CN100546445C - The method of a kind of printed substrate and housing injection moulding thereof and device - Google Patents
The method of a kind of printed substrate and housing injection moulding thereof and device Download PDFInfo
- Publication number
- CN100546445C CN100546445C CNB2007101303957A CN200710130395A CN100546445C CN 100546445 C CN100546445 C CN 100546445C CN B2007101303957 A CNB2007101303957 A CN B2007101303957A CN 200710130395 A CN200710130395 A CN 200710130395A CN 100546445 C CN100546445 C CN 100546445C
- Authority
- CN
- China
- Prior art keywords
- printed substrate
- housing
- injection moulding
- mould
- electronic devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The embodiment of the invention discloses a kind of method with printed substrate and shell integral molded plastic, this method may further comprise the steps: printed substrate is fixed in the housing mould; The described housing mould that has described printed substrate is carried out integral molded plastic; Open the shell that described housing mould obtains to be embedded with described printed substrate.The invention also discloses a kind of assembly that is used for printed substrate and shell integral molded plastic, comprise printed substrate and housing mould.The present invention carries out integral molded plastic with printed substrate and shell when in-mould injection, do not need the connection of hardware, so overcome the assembly cost height between the printed substrate and housing, the poor rigidity of resultant complete machine, the big defective of thickness of communication apparatus in the prior art, and then reached with lower cost and obtained the complete machine good rigidly, the communication apparatus that thickness is little.
Description
Technical field
The present invention relates to printed substrate and make the field, particularly relate to the method and the device of a kind of printed substrate and housing injection moulding thereof.
Background technology
In the last few years, consumption electronic product and various communication apparatus were used widely, and miniaturization has become various communication apparatus a kind of trend of development later on.As the printed substrate that is used for communication apparatus at large (PCB, Printed Circuit Board), in various communication apparatus, have following two major functions: the support function that 1, provides various electronic devices and components such as integrated circuit to fix, assemble.2, realize the wiring between the various electronic devices and components such as integrated circuit and be electrically connected (signal transmission) or electric insulation provides desired electrical characteristic, as functions such as characteristic impedances.The mode that assembling between printed substrate and its shell is in the prior art adopted usually is: embed the hardware that will process in advance when plastic casing is carried out injection moulding, and then printed substrate is fixed on the plastic casing by hardware.As shown in Figure 1, be prior art printed substrate and shell assembling schematic diagram, when shell 3 is carried out injection moulding, hardware 2 is embedded in the shell 3 used housing moulds, hardware 2 and shell 3 are carried out integral molded plastic, obtain the shell 3 of embedded hardware 2, and then printed substrate is fixed on the housing 3 by hardware 2.
In realizing the process of the embodiment of the invention, the inventor finds to exist following problem in the mounting technology of existing printed substrate and its housing: 1, owing to the complexity of the assembly technology between printed substrate and the housing cause expensive; 2, can not reach desirable rigidity by the fixing made complete machine of hardware.
Summary of the invention
The embodiment of the invention provides the method and the device of a kind of printed substrate and housing injection moulding thereof, the problem that assembly technology complexity in the solution prior art between printed substrate and the housing and complete machine rigidity can not reach ideal standard.
For achieving the above object, the embodiment of the invention proposes the method for a kind of printed substrate and housing injection moulding thereof on the one hand, it is characterized in that, may further comprise the steps: printed substrate is fixed in the housing mould; The described housing mould that has described printed substrate is carried out integral molded plastic; Housing mould after described injection moulding obtains described printed substrate and housing thereof.
On the other hand, the embodiment of the invention also provides the assembly of a kind of printed substrate and housing injection moulding thereof, it is characterized in that, comprise printed substrate and housing mould, described housing mould is fixed in described printed substrate in the described housing mould by positioner, obtains printed substrate and shell thereof behind the described housing mould integral molded plastic that is fixed with printed substrate.
