CN103237628A - Slurry management device for wire saw - Google Patents
Slurry management device for wire saw Download PDFInfo
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- CN103237628A CN103237628A CN2011800603179A CN201180060317A CN103237628A CN 103237628 A CN103237628 A CN 103237628A CN 2011800603179 A CN2011800603179 A CN 2011800603179A CN 201180060317 A CN201180060317 A CN 201180060317A CN 103237628 A CN103237628 A CN 103237628A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A slurry management device for a wire saw is provided with: a first tank (5A) which receives slurry waste (3); a centrifugal separator (14) into which the slurry waste (3b) from the first tank (5A) is introduced and which isolates a slurry (2); a second tank (5B) which receives the solid-content slurry (2) from the centrifugal separator (14); a slurry supply path (26) which supplies the slurry (2) from the second tank (5B) to a fixed-abrasive wire saw (1); a controller (41) which detects the slurry density using detection values from a density meter (29) and a viscometer (30), both arranged on a circulation flow path (28) for extracting and circulating the slurry (2) from the second tank (5B); a slurry discharge path (33) which discharges some of the slurry (2) from the second tank (5B) as a waste slurry (31); and a new slurry supply path (38) which supplies a new slurry (2a) to the second tank (5B). The discharge of waste slurry (31) by the slurry discharge path (33) and the supply of the new slurry (2a) by the new slurry supply path (38) are implemented in order to maintain a specific density for the slurry density detected using the controller (41).
Description
Technical field
The adjustment that the present invention relates to the slurry supplied with to the bonded-abrasive scroll saw is easier to and can realizes the slurry management devices of the scroll saw of stable cut-out.
Background technology
In the past, form the device of wafer as being used for to cut off object workpiece (for example silicon ingot) to cut off and used scroll saw.In this scroll saw, following free abrasive particle scroll saw is arranged: the thinner metal alignment that has applied tensioning is advanced, to be cut off the thing pushing and pressing on one side to this metal alignment winding-up slurry on one side lists at metal wire, to be cut off thing thus and be cut to the multi-disc wafer-like simultaneously, described slurry makes the abrasive particle (for example, with reference to patent documentation 1) that contains to cut in the cooling agent that heat in metal cutting is removed.
In addition, in recent years, following bonded-abrasive scroll saw is arranged: use the bonded-abrasive metal alignment on the surface of thinner metal wire, adhered to diamond abrasive grain etc. in advance, on one side will be cut off the thing pushing and pressing to this metal alignment winding-up on one side as the slurry of cooling agent lists at metal wire, to be cut off thing thus and be cut to multi-disc wafer-like (for example, with reference to patent documentation 2) simultaneously.
In above-mentioned free abrasive particle scroll saw and bonded-abrasive scroll saw, form many wafers for silicon ingot is cut off, generally from cut off operation begin to finishing, carry out with 1 batch operation.In addition, about the slurry waste liquid from such scroll saw, for the minimizing of resources effective utilization, discarded object etc., studied by separating the slurry management that recycling realizes.
In above-mentioned free abrasive particle scroll saw, supply with and silicon ingot is cut off to metal wire owing to will in cooling agent, be mixed with the slurry of abrasive particle, so the slurry waste liquid of discharging from free abrasive particle scroll saw is the state that is mixed with abrasive particle (SiC) and smear metal (Si) cooling agent.Therefore, reclaim for such slurry waste liquid is separated, slurry waste liquid is separated into cooling agent and solid state component, and solid state component is followed abrasive particle=recovery, smear metal=two discarded stages separate.Here, under situation about will separate continuously, slurry waste liquid need be extracted out continuously, while monitoring that its extraction amount and yield separately carry out the such complicated operations of foldback of the blending of discarded, the new cooling agent of the recovery of abrasive particle, smear metal and new abrasive particle, regeneration slurry, have the problem of difficulty of management.Therefore, managing general main flow from the slurry of the slurry waste liquid of free abrasive particle scroll saw is batch.
