TWI502713B - 具有蜿蜒形狀的導線和蜿蜒形狀的強磁核心之半導體電感器以及形成該電感器之方法 - Google Patents

具有蜿蜒形狀的導線和蜿蜒形狀的強磁核心之半導體電感器以及形成該電感器之方法 Download PDF

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Publication number
TWI502713B
TWI502713B TW100135198A TW100135198A TWI502713B TW I502713 B TWI502713 B TW I502713B TW 100135198 A TW100135198 A TW 100135198A TW 100135198 A TW100135198 A TW 100135198A TW I502713 B TWI502713 B TW I502713B
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TW
Taiwan
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section
main core
core
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TW100135198A
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English (en)
Chinese (zh)
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TW201230280A (en
Inventor
彼得 史梅斯
安卓 帕普
彼得Ｊ 哈波
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國家半導體公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
TW100135198A 2010-11-10 2011-09-29 具有蜿蜒形狀的導線和蜿蜒形狀的強磁核心之半導體電感器以及形成該電感器之方法 TWI502713B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/943,391 US8338913B2 (en) 2010-11-10 2010-11-10 Semiconductor inductor with a serpentine shaped conductive wire interlaced with a serpentine shaped ferromagnetic core

Publications (2)

Publication Number Publication Date
TW201230280A TW201230280A (en) 2012-07-16
TWI502713B true TWI502713B (zh) 2015-10-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW100135198A TWI502713B (zh) 2010-11-10 2011-09-29 具有蜿蜒形狀的導線和蜿蜒形狀的強磁核心之半導體電感器以及形成該電感器之方法

Country Status (5)

Country Link
US (1) US8338913B2 (https=)
JP (1) JP2013542619A (https=)
CN (1) CN103222054A (https=)
TW (1) TWI502713B (https=)
WO (1) WO2012064398A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9601833B2 (en) 2013-03-25 2017-03-21 Wavcatcher Broadband notch antennas
WO2016159986A1 (en) 2015-03-31 2016-10-06 Halliburton Energy Services Inc. Plug tracking through surface mounted equipment
GB2557706A (en) 2015-05-15 2018-06-27 Halliburton Energy Services Inc Geometrically configurable multi-core inductor and methods for tools having particular space constraints
US11348875B2 (en) * 2020-02-27 2022-05-31 Micron Technology, Inc. Semiconductor devices with flexible connector array

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196505A (ja) * 1985-02-26 1986-08-30 Nec Corp インダクタンス構造体
JPH03125412A (ja) * 1989-10-11 1991-05-28 Amorufuasu Denshi Device Kenkyusho:Kk インダクタンス素子
EP0725407A1 (en) * 1995-02-03 1996-08-07 International Business Machines Corporation Three-dimensional integrated circuit inductor
JPH0992538A (ja) * 1995-09-21 1997-04-04 Canon Inc プリントインダクタおよびプリント基板
JPH10233315A (ja) * 1997-02-19 1998-09-02 Citizen Electron Co Ltd 表面実装型コイルおよびその製造方法
US6452247B1 (en) 1999-11-23 2002-09-17 Intel Corporation Inductor for integrated circuit
US6493861B1 (en) 1999-12-28 2002-12-10 Intel Corporation Interconnected series of plated through hole vias and method of fabrication therefor
US6990725B2 (en) * 2001-10-05 2006-01-31 Fontanella Mark D Fabrication approaches for the formation of planar inductors and transformers
US7705421B1 (en) 2005-11-18 2010-04-27 National Semiconductor Corporation Semiconductor die with an integrated inductor
KR100725714B1 (ko) 2006-08-29 2007-06-07 동부일렉트로닉스 주식회사 인덕터 및 인덕터 제조방법
US20100259349A1 (en) 2009-04-09 2010-10-14 Qualcomm Incorporated Magnetic Film Enhanced Inductor

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
C H Ahn. et. al "A new toroidal meander type integrated inductor with a multilevel meander magnetic core" January 1994, IEEE Transactions on Magnetic ,Vol.30, No.1, Page 73-79 *
C H Ahn. et. al "Micromachined planar inductors on silicon wafer for MEMS applications" December 1998, IEEE Transactions on industrial electronics ,Vol.45, No.6, Page 866-876 *
K Shirakawa et. al "Thin film cloth structured inductor for magnetic integrated circuit" September 1990, IEEE Transactions on Magnetic ,Vol.26, No.5, Page 2262-2264 *

Also Published As

Publication number Publication date
US20120112296A1 (en) 2012-05-10
JP2013542619A (ja) 2013-11-21
CN103222054A (zh) 2013-07-24
US8338913B2 (en) 2012-12-25
WO2012064398A1 (en) 2012-05-18
TW201230280A (en) 2012-07-16

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