CN103231934A - Tape connection mode - Google Patents
Tape connection mode Download PDFInfo
- Publication number
- CN103231934A CN103231934A CN2013101588393A CN201310158839A CN103231934A CN 103231934 A CN103231934 A CN 103231934A CN 2013101588393 A CN2013101588393 A CN 2013101588393A CN 201310158839 A CN201310158839 A CN 201310158839A CN 103231934 A CN103231934 A CN 103231934A
- Authority
- CN
- China
- Prior art keywords
- strip
- overlay film
- tape
- connection mode
- continued access
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Replacement Of Web Rolls (AREA)
Abstract
The invention relates to a tape connection mode which can be adjusted according to SMT tape types and can achieve the easy connection of a tape with an existing automation device consistently. The tape connected through the tape connection mode does not need to be additionally provided with a sequential tap or other sequential materials, has good connection coherence and consistent thickness and cannot cause coating film recovery clogging. The key technology of the tape connection mode is that the coating film on the surface of the tape is subjected to abutting fusion according to the physical characteristic of the tape. The tape connection mode is novel and low in production cost, needs no additional auxiliary, fits the production characteristic of products in the same class completely, has coherent coating film recovery and eliminates the production downtime caused by other factors. In addition, the tape connection mode has the advantages of being easy to operate, reliable in connection, short in operation time and the like.
Description
Technical field
The present invention relates to electronics production and processing field, specifically is a Seed packaged band connection mode.
Background technology
Surfacd Mounting Technolegy is called for short SMT, it is a kind of surface mounting technology, it is latest generation electronics package technique, it is collapsed into volume with traditional electronic devices and components and has only 1/tens device, thereby realized the high density of electronic product assembling, highly reliable, miniaturization, low cost, and the automation of producing.The components and parts of this miniaturization are called SMY device (or claiming SMC, chip device), and the process that this kind element is assembled in the printing (or other substrate) is called SMT technology.Relevant mounting equipment then is called SMT equipment.Advanced electronic product particularly at computing machine and communication class electronic product, generally adopts the SMT technology.The SMY device yield rises year by year in the world, and traditional devices output descends year by year, and therefore along with the passing between advancing, the SMT technology will be more and more universal.
Large batch of chip device transports mostly by preformed groove position on substrate, again chip device is encapsulated in the preformed groove position on the substrate, covering the last layer film at the substrate that is packaged with chip device again realizes, the substrate that is packaged with chip device is commonly referred to as strip, in production practice, be that strip directly is connected on the automation equipment mostly, by the stepping facility of automation equipment strip sent into erecting equipment, re-stripping film formula device is realized the installation of chip device.Owing to adopt the chip device use amount of web feed often bigger, the contained chip device of one coiled strip band is limited, this just need use strip and connect the special-purpose band that connects material, generally speaking, the band that connects material is divided into the single face band that connects material mostly, the two-sided band that connects material, band and the special use band that connects material all can connect material, though can solve a part of problem by these bands that connect material, but there is more problem equally, there is optical aberration as some band that connects material, easily the automation equipment of realizing the strip location by optical detection is caused deviations, and additionally added connect material the band strip on thickness, often can not reach conformability, easily the automation equipment feed end is resulted in blockage, influence efficient.The most important point is because the band that connects material can not be unified with the strip model, often in use causes the continuity of strip to interrupt, though removed the influence that switching on and shutting down cause from, amid a sharp increase to the positioning requirements of strip.
Summary of the invention
The present invention is above technical matters just, and providing a kind of can regulate according to the strip model, and is easy to the strip connection mode that is connected with existing automation equipment.