The technical scheme of the embodiment of the invention has the following advantages, because when in-mould injection, printed substrate and shell are carried out integral molded plastic, so do not need the connection of hardware, therefore the assembly cost height between the printed substrate and housing, the poor rigidity of resultant complete machine, the defective that communication apparatus thickness is big in the prior art have been overcome, and then reached with lower cost and obtained the complete machine good rigidly, the communication apparatus that thickness is little.
Description of drawings
Fig. 1 is prior art printed substrate and shell assembling schematic diagram;
Fig. 2 is the schematic diagram of the method for embodiment of the invention printed substrate and housing injection moulding thereof;
Fig. 3 is the flow chart of the method for embodiment of the invention printed substrate and housing injection moulding thereof;
Fig. 4 is embodiment of the invention housing mould and printed substrate assembling schematic diagram;
Fig. 5 is an embodiment of the invention housing mould schematic diagram.
Embodiment
Temperature when prior art is thought integral molded plastic in the mould is too high, electronic devices and components on printed substrate or the printed substrate can suffer damage when injection moulding, and can't guarantee the reliability of printed substrate, therefore all adopt earlier in the enclosure in the prior art, again the method for printed substrate and case body being fixed by hardware with the hardware injection moulding.Yet the inventor finds that printed substrate is at SMT (surface mounting technology; Surfaced Mounting Technology) can bear the high temperature of 260 degree the time; and general injection temperature is just between 230 degree-260 degree; therefore can when injection moulding, printed substrate and shell be carried out integral molded plastic; certainly the embodiment of the invention also can adopt the electronic devices and components on the certain methods protection printed substrate; particularly to the protection of the electronic devices and components of high temp. sensitive, thereby overcome the resistant to elevated temperatures problem of printed substrate in the integral molded plastic process.
As shown in Figure 2, schematic diagram for the method for embodiment of the invention printed substrate and housing injection moulding thereof, printed substrate 1 need not to assemble by hardware 2 and shell 3 after integral molded plastic is finished, thereby has overcome the assembly cost height between the printed substrate and housing, the poor rigidity of resultant complete machine, the defective that communication apparatus thickness is big in the prior art.
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail:
Be illustrated in figure 3 as the flow chart of the method for embodiment of the invention printed substrate and housing injection moulding thereof, this method can be widely used in the production of each electronic product, for example each electronic product such as mobile phone, notebook computer, MP3, MP4, intelligent terminal, display.This embodiment may further comprise the steps:
Step S301 is fixed on printed substrate in the housing mould.
In the injection moulding starting stage, printed substrate is fixed in the housing mould, like this so that in this printed substrate and shell injection moulding, can finish the assembling of printed substrate and shell, thereby reduce the step of assembling.Wherein, this printed substrate is the printed substrate that has assembled electronic devices and components, and this printed substrate can also assemble the device to high temp. sensitive.Can adopt multiple mode that printed substrate is fixed in the housing mould, for example adopt mechanical means such as rivet is fixed, screw, the embodiment of the invention has proposed a kind of method comparatively easily, by at least one pair of location hole and fastening screw printed substrate is fixed in the housing mould, wherein the logarithm of location hole and fastening screw can be determined in practical operation according to the size of printed substrate, if printed substrate more greatly then just need many location hole and fastening screw to be fixed.For example in printed substrate, stay location hole, and the while adds fastening screw on housing mould, the shape of this fastening screw is identical with the shape of location hole, inserts above-mentioned location hole by this fastening screw and makes it possible to firm being fixed in the housing mould of printed substrate.This fastening screw and location hole can adopt multiple shape, for example circular, rectangle or other shape, main purpose be with printed substrate can be stable be fixed in the housing mould.
