JP6465467B2 - 薄膜型インダクター - Google Patents
薄膜型インダクター Download PDFInfo
- Publication number
- JP6465467B2 JP6465467B2 JP2017225002A JP2017225002A JP6465467B2 JP 6465467 B2 JP6465467 B2 JP 6465467B2 JP 2017225002 A JP2017225002 A JP 2017225002A JP 2017225002 A JP2017225002 A JP 2017225002A JP 6465467 B2 JP6465467 B2 JP 6465467B2
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- JP
- Japan
- Prior art keywords
- coil
- thin film
- film inductor
- inductor according
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010409 thin film Substances 0.000 title claims description 48
- 238000007747 plating Methods 0.000 claims description 28
- 239000004020 conductor Substances 0.000 claims description 16
- 239000000696 magnetic material Substances 0.000 claims description 15
- 239000011810 insulating material Substances 0.000 claims description 14
- 230000003746 surface roughness Effects 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
Description
1 本体
21、22 第1及び第2外部電極
11 磁性物質
12 コイル
3 絶縁層
Claims (16)
- コイルを封止する磁性物質を含む本体と、
前記本体の外部面上に配置される第1及び第2外部電極と、を含む薄膜型インダクターであって、
前記コイルは、コイル本体と、前記外部電極と前記コイル本体を互いに連結するビア部と、を含み、
前記ビア部は、前記第1外部電極と直接連結されており、
前記コイル本体は、下部のベース導体層と、上部のめっき層と、で構成され、
前記ビア部は、前記ベース導体層及び前記第1外部電極と直接連結される、薄膜型インダクター。 - 前記本体は、ビア部が延びる方向に沿って互いに向かい合う上面及び下面を有し、
前記第1及び第2外部電極は、前記下面に互いに離隔するように配置される、請求項1に記載の薄膜型インダクター。 - 前記第1及び第2外部電極は、本体の下面からそれに隣接した本体の端面に延びる、請求項2に記載の薄膜型インダクター。
- 前記コイルは絶縁層により囲まれており、前記絶縁層は、前記コイルと前記磁性物質とを絶縁させる、請求項1から3のいずれか一項に記載の薄膜型インダクター。
- 前記ビア部は、少なくとも1つのビアホールと、前記ビアホールを充填するビア電極と、を含む、請求項1から4のいずれか一項に記載の薄膜型インダクター。
- 前記コイル本体は複数のコイルパターンを含み、前記複数のコイルパターンのうち最内側コイルパターンは、ベース導体層を介して前記ビア部と直接連結される、請求項1から5のいずれか一項に記載の薄膜型インダクター。
- 前記コイル本体の下部の少なくとも一部には絶縁材が残存する、請求項1から6のいずれか一項に記載の薄膜型インダクター。
- 前記絶縁材の最大厚さが30μm以下である、請求項7に記載の薄膜型インダクター。
- 前記絶縁材において、前記第1及び第2外部電極と互いに向かい合う絶縁材の下面の表面粗さ(Ra_lower)は、前記絶縁材の下面と向かい合う上面の表面粗さ(Ra_upper)より大きい、請求項7または8に記載の薄膜型インダクター。
- 前記コイル本体は複数のコイルパターンを含み、前記複数のコイルパターンのうち最外側コイルパターンは、前記コイルの引き出し部を介して前記第2外部電極と直接連結される、請求項1から9のいずれか一項に記載の薄膜型インダクター。
- 前記引き出し部は、前記ビア部と互いに直角を成し、前記本体の外部面に露出する、請求項10に記載の薄膜型インダクター。
- 前記めっき層は異方性めっき層を含む、請求項1から11のいずれか一項に記載の薄膜型インダクター。
- 前記めっき層のコイルの成長方向は、前記ビア部が延びる方向と一致する、請求項1から12のいずれか一項に記載の薄膜型インダクター。
- 前記第1及び第2外部電極はL字状の電極である、請求項1から13のいずれか一項に記載の薄膜型インダクター。
- 前記コイルの上面は、上側に向かって凸の曲線状である、請求項1から14のいずれか一項に記載の薄膜型インダクター。
- チップの形態で構成され、前記チップの全厚さが200μm以上300μm以下である、請求項1に記載の薄膜型インダクター。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2017-0085286 | 2017-07-05 | ||
KR1020170085286A KR101952873B1 (ko) | 2017-07-05 | 2017-07-05 | 박막형 인덕터 |
Publications (2)
Publication Number | Publication Date |
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JP2019016767A JP2019016767A (ja) | 2019-01-31 |
JP6465467B2 true JP6465467B2 (ja) | 2019-02-06 |
Family
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Family Applications (1)
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JP2017225002A Active JP6465467B2 (ja) | 2017-07-05 | 2017-11-22 | 薄膜型インダクター |
Country Status (3)
Country | Link |
