TWI461258B - Slurry recycling method and slurry recycling apparatus for the same - Google Patents

Description

Method for recycling and utilizing polishing slurry and application in recycling and utilization of the polishing slurry Method of slurry slurry recycling equipment

The present invention relates to a method for recycling and utilizing a polishing slurry, and more particularly to a polishing slurry recycling method suitable for use in a working slicing device and a polishing slurry recycling device applied to the polishing slurry recycling method .

In the past, most of the waste abrasive slurry formed by the operation of the slicing equipment was transported to the waste grinding slurry processing company for recycling. Thereafter, the waste abrasive slurry processing company will consume acid and alkali, a large amount of water, electric energy, and heat to recover the recyclable materials in the waste abrasive slurry.

However, the above method is carried out by transporting the waste polishing slurry to the waste polishing slurry processing company for recycling, which is time consuming and requires a large amount of resources for the recovery operation.

Therefore, the present inventors have felt that the above-mentioned deficiencies can be improved, and they have devoted themselves to research and cooperated with the application of the theory, and finally proposed a present invention which is reasonable in design and effective in improving the above-mentioned defects.

An embodiment of the present invention provides a polishing slurry recovery and utilization method and a polishing slurry recovery and utilization device applied to the polishing slurry recovery and utilization method, which are suitable for performing a polishing slurry recovery and reuse operation in a working slicing device.

Embodiments of the present invention provide a method for recycling and utilizing a polishing slurry, which is suitable for application to a slicing device in operation, and the slicing device is in a slicing process After the slice is formed, the slurry is ground, and the step of recycling the slurry comprises: transporting the sliced slurry to a first centrifuge, and then slicing the slice at the first rotation speed through the first centrifuge The polishing slurry is separated into a first light liquid and a first heavy liquid, wherein the first heavy liquid is used for the cutting device to be used again on the slice; the first light liquid is sent to a cyclone separation group, and The cyclone separation group separates the first light liquid into an overflow and an underflow, wherein the underflow is used for the slicing device to be reused on the slice; and the overflow is delivered to a second centrifuge The second centrifuge separates the overflow into a second light liquid and a second heavy liquid at a second rotation speed greater than the first rotation speed, wherein the second light liquid is used for the cutting device to be applied to the slice again. And the second heavy liquid is a waste abrasive slurry.

Preferably, the step of recycling the slurry slurry further comprises: providing a conditioning tank connected to the slicing device, the first centrifuge, the cyclone separation group, and the second centrifuge; via the first centrifugation After separating the sliced slurry into the first light liquid and the first heavy liquid, the first heavy liquid is sent to the mixing tank; the first light liquid is separated into the same by the cyclone separation group. After the overflow and the underflow, the underflow is sent to the mixing tank; after the polishing slurry is separated into the second light liquid and the second heavy liquid via the second centrifuge, at least part of the second Delivering light liquid to the conditioning tank; adding an unused abrasive slurry to the conditioning tank; and the first heavy liquid, the underflow, at least a portion of the second light liquid, and the unused slurry The blending tank is conditioned to form a regenerated abrasive slurry, and then the regenerated abrasive slurry is conveyed to the slicing apparatus for the slicing apparatus to directly apply the regenerated abrasive slurry to the slicing.

An embodiment of the present invention further provides a polishing slurry recycling device used in the above method for recycling and utilizing a polishing slurry, comprising: the first centrifuge, Connected to the slicing device, and the first centrifuge has a first heavy liquid outlet and a first light liquid outlet; the cyclone separation group is connected to the first light liquid outlet of the first centrifuge, and the The cyclone separation group has an underflow outlet and an overflow outlet; and the second centrifuge is connected to the overflow outlet of the cyclone separation group, and the second centrifuge has a second heavy liquid outlet and a second light Liquid outlet.

Preferably, the polishing slurry recycling device further comprises a mixing tank, and the mixing tank is connected to the slicing device, the first heavy liquid outlet of the first centrifuge, the underflow outlet of the cyclone separation group, and the first a second light liquid outlet of the centrifuge, the mixing tank being adapted to be filled with an unused abrasive slurry, the mixing tank having a stirrer, and the stirrer for placing the liquid placed in the blending tank Mix and mix.