Step S302 carries out housing mould matched moulds and carries out integral molded plastic, just printed substrate and housing is carried out integral molded plastic.Generally housing mould can be divided into two parts up and down, after being fixed on printed substrate in the housing mould, the matched moulds of two parts up and down of housing mould can be carried out injection moulding to this housing mould, thereby obtains the housing of injection mo(u)lding behind matched moulds.Yet the embodiment of the invention to fixing top or the bottom with housing mould of printed substrate limited, as long as this printed substrate is fixed in this housing mould inside, will not be injection-moulded in printed substrate on the shell in injection moulding.Because printed substrate can bear the high temperature of 260 degree when SMT, and general injection temperature is just spent between-260 degree 230, so injection moulding can not produce any damage to printed substrate.
Step S303 opens housing mould and obtains printed substrate and housing thereof.After injection moulding is finished to housing mould, open the shell that housing mould takes out injection moulding, this moment, this shell can be embedded with printed substrate, so just exempted in the enclosure earlier in the enclosure, then in the complex steps that printed substrate is fixed on hardware or the working of plastics hardware or working of plastics injection moulding.And like this with respect under same volume, printed substrate and housing all being greater than tradition by the form of fixing of hardware with printed substrate and housing in conjunction with reliability and rigidity by in-mould injection.
By the embodiment of the invention printed substrate and shell are carried out integral molded plastic, therefore do not need the connection of hardware, thereby the assembly cost height between the printed substrate and housing, the poor rigidity of resultant complete machine, the big defective of thickness of communication apparatus in the prior art have been overcome, and then reached with lower cost and obtained the complete machine good rigidly, the beneficial effect of the communication apparatus that thickness is little.And for the electronic product of large-scale production, can further reduce the production cost of production firm, improve the speed of production of product owing to reduced processing step.
The embodiment of the invention has also proposed the method for kinds of protect at the electronic devices and components on the printed substrate; for example cavity is set, makes the high temperature plastic cement can not flow to electronic devices and components on the printed substrate top in zone corresponding on the housing mould with electronic devices and components on the printed substrate.The position of this cavity electronic devices and components on the position on the housing mould and printed substrate is corresponding, can prevent when injection moulding the high temperature plastic cement to the infringement of electronic devices and components, thereby solve electronic devices and components on the printed substrate are difficult to withstand high temperatures in the integral molded plastic process problem.
The embodiment of the invention also proposes a kind of method of electronic devices and components protection, for example is that the electronic devices and components on the printed substrate are provided with heat shield when injection moulding.In the process of integral molded plastic, use the heat shield of a metal that electronic devices and components are covered, in order to the electronic devices and components on the printed substrate being protected when the integral molded plastic, thereby ensure the operate as normal of heat-sensitive device on the printed substrate.
Certainly not all electronic devices and components all must be protected; can optionally protect according to the different qualities of electronic devices and components it; for example only protection may just not need protection for the electronic devices and components that can not be subjected to temperatures involved to the electronic devices and components of high temp. sensitive.For electronic devices and components to the serious sensitivity of high temperature; can also adopt the mode of above-mentioned two kinds of method combinations to protect; be that the mode that cavity adds heat shield is protected it; so just can accomplish general protection to printed substrate; guarantee that the electronic devices and components on it also can not be subjected to the infringement of high temperature, guarantee that reliability of products and stability can not reduce.
The embodiment of the invention also proposes a kind of heat dissipation problem for the solution printed substrate, and the method for thermal hole is set in the shell relevant position, forms thermal hole by the thermal hole formpiston on the housing mould on shell, helps the heat radiation of printed substrate like this.Because in the electronic equipment use; during printed substrate work; electronic devices and components on it can produce a large amount of heats; if can not in time these heats be dissipated; then can cause electronic devices and components work undesired or burn out, thereby have influence on the operate as normal of printed substrate and even whole communication apparatus.So the heat that the printed substrate of the thermal hole that forms on shell by the thermal hole formpiston in the injection moulding engineering in can assurance equipment in use produced spreads in time to guarantee the normal use of whole communication apparatus.