In addition, in said fixing abrasive particle scroll saw, because the slurry that will be only be made of cooling agent supplies with and silicon ingot is cut off to the bonded-abrasive metal wire, so the slurry waste liquid of discharging from the bonded-abrasive scroll saw is for having mixed the structure of the silicon particle that is cut etc. cooling agent.
Patent documentation 1: the spy opens flat 11-309674 communique
Patent documentation 2: the spy opens the 2010-29998 communique.
Summary of the invention
In said fixing abrasive particle scroll saw, known and above-mentioned free abrasive particle scroll saw is compared and can significantly be improved cut-off velocity, because cut-off velocity is very fast, if so not precision control slurry well quality (namely, the concentration that obtains with respect to the proportion according to the solid state component in the slurry is considered the slurry concentration of the expression cuttability of the particle diameter that the viscosity according to solid state component obtains), the instability quality of cut-out problem is then arranged.That is, even the concentration of the solid state component in the slurry is higher, cuttability also descends under, the viscosity condition with higher less at the particle diameter of solid state component.In the management of the slurry of batch because when cutting off beginning and the slurry concentration that cuts off when finishing change significantly, cut off quality and change, so be difficult in the management of the slurry waste liquid of bonded-abrasive scroll saw, adopt batch.In addition, in order to use batch the slurry of stable quality is supplied with to the bonded-abrasive scroll saw, need be stored a large amount of slurries in advance, so the problem that has equipment and cost to increase.
Therefore, in the management of the slurry waste liquid of bonded-abrasive scroll saw, the slurry waste liquid of wishing to use a spot of slurry to cut off separates and the management of recycling continuously, but in the past about can be from slurry waste liquid separating solid particles and can there be disclosed technology in the slurry that is adjusted into the slurry concentration that is suitable for cutting off to the management of the slurry of bonded-abrasive scroll saw stable supplying easily and stably.
The object of the present invention is to provide a kind of adjustment of the slurry of making, supplying with to the bonded-abrasive scroll saw in view of above-mentioned problem points in the past to be easier to and can to realize the slurry management devices of the scroll saw of stable cut-out.
In order to achieve the above object, the slurry management devices of scroll saw of the present invention is characterised in that to possess: the 1st groove, accept slurry waste liquid and storage from the bonded-abrasive scroll saw; Centrifugal separator, the slurry waste liquid importing with the 1st groove separates solids; The 2nd groove is accepted the slurry that contains solid state component and the storage that have been separated solids by this centrifugal separator; Slurry feed system path is supplied with the slurry of the 2nd groove to above-mentioned bonded-abrasive scroll saw; Proportion is taken into account viscosimeter, be equipped in the slurry of above-mentioned the 2nd groove taken out and the circulation stream of circulation on; Controller, the proportion detected value of above-mentioned densimeter and the viscosity measurements value of above-mentioned viscosimeter are taken into, test slurry concentration, described slurry concentration is with respect to the concentration that the proportion according to the solid state component in the slurry obtains, and considers the particle diameter that the viscosity according to solid state component obtains; Slurry is discharged system path, and the part of the slurry of the 2nd groove is discharged as waste slurry; New slurry feed system path is supplied with new slurry to above-mentioned the 2nd groove; Above-mentioned controller carries out discharging the discharge of waste slurry of system path and the supply of the new slurry by new slurry feed system path by above-mentioned slurry, so that above-mentioned detected slurry concentration keeps normal concentration.
In the slurry management devices of above-mentioned scroll saw, preferably, in above-mentioned the 1st groove, possesses cyclopneumatic separator; To guide to cyclopneumatic separator from the slurry waste liquid of said fixing abrasive particle scroll saw, the slurry waste liquid that has improved the concentration of solids is supplied with to above-mentioned centrifugal separator.
In addition, in the slurry management devices of above-mentioned scroll saw, preferably, afore mentioned rules concentration is the Cmax that can carry out by the stable cut-out of bonded-abrasive scroll saw.
In addition, in the slurry management devices of above-mentioned scroll saw, preferably, above-mentioned the 1st groove and the 2nd groove are constituted integratedly, the slurry waste liquid of the 1st groove is supplied with to the 2nd groove via overflow wall.