In summary, the polishing slurry recycling method provided by the embodiment of the present invention and the polishing slurry recycling and utilization device used in the polishing slurry recycling method can directly and effectively recover the sliced polishing slurry on the production line. And through the mixing tank to achieve the effect of recycling; in addition, the processing of the slurry after cutting, no need to add water or heating, thereby reducing energy consumption and cost.

The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.

[Preferred embodiment]

Referring to FIG. 1 , the present invention is a method for recycling and utilizing a polishing slurry. The slice device 200 is applied to an operation to process a slice of the slurry that is produced by the slice device 200 during the slicing process. The invention is illustrated by the following examples, without being limited thereto.

First, a brief description will be given of a polishing slurry recycling and utilization apparatus 100 used in the above-described polishing slurry recycling method, and then, a polishing slurry recycling method will be described.

It should be noted that the polishing slurry recycling device 100 proposed in the embodiment is only one embodiment. In actual use, the polishing slurry recycling method is not limited to the following polishing slurry recycling. Device 100.

The polishing slurry recycling device 100 includes a first centrifuge 1, a cyclone module 2, a second centrifuge 3, and a mixing tank 4.

The first centrifuge 1 has an inlet 11, a first heavy liquid outlet 12, and a first light liquid outlet 13, and the inlet 11 of the first centrifuge 1 is connected to the slicing device 200.

The cyclone separation group 2 has an inlet 21, an underflow outlet 22, and an overflow outlet 23, and the inlet 21 of the cyclonic separation group 2 is in communication with the first light liquid outlet 13 of the first centrifuge 1.

The second centrifuge 3 has an inlet 31, a second heavy liquid outlet 32, and a second light liquid outlet 33, and the inlet 31 of the second centrifuge 3 communicates with the overflow of the cyclone separation group 2. Exit 23.

It should be noted that since the first centrifuge 1 and the second centrifuge 3 are conventionally existing devices, they can utilize the characteristics of different sedimentation speeds of the solid particles of different densities or particle sizes in the fluid, and separate the above by centrifugal force. Two kinds of solid particles, and the specifics of the first centrifuge 1 and the second centrifuge 3 The structure will not be described here.

Further, the cyclone separation group 2 includes at least one cyclone, preferably three, but is not limited thereto. The cyclone separator can be driven by a pump to make the solid particles of different weights rotate at a high speed in the fluid, the centrifugal force is much larger than the gravity, and the higher the speed, the centrifugation obtained by the heavier solid particles. The greater the settling velocity, the heavier solid particles are separated from the fluid containing the lighter fixed particles. The specific structure of the cyclone separation group 2 is a conventional technical feature, and will not be described herein.

The mixing tank 4 is connected to the slicing apparatus 200, the first heavy liquid outlet 12 of the first centrifuge 1, the underflow outlet 22 of the cyclone separation group 2, and the second light liquid outlet 33 of the second centrifuge 3.

Further, the blending tank 4 is adapted to be filled with an unused abrasive slurry, and the blending tank 4 has a stirrer 41 for agitating the liquid placed in the blending tank 4. .

The polishing slurry recycling apparatus 100 has been described above, and the following description will be given on how to apply the polishing slurry recycling apparatus 100 to the polishing slurry recycling method.

First, the environmental conditions to which the polishing slurry recycling method of the present invention is applied are roughly exemplified as follows, but are not limited thereto.

The slicing apparatus 200 is required to add an unused polishing slurry during the initial operation, and the polishing slurry used therein comprises a plurality of cutting particles and a viscous carrier.

When the slicing device 200 is in operation for slicing, the slicing device 200 will generate a slice of the post-grinding slurry. Further, the post-slipping polishing slurry includes a plurality of wafer chips, the cut particles, and the above A viscous carrier.

That is to say, the ground slurry after slicing has more wafer dust than the unused abrasive slurry. The polishing slurry recycling method of the present invention aims to remove the wafer chips in the slurry after slicing as much as possible, thereby recovering the cut particles and the carrier in the slurry after the slice is reused.