The embodiment of the invention has also proposed a kind of assembly with printed substrate and shell integral molded plastic at above-mentioned method with printed substrate and shell integral molded plastic, as shown in Figure 4 and Figure 5, is embodiment of the invention housing mould schematic diagram.This assembly with printed substrate and shell integral molded plastic comprises printed substrate 1 and housing mould 4, housing mould 4 is fixed in printed substrate 1 in the housing mould 4 by positioner, obtain printed substrate and shell 3 thereof behind housing mould 4 integral molded plastics, wherein, printed substrate 1 has been finished the assembling of electronic devices and components.Because printed substrate 1 can bear the high temperature of 260 degree when SMT, and general injection temperature is just spent between-260 degree 230, so injection moulding can not produce any damage to printed substrate 1.After housing mould 4 integral molded plastics are finished, open housing mould 4 and take out the shell 3 of injection moulding, this moment, this shell 3 can be embedded with printed substrate 1, so just exempted in shell 3 earlier hardware or working of plastics being injection-moulded in the shell 3, and then printed substrate 1 has been fixed on complex steps on hardware or the working of plastics.And with respect under same volume, printed substrate 1 and housing 3 all being greater than tradition by the form of fixing of hardware with printed substrate and housing in conjunction with reliability and rigidity by in-mould injection.
Wherein, above-mentioned positioner can adopt multiple traditional mechanical fixed form, for example adopt mechanical means such as rivet is fixed, screw, the embodiment of the invention proposes a kind of positioner and comprises at least one pair of location hole 6 and fastening screw 5, for example be preset in location hole 6 on the printed substrate 1 and the fastening screw 5 on the outer casing mold 4, insert above-mentioned location hole 6 by this fastening screw 5 and make it possible to printed substrate 1 firm being fixed in the housing mould 4.Wherein the shape of this fastening screw 5 is identical with the shape of location hole 6, and this fastening screw 5 and location hole 6 can adopt multiple shape, for example circular, rectangle or other shape, main purpose be with printed substrate 1 can be stable be fixed in the housing mould 4.Wherein the logarithm of location hole and fastening screw can be determined in practical operation according to the size of printed substrate, if printed substrate more greatly then just need many location hole and fastening screw to be fixed.
Wherein, housing mould 4 comprises cavity 7, this cavity 7 be arranged on printed substrate 1 on the corresponding zone of electronic devices and components is arranged, make the high temperature plastic cement can not flow to electronic devices and components on the printed substrate 1 top.The position of this cavity 7 electronic devices and components on the position on the housing mould 4 and printed substrate 1 is corresponding, can prevent when injection moulding the high temperature plastic cement to the infringement of electronic devices and components, thereby solve electronic devices and components on the printed substrate 1 are difficult to withstand high temperatures in the integral molded plastic process problem.
Wherein, this assembly also comprises heat shield; be used for the electronic devices and components on the protection printed substrate 1 when injection moulding; in the process of integral molded plastic, use the heat shield of a metal that electronic devices and components are covered; in order to the electronic devices and components on the printed substrate 1 being protected when the integral molded plastic, thereby ensure the operate as normal of heat-sensitive device on the printed substrate 1.Same not all electronic devices and components all are to need above-mentioned cavity 7 and heat shield protection; can optionally protect according to the different qualities of electronic devices and components it; for example only protection may just not need protection for the electronic devices and components that can not be subjected to temperatures involved to the electronic devices and components of high temp. sensitive.For electronic devices and components to the serious sensitivity of high temperature; can also adopt the mode of above-mentioned two kinds of method combinations to protect; be that the mode that cavity 7 adds heat shield is protected it; so just can accomplish general protection to printed substrate; guarantee that the electronic devices and components on it also can not be subjected to the infringement of high temperature, guarantee that reliability of products and stability can not reduce.