Slurry management devices according to scroll saw of the present invention, will be by the slurry waste liquid of admitting in the 1st groove be guided to centrifugal separator, solids are separated the slurry that contains solid state component that obtains to be supplied with to the 2nd groove, the slurry of the 2nd groove is supplied with to the bonded-abrasive scroll saw, the part of the slurry of the 2nd groove is discharged as waste slurry and new slurry is supplied with to above-mentioned the 2nd groove, so that slurry concentration becomes normal concentration, described slurry concentration is with respect to the proportion of the concentration of the solid state component of the slurry of expression the 2nd groove, consider the viscosity of the particle diameter of expression solid state component, so can play following good effect: the 1st groove that can be by smaller volume and the 2nd groove and centrifugal separator stably generate the slurry of normal concentration from slurry waste liquid, and by the slurry of normal concentration is supplied with to the bonded-abrasive scroll saw, can guarantee always stable cut-out.
Description of drawings
Fig. 1 is the block diagram of an embodiment of the slurry management devices of expression scroll saw of the present invention.
Fig. 2 is the line chart that the management of slurry of the present invention and the management during with the slurry waste liquid batch processed in are in the past relatively represented.
Description of reference numerals
1 bonded-abrasive scroll saw
2 slurries
The 2a new slurry
3 slurry waste liquids
The 3a slurry waste liquid
The 3b slurry waste liquid
5A the 1st groove
5B the 2nd groove
6 overflow wall
7 cyclopneumatic separators
14 centrifugal separators
15 solids
23,24 densimeters
26 slurry feed system paths
28 circulation streams
29 densimeters
30 viscosimeters
31 waste slurries
33 slurries are discharged system path
38 new slurry feed system paths
41 controllers
The S normal concentration.
The specific embodiment
Below, in conjunction with illustrated example explanation embodiments of the present invention.
Fig. 1 is the block diagram of an embodiment of the slurry management devices of expression scroll saw of the present invention, among the figure, the 1st, the bonded-abrasive scroll saw, in bonded-abrasive scroll saw 1, be supplied to the slurry 2 that is constituted by cooling agent, carry out the cut-out by the ingot of not shown bonded-abrasive metal wire, accepted by liquid bearing container 4 from the slurry waste liquid 3 that bonded-abrasive scroll saw 1 is discharged.
Among the figure, the 5th, accumulator tank, this accumulator tank 5 are formed with the 1st groove 5A and the 2nd groove 5B of overflow wall 6 separations that possessed by inside, are provided with the cyclopneumatic separator 7 towards downside taper shape in the 1st groove 5A.
The waste liquid that the slurry waste liquid 3 of aforesaid liquid bearing container 4 is possessed pump 8 is taken into system path 9 to cyclopneumatic separator 7 supplies that are located among above-mentioned the 1st groove 5A.Namely, the introducing port 10 that waste liquid is taken into the tangential direction on the large-diameter portion of cyclopneumatic separator 7 that 9 pairs of system paths are located at above-mentioned taper shape connects to import slurry waste liquid 3, thus, to improve the slurry waste liquid 3b taking-up of slurry concentration from the miner diameter end 11 of cyclopneumatic separator 7, in addition, discharge the slurry waste liquid 3a that slurry concentration descends at the pit of the stomach 12 in the 1st groove 5A from the side of big footpath.
The miner diameter end 11 of above-mentioned cyclopneumatic separator 7 is connected on the centrifugal separator 14 via extraction system path 13, will be from the raising of above-mentioned miner diameter end 11 the slurry waste liquid 3b of slurry concentration be divided into the bigger solids of particle diameter 15 by centrifugal separator 14 and reduced the slurry that contains solid state component 2 of the content of solids, solids 15 are reclaimed to returnable 16, slurry 2 is reclaimed to slurry box 17.
The slurry 2 of above-mentioned slurry box 17 is supplied with to above-mentioned the 2nd groove 5B by the supply pipe 19 that possesses pump 18.Be provided with densimeter 23,24 in above-mentioned extraction system path 13 and supply pipe 19, by the instrumentation with this densimeter 23,24 proportion, can obtain the rate of removing of the solids that utilize centrifugal separator 14.