In addition, the average particle diameter and weight of the cut particles are larger than the average particle size and weight of the wafer chips. Moreover, in the embodiment, the wafer chips are swarf, the dicing particles are cerium carbide particles, and the carrier is a viscous glycol liquid.

However, in practical applications, the above-mentioned wafer chips, cutting particles, and carrier can be adjusted according to the development of the industry or the needs of the user, and are not limited to the above types.

Referring to FIG. 2 and referring to FIG. 1 simultaneously, the polishing slurry recycling method includes steps S101 to S105, and the detailed description of the above steps S101 to S105 is substantially as follows.

Step S101: transporting the post-slicing slurry to the first centrifuge 1, and separating the post-slurry slurry into a first light liquid and a first heavy liquid through the first centrifuge 1 at a first rotation speed. .

The first rotation speed is 300G in the embodiment, but is not limited thereto.

Furthermore, the total amount of wafer scraps contained in the first heavy liquid is extremely small, that is, the ratio of the cut particles contained in the first heavy liquid to the wafer shavings can be reused for the slicing apparatus 200. The standard on the slice.

In addition, the first light liquid mainly contains wafer shavings, a carrier, and a small amount of cutting particles.

Step S102: conveying the first heavy liquid to the mixing tank 4, and conveying the first light liquid to the cyclone separation group 2. Thereafter, the first light liquid is separated into an overflow and an underflow via the cyclone separation group 2.

Wherein, the underflow contains a total amount of wafer scraps, that is, the ratio of the cut particles contained in the underflow to the wafer shavings can reach the standard for the slicing apparatus 200 to be reused on the slicing.

Furthermore, the overflow mainly comprises wafer shavings, a carrier, and a very small amount of cutting particles.

Step S103: A part of the above-mentioned underflow is sent to the mixing tank 4, and the overflow is sent to the second centrifuge 3. Thereafter, the overflow is separated into a second light liquid and a second heavy liquid by the second centrifuge 3 at a second rotation speed greater than the first rotation speed.

The second rotation speed is approximately 5 times to 15 times of the first rotation speed. In the embodiment, the second rotation speed is exemplified by 2000G to 3000G, but is not limited thereto.

Furthermore, the second light liquid contains a minimum amount of wafer chips and cutting particles, that is, the carrier contained in the second light liquid can reach the standard for the cutting device 200 to be reused on the slice.

Further, due to the limitations of today's centrifugation (or separation) techniques, the second light liquor can only be re-applied in moderation (not all) depending on the needs of the slicing device 200. In other words, it is not excluded that the second light liquid can only be used again in the slicing apparatus 200 when the centrifugation (or separation) technique is further developed or broken.

Further, the second heavy liquid contains an extremely high proportion of wafer chips, and therefore, the second heavy liquid corresponds to a waste polishing slurry. That is, the second heavy liquid is suitable for transport to a specific waste abrasive processing company 300 for returning Receive processing jobs.

Step S104: conveying at least a portion of the second light liquid to the mixing tank 4, and adding the unused polishing slurry to the mixing tank 4, passing through the agitator 41 of the mixing tank 4, and the first heavy liquid, the underflow, A part of the second light liquid and the unused polishing slurry are conditioned in the mixing tank 4 to form a regenerated abrasive slurry.

It should be noted that the amount of the above-mentioned unused abrasive slurry can be adjusted according to the needs of the user. In the present embodiment, the median diameter of the polishing slurry (D50, which means that the particle diameter smaller than this value accounts for 50% of the total volume) used in the initial operation of the sectioning apparatus 200 is approximately X units. Further, X is larger than zero. Similarly, when the median diameter of the unused polishing slurry is approximately X units, the median diameter of the regenerated polishing slurry is preferably adjusted to be approximately 0.9X units.

In addition, the remaining second light liquid that has not been delivered to the conditioning tank 4 can be transported to a storage tank (not shown) for other use, or the remaining second light liquid can be combined with the second heavy liquid. It is transported to the waste grinding slurry processing company 300 for recycling operations.