Wherein, housing mould also comprises the thermal hole formpiston; be used on shell, forming thermal hole; this thermal hole is for the printed substrate heat radiation, because in the electronic equipment use, during printed substrate work; electronic devices and components on it can produce a large amount of heats; if can not in time these heats be dissipated, then can cause electronic devices and components work undesired or burn out, thereby have influence on the operate as normal of printed substrate and even whole communication apparatus.So the heat that the printed substrate of the thermal hole that forms on shell by the thermal hole formpiston in the injection moulding engineering in can assurance equipment in use produced spreads in time to guarantee the normal use of whole communication apparatus.
By above-mentioned assembly with printed substrate and shell integral molded plastic, printed substrate and shell can be carried out integral molded plastic, therefore do not need the connection of hardware, thereby the assembly cost height between the printed substrate and housing, the poor rigidity of resultant complete machine, the big defective of thickness of communication apparatus in the prior art have been overcome, and then reached with lower cost and obtained the complete machine good rigidly, the beneficial effect of the communication apparatus that thickness is little.And for the electronic product of large-scale production, can further reduce the production cost of production firm, improve the speed of production of product owing to reduced processing step.
The above only is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (13)
1, the method for a kind of printed substrate and housing injection moulding thereof is characterized in that, may further comprise the steps:
Printed substrate is fixed in the housing mould;
The described housing mould that has described printed substrate is carried out integral molded plastic;
Housing mould after described injection moulding obtains described printed substrate and housing thereof.
2, the method for printed substrate and housing injection moulding thereof according to claim 1, it is characterized in that described printed substrate is fixed in the housing mould specifically comprises: described printed substrate is fixed in the described housing mould by at least one pair of location hole and fastening screw.
3, the method for printed substrate and housing injection moulding thereof according to claim 1, it is characterized in that, describedly the described housing mould that has described printed substrate is carried out integral molded plastic also comprise: on described housing, form the thermal hole that makes described printed substrate heat radiation.
4, the method for printed substrate and housing injection moulding thereof according to claim 1, it is characterized in that, described be fixed on printed substrate in the housing mould after, with, described the described housing mould that has described printed substrate is carried out also comprising before the integral molded plastic: cavity is set in zone corresponding on the described housing mould with electronic devices and components on the described printed substrate.
5, the method for printed substrate and housing injection moulding thereof according to claim 1, it is characterized in that, described be fixed on printed substrate in the housing mould after, with, described the described housing mould that has described printed substrate is carried out also comprising before the integral molded plastic: for the electronic devices and components on the described printed substrate are provided with heat shield.
6, as the method for printed substrate as described in claim 4 or 5 and housing injection moulding thereof, it is characterized in that described electronic devices and components are heat-sensitive device.
7, as the method for printed substrate and housing injection moulding thereof as described in any one in the claim 1 to 5, it is characterized in that described printed substrate is for having assembled the printed substrate of electronic devices and components.
8, the assembly of a kind of printed substrate and housing injection moulding thereof, it is characterized in that, comprise printed substrate and housing mould, described housing mould is fixed in described printed substrate in the described housing mould by positioner, obtains printed substrate and housing thereof behind the described housing mould integral molded plastic that is fixed with printed substrate.
9, as the assembly of printed substrate as described in the claim 8 and housing injection moulding thereof, it is characterized in that described positioner comprises at least one pair of location hole and fastening screw.
10, as the assembly of printed substrate as described in the claim 8 and housing injection moulding thereof, it is characterized in that described housing mould comprises cavity, described cavity be arranged on printed substrate on the corresponding zone of electronic devices and components is arranged.
11, as the assembly of printed substrate as described in the claim 8 and housing injection moulding thereof, it is characterized in that, also comprise heat shield, be used for when injection moulding, protecting the electronic devices and components on the described printed substrate.