The slurry 2 of the inside of above-mentioned the 2nd groove 5B is supplied with to above-mentioned bonded-abrasive scroll saw 1 by the slurry feed system path 26 with pump 25.In addition, be provided with the circulation stream 28 that the slurry 2 with the inside of above-mentioned the 2nd groove 5B takes out, sends back to above-mentioned the 2nd groove 5B again by pump 27, be provided with densimeter 29 and the subsidiary viscosimeter 30 that thermometer 30a is arranged at this circulation stream 28.
On above-mentioned circulation stream 28, be provided with for the slurry that the slurry 2 of circulation is discharged to waste slurry case 32 as waste slurry 31 and discharge system path 33, discharge on the system path 33 at above-mentioned circulation stream 28 and slurry, be provided with and switch the valve 34,35 of discharging to waste slurry case 32 with slurry 2.In addition, in above-mentioned, connect situation about being arranged on the circulation stream 28 and be illustrated slurry being discharged system path 33, discharge system path 33 but slurry also can be set independently, so that the slurry 2 of above-mentioned the 2nd groove 5B is directly discharged to waste slurry case 32.
In addition, on above-mentioned the 2nd groove 5B, connecting the new slurry 2a that will be stored in the new slurry case 36 and passing through the new slurry feed system path 38 that pump 37 is supplied with.In Fig. 1,39 are provided in a side of the mixer among the 2nd groove 5B, the 40th, the slurry waste liquid 3a of above-mentioned the 1st groove 5A cross overflow wall 6 when flowing among above-mentioned the 2nd groove 5B with slurry waste liquid 3a towards below the guiding walls of guiding to stir by mixer 39.
In Fig. 1, the 41st, controller, proportion detected value and subsidiary viscosity, the temperature detection value that the viscosimeter 30 of said temperature meter 30a is arranged of the above-mentioned densimeter 29 of controller 41 inputs, the slurry concentration (value relevant with the cut-out performance in the bonded-abrasive scroll saw 1) of the particle diameter of the solid state component in the slurry 2 is considered in detection.And, detected slurry concentration has reached under the situation of normal concentration in controller 41, controller 41 operation above-mentioned valves 34,35, the slurry 2 of the ormal weight in the 2nd groove 5B is discharged to waste slurry case 32 as waste slurry 31, simultaneously, driving pump 37 is supplied with the amount that equates with the waste slurry 31 of above-mentioned discharge with the new slurry 2a that is stored in the new slurry case 36 to the 2nd groove 5B.Thus, the slurry concentration of the slurry 2 in the 2nd groove 5B reverts to below the normal concentration.
The action of above-described embodiment then, is described.
To be discharged to the action of slurry waste liquid 3 by pump 8 the liquid bearing container 4 from bonded-abrasive scroll saw 1 is taken into system path 9 via waste liquid and supplies with to the cyclopneumatic separator 7 that is located among above-mentioned the 1st groove 5A.So from the slurry waste liquid 3b taking-up that the miner diameter end 11 of cyclopneumatic separator 7 will improve slurry concentration, in addition, the slurry waste liquid 3a after the pit of the stomach 12 descends slurry concentration from the side of big footpath discharges in the 1st groove 5A.
By supplying with to centrifugal separator 14 via extraction system path 13 from the higher slurry waste liquid 3b of the slurry concentration of the miner diameter end 11 of above-mentioned cyclopneumatic separator 7, be divided into solids 15 and reduced the slurry that contains solid state component 2 of the content of solids, solids 15 are reclaimed to returnable 16, slurry 2 is reclaimed to slurry box 17.At this moment, the more high separating property of the more high then performance of the concentration of the slurry that centrifugal separator 14 is supplied to, so supply with to centrifugal separator 14 by the slurry waste liquid 3b that will be have as described above improved slurry concentration by cyclopneumatic separator 7, centrifugal separator 14 separates solids 15 effectively.