The present invention is achieved through the following technical solutions:
One Seed packaged band connection mode is characterized in that this connection mode comprises following a few step:
One, the strip location installs the continued access strip, and positions by the knock hole on strip next door;
Two, the overlay film on the continued access strip substrate is peeled off in strip cutting, and the substrate of cutting integral multiple unit gap length, makes on the continued access strip front end overlay film standby after having more one section;
Three, strip connects, treat when preceding strip is about to use up, to fix at preceding strip tail end, the continued access strip of step 2 well cutting being had more the front end of one section overlay film overlaps with tail end at preceding strip again, the front end that the continued access strip is had more one section overlay film by anchor clamps clamps with tail end at preceding strip again, and the one side that anchor clamps contact with overlay film is by moment high temperature overlay film that the continued access strip is had more and be fused together at the overlay film of preceding strip tail end;
Four, strip resets, with after the overlay film fusion of preceding strip tail end, cooling off and link together, specialized equipment resets at the overlay film that the continued access strip is had more through step 3, with the continued access strip move to use up in preceding strip position, wait for next continued access strip location, so circulation.
The strip that connects by this kind mode need not other adjunction strip or other materials that connects material, it is good to connect continuity, consistency of thickness, and can not cause overlay film to reclaim and stop up, its gordian technique is the physical property according to raw band, and the overlay film on strip surface is docked fusion.As required the overlay film specification of Lian Jieing determine the overlay film weld length and moment high temperature temperature and time length, namely to guarantee the overlay film fusion, can link together after the cooling, also to prevent the overheated fusing of overlay film.The connection mode method of attachment novelty that the present invention relates to; need not additionally assist material; productive costs is low; and connection mode this class industry characteristics of fitting fully, overlay film reclaims and links up, and having eliminated that production that other modes bring shuts down may; in addition; the present invention also has simple to operate, connects characteristics such as reliable, production time weak point.In addition, unit length control strip length according to the strip packaging also is one of innovative point, namely to guarantee overlay film fusion, cooled continuity, also will reduce strip length as far as possible, so by " integral multiple unit gap length " Cutting Length be limited in the step 2.
The specific embodiment
The present invention will be further described below in conjunction with specific embodiment.
One Seed packaged band connection mode is characterized in that this connection mode comprises following a few step:
One, the strip location installs the continued access strip, and positions by the knock hole on strip next door;
Two, strip cutting is peeled off the overlay film on the continued access strip substrate, and is cut the substrate of single times of unit gap length, and it is standby that the front end overlay film is had more after the single times of unit gap length;
Three, strip connects, treat when preceding strip is about to use up, to fix at preceding strip tail end, the continued access strip of step 2 well cutting being had more the front end of single times of unit gap length overlay film overlaps with tail end at preceding strip again, the front end that the continued access strip is had more single times of unit gap length overlay film by anchor clamps clamps with tail end at preceding strip again, and the one side that anchor clamps contact with overlay film is by moment high temperature overlay film that the continued access strip is had more and be fused together at the overlay film of preceding strip tail end;
Four, strip resets, with after the overlay film fusion of preceding strip tail end, cooling off and link together, specialized equipment resets at the overlay film that the continued access strip is had more through step 3, with the continued access strip move to use up in preceding strip position, wait for next continued access strip location, so circulation.
The strip that connects by this kind mode need not other adjunction strip or other materials that connects material, it is good to connect continuity, consistency of thickness, and can not cause overlay film to reclaim and stop up, its gordian technique is the physical property according to raw band, and the overlay film on strip surface is docked fusion.As required the overlay film specification of Lian Jieing determine the overlay film weld length and moment high temperature temperature and time length, namely to guarantee the overlay film fusion, can link together after the cooling, also to prevent the overheated fusing of overlay film.The connection mode method of attachment novelty that the present invention relates to; need not additionally assist material; productive costs is low; and connection mode this class industry characteristics of fitting fully, overlay film reclaims and links up, and having eliminated that production that other modes bring shuts down may; in addition; the present invention also has simple to operate, connects characteristics such as reliable, production time weak point.