12, as the assembly of printed substrate as described in the claim 8 and housing injection moulding thereof, it is characterized in that described housing mould comprises the thermal hole formpiston, be used on described housing, forming thermal hole that described thermal hole is for described printed substrate heat radiation.
13, as the assembly of printed substrate as described in the claim 8 and housing injection moulding thereof, it is characterized in that described printed substrate has been finished the assembling of electronic devices and components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101303957A CN100546445C (en) | 2007-07-19 | 2007-07-19 | The method of a kind of printed substrate and housing injection moulding thereof and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101303957A CN100546445C (en) | 2007-07-19 | 2007-07-19 | The method of a kind of printed substrate and housing injection moulding thereof and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101080149A CN101080149A (en) | 2007-11-28 |
| CN100546445C true CN100546445C (en) | 2009-09-30 |
Family
ID=38907293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101303957A Active CN100546445C (en) | 2007-07-19 | 2007-07-19 | The method of a kind of printed substrate and housing injection moulding thereof and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100546445C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101740836B (en) * | 2009-12-25 | 2013-10-09 | 华为终端有限公司 | Preparation method of power unit and power unit |
| CN101791839A (en) * | 2010-03-23 | 2010-08-04 | 上海日用-友捷汽车电气有限公司 | Injection molding method of PWM (Pulse Width Modulation) controller shell body and metal pins |
| CN102711003B (en) * | 2012-01-05 | 2015-11-11 | 瑞声声学科技(深圳)有限公司 | Loud speaker, loudspeaker housing and preparation method thereof |
| CN103200762B (en) * | 2012-01-10 | 2018-03-06 | 欧司朗股份有限公司 | Circuit board and its manufacture method and the lighting device with the circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2744127Y (en) * | 2004-10-28 | 2005-11-30 | 康佳集团股份有限公司 | PCB board mounting supporter |
-
2007
- 2007-07-19 CN CNB2007101303957A patent/CN100546445C/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2744127Y (en) * | 2004-10-28 | 2005-11-30 | 康佳集团股份有限公司 | PCB board mounting supporter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101080149A (en) | 2007-11-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2175708B1 (en) | Electronic module with heat sink | |
| CN100546445C (en) | The method of a kind of printed substrate and housing injection moulding thereof and device | |
| CN102088130A (en) | Shell of electronic device and manufacturing method thereof | |
| KR20060111404A (en) | Electronic circuit device and manufacturing method of the same | |
| CN103140064B (en) | The method for designing of housing and housing, comprise the electronic equipment of this housing | |
| CA2608550A1 (en) | Electronic control unit and process of producing the same | |
| CN104703446A (en) | Electronic device and manufacturing method thereof | |
| KR101448257B1 (en) | Waterproof type receptacle connector | |
| US8957829B2 (en) | Antenna module and method for making the same | |
| JP4995866B2 (en) | Electronic component mounting structure and mounting method | |
| CN109040379B (en) | Transparent mobile terminal | |
| CN106707662A (en) | Camera structure | |
| CN201247437Y (en) | Apparatus capable of restraining memory electromagnetic wave radiation | |
| CN204614784U (en) | Semiconductor device, intelligent power module and air conditioner | |
| CN208767544U (en) | A kind of connector and photographic device | |
| CN1907679A (en) | Method of protecting casing of low-voltage ejection shaping circuit | |
| CN204130728U (en) | Wire and cable connector | |
| CN104954514B (en) | Terminal and its method for making | |
| CN102340962A (en) | Fixed structure and electronic device employing same | |
| CN218676070U (en) | High-protection USB device | |
| JP3073162B2 (en) | Electronic equipment housing | |
| JP2008270688A (en) | Electric and electronic module for motor vehicle | |
| CN204536996U (en) | Can the all-in-one of intelligent control system temperature | |
| CN217936251U (en) | Communication equipment casing structure | |
| CN104219592A (en) | Shell structure with electroacoustic device, equipment with electroacoustic device and manufacturing method of shell structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |