JP2012125891A - Slurry control device for wire saw - Google Patents

Slurry control device for wire saw Download PDF

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JP2012125891A
JP2012125891A JP2010280225A JP2010280225A JP2012125891A JP 2012125891 A JP2012125891 A JP 2012125891A JP 2010280225 A JP2010280225 A JP 2010280225A JP 2010280225 A JP2010280225 A JP 2010280225A JP 2012125891 A JP2012125891 A JP 2012125891A
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slurry
tank
wire saw
concentration
waste liquid
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JP5624449B2 (en
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Mikio Takasu
幹雄 高須
Masaya Tanaka
雅也 田中
Hiroaki Ueda
弘明 上田
Tsutomu Matsushita
勉 松下
Shinji Kawabuchi
真二 川渕
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IHI Compressor and Machinery Co Ltd
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IHI Compressor and Machinery Co Ltd
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Priority to JP2010280225A priority Critical patent/JP5624449B2/en
Priority to TW100144656A priority patent/TWI533973B/en
Priority to CN201180060317.9A priority patent/CN103237628B/en
Priority to KR1020137015183A priority patent/KR101860296B1/en
Priority to SG2013045786A priority patent/SG191158A1/en
Priority to PCT/JP2011/006964 priority patent/WO2012081239A1/en
Priority to MYPI2013002082A priority patent/MY170481A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007Use, recovery or regeneration of abrasive mediums
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • B24B27/0633Grinders for cutting-off using a cutting wire
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PROBLEM TO BE SOLVED: To facilitate adjustment of slurry supplied to a fixed abrasive grain wire saw and to enable stable cutting.SOLUTION: This slurry control device for the wire saw includes: a first tank 5A receiving slurry waste 3; a centrifugal separator 14 to which the slurry waste 3b in the first tank 5A is introduced to separate slurry 2; a second tank 5B receiving the slurry 2 in the centrifugal separator 14; a slurry supply route 26 supplying the slurry 2 in the second tank 5B to the fixed abrasive grain wire saw 1; a controller 41 detecting a slurry concentration from detection values by a gravimeter 29 and a viscometer 30 provided in a circulation flow passage 28 taking out and circulating the slurry 2 in the second tank 5B; a slurry discharge route 33 discharging part of the slurry 2 in the second tank 5B as waste slurry 31; and a new slurry supply route 38 supplying new slurry 2a to the second tank 5B. The waste slurry 31 is discharged in the slurry discharge route 33 and the new slurry 2a is supplied in the new slurry supply route 38, so that the slurry concentration detected by the controller 41 maintains a specified concentration.

Description

本発明は、固定砥粒ワイヤソーに供給するスラリの調整が容易で且つ安定した切断が図れるようにしたワイヤソーのスラリ管理装置に関するものである。   The present invention relates to a slurry management device for a wire saw in which a slurry supplied to a fixed abrasive wire saw can be easily adjusted and stable cutting can be achieved.

従来から、切断対象ワーク(例えば、シリコンインゴット)を切断してウェハを形成するための装置としてワイヤソーが用いられている。このワイヤソーには、テンションを付与した細いワイヤ列を走行させ、そのワイヤ列に、切削熱を除去するクーラントに切削を行うための砥粒を含有させたスラリを吹き付けながら被切断物をワイヤ列に押し当てることにより、被切断物を複数枚のウェハ状に同時に切断するようにした遊離砥粒ワイヤソーがある(例えば、特許文献1等参照)。   Conventionally, a wire saw has been used as an apparatus for forming a wafer by cutting a workpiece to be cut (for example, a silicon ingot). In this wire saw, a thin wire row to which tension is applied is run, and the object to be cut is made into a wire row while spraying abrasive containing abrasive grains for cutting on the coolant to remove cutting heat. There is a free abrasive wire saw in which an object to be cut is simultaneously cut into a plurality of wafers by pressing (see, for example, Patent Document 1).

又、近年、細いワイヤの表面にダイヤモンド砥粒等を予め付着した固定砥粒ワイヤ列を用いて、そのワイヤ列に、クーラントであるスラリを吹き付けながら被切断物をワイヤ列に押し当てることにより、被切断物を複数枚のウェハ状に同時に切断するようにした固定砥粒ワイヤソーがある(例えば、特許文献2等参照)。   Further, in recent years, by using a fixed abrasive wire array in which diamond abrasive grains or the like are previously attached to the surface of a thin wire, the object to be cut is pressed against the wire array while spraying slurry as coolant on the wire array. There is a fixed abrasive wire saw that cuts an object to be cut into a plurality of wafers simultaneously (see, for example, Patent Document 2).

前記遊離砥粒ワイヤソー及び固定砥粒ワイヤソーでは、シリコンインゴットを切断して多数のウェハを形成するために、切断作業の開始から終了までの間を1つのバッチ操作で行っているのが一般的である。又、このようなワイヤソーからのスラリ廃液は、資源の有効活用、廃棄物の減容化等のために、分離回収を行って再利用することによるスラリ管理が検討されている。   In the loose abrasive wire saw and the fixed abrasive wire saw, in order to form a large number of wafers by cutting a silicon ingot, it is common to perform a single batch operation from the start to the end of the cutting operation. is there. In addition, slurry management by separating and recovering the slurry waste liquid from the wire saw by separating and recovering it is being studied for effective use of resources and volume reduction of waste.