To be supplied with to above-mentioned the 2nd groove 5B via supply pipe 19 by the action of pump 18 by the slurry 2 that centrifugal separator 14 is recovered in the slurry box 17, in addition, the slurry 2 of the 2nd groove 5B is supplied with to above-mentioned bonded-abrasive scroll saw 1 via slurry feed system path 26 by the action of pump 25 recycled.
To there be viscosity, the temperature detection value of the viscosimeter 30 of thermometer 30a to be input in the controller 41 from the proportion detected value that is located at the densimeter 29 on the circulation stream 28 with from subsidiary, described circulation stream 28 is equipped on above-mentioned the 2nd groove 5B, and controller 41 detects the slurry concentration of the particle diameter of considering the solid state component in the slurry 2.
Fig. 2 be with the management of slurry of the present invention and in the past with the slurry waste liquid batch processed time the figure that relatively represents of management, represent the time at transverse axis, represent proportion at the longitudinal axis.Here, in management of the present invention, by detecting viscosity with proportion, detect the cut-out performance of giving in the bonded-abrasive scroll saw 1 and bring the slurry concentration of influence.Namely, in the separation by above-mentioned centrifugal separator 14, make solids (solid state component) accumulation of small particle diameter in its characteristic, therefore, even keep the concentration of the solid state component in the slurry, viscosity uprises by the minuteness particle increase of solid state component, and the problem of the cut-out performance decline of bonded-abrasive scroll saw 1 is also arranged, for the slurry concentration of eliminating this problem, obtain the granularity of considering the solid state component in the above-mentioned slurry 2 is controlled.
When above-mentioned slurry concentration is lower than normal concentration S shown in Figure 2, continue the operation that slurry 2 former states of the 2nd groove 5B are supplied with to above-mentioned bonded-abrasive scroll saw 1.At this moment, the X of Fig. 2 can stablize the critical value of carrying out by the cut-out of bonded-abrasive scroll saw 1, afore mentioned rules concentration S close to above-mentioned critical value X, can carry out the Cmax by the stable cut-out of bonded-abrasive scroll saw 1.
Under the situation of the normal concentration S that has been reached Fig. 2 by above-mentioned controller 41 detected slurry concentrations, controller 41 operation above-mentioned valves 34,35, the slurry 2 of the ormal weight in the 2nd groove 5B is discharged to waste slurry case 32 as waste slurry 31, simultaneously, driving pump 37 is supplied with the amount equal with the waste slurry 31 of above-mentioned discharge with the new slurry 2a of new slurry case 36 to the 2nd groove 5B.Thus, the slurry 2 in the 2nd groove 5B is diluted by new slurry 2a, and slurry concentration reverts to below the normal concentration S.
By aforesaid operations, with stable the remaining below the normal concentration S of Fig. 2 always of the slurry 2 in the 2nd groove 5B, the slurry 2 of the slurry concentration by will be stable is like this supplied with to bonded-abrasive scroll saw 1, realizes always stable cut-out by bonded-abrasive scroll saw 1.
On the other hand, the Y of Fig. 2 represents the batch processed of slurry waste liquid in the past, under the situation of the batch processed that online Y is such, if continue to cut off operation, then slurry concentration increases gradually, so the slurry concentration in the time of at first will cutting off end is set at the front value of critical value X, seize back confiscated property and obtain and adjust the setting value of slurry concentration when keeping this cut-outs end when cutting off beginning, so in the past, slurry concentration in the time of cut-out need being begun is adjusted into very low value, for this reason, need carry out the separation by the precision of separation devices such as film filter, have the problem that cost increases.
With respect to this, in the present invention, as shown in Figure 2, the slurry concentration of slurry 2 is adjusted into normal concentration S close to critical value X, so use centrifugal separator 14 that slurry concentration is maintained value close to normal concentration S easily.Namely, because centrifugal separator 14 has the performance that the more high then yield of concentration of solids more increases, so supply with to centrifugal separator 14 by the slurry waste liquid 3b after will being concentrated by cyclopneumatic separator 7, solids 15 can be separated well, thus, slurry concentration is remained below the normal concentration S.In addition, even at the separation by above-mentioned centrifugal separator 14, slurry concentration also than normal concentration S under the big situation, abandon, supply with new new slurry 2a by the part with the slurry 2 in the 2nd groove 5B, revert to normal concentration S, so can be easily and implement the management of slurry 2 cheaply, have to make the slurry 2 supplied with to bonded-abrasive scroll saw 1 stable advantage always.In addition, about slurry concentration than normal concentration S big and waste slurry 31 that discharge to the outside, preferably subsidiary equipment film filter, for example wave separator etc., improve the rate of recovery of cooling agent.Film filter under this situation is compared with the separator of batch in the past, can make very small-scale structure.
