CN103222054A - 具有蛇形导体和芯体的电感器 - Google Patents

具有蛇形导体和芯体的电感器 Download PDF

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Publication number
CN103222054A
CN103222054A CN2011800541007A CN201180054100A CN103222054A CN 103222054 A CN103222054 A CN 103222054A CN 2011800541007 A CN2011800541007 A CN 2011800541007A CN 201180054100 A CN201180054100 A CN 201180054100A CN 103222054 A CN103222054 A CN 103222054A
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CN
China
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section
segments
wire
main
segment
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Pending
Application number
CN2011800541007A
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English (en)
Chinese (zh)
Inventor
P·司美思
A·帕普
P·J·霍波
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National Semiconductor Corp
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National Semiconductor Corp
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Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of CN103222054A publication Critical patent/CN103222054A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements

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  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
CN2011800541007A 2010-11-10 2011-08-31 具有蛇形导体和芯体的电感器 Pending CN103222054A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/943,391 2010-11-10
US12/943,391 US8338913B2 (en) 2010-11-10 2010-11-10 Semiconductor inductor with a serpentine shaped conductive wire interlaced with a serpentine shaped ferromagnetic core
PCT/US2011/049903 WO2012064398A1 (en) 2010-11-10 2011-08-31 Inductor with serpentine shaped conductor and core

Publications (1)

Publication Number Publication Date
CN103222054A true CN103222054A (zh) 2013-07-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800541007A Pending CN103222054A (zh) 2010-11-10 2011-08-31 具有蛇形导体和芯体的电感器

Country Status (5)

Country Link
US (1) US8338913B2 (https=)
JP (1) JP2013542619A (https=)
CN (1) CN103222054A (https=)
TW (1) TWI502713B (https=)
WO (1) WO2012064398A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9601833B2 (en) 2013-03-25 2017-03-21 Wavcatcher Broadband notch antennas
WO2016159986A1 (en) 2015-03-31 2016-10-06 Halliburton Energy Services Inc. Plug tracking through surface mounted equipment
GB2557706A (en) 2015-05-15 2018-06-27 Halliburton Energy Services Inc Geometrically configurable multi-core inductor and methods for tools having particular space constraints
US11348875B2 (en) * 2020-02-27 2022-05-31 Micron Technology, Inc. Semiconductor devices with flexible connector array

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0725407A1 (en) * 1995-02-03 1996-08-07 International Business Machines Corporation Three-dimensional integrated circuit inductor

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196505A (ja) * 1985-02-26 1986-08-30 Nec Corp インダクタンス構造体
JPH03125412A (ja) * 1989-10-11 1991-05-28 Amorufuasu Denshi Device Kenkyusho:Kk インダクタンス素子
JPH0992538A (ja) * 1995-09-21 1997-04-04 Canon Inc プリントインダクタおよびプリント基板
JPH10233315A (ja) * 1997-02-19 1998-09-02 Citizen Electron Co Ltd 表面実装型コイルおよびその製造方法
US6452247B1 (en) 1999-11-23 2002-09-17 Intel Corporation Inductor for integrated circuit
US6493861B1 (en) 1999-12-28 2002-12-10 Intel Corporation Interconnected series of plated through hole vias and method of fabrication therefor
US6990725B2 (en) * 2001-10-05 2006-01-31 Fontanella Mark D Fabrication approaches for the formation of planar inductors and transformers
US7705421B1 (en) 2005-11-18 2010-04-27 National Semiconductor Corporation Semiconductor die with an integrated inductor
KR100725714B1 (ko) 2006-08-29 2007-06-07 동부일렉트로닉스 주식회사 인덕터 및 인덕터 제조방법
US20100259349A1 (en) 2009-04-09 2010-10-14 Qualcomm Incorporated Magnetic Film Enhanced Inductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0725407A1 (en) * 1995-02-03 1996-08-07 International Business Machines Corporation Three-dimensional integrated circuit inductor

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
CHONG H. AHN ET AL.,: "A New Toroidal-Meander Type Integrated Inductor With A Multilevel Meander Magnetic Core", 《IEEE TRANSACTIONS ON MAGNETICS》 *
CHONG H. AHN ET AL.,: "Micromachined Planar Inductors on Silicon Wafers for MEMS Applications", 《IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS》 *
K.SHIRAKAWA ET AL.,: "THIN FILM CLOTH-STRUCTURED INDUCTOR FOR MAGNETIC INTEGRATED CIRCUIT", 《IEEE TRANSACTLONS ON MAGNETICS》 *

Also Published As

Publication number Publication date
US20120112296A1 (en) 2012-05-10
JP2013542619A (ja) 2013-11-21
US8338913B2 (en) 2012-12-25
WO2012064398A1 (en) 2012-05-18
TW201230280A (en) 2012-07-16
TWI502713B (zh) 2015-10-01

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130724