前記遊離砥粒ワイヤソーでは、クーラントに砥粒を混合したスラリをワイヤに供給してシリコンインゴットを切断しているために、遊離砥粒ワイヤソーから排出されるスラリ廃液は、クーラントに砥粒(SiC)と切屑(Si)が混合した状態となっている。そのため、このようなスラリ廃液を分離回収するには、スラリ廃液をクーラントと固形分とに分離すると共に、固形分は砥粒=回収、切屑=廃棄の2段階を踏んで分離することになる。ここで、連続分離を行おうとした場合には、スラリ廃液を連続的に抜き取り、その抜取量と各々の回収量を監視しながら砥粒の回収、切屑の廃棄、新クーラントと新砥粒の調合、再生スラリの返送といった複雑な操作を行う必要があって管理が難しいという問題がある。このため、遊離砥粒ワイヤソーからのスラリ廃液のスラリ管理は一般にバッチ式が主流となっている。   In the loose abrasive wire saw, the slurry in which the abrasive is mixed with the coolant is supplied to the wire to cut the silicon ingot. Therefore, the slurry waste liquid discharged from the loose abrasive wire saw is the abrasive (SiC) in the coolant. And chips (Si) are mixed. Therefore, in order to separate and recover such slurry waste liquid, the slurry waste liquid is separated into a coolant and a solid content, and the solid content is separated in two stages of abrasive grains = recovery and chips = discard. Here, when continuous separation is attempted, the slurry waste liquid is continuously withdrawn, and while monitoring the amount to be withdrawn and the amount to be collected for each, the collection of abrasive grains, the disposal of chips, the preparation of new coolant and new abrasive grains There is a problem that it is difficult to manage because it is necessary to perform complicated operations such as returning the regenerated slurry. For this reason, the batch type is generally used for slurry management of slurry waste liquid from loose abrasive wire saws.

又、前記固定砥粒ワイヤソーでは、クーラントのみからなるスラリを固定砥粒ワイヤに供給してシリコンインゴットを切断しているために、固定砥粒ワイヤソーから排出されるスラリ廃液は、クーラントに切削されたシリコン粒子等が混合されたものとなっている。   In the above-mentioned fixed abrasive wire saw, the slurry consisting only of coolant is supplied to the fixed abrasive wire to cut the silicon ingot. Therefore, the slurry waste liquid discharged from the fixed abrasive wire saw is cut into the coolant. Silicon particles are mixed.

特開平11−309674号公報Japanese Patent Laid-Open No. 11-309664 特開2010−29998号公報JP 2010-29998 A

前記固定砥粒ワイヤソーでは、前記遊離砥粒ワイヤソーに比して切断速度を大幅に高められることが知られており、切断速度が早いために、スラリの品質(即ち、スラリ中の固形分の比重から得られる濃度に対して固形分の粘度から得られる粒径を考慮した切断性を表わすスラリ濃度)を精度良く制御しないと、切断品質が安定しないという問題がある。バッチ式のスラリ管理では切断開始時と切断終了時のスラリ濃度が大きく変化して切断品質が変化することになるため、固定砥粒ワイヤソーのスラリ廃液の管理にバッチ式を採用することは困難である。又、バッチ式を用いて安定した品質のスラリを固定砥粒ワイヤソーに供給するためには大量のスラリを貯留しておく必要があるために、設備及びコストが増加するという問題がある。   It is known that the fixed abrasive wire saw can greatly increase the cutting speed as compared to the loose abrasive wire saw. Since the cutting speed is high, the quality of the slurry (that is, the specific gravity of the solid content in the slurry). If the slurry concentration (representing the cutting property in consideration of the particle size obtained from the viscosity of the solid content) is not accurately controlled with respect to the concentration obtained from the above, the cutting quality is not stable. In batch type slurry management, the slurry concentration at the start of cutting and at the end of cutting greatly changes the cutting quality, so it is difficult to adopt the batch type for managing the slurry waste liquid of fixed abrasive wire saws. is there. In addition, in order to supply a slurry of stable quality to a fixed abrasive wire saw using a batch system, it is necessary to store a large amount of slurry, and there is a problem that equipment and cost increase.

このため、固定砥粒ワイヤソーのスラリ廃液の管理には、少量のスラリを用いて切断したスラリ廃液を連続分離して再利用する管理が望ましいが、従来、スラリ廃液から固体粒子を容易に安定して分離することができ、しかも、切断に適したスラリ濃度に調整したスラリを固定砥粒ワイヤソーに安定供給できるようにしたスラリの管理について開示したものは存在していない。   For this reason, it is desirable to manage the slurry waste liquid of fixed abrasive wire saws by continuously separating and reusing the slurry waste liquid cut with a small amount of slurry, but conventionally, solid particles have been easily stabilized from the slurry waste liquid. However, there is no disclosure of the management of the slurry that enables the slurry adjusted to the slurry concentration suitable for cutting to be stably supplied to the fixed abrasive wire saw.

本発明の目的は、上記従来の問題点に鑑みてなしたもので、固定砥粒ワイヤソーに供給するスラリの調整が容易で且つ安定した切断が図れるようにしたワイヤソーのスラリ管理装置を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide a wire saw slurry management apparatus that can easily adjust the slurry supplied to a fixed abrasive wire saw and that can achieve stable cutting. It is in.