In addition, under the situation that will import to from the slurry waste liquid 3 that possesses a plurality of bonded-abrasive scroll saws 1 among the 1st groove 5A, crossing overflow wall 6 by the slurry waste liquid 3a with the 1st groove 5A supplies with and can be corresponding to the 2nd groove 5B, in addition, because the slurry waste liquid 3a of the 1st groove 5A has separated material behind the higher slurry waste liquid 3b of slurry concentration by cyclopneumatic separator 7, even so the slurry waste liquid 3a that this slurry concentration is lower supplies with to the 2nd groove 5B, problem can not take place yet.The accumulator tank 5 that constitutes integratedly according to like this 1st groove 5A and the 2nd groove 5B being separated with overflow wall 6 is oversimplified the handing-over of liquid, can suitably use in the processing of a large amount of slurry waste liquid 3.
In addition, by being discharged to waste slurry 31 in the above-mentioned waste slurry case 32 to guiding such as filter and Separation of Solid and Liquid, filtrate can be reclaimed as slurry and effectively utilizes.
In addition, the slurry management devices of scroll saw of the present invention not only is defined in above-described embodiment, certainly for example also can be with the 1st groove 5A with the 2nd groove 5B does not arrange integratedly and arrange individually, in addition, can be in the scope that does not break away from purport of the present invention in addition various changes.
Utilizability on the industry
The slurry management devices of scroll saw of the present invention is suitable for the bonded-abrasive scroll saw slurry concentration with cutting workpiece by being adjusted into, can be stable and use when carrying out cut-out operation by the bonded-abrasive scroll saw expeditiously.
Claims (5)
1. the slurry management devices of a scroll saw is characterized in that,
Possess:
The 1st groove is accepted slurry waste liquid and storage from the bonded-abrasive scroll saw;
Centrifugal separator, the slurry waste liquid importing with the 1st groove separates solids;
The 2nd groove is accepted the slurry that contains solid state component and the storage that have been separated solids by this centrifugal separator;
Slurry feed system path is supplied with the slurry of the 2nd groove to above-mentioned bonded-abrasive scroll saw;
Proportion is taken into account viscosimeter, be equipped in the slurry of above-mentioned the 2nd groove taken out and the circulation stream of circulation on;
Controller, the proportion detected value of above-mentioned densimeter and the viscosity measurements value of above-mentioned viscosimeter are taken into, test slurry concentration, described slurry concentration is with respect to the concentration that the proportion according to the solid state component in the slurry obtains, and considers the particle diameter that the viscosity according to solid state component obtains;
Slurry is discharged system path, and the part of the slurry of the 2nd groove is discharged as waste slurry;
New slurry feed system path is supplied with new slurry to above-mentioned the 2nd groove;
Above-mentioned controller carries out discharging the discharge of waste slurry of system path and the supply of the new slurry by new slurry feed system path by above-mentioned slurry, so that above-mentioned detected slurry concentration keeps normal concentration.
2. the slurry management devices of scroll saw as claimed in claim 1 is characterized in that,
In above-mentioned the 1st groove, possesses cyclopneumatic separator;
To guide to cyclopneumatic separator from the slurry waste liquid of said fixing abrasive particle scroll saw, the slurry waste liquid that has improved the concentration of solids is supplied with to above-mentioned centrifugal separator.
3. the slurry management devices of scroll saw as claimed in claim 1 or 2 is characterized in that,
Afore mentioned rules concentration is the Cmax that can carry out by the stable cut-out of bonded-abrasive scroll saw.
