CN103222054A - 具有蛇形导体和芯体的电感器 - Google Patents

具有蛇形导体和芯体的电感器 Download PDF

Info

Publication number
CN103222054A
CN103222054A CN2011800541007A CN201180054100A CN103222054A CN 103222054 A CN103222054 A CN 103222054A CN 2011800541007 A CN2011800541007 A CN 2011800541007A CN 201180054100 A CN201180054100 A CN 201180054100A CN 103222054 A CN103222054 A CN 103222054A
Authority
CN
China
Prior art keywords
section
segments
wire
main
segment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800541007A
Other languages
English (en)
Chinese (zh)
Inventor
P·司美思
A·帕普
P·J·霍波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of CN103222054A publication Critical patent/CN103222054A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN2011800541007A 2010-11-10 2011-08-31 具有蛇形导体和芯体的电感器 Pending CN103222054A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/943,391 2010-11-10
US12/943,391 US8338913B2 (en) 2010-11-10 2010-11-10 Semiconductor inductor with a serpentine shaped conductive wire interlaced with a serpentine shaped ferromagnetic core
PCT/US2011/049903 WO2012064398A1 (en) 2010-11-10 2011-08-31 Inductor with serpentine shaped conductor and core

Publications (1)

Publication Number Publication Date
CN103222054A true CN103222054A (zh) 2013-07-24

Family

ID=46018808

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800541007A Pending CN103222054A (zh) 2010-11-10 2011-08-31 具有蛇形导体和芯体的电感器

Country Status (5)

Country Link
US (1) US8338913B2 (enExample)
JP (1) JP2013542619A (enExample)
CN (1) CN103222054A (enExample)
TW (1) TWI502713B (enExample)
WO (1) WO2012064398A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9601833B2 (en) 2013-03-25 2017-03-21 Wavcatcher Broadband notch antennas
BR112017015813A2 (en) 2015-03-31 2018-03-27 Halliburton Energy Services, Inc. system and method for tracking an object.
WO2016186624A1 (en) 2015-05-15 2016-11-24 Halliburton Energy Services Inc. Geometrically configurable multi-core inductor and methods for tools having particular space constraints
US11348875B2 (en) * 2020-02-27 2022-05-31 Micron Technology, Inc. Semiconductor devices with flexible connector array

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0725407A1 (en) * 1995-02-03 1996-08-07 International Business Machines Corporation Three-dimensional integrated circuit inductor

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196505A (ja) * 1985-02-26 1986-08-30 Nec Corp インダクタンス構造体
JPH03125412A (ja) * 1989-10-11 1991-05-28 Amorufuasu Denshi Device Kenkyusho:Kk インダクタンス素子
JPH0992538A (ja) * 1995-09-21 1997-04-04 Canon Inc プリントインダクタおよびプリント基板
JPH10233315A (ja) * 1997-02-19 1998-09-02 Citizen Electron Co Ltd 表面実装型コイルおよびその製造方法
US6452247B1 (en) 1999-11-23 2002-09-17 Intel Corporation Inductor for integrated circuit
US6493861B1 (en) 1999-12-28 2002-12-10 Intel Corporation Interconnected series of plated through hole vias and method of fabrication therefor
US6990725B2 (en) * 2001-10-05 2006-01-31 Fontanella Mark D Fabrication approaches for the formation of planar inductors and transformers
US7705421B1 (en) 2005-11-18 2010-04-27 National Semiconductor Corporation Semiconductor die with an integrated inductor
KR100725714B1 (ko) 2006-08-29 2007-06-07 동부일렉트로닉스 주식회사 인덕터 및 인덕터 제조방법
US20100259349A1 (en) 2009-04-09 2010-10-14 Qualcomm Incorporated Magnetic Film Enhanced Inductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0725407A1 (en) * 1995-02-03 1996-08-07 International Business Machines Corporation Three-dimensional integrated circuit inductor

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
CHONG H. AHN ET AL.,: "A New Toroidal-Meander Type Integrated Inductor With A Multilevel Meander Magnetic Core", 《IEEE TRANSACTIONS ON MAGNETICS》 *
CHONG H. AHN ET AL.,: "Micromachined Planar Inductors on Silicon Wafers for MEMS Applications", 《IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS》 *
K.SHIRAKAWA ET AL.,: "THIN FILM CLOTH-STRUCTURED INDUCTOR FOR MAGNETIC INTEGRATED CIRCUIT", 《IEEE TRANSACTLONS ON MAGNETICS》 *

Also Published As

Publication number Publication date
TW201230280A (en) 2012-07-16
US8338913B2 (en) 2012-12-25
WO2012064398A1 (en) 2012-05-18
US20120112296A1 (en) 2012-05-10
JP2013542619A (ja) 2013-11-21
TWI502713B (zh) 2015-10-01

Similar Documents

Publication Publication Date Title
US6194774B1 (en) Inductor including bonding wires
US10424431B2 (en) Coil, inductor device and method for manufacturing the coil
CN109817427B (zh) 线圈组件
US7557423B2 (en) Semiconductor structure with a discontinuous material density for reducing eddy currents
US7312684B2 (en) Semiconductor device
US20130241684A1 (en) Method for manufacturing common mode filter and common mode filter
CN103222054A (zh) 具有蛇形导体和芯体的电感器
US11270834B2 (en) Electronic device and the method to make the same
CN110970560B (zh) 芯片内建电感结构
CN101202277A (zh) 对称电感元件
US7982571B2 (en) Inductance with a small surface area and with a midpoint which is simple to determine
US6830984B2 (en) Thick traces from multiple damascene layers
US9583555B2 (en) Semiconductor device having inductor
KR20050022321A (ko) 마이크로 스트립 라인 구조를 가지는 기판, 마이크로스트립 라인 구조를 가지는 반도체 장치, 및 마이크로스트립 라인 구조를 가지는 기판의 제조 방법
TWI794262B (zh) 具有多邊形電感元件的半導體裝置
CN112740343B (zh) 平衡对称线圈
TW529046B (en) Inductance device using an enclosed magnetic flux pattern to improve magnetic permeability and electric conductivity and its manufacturing method
CN106783808A (zh) 高q因子电感器结构和包括其的rf集成电路
CN113013139A (zh) 多层式芯片内置电感结构
US20150340148A1 (en) Inductor and method of forming an inductor
TW201207873A (en) Electrical device and method for fabricating the same, spiral inductor device and method for fabricating the same
TWI553830B (zh) 積體電路電感器
TWI514547B (zh) 半導體裝置
CN118900626A (zh) 接合线电感设备
JPH0513682A (ja) 半導体装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130724