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US (1) | US10699839B2 (ja) |
JP (1) | JP6465467B2 (ja) |
KR (1) | KR101952873B1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102118490B1 (ko) | 2015-05-11 | 2020-06-03 | 삼성전기주식회사 | 다층 시드 패턴 인덕터 및 그 제조방법 |
JP7198000B2 (ja) * | 2018-05-28 | 2022-12-28 | 太陽誘電株式会社 | コイル部品及び電子機器 |
KR102609159B1 (ko) * | 2019-03-06 | 2023-12-05 | 삼성전기주식회사 | 코일 부품 |
KR102178528B1 (ko) * | 2019-06-21 | 2020-11-13 | 삼성전기주식회사 | 코일 전자부품 |
DE102019129260B4 (de) * | 2019-10-30 | 2021-06-10 | Infineon Technologies Ag | Schaltung mit Transformator und entsprechendes Verfahren |
KR20220009212A (ko) * | 2020-07-15 | 2022-01-24 | 삼성전기주식회사 | 코일 부품 |
KR102450601B1 (ko) | 2020-11-23 | 2022-10-07 | 삼성전기주식회사 | 코일 부품 |
KR20220077750A (ko) | 2020-12-02 | 2022-06-09 | 삼성전기주식회사 | 코일 부품 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3500319B2 (ja) * | 1998-01-08 | 2004-02-23 | 太陽誘電株式会社 | 電子部品 |
JP4046827B2 (ja) | 1998-01-12 | 2008-02-13 | Tdk株式会社 | 平面コイル及び平面トランス |
JP4458093B2 (ja) * | 2005-01-07 | 2010-04-28 | 株式会社村田製作所 | 電子部品及び電子部品製造方法 |
JP2012064683A (ja) * | 2010-09-15 | 2012-03-29 | Murata Mfg Co Ltd | 積層型コイル |
KR101219003B1 (ko) * | 2011-04-29 | 2013-01-04 | 삼성전기주식회사 | 칩형 코일 부품 |
JP5644957B2 (ja) * | 2011-10-14 | 2014-12-24 | 株式会社村田製作所 | 電子部品 |
JP6060508B2 (ja) * | 2012-03-26 | 2017-01-18 | Tdk株式会社 | 平面コイル素子およびその製造方法 |
JP6102578B2 (ja) | 2012-09-27 | 2017-03-29 | Tdk株式会社 | 異方性めっき方法 |
JP6212921B2 (ja) | 2013-04-23 | 2017-10-18 | 株式会社村田製作所 | 積層型インダクタ素子およびその製造方法 |
KR20150005292A (ko) | 2013-07-05 | 2015-01-14 | 삼성전기주식회사 | 코일 부품 |
KR101946493B1 (ko) * | 2013-07-16 | 2019-02-11 | 삼성전기 주식회사 | 칩 전자부품 |
JP6312997B2 (ja) * | 2013-07-31 | 2018-04-18 | 新光電気工業株式会社 | コイル基板及びその製造方法、インダクタ |
TWI488198B (zh) * | 2013-08-02 | 2015-06-11 | Cyntec Co Ltd | 多層線圈之製造方法 |
KR102004791B1 (ko) | 2014-05-21 | 2019-07-29 | 삼성전기주식회사 | 칩 전자부품 및 그 실장기판 |
JP6206349B2 (ja) * | 2014-07-08 | 2017-10-04 | 株式会社村田製作所 | インダクタ部品およびその製造方法 |
US20160012956A1 (en) * | 2014-07-11 | 2016-01-14 | Samsung Electro-Mechanics Co., Ltd. | Thin-type common mode filter and manufacturing method thereof |
WO2016039518A1 (ko) | 2014-09-11 | 2016-03-17 | 주식회사 이노칩테크놀로지 | 파워 인덕터 및 그 제조 방법 |
KR101662207B1 (ko) | 2014-09-11 | 2016-10-06 | 주식회사 모다이노칩 | 파워 인덕터 |
KR101832554B1 (ko) | 2015-01-28 | 2018-02-26 | 삼성전기주식회사 | 칩 전자부품 및 그 제조방법 |
JP5999278B1 (ja) * | 2015-04-02 | 2016-09-28 | Tdk株式会社 | 複合フェライト組成物および電子部品 |
JP6893761B2 (ja) | 2015-12-02 | 2021-06-23 | Tdk株式会社 | コイル部品の製造方法、コイル部品、及び電源回路ユニット |
-
2017
- 2017-07-05 KR KR1020170085286A patent/KR101952873B1/ko active IP Right Grant
- 2017-11-20 US US15/818,440 patent/US10699839B2/en active Active
- 2017-11-22 JP JP2017225002A patent/JP6465467B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2019016767A (ja) | 2019-01-31 |
US20190013141A1 (en) | 2019-01-10 |
US10699839B2 (en) | 2020-06-30 |
KR20190004914A (ko) | 2019-01-15 |
KR101952873B1 (ko) | 2019-02-27 |
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