上記目的を達成するために、本発明のワイヤソーのスラリ管理装置は、固定砥粒ワイヤソーからのスラリ廃液を受けて貯留する第1槽と、該第1槽のスラリ廃液を導入して固体粒子を分離する遠心分離機と、該遠心分離機で固体粒子が分離されたスラリを受けて貯留する第2槽と、該第2槽のスラリを前記固定砥粒ワイヤソーに供給するスラリ供給系路と、前記第2槽のスラリを取り出して循環する循環流路に備えた比重計及び粘度計と、前記比重計による比重検出値と前記粘度計による粘度検出値を取り入れて、スラリ中の固形分の比重から得られる濃度に対して固形分の粘度から得られる粒径を考慮したスラリ濃度を検出する制御器と、第2槽のスラリの一部を廃スラリとして排出するスラリ排出系路と、新スラリを前記第2槽に供給する新スラリ供給系路とを備え、前記制御器は、前記検出しているスラリ濃度が規定濃度を保持するように、前記スラリ排出系路による廃スラリの排出と新スラリ供給系路による新スラリの供給とを行うようにしたことを特徴としている。   In order to achieve the above object, a wire saw slurry management apparatus according to the present invention receives a slurry waste liquid from a fixed abrasive wire saw and stores the first tank, and introduces the slurry waste liquid of the first tank to obtain solid particles. A centrifuge to separate, a second tank for receiving and storing a slurry from which solid particles have been separated by the centrifuge, a slurry supply path for supplying the slurry of the second tank to the fixed abrasive wire saw, The specific gravity of the solid content in the slurry is obtained by taking in the specific gravity meter and the viscometer provided in the circulation flow path for taking out and circulating the slurry of the second tank, the specific gravity detection value by the specific gravity meter and the viscosity detection value by the viscometer. A controller for detecting the slurry concentration in consideration of the particle size obtained from the viscosity of the solid content with respect to the concentration obtained from the slurry, a slurry discharge system for discharging a part of the slurry of the second tank as waste slurry, and a new slurry Is supplied to the second tank A new slurry supply system, and the controller discharges the waste slurry by the slurry discharge system and the new slurry by the new slurry supply system so that the detected slurry concentration maintains a specified concentration. It is characterized by the fact that the supply is performed.

上記ワイヤソーのスラリ管理装置において、前記第1槽にサイクロ分離機を備え、前記固定砥粒ワイヤソーからのスラリ廃液をサイクロン分離機に導いて固体粒子の濃度を高めたスラリ廃液を前記遠心分離機に供給することは好ましい。   In the wire saw slurry management apparatus, the first tank is provided with a cyclo separator, and the slurry waste liquid from the fixed abrasive wire saw is guided to the cyclone separator to increase the concentration of solid particles in the centrifuge. It is preferable to supply.

又、上記ワイヤソーのスラリ管理装置において、前記規定濃度が、固定砥粒ワイヤソーによる安定切断が可能な最大濃度であることは好ましい。   In the wire saw slurry management apparatus, it is preferable that the specified concentration is a maximum concentration at which stable cutting with a fixed abrasive wire saw is possible.

又、上記ワイヤソーのスラリ管理装置において、前記第1槽と第2槽とを一体に構成し、第1槽のスラリ廃液がオーバーフロー壁を介して第2槽に供給されるようにしたことは好ましい。   In the wire saw slurry management apparatus, it is preferable that the first tank and the second tank are integrally configured so that the slurry waste liquid in the first tank is supplied to the second tank through the overflow wall. .

本発明のワイヤソーのスラリ管理装置によれば、第1槽に受け入れたスラリ廃液を遠心分離機に導いて固体粒子を分離することにより得たスラリを第2槽に供給し、該第2槽のスラリを固定砥粒ワイヤソーに供給するようにし、第2槽のスラリの固形分の濃度を示す比重に対して固形分の粒径を示す粘度を考慮したスラリ濃度が規定濃度になるように、第2槽のスラリの一部を廃スラリとして排出すると共に、新スラリを前記第2槽に供給するようにしたので、比較的小さな容積の第1槽と第2槽及び遠心分離機によりスラリ廃液から規定濃度のスラリを生成することができ、且つ規定濃度のスラリを固定砥粒ワイヤソーに供給することにより常に安定した切断が確保できるという優れた効果を奏し得る。   According to the slurry management device for a wire saw of the present invention, the slurry obtained by separating the solid particles by introducing the slurry waste liquid received in the first tank to the centrifuge is supplied to the second tank, The slurry is supplied to the fixed abrasive wire saw, and the slurry concentration in consideration of the viscosity indicating the particle size of the solid content with respect to the specific gravity indicating the solid content concentration of the slurry in the second tank is set to the specified concentration. Since a part of the slurry in the two tanks is discharged as waste slurry and the new slurry is supplied to the second tank, the first tank, the second tank, and the centrifuge having a relatively small volume are used to remove the slurry from the slurry waste liquid. An excellent effect that a slurry having a specified concentration can be generated and a stable cutting can always be secured by supplying the slurry having a specified concentration to the fixed abrasive wire saw can be obtained.

本発明におけるワイヤソーのスラリ管理装置の一実施例を示すブロック図である。It is a block diagram which shows one Example of the slurry management apparatus of the wire saw in this invention. 本発明によるスラリの管理と、従来においてスラリ廃液をバッチ処理した際の管理を比較して示した線図である。It is the diagram which compared and showed the management of the slurry by this invention, and the management at the time of batch-processing the slurry waste liquid conventionally.

