of two or more of the individual features mentioned or evident from the text and/or drawings. All of these different combinations constitute alternative aspects of the present invention. The embodiments described in this specification illustrate the best mode known for carrying out the invention and will enable those skilled in the art to utilize the invention.

Claims (10)

1. A chip test connection device, comprising:
loading the circuit board;
the connectors are provided with a first end and a second end which are oppositely arranged, the first end is fixed on the loading circuit board, and the second end is an elastic contact used for connecting a chip;
and the guide plates are fixed on the loading circuit board and used for bearing the chip.
2. The chip test connection arrangement of claim 1, wherein the connector comprises:
the sleeve is provided with a first sleeve end and a second sleeve end which are oppositely arranged, the first sleeve end is closed, and the second sleeve end is opened;
the elastic structure is arranged in the sleeve;
and the contact is connected with the elastic structure and protrudes out of the second sleeve end.
3. The chip test connection arrangement of claim 2, wherein the resilient structure is a coil spring.
4. The chip test connection arrangement of claim 2, wherein the first sleeve end is secured to the load circuit board and the contact is adapted to be connected to the chip.
5. The chip test connection arrangement of claim 1, wherein the loading circuit board has a recess formed therein, the first end of the connector being secured in the recess.
6. The chip test connection arrangement of claim 1, wherein a plurality of the guide plates enclose a shape that fits an outer frame of the chip.
7. The chip test connection device according to claim 1, wherein a surface of the guide plate adjacent to the chip is provided with a boss protruding toward one side of the chip, the boss being used for carrying the chip.
8. The chip test connection arrangement of claim 7, wherein a height of a face of the boss carrying the chip is lower than a height of the connector.
9. A chip test system, comprising:
the chip test connection device according to any one of claims 1 to 8.
10. The chip test system according to claim 9, further comprising:
the tester is provided with a test head, and the loading circuit board is connected to the test head.
CN201811069678.XA 2018-09-13 2018-09-13 Chip test connecting device and chip test system Pending CN110895305A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811069678.XA CN110895305A (en) 2018-09-13 2018-09-13 Chip test connecting device and chip test system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811069678.XA CN110895305A (en) 2018-09-13 2018-09-13 Chip test connecting device and chip test system

Publications (1)

Publication Number Publication Date
CN110895305A true CN110895305A (en) 2020-03-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811069678.XA Pending CN110895305A (en) 2018-09-13 2018-09-13 Chip test connecting device and chip test system

Country Status (1)

Country Link
CN (1) CN110895305A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114578216A (en) * 2022-04-30 2022-06-03 南昌耀德精密五金有限公司 Conducting device for chip test

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114578216A (en) * 2022-04-30 2022-06-03 南昌耀德精密五金有限公司 Conducting device for chip test
CN114578216B (en) * 2022-04-30 2022-07-15 南昌耀德精密五金有限公司 Conducting device for chip test

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