4. the slurry management devices of scroll saw as claimed in claim 1 or 2 is characterized in that,
Above-mentioned the 1st groove and the 2nd groove are constituted integratedly, the slurry waste liquid of the 1st groove is supplied with to the 2nd groove via overflow wall.
5. the slurry management devices of scroll saw as claimed in claim 3 is characterized in that,
Above-mentioned the 1st groove and the 2nd groove are constituted integratedly, the slurry waste liquid of the 1st groove is supplied with to the 2nd groove via overflow wall.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-280225 | 2010-12-16 | ||
| JP2010280225A JP5624449B2 (en) | 2010-12-16 | 2010-12-16 | Wire saw slurry management device |
| PCT/JP2011/006964 WO2012081239A1 (en) | 2010-12-16 | 2011-12-14 | Slurry management device for wire saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103237628A true CN103237628A (en) | 2013-08-07 |
| CN103237628B CN103237628B (en) | 2016-07-06 |
Family
ID=46244358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180060317.9A Expired - Fee Related CN103237628B (en) | 2010-12-16 | 2011-12-14 | The slurry managing device of scroll saw |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP5624449B2 (en) |
| KR (1) | KR101860296B1 (en) |
| CN (1) | CN103237628B (en) |
| MY (1) | MY170481A (en) |
| SG (1) | SG191158A1 (en) |
| TW (1) | TWI533973B (en) |
| WO (1) | WO2012081239A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111195991A (en) * | 2018-11-16 | 2020-05-26 | 胜高股份有限公司 | Method for manufacturing wafer, method for evaluating quality of reusable slurry for wire saw, and method for evaluating quality of used slurry for wire saw |
| CN111805775A (en) * | 2020-06-09 | 2020-10-23 | 徐州鑫晶半导体科技有限公司 | Mortar supply method, mortar supply equipment and crystal bar cutting system |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6085500B2 (en) * | 2013-03-08 | 2017-02-22 | 株式会社Ｉｈｉ回転機械 | Wire source slurry coolant recovery system |
| JP6819619B2 (en) * | 2018-01-22 | 2021-01-27 | 信越半導体株式会社 | Work cutting method and wire saw |
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- 2010-12-16 JP JP2010280225A patent/JP5624449B2/en active Active
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- 2011-12-14 WO PCT/JP2011/006964 patent/WO2012081239A1/en active Application Filing
- 2011-12-14 CN CN201180060317.9A patent/CN103237628B/en not_active Expired - Fee Related
- 2011-12-14 KR KR1020137015183A patent/KR101860296B1/en active IP Right Grant
- 2011-12-14 MY MYPI2013002082A patent/MY170481A/en unknown
- 2011-12-14 SG SG2013045786A patent/SG191158A1/en unknown
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| JP2001341074A (en) * | 2000-03-30 | 2001-12-11 | Mikura Bussan Kk | Regenerative processor for inorganic abrasive waste liquid |
| JP2002144229A (en) * | 2000-11-02 | 2002-05-21 | Nippei Toyama Corp | Wire-saw nd cutting method for wire-saw |
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| CN111195991A (en) * | 2018-11-16 | 2020-05-26 | 胜高股份有限公司 | Method for manufacturing wafer, method for evaluating quality of reusable slurry for wire saw, and method for evaluating quality of used slurry for wire saw |
| CN111805775A (en) * | 2020-06-09 | 2020-10-23 | 徐州鑫晶半导体科技有限公司 | Mortar supply method, mortar supply equipment and crystal bar cutting system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103237628B (en) | 2016-07-06 |
| TWI533973B (en) | 2016-05-21 |
| MY170481A (en) | 2019-08-07 |
| JP5624449B2 (en) | 2014-11-12 |
| SG191158A1 (en) | 2013-07-31 |
| TW201236815A (en) | 2012-09-16 |
| KR101860296B1 (en) | 2018-05-23 |
| WO2012081239A1 (en) | 2012-06-21 |
| KR20130128415A (en) | 2013-11-26 |
| JP2012125891A (en) | 2012-07-05 |
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