以下、本発明の実施の形態を図示例と共に説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図1は本発明におけるワイヤソーのスラリ管理装置の一実施例を示すブロック図であり、図中、1は固定砥粒ワイヤソーであり、固定砥粒ワイヤソー1ではクーラントからなるスラリ2が供給されて図示しない固定砥粒ワイヤによるインゴットの切断を行っており、固定砥粒ワイヤソー1から排出されるスラリ廃液3は液受け容器4で受けている。   FIG. 1 is a block diagram showing an embodiment of a wire saw slurry management apparatus according to the present invention. In the figure, reference numeral 1 denotes a fixed abrasive wire saw, and the fixed abrasive wire saw 1 is supplied with a slurry 2 made of coolant. The ingot is cut by the fixed abrasive wire that is not used, and the slurry waste liquid 3 discharged from the fixed abrasive wire saw 1 is received by the liquid receiving container 4.

図中、5は貯槽であり、該貯槽5は、内部に備えたオーバーフロー壁6によって左右に仕切られた第1槽5Aと第2槽5Bを形成しており、第1槽5Aには下側に向かって先細り形状のサイクロン分離機7が設けられている。   In the figure, reference numeral 5 denotes a storage tank, and the storage tank 5 forms a first tank 5A and a second tank 5B which are partitioned on the left and right by an overflow wall 6 provided inside, and the first tank 5A has a lower side. A cyclone separator 7 having a tapered shape is provided.

前記液受け容器4のスラリ廃液3は、ポンプ8を備えた廃液取入系路9によって前記第1槽5Aに設けたサイクロン分離機7に供給されるようになっている。即ち、廃液取入系路9は、前記先細り形状のサイクロン分離機7の大径部に設けた接線方向の導入口10に対してスラリ廃液3を導入するように接続されており、これによりサイクロン分離機7の小径端11からはスラリ濃度が高められたスラリ廃液3bが取り出され、又、大径側の中心口12からはスラリ濃度が低下したスラリ廃液3aが第1槽5A内に排出されるようになっている。   The slurry waste liquid 3 in the liquid receiving container 4 is supplied to a cyclone separator 7 provided in the first tank 5A by a waste liquid intake system path 9 provided with a pump 8. That is, the waste liquid intake passage 9 is connected so as to introduce the slurry waste liquid 3 into the tangential inlet 10 provided in the large-diameter portion of the tapered cyclone separator 7. The slurry waste liquid 3b having an increased slurry concentration is taken out from the small diameter end 11 of the separator 7, and the slurry waste liquid 3a having a reduced slurry concentration is discharged into the first tank 5A from the central port 12 on the large diameter side. It has become so.

前記サイクロン分離機7の小径端11は取出系路13を介して遠心分離機14に接続されており、前記小径端11からのスラリ濃度が高められたスラリ廃液3bは、遠心分離機14によって固体粒子15と、固体粒子の含有が低下されたスラリ2とに分けられ、固体粒子15は回収容器16に回収され、スラリ2はスラリタンク17に回収される。   The small-diameter end 11 of the cyclone separator 7 is connected to a centrifuge 14 via a take-out line 13, and the slurry waste liquid 3 b having an increased slurry concentration from the small-diameter end 11 is solidified by the centrifuge 14. It is divided into the particles 15 and the slurry 2 in which the content of solid particles is reduced. The solid particles 15 are collected in the collection container 16, and the slurry 2 is collected in the slurry tank 17.

前記スラリタンク17のスラリ2はポンプ18を備えた供給管19により前記第2槽5Bに供給するようにしている。前記取出系路13と供給管19には比重計23,24が設けてあり、この比重計23,24による比重の計測によって遠心分離機14での固体粒子の除去率が求められるようになっている。   The slurry 2 of the slurry tank 17 is supplied to the second tank 5B through a supply pipe 19 provided with a pump 18. The take-out line 13 and the supply pipe 19 are provided with specific gravity meters 23 and 24. By measuring the specific gravity with the specific gravity meters 23 and 24, the removal rate of the solid particles in the centrifuge 14 is obtained. Yes.

前記第2槽5Bの内部のスラリ2は、ポンプ25を有するスラリ供給系路26によって前記固定砥粒ワイヤソー1に供給されるようになっている。又、前記第2槽5Bの内部のスラリ2をポンプ27により取り出して再び前記第2槽5Bに戻す循環流路28が設けてあり、該循環流路28には比重計29と温度計30aが付属された粘度計30を設けている。   The slurry 2 inside the second tank 5B is supplied to the fixed abrasive wire saw 1 by a slurry supply system passage 26 having a pump 25. A circulation passage 28 is provided for taking out the slurry 2 inside the second tank 5B by the pump 27 and returning it to the second tank 5B. A hydrometer 29 and a thermometer 30a are provided in the circulation passage 28. An attached viscometer 30 is provided.

前記循環流路28には、循環しているスラリ2を廃スラリ31として廃スラリタンク32に排出するためのスラリ排出系路33が設けてあり、前記循環流路28とスラリ排出系路33には、スラリ2を廃スラリタンク32へ排出するように切り替えるバルブ34,35を設けている。尚、前記ではスラリ排出系路33を循環流路28に接続して設けた場合について説明したが、前記第2槽5Bのスラリ2を廃スラリタンク32に直接排出するようにスラリ排出系路33を独立して設けるようにしてもよい。   The circulation channel 28 is provided with a slurry discharge system path 33 for discharging the circulating slurry 2 as a waste slurry 31 to a waste slurry tank 32, and the circulation channel 28 and the slurry discharge system path 33 are provided with the slurry channel 31. Are provided with valves 34 and 35 for switching the slurry 2 to be discharged into the waste slurry tank 32. In the above description, the case in which the slurry discharge path 33 is connected to the circulation path 28 has been described. However, the slurry discharge path 33 so as to directly discharge the slurry 2 of the second tank 5B to the waste slurry tank 32. May be provided independently.