In addition; can pass through to reserve at strip the overlay film of certain-length, thereby reduce strip step of the present invention, belong to the less more bad embodiment of Applicable scope owing to lack the connection mode of strip step; do not give unnecessary details at this, but do not show that the present invention abandons the protection to this embodiment.
Claims (1)
1. a Seed packaged band connection mode is characterized in that this connection mode comprises following a few step:
One, the strip location installs the continued access strip, and positions by the knock hole on strip next door;
Two, strip cutting is peeled off the overlay film on the continued access strip substrate, and is cut the substrate of single times of unit gap length, and it is standby that the front end overlay film is had more after the single times of unit gap length;
Three, strip connects, treat when preceding strip is about to use up, to fix at preceding strip tail end, the continued access strip of step 2 well cutting being had more the front end of single times of unit gap length overlay film overlaps with tail end at preceding strip again, the front end that the continued access strip is had more single times of unit gap length overlay film by anchor clamps clamps with tail end at preceding strip again, and the one side that anchor clamps contact with overlay film is by moment high temperature overlay film that the continued access strip is had more and be fused together at the overlay film of preceding strip tail end;
Four, strip resets, with after the overlay film fusion of preceding strip tail end, cooling off and link together, specialized equipment resets at the overlay film that the continued access strip is had more through step 3, with the continued access strip move to use up in preceding strip position, wait for next continued access strip location, so circulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101588393A CN103231934A (en) | 2013-05-03 | 2013-05-03 | Tape connection mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101588393A CN103231934A (en) | 2013-05-03 | 2013-05-03 | Tape connection mode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103231934A true CN103231934A (en) | 2013-08-07 |
Family
ID=48880025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101588393A Pending CN103231934A (en) | 2013-05-03 | 2013-05-03 | Tape connection mode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103231934A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211620A (en) * | 2016-07-18 | 2016-12-07 | 环鸿电子（昆山）有限公司 | A kind of chip mounter automatic reset method and system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04243757A (en) * | 1991-01-22 | 1992-08-31 | Tdk Corp | Automatic connecting device for series of chip component |
| EP1002753A1 (en) * | 1998-11-18 | 2000-05-24 | Sihl GmbH | Method to remove units of laminated webs that consist of a multitude of units |
| CN1347836A (en) * | 2000-10-11 | 2002-05-08 | 松下电器产业株式会社 | Connecting piece for connecting delivery belt and delivery belt connecting method using with the same connecting piece |
| CN101652303A (en) * | 2007-03-30 | 2010-02-17 | 松下电器产业株式会社 | Working device, adhesive tape applying device, and method of adding tape member |
| CN101815663A (en) * | 2007-10-03 | 2010-08-25 | 松下电器产业株式会社 | Adhesive tape application device and tape connection method |
-
2013
- 2013-05-03 CN CN2013101588393A patent/CN103231934A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04243757A (en) * | 1991-01-22 | 1992-08-31 | Tdk Corp | Automatic connecting device for series of chip component |
| EP1002753A1 (en) * | 1998-11-18 | 2000-05-24 | Sihl GmbH | Method to remove units of laminated webs that consist of a multitude of units |
| CN1347836A (en) * | 2000-10-11 | 2002-05-08 | 松下电器产业株式会社 | Connecting piece for connecting delivery belt and delivery belt connecting method using with the same connecting piece |
| CN101652303A (en) * | 2007-03-30 | 2010-02-17 | 松下电器产业株式会社 | Working device, adhesive tape applying device, and method of adding tape member |
| CN101815663A (en) * | 2007-10-03 | 2010-08-25 | 松下电器产业株式会社 | Adhesive tape application device and tape connection method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211620A (en) * | 2016-07-18 | 2016-12-07 | 环鸿电子（昆山）有限公司 | A kind of chip mounter automatic reset method and system |
| CN106211620B (en) * | 2016-07-18 | 2018-10-16 | 环鸿电子（昆山）有限公司 | A kind of chip mounter automatic reset method and system |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130807 |