JP2013542619A - 蛇行形状の導体及びコアを備えたインダクタ - Google Patents

蛇行形状の導体及びコアを備えたインダクタ Download PDF

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Publication number
JP2013542619A
JP2013542619A JP2013538718A JP2013538718A JP2013542619A JP 2013542619 A JP2013542619 A JP 2013542619A JP 2013538718 A JP2013538718 A JP 2013538718A JP 2013538718 A JP2013538718 A JP 2013538718A JP 2013542619 A JP2013542619 A JP 2013542619A
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Japan
Prior art keywords
conductive
main
conductive wire
semiconductor structure
segments
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Pending
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JP2013538718A
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English (en)
Japanese (ja)
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JP2013542619A5 (https=
Inventor
スメイズ ピーター
パポウ アンドレイ
ジェイ ホッパー ピーター
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National Semiconductor Corp
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National Semiconductor Corp
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Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of JP2013542619A publication Critical patent/JP2013542619A/ja
Publication of JP2013542619A5 publication Critical patent/JP2013542619A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements

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  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
JP2013538718A 2010-11-10 2011-08-31 蛇行形状の導体及びコアを備えたインダクタ Pending JP2013542619A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/943,391 2010-11-10
US12/943,391 US8338913B2 (en) 2010-11-10 2010-11-10 Semiconductor inductor with a serpentine shaped conductive wire interlaced with a serpentine shaped ferromagnetic core
PCT/US2011/049903 WO2012064398A1 (en) 2010-11-10 2011-08-31 Inductor with serpentine shaped conductor and core

Publications (2)

Publication Number Publication Date
JP2013542619A true JP2013542619A (ja) 2013-11-21
JP2013542619A5 JP2013542619A5 (https=) 2014-09-18

Family

ID=46018808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013538718A Pending JP2013542619A (ja) 2010-11-10 2011-08-31 蛇行形状の導体及びコアを備えたインダクタ

Country Status (5)

Country Link
US (1) US8338913B2 (https=)
JP (1) JP2013542619A (https=)
CN (1) CN103222054A (https=)
TW (1) TWI502713B (https=)
WO (1) WO2012064398A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9601833B2 (en) 2013-03-25 2017-03-21 Wavcatcher Broadband notch antennas
WO2016159986A1 (en) 2015-03-31 2016-10-06 Halliburton Energy Services Inc. Plug tracking through surface mounted equipment
GB2557706A (en) 2015-05-15 2018-06-27 Halliburton Energy Services Inc Geometrically configurable multi-core inductor and methods for tools having particular space constraints
US11348875B2 (en) * 2020-02-27 2022-05-31 Micron Technology, Inc. Semiconductor devices with flexible connector array

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196505A (ja) * 1985-02-26 1986-08-30 Nec Corp インダクタンス構造体
JPH03125412A (ja) * 1989-10-11 1991-05-28 Amorufuasu Denshi Device Kenkyusho:Kk インダクタンス素子
JPH0992538A (ja) * 1995-09-21 1997-04-04 Canon Inc プリントインダクタおよびプリント基板
JPH10233315A (ja) * 1997-02-19 1998-09-02 Citizen Electron Co Ltd 表面実装型コイルおよびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0725407A1 (en) * 1995-02-03 1996-08-07 International Business Machines Corporation Three-dimensional integrated circuit inductor
US6452247B1 (en) 1999-11-23 2002-09-17 Intel Corporation Inductor for integrated circuit
US6493861B1 (en) 1999-12-28 2002-12-10 Intel Corporation Interconnected series of plated through hole vias and method of fabrication therefor
US6990725B2 (en) * 2001-10-05 2006-01-31 Fontanella Mark D Fabrication approaches for the formation of planar inductors and transformers
US7705421B1 (en) 2005-11-18 2010-04-27 National Semiconductor Corporation Semiconductor die with an integrated inductor
KR100725714B1 (ko) 2006-08-29 2007-06-07 동부일렉트로닉스 주식회사 인덕터 및 인덕터 제조방법
US20100259349A1 (en) 2009-04-09 2010-10-14 Qualcomm Incorporated Magnetic Film Enhanced Inductor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196505A (ja) * 1985-02-26 1986-08-30 Nec Corp インダクタンス構造体
JPH03125412A (ja) * 1989-10-11 1991-05-28 Amorufuasu Denshi Device Kenkyusho:Kk インダクタンス素子
JPH0992538A (ja) * 1995-09-21 1997-04-04 Canon Inc プリントインダクタおよびプリント基板
JPH10233315A (ja) * 1997-02-19 1998-09-02 Citizen Electron Co Ltd 表面実装型コイルおよびその製造方法

Also Published As

Publication number Publication date
US20120112296A1 (en) 2012-05-10
CN103222054A (zh) 2013-07-24
US8338913B2 (en) 2012-12-25
WO2012064398A1 (en) 2012-05-18
TW201230280A (en) 2012-07-16
TWI502713B (zh) 2015-10-01

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