又、前記第2槽5Bには、新スラリタンク36に貯留された新スラリ2aを、ポンプ37により供給するようにした新スラリ供給系路38が設けられている。図1中、39は第2槽5Bに設けた攪拌機、40は前記第1槽5Aのスラリ廃液3aがオーバーフロー壁6を超えて前記第2槽5Bに流入した際にスラリ廃液3aを下方へ向かわせて攪拌機39によって撹拌されるように案内するガイド壁である。   The second tank 5B is provided with a new slurry supply system path 38 in which the new slurry 2a stored in the new slurry tank 36 is supplied by a pump 37. In FIG. 1, reference numeral 39 denotes a stirrer provided in the second tank 5B, and 40 denotes the slurry waste liquid 3a downward when the slurry waste liquid 3a in the first tank 5A flows into the second tank 5B over the overflow wall 6. The guide wall is guided so as to be stirred by the stirrer 39.

図1中、41は制御器であり、制御器41は、前記比重計29による比重検出値と前記温度計30aが付属された粘度計30による粘度・温度検出値を入力して、スラリ2中の固形分の粒度を考慮したスラリ濃度(固定砥粒ワイヤソー1での切断性能に関係する値)を検出している。そして、制御器41において検出しているスラリ濃度が規定濃度に達した場合には、制御器41は、前記バルブ34,35を操作して第2槽5B内の所定量のスラリ2を廃スラリ31として廃スラリタンク32に排出し、同時に、ポンプ37を駆動して、新スラリタンク36に貯留された新スラリ2aを、前記廃スラリ31と等量だけ第2槽5Bに供給する。これにより、第2槽5B内のスラリ2のスラリ濃度は規定濃度以下に回復するようになる。   In FIG. 1, reference numeral 41 denotes a controller. The controller 41 inputs the specific gravity detection value by the specific gravity meter 29 and the viscosity / temperature detection value by the viscometer 30 to which the thermometer 30 a is attached. The slurry concentration (a value related to the cutting performance of the fixed abrasive wire saw 1) in consideration of the solids particle size is detected. When the slurry concentration detected by the controller 41 reaches the specified concentration, the controller 41 operates the valves 34 and 35 to remove a predetermined amount of the slurry 2 in the second tank 5B. 31 is discharged to the waste slurry tank 32, and at the same time, the pump 37 is driven to supply the new slurry 2a stored in the new slurry tank 36 to the second tank 5B in the same amount as the waste slurry 31. As a result, the slurry concentration of the slurry 2 in the second tank 5B is restored to a specified concentration or less.

次に、上記実施例の作動を説明する。   Next, the operation of the above embodiment will be described.

固定砥粒ワイヤソー1から液受け容器4に排出されたスラリ廃液3は、ポンプ8の作動により廃液取入系路9を介して前記第1槽5Aに設けたサイクロン分離機7に供給される。すると、サイクロン分離機7の小径端11からはスラリ濃度が高められたスラリ廃液3bが取り出され、又、大径側の中心口12からはスラリ濃度が低下したスラリ廃液3aが第1槽5A内に排出される。   The slurry waste liquid 3 discharged from the fixed abrasive wire saw 1 to the liquid receiving container 4 is supplied to the cyclone separator 7 provided in the first tank 5 </ b> A through the waste liquid intake path 9 by the operation of the pump 8. Then, the slurry waste liquid 3b having an increased slurry concentration is taken out from the small-diameter end 11 of the cyclone separator 7, and the slurry waste liquid 3a having a reduced slurry concentration is taken in the first tank 5A from the central port 12 on the large-diameter side. To be discharged.

前記サイクロン分離機7の小径端11からのスラリ濃度が高いスラリ廃液3bは、取出系路13を介して遠心分離機14に供給されることにより、固体粒子15と、固体粒子の含有が低下されたスラリ2とに分けられ、固体粒子15は回収容器16に回収され、スラリ2はスラリタンク17に回収される。この時、遠心分離機14は供給されるスラリの濃度が高いほど高い分離性能を発揮するので、前記したようにサイクロン分離機7によってスラリ濃度を高めたスラリ廃液3bを遠心分離機14に供給することにより、遠心分離機14は効果的に固体粒子15を分離する。   The slurry waste liquid 3b having a high slurry concentration from the small-diameter end 11 of the cyclone separator 7 is supplied to the centrifuge 14 via the take-out path 13, whereby the solid particles 15 and the content of the solid particles are reduced. The solid particles 15 are collected in a collection container 16 and the slurry 2 is collected in a slurry tank 17. At this time, the higher the concentration of the supplied slurry, the higher the separation performance of the centrifugal separator 14. Therefore, as described above, the slurry waste liquid 3 b whose slurry concentration is increased by the cyclone separator 7 is supplied to the centrifugal separator 14. Thus, the centrifuge 14 effectively separates the solid particles 15.