Step S105: conveying the above-mentioned regenerated abrasive slurry to the slicing device 200, so that the slicing device 200 directly applies the regenerated abrasive slurry to the slice.

In summary, after performing the above steps through the abrasive slurry recycling apparatus 100, the obtained first heavy liquid and underflow system are used to provide reusable cutting particles, and the second light liquid is used to provide Reusable carrier.

In more detail, if the median particle diameter of the polishing slurry during the different steps is compared, the following results can be obtained.

The median diameter of the polishing slurry used in the initial operation of the slicing apparatus 200 is larger than the median diameter of the regenerated abrasive slurry, and the median diameter of the regenerated abrasive slurry is larger than the slurry after the slicing The median particle size, and the median particle size of the ground slurry after slicing is greater than the median particle size of the waste abrasive slurry.

In more detail, after the actual test, the median diameter of the polishing slurry used in the initial operation of the slicing apparatus is approximately 10 micrometers (μm), and the median diameter of the unused abrasive slurry is also approximately The median diameter of the regenerated abrasive slurry can be adjusted to approximately 9 micrometers under conditions of a micron diameter of 10 micrometers and a post-slicing slurry of approximately 6 micrometers.

That is, the polishing slurry recovery and utilization method and the polishing slurry recovery and utilization apparatus 100 proposed by the present invention can maintain the polishing apparatus in use in the above-described slicing apparatus 200 with the median diameter of 9 μm, thereby achieving the production line. The effect of direct recycling and reuse.

Further, the polishing slurry recycling method in the present embodiment has the effect of forming the regenerated polishing slurry through the mixing tank 4, but it is not excluded to replace the conditioning tank 4 by other means or means.

[Possible effects of the embodiments of the present invention]

The polishing slurry recycling method and the polishing slurry recycling device according to the embodiments of the present invention have the advantages that the reusable can be directly and effectively separated on a production line (eg, a slicing device in operation) Cutting particles and carrier to quickly remove the chippings and pass through the mixing tank to achieve recycling effect; in addition, the processing of the slurry after cutting does not require adding water or heating, thereby reducing energy consumption and cost. Effect; In summary, the present invention provides a low pollution recycling method and apparatus suitable for direct use on a production line.

The above description is only an embodiment of the present invention, and is not intended to limit the scope of the invention.

100‧‧‧ polishing slurry recycling equipment

1‧‧‧First centrifuge

11‧‧‧ Entrance

12‧‧‧First heavy liquid outlet

13‧‧‧First light liquid outlet

2‧‧‧Cyclone separation group

21‧‧‧ entrance

22‧‧‧Bottom outlet

23‧‧‧ overflow outlet

3‧‧‧Second centrifuge

31‧‧‧ Entrance

32‧‧‧Second heavy liquid outlet

33‧‧‧Second light liquid outlet

4‧‧‧Harmonic trough

41‧‧‧Agitator

200‧‧‧Slicing equipment

300‧‧‧Waste abrasive processing company

S101~S105‧‧‧Steps

Figure 1 is a functional block diagram of the present invention.

2 is a schematic flow chart of the steps of the present invention.

100‧‧‧ polishing slurry recycling equipment

1‧‧‧First centrifuge

11‧‧‧ Entrance

12‧‧‧First heavy liquid outlet

13‧‧‧First light liquid outlet

2‧‧‧Cyclone separation group

21‧‧‧ entrance

22‧‧‧Bottom outlet

23‧‧‧ overflow outlet

3‧‧‧Second centrifuge

31‧‧‧ Entrance

32‧‧‧Second heavy liquid outlet

33‧‧‧Second light liquid outlet

4‧‧‧Harmonic trough

41‧‧‧Agitator

200‧‧‧Slicing equipment

300‧‧‧Waste abrasive processing company

Claims (10)

A method for recycling and utilizing a polishing slurry, which is suitable for use in a working slicing device, and the slicing device generates a slice after the slicing process to grind the slurry, and the step of recycling the polishing slurry comprises: after the slicing The slurry is sent to a first centrifuge, and the sliced slurry is separated into a first light liquid and a first heavy liquid by the first centrifuge at a first rotation speed, wherein the first heavy liquid The first light liquid is transported to a cyclone separation group, and the first light liquid is separated into an overflow and an underflow through the cyclone separation group, wherein the bottom stream is used for the underflow. For the slice device to be used again on the slice; and conveying the overflow to a second centrifuge, and separating the overflow into a second via the second centrifuge at a second rotational speed greater than the first rotational speed a light liquid and a second heavy liquid, wherein the second light liquid is used for the cutting device to be applied again to the slice, and the second heavy liquid is a waste abrasive slurry. The method for recycling a slurry according to claim 1, wherein the step further comprises: providing a blending tank connected to the slicing device, the first centrifuge, the cyclone separation group, and the second centrifugation After the sliced post-grinding slurry is separated into the first light liquid and the first heavy liquid via the first centrifuge, the first heavy liquid is transported to the mixing tank; the cyclone separation group is After the first light liquid is separated into the overflow and the underflow, the underflow is sent to the mixing tank; the polishing slurry is separated into the second light liquid and the second centrifuge After the second heavy liquid, at least a portion of the second light liquid is transferred to the mixing tank; an unused abrasive slurry is added to the mixing tank; and the first heavy liquid, the underflow, at least a portion of the The second light liquid and the unused polishing slurry are blended in the mixing tank to form a regenerated abrasive slurry, and then the regenerated abrasive slurry is transported to the slicing device for the slicing device to directly apply the The slurry was regenerated on the slice. The polishing slurry recycling method according to the second aspect of the invention, wherein the median diameter of the polishing slurry used in the initial operation of the cutting device is larger than the median diameter of the regenerated abrasive slurry, the regeneration The median particle diameter of the polishing slurry is larger than the median diameter of the polishing slurry after the sectioning, and the median diameter of the polishing slurry after the sectioning is larger than the median diameter of the waste abrasive slurry. The polishing slurry recycling method according to the third aspect of the invention, wherein the primary particle size (D50) of the polishing slurry used in the initial operation of the cutting device is approximately X units, and X is greater than zero, which is not used. The median particle diameter of the passed polishing slurry is also approximately X units, and the median diameter of the regenerated polishing slurry is approximately 0.9X units. The polishing slurry recycling method according to claim 3, wherein the polishing slurry used in the initial operation of the cutting device has a median diameter of about 10 micrometers (μm), and the unused slurry is used. The median particle size of the material is also approximately 10 microns, and the median particle size of the regenerated abrasive slurry is approximately 9 microns. The method for recycling a slurry according to any one of claims 1 to 5, wherein the slurry after the slicing comprises a plurality of wafer shavings a plurality of cutting particles, and a viscous carrier, the average particle size and weight of the cutting particles are greater than the average particle size and weight of the wafer chips, and the first heavy liquid and the underflow are used to provide The recycled granules are reused and the second light liquor is used to provide a reusable carrier. The method for recycling a slurry according to claim 6, wherein the wafer chips are swarf chips, and the dicing particles are cerium carbide particles, and the carrier is a viscous glycol liquid. The polishing slurry recycling method according to any one of claims 1 to 5, wherein the second rotation speed is approximately 5 to 15 times the first rotation speed. A polishing slurry recycling apparatus using the polishing slurry recycling method according to claim 1, comprising: the first centrifuge connected to the slicing device, and the first centrifuge has a a first heavy liquid outlet and a first light liquid outlet; the cyclone separation group is connected to the first light liquid outlet of the first centrifuge, and the cyclone separation group has an underflow outlet and an overflow outlet; A second centrifuge is connected to the overflow outlet of the cyclone separation group, and the second centrifuge has a second heavy liquid outlet and a second light liquid outlet. The abrasive slurry recycling device of claim 9, further comprising a blending tank, wherein the blending tank is connected to the slicing device, the first heavy liquid outlet of the first centrifuge, and the cyclone separation group An underflow outlet, and a second light liquid outlet of the second centrifuge, the mixing tank is adapted to be filled with an unused abrasive slurry, the mixing tank has a stirrer, and the stirrer is used for placing Carrying out the liquid in the mixing tank Mix and mix.