遠心分離機14によってスラリタンク17に回収されたスラリ2は、ポンプ18の作動により供給管19を介して前記第2槽5Bに供給され、又、該第2槽5Bのスラリ2は、ポンプ25の作動によりスラリ供給系路26を介して前記固定砥粒ワイヤソー1に供給されて循環使用されるようになる。   The slurry 2 collected in the slurry tank 17 by the centrifugal separator 14 is supplied to the second tank 5B through the supply pipe 19 by the operation of the pump 18, and the slurry 2 in the second tank 5B is supplied to the pump 25. As a result of the operation, the slurry is supplied to the fixed abrasive wire saw 1 through the slurry supply system 26 and is circulated for use.

前記第2槽5Bに備えている循環流路28に設けた比重計29からの比重検出値と温度計30aが付属された粘度計30からの粘度・温度検出値が制御器41に入力されており、制御器41は、スラリ2中の固形分の粒度を考慮したスラリ濃度を検出している。   The specific gravity detection value from the specific gravity meter 29 provided in the circulation flow path 28 provided in the second tank 5B and the viscosity / temperature detection value from the viscometer 30 to which the thermometer 30a is attached are input to the controller 41. Therefore, the controller 41 detects the slurry concentration in consideration of the particle size of the solid content in the slurry 2.

図2は、本発明によるスラリの管理と、従来におけるスラリ廃液をバッチ処理した際の管理を比較して示したものであり、横軸に時間、縦軸に比重を示している。ここで、本発明の管理では比重と共に粘度を検出することで、固定砥粒ワイヤソー1での切断性能に影響を与えるスラリ濃度を検出している。即ち、前記遠心分離機14による分離ではその特性上小粒径の固体粒子が蓄積するようになり、このために、比重は高くないのに微細粒子が増加して粘度が高くなることにより、固定砥粒ワイヤソー1による切断性能が低下する問題があり、この問題を解消するために、前記スラリ2中の固形分の粒度を考慮したスラリ濃度を求めて制御している。   FIG. 2 compares the management of the slurry according to the present invention with the conventional management of batch processing of the slurry waste liquid, with the horizontal axis representing time and the vertical axis representing specific gravity. Here, in the management of the present invention, the slurry concentration that affects the cutting performance of the fixed abrasive wire saw 1 is detected by detecting the viscosity together with the specific gravity. That is, in the separation by the centrifugal separator 14, solid particles having a small particle diameter accumulate due to its characteristics. For this reason, although the specific gravity is not high, the fine particles increase and the viscosity becomes high. There is a problem that the cutting performance by the abrasive wire saw 1 is lowered, and in order to solve this problem, the slurry concentration in consideration of the particle size of the solid content in the slurry 2 is obtained and controlled.

前記スラリ濃度が、図2に示す規定濃度Sより低いときは、第2槽5Bのスラリ2をそのまま前記固定砥粒ワイヤソー1に供給する作業を継続する。このとき、図2のXは固定砥粒ワイヤソー1による切断を安定して行うことができる限界値であり、前記規定濃度Sは、前記限界値Xに近い、固定砥粒ワイヤソー1による安定切断が可能な最大濃度である。   When the slurry concentration is lower than the prescribed concentration S shown in FIG. 2, the operation of supplying the slurry 2 in the second tank 5B to the fixed abrasive wire saw 1 as it is is continued. At this time, X in FIG. 2 is a limit value at which cutting with the fixed abrasive wire saw 1 can be performed stably, and the specified concentration S is close to the limit value X and stable cutting with the fixed abrasive wire saw 1 is performed. The maximum concentration possible.

前記制御器41で検出しているスラリ濃度が図2の規定濃度Sに達した場合には、制御器41は、前記バルブ34,35を操作して第2槽5B内の所定量のスラリ2を廃スラリ31として廃スラリタンク32に排出し、同時に、ポンプ37を駆動して、新スラリタンク36の新スラリ2aを、前記廃スラリ31と同等量だけ第2槽5Bに供給する。これにより、第2槽5B内のスラリ2は新スラリ2aによって希釈され、スラリ濃度は規定濃度S以下に回復するようになる。   When the slurry concentration detected by the controller 41 reaches the specified concentration S in FIG. 2, the controller 41 operates the valves 34 and 35 to provide a predetermined amount of slurry 2 in the second tank 5B. The waste slurry 31 is discharged into the waste slurry tank 32, and at the same time, the pump 37 is driven to supply the new slurry 2a of the new slurry tank 36 to the second tank 5B by the same amount as the waste slurry 31. As a result, the slurry 2 in the second tank 5B is diluted with the new slurry 2a, and the slurry concentration is restored to the specified concentration S or less.

上記操作により、第2槽5B内のスラリ2は常に図2の規定濃度S以下に安定して保持されるようになり、このように安定したスラリ濃度のスラリ2が固定砥粒ワイヤソー1に供給されることにより、固定砥粒ワイヤソー1では常に安定した切断が達成されるようになる。   By the above operation, the slurry 2 in the second tank 5B is always stably held below the specified concentration S in FIG. 2, and the slurry 2 having such a stable slurry concentration is supplied to the fixed abrasive wire saw 1. By doing so, the fixed abrasive wire saw 1 always achieves stable cutting.

一方、図2のYは、従来におけるスラリ廃液のバッチ処理を示しており、線Yのようなバッチ処理の場合には、切断作業を継続していくと徐々にスラリ濃度は増加することになるため、先ず、切断終了時のスラリ濃度を限界値Xの直前値になるように設定し、この切断終了時の設定値が保持されるように切断開始時のスラリ濃度を逆算して求めて調整しているため、従来においては、切断開始時におけるスラリ濃度を極めて低い値に調整する必要があり、このために、膜濾過器等の分離装置による精密な分離を行う必要があり、コストが増加するという問題を有していた。   On the other hand, Y in FIG. 2 shows the conventional batch processing of slurry waste liquid. In the case of batch processing like the line Y, the slurry concentration gradually increases as the cutting operation is continued. Therefore, first, the slurry concentration at the end of cutting is set to be a value immediately before the limit value X, and the slurry concentration at the start of cutting is calculated by back calculation so that the set value at the end of cutting is maintained. Therefore, in the past, it was necessary to adjust the slurry concentration at the start of cutting to a very low value, which necessitates precise separation by a separation device such as a membrane filter, resulting in an increase in cost. Had the problem of doing.

これに対し、本発明では、図2に示したように、スラリ2のスラリ濃度を限界値Xに近い規定濃度Sに調整するようにしたので、遠心分離機14を用いてスラリ濃度を規定濃度Sの近い値に維持することは容易となる。即ち、遠心分離機14は、固体粒子の濃度が高いほど回収量が増加する性能を有するので、サイクロン分離機7で濃縮したスラリ廃液3bを遠心分離機14に供給することで固体粒子15を良好に分離することができ、よって、スラリ濃度を規定濃度S以下に容易に保持させることができる。又、上記遠心分離機14による分離によっても、スラリ濃度が規定濃度Sより大きくなってしまう場合には、第2槽5B内のスラリ2の一部を捨てて、新しい新スラリ2aを供給することで規定濃度Sに回復するようにしているので、スラリ2の管理を容易且つ安価に実施することができ、固定砥粒ワイヤソー1に供給するスラリ2を常に安定させられる利点がある。又、スラリ濃度が規定濃度Sより大きくなって外部に排出する廃スラリ31は膜濾過装置、例えばスイングセパレータ等を付属して備えてクーラントの回収率を高めることは好ましい。この場合の膜濾過装置は従来のバッチ式における分離装置に比して飛躍的に小規模なものとすることができる。   On the other hand, in the present invention, as shown in FIG. 2, the slurry concentration of the slurry 2 is adjusted to the specified concentration S close to the limit value X. Therefore, the slurry concentration is adjusted to the specified concentration using the centrifuge 14. It is easy to maintain a value close to S. That is, since the centrifuge 14 has the performance that the recovered amount increases as the concentration of the solid particles increases, the solid particles 15 are improved by supplying the slurry waste liquid 3b concentrated in the cyclone separator 7 to the centrifuge 14. Therefore, the slurry concentration can be easily maintained below the specified concentration S. Further, if the slurry concentration becomes higher than the specified concentration S even after the separation by the centrifugal separator 14, a part of the slurry 2 in the second tank 5B is discarded and a new new slurry 2a is supplied. Therefore, the slurry 2 can be easily and inexpensively managed, and there is an advantage that the slurry 2 supplied to the fixed abrasive wire saw 1 can always be stabilized. Further, it is preferable that the waste slurry 31 discharged to the outside when the slurry concentration exceeds the specified concentration S is provided with a membrane filtration device such as a swing separator to increase the coolant recovery rate. In this case, the membrane filtration device can be drastically reduced in comparison with the conventional batch type separation device.

尚、複数備えられている固定砥粒ワイヤソー1からのスラリ廃液3を第1槽5Aに導入した場合には、第1槽5Aのスラリ廃液3aがオーバーフロー壁6を超えて第2槽5Bに供給されることにより対応することができ、又、第1槽5Aのスラリ廃液3aはサイクロン分離機7によってスラリ濃度が高いスラリ廃液3bが分離されたものであるため、このスラリ濃度の低いスラリ廃液3aが第2槽5Bに供給されても問題を生じることはない。このように第1槽5Aと第2槽5Bがオーバーフロー壁6で隔てられて一体に構成した貯槽5によれば、液の受渡しが簡略化され、多量のスラリ廃液3の処理に好適に適用することができる。   In addition, when the slurry waste liquid 3 from the fixed abrasive wire saw 1 provided in plurality is introduced into the first tank 5A, the slurry waste liquid 3a in the first tank 5A is supplied to the second tank 5B over the overflow wall 6. In addition, since the slurry waste liquid 3a in the first tank 5A is separated from the slurry waste liquid 3b having a high slurry concentration by the cyclone separator 7, the slurry waste liquid 3a having a low slurry concentration is used. Is not supplied to the second tank 5B. In this way, according to the storage tank 5 in which the first tank 5A and the second tank 5B are separated from each other by the overflow wall 6, the liquid delivery is simplified, and the first tank 5A and the second tank 5B are suitably applied to the processing of a large amount of slurry waste liquid 3. be able to.

又、前記廃スラリタンク32に排出された廃スラリ31は濾過機等に導いて固液分離することにより、濾液をスラリとして回収し有効利用することができる。   Further, the waste slurry 31 discharged to the waste slurry tank 32 is guided to a filter or the like and separated into solid and liquid, whereby the filtrate can be recovered as slurry and used effectively.

又、本発明のワイヤソーのスラリ管理装置は、上述の実施例にのみ限定されるものではなく、例えば、第1槽5Aと第2槽5Bを一体に設けることなく別個に設けていてもよいこと、その他、本発明の要旨を逸脱しない範囲内において種々変更を加え得ることは勿論である。   Further, the wire saw slurry management device of the present invention is not limited to the above-described embodiment. For example, the first tank 5A and the second tank 5B may be separately provided without being integrally provided. Of course, various modifications can be made without departing from the scope of the present invention.

1 固定砥粒ワイヤソー
2 スラリ
2a 新スラリ
3 スラリ廃液
3a スラリ廃液
3b スラリ廃液
5A 第1槽
5B 第2槽
6 オーバーフロー壁
7 サイクロン分離機
14 遠心分離機
15 固体粒子
23,24 比重計
26 スラリ供給系路
28 循環流路
29 比重計
30 粘度計
31 廃スラリ
33 スラリ排出系路
38 新スラリ供給系路
41 制御器
S 規定濃度
DESCRIPTION OF SYMBOLS 1 Fixed abrasive wire saw 2 Slurry 2a New slurry 3 Slurry waste liquid 3a Slurry waste liquid 3b Slurry waste liquid 5A 1st tank 5B 2nd tank 6 Overflow wall 7 Cyclone separator 14 Centrifuge 15 Solid particle 23, 24 Hydrometer 26 Slurry supply system Path 28 Circulating path 29 Hydrometer 30 Viscometer 31 Waste slurry 33 Slurry discharge path 38 New slurry supply path 41 Controller S Specified concentration

Claims (4)

固定砥粒ワイヤソーからのスラリ廃液を受けて貯留する第1槽と、該第1槽のスラリ廃液を導入して固体粒子を分離する遠心分離機と、該遠心分離機で固体粒子が分離されたスラリを受けて貯留する第2槽と、該第2槽のスラリを前記固定砥粒ワイヤソーに供給するスラリ供給系路と、前記第2槽のスラリを取り出して循環する循環流路に備えた比重計及び粘度計と、前記比重計による比重検出値と前記粘度計による粘度検出値を取り入れて、スラリ中の固形分の比重から得られる濃度に対して固形分の粘度から得られる粒径を考慮したスラリ濃度を検出する制御器と、第2槽のスラリの一部を廃スラリとして排出するスラリ排出系路と、新スラリを前記第2槽に供給する新スラリ供給系路とを備え、前記制御器は、前記検出しているスラリ濃度が規定濃度を保持するように、前記スラリ排出系路による廃スラリの排出と新スラリ供給系路による新スラリの供給とを行うようにしたことを特徴とするワイヤソーのスラリ管理装置。   The first tank for receiving and storing the slurry waste liquid from the fixed abrasive wire saw, the centrifuge for separating the solid particles by introducing the slurry waste liquid in the first tank, and the solid particles separated by the centrifuge Specific gravity provided in a second tank for receiving and storing the slurry, a slurry supply system for supplying the slurry in the second tank to the fixed abrasive wire saw, and a circulation channel for taking out and circulating the slurry in the second tank Taking into account the particle size obtained from the viscosity of the solid content with respect to the concentration obtained from the specific gravity of the solid content in the slurry by incorporating the specific gravity detection value by the hydrometer and the viscometer and the viscosity detection value by the viscometer A controller for detecting the slurry concentration, a slurry discharge passage for discharging a part of the slurry in the second tank as waste slurry, and a new slurry supply passage for supplying new slurry to the second tank, The controller is configured to detect the detected slurry. As degree retains a defined concentration, slurry management device wire saw being characterized in that to perform the supply of a new slurry by the discharge and the new slurry supply line of the waste slurry by the slurry discharge pathway. 前記第1槽にサイクロ分離機を備え、前記固定砥粒ワイヤソーからのスラリ廃液をサイクロン分離機に導いて固体粒子の濃度を高めたスラリ廃液を前記遠心分離機に供給するようにしたことを特徴とする請求項1に記載のワイヤソーのスラリ管理装置。   The first tank is provided with a cyclo separator, and the slurry waste liquid from the fixed abrasive wire saw is guided to the cyclone separator to supply the centrifugal separator with the slurry waste liquid whose concentration of solid particles is increased. The slurry management device for a wire saw according to claim 1. 前記規定濃度が、固定砥粒ワイヤソーによる安定切断が可能な最大濃度であることを特徴とする請求項1又は2に記載のワイヤソーのスラリ管理装置。   3. The wire saw slurry management apparatus according to claim 1, wherein the specified concentration is a maximum concentration at which stable cutting with a fixed abrasive wire saw is possible. 4. 前記第1槽と第2槽とを一体に構成し、第1槽のスラリ廃液がオーバーフロー壁を介して第2槽に供給されるようにしたことを特徴とする請求項1〜3のいずれか1つに記載のワイヤソーのスラリ管理装置。   The said 1st tank and the 2nd tank are comprised integrally, The slurry waste liquid of the 1st tank was supplied to the 2nd tank via the overflow wall, The one of Claims 1-3 characterized by the above-mentioned. The wire saw slurry management apparatus according to one.
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JP2010280225A JP5624449B2 (en) 2010-12-16 2010-12-16 Wire saw slurry management device
TW100144656A TWI533973B (en) 2010-12-16 2011-12-05 Saw the slurry management device
KR1020137015183A KR101860296B1 (en) 2010-12-16 2011-12-14 Slurry management device for wire saw
SG2013045786A SG191158A1 (en) 2010-12-16 2011-12-14 Slurry management device for wire saw
CN201180060317.9A CN103237628B (en) 2010-12-16 2011-12-14 The slurry managing device of scroll saw
PCT/JP2011/006964 WO2012081239A1 (en) 2010-12-16 2011-12-14 Slurry management device for wire saw
MYPI2013002082A MY170481A (en) 2010-12-16 2011-12-14 Slurry management device for wire saw

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