JP2013542619A - 蛇行形状の導体及びコアを備えたインダクタ - Google Patents

蛇行形状の導体及びコアを備えたインダクタ Download PDF

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Publication number
JP2013542619A
JP2013542619A JP2013538718A JP2013538718A JP2013542619A JP 2013542619 A JP2013542619 A JP 2013542619A JP 2013538718 A JP2013538718 A JP 2013538718A JP 2013538718 A JP2013538718 A JP 2013538718A JP 2013542619 A JP2013542619 A JP 2013542619A
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JP
Japan
Prior art keywords
conductive
main
conductive wire
semiconductor structure
segments
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Pending
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JP2013538718A
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English (en)
Japanese (ja)
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JP2013542619A5 (enExample
Inventor
スメイズ ピーター
パポウ アンドレイ
ジェイ ホッパー ピーター
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National Semiconductor Corp
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National Semiconductor Corp
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Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of JP2013542619A publication Critical patent/JP2013542619A/ja
Publication of JP2013542619A5 publication Critical patent/JP2013542619A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2013538718A 2010-11-10 2011-08-31 蛇行形状の導体及びコアを備えたインダクタ Pending JP2013542619A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/943,391 2010-11-10
US12/943,391 US8338913B2 (en) 2010-11-10 2010-11-10 Semiconductor inductor with a serpentine shaped conductive wire interlaced with a serpentine shaped ferromagnetic core
PCT/US2011/049903 WO2012064398A1 (en) 2010-11-10 2011-08-31 Inductor with serpentine shaped conductor and core

Publications (2)

Publication Number Publication Date
JP2013542619A true JP2013542619A (ja) 2013-11-21
JP2013542619A5 JP2013542619A5 (enExample) 2014-09-18

Family

ID=46018808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013538718A Pending JP2013542619A (ja) 2010-11-10 2011-08-31 蛇行形状の導体及びコアを備えたインダクタ

Country Status (5)

Country Link
US (1) US8338913B2 (enExample)
JP (1) JP2013542619A (enExample)
CN (1) CN103222054A (enExample)
TW (1) TWI502713B (enExample)
WO (1) WO2012064398A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9601833B2 (en) 2013-03-25 2017-03-21 Wavcatcher Broadband notch antennas
BR112017015813A2 (en) 2015-03-31 2018-03-27 Halliburton Energy Services, Inc. system and method for tracking an object.
WO2016186624A1 (en) 2015-05-15 2016-11-24 Halliburton Energy Services Inc. Geometrically configurable multi-core inductor and methods for tools having particular space constraints
US11348875B2 (en) * 2020-02-27 2022-05-31 Micron Technology, Inc. Semiconductor devices with flexible connector array

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196505A (ja) * 1985-02-26 1986-08-30 Nec Corp インダクタンス構造体
JPH03125412A (ja) * 1989-10-11 1991-05-28 Amorufuasu Denshi Device Kenkyusho:Kk インダクタンス素子
JPH0992538A (ja) * 1995-09-21 1997-04-04 Canon Inc プリントインダクタおよびプリント基板
JPH10233315A (ja) * 1997-02-19 1998-09-02 Citizen Electron Co Ltd 表面実装型コイルおよびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0725407A1 (en) * 1995-02-03 1996-08-07 International Business Machines Corporation Three-dimensional integrated circuit inductor
US6452247B1 (en) 1999-11-23 2002-09-17 Intel Corporation Inductor for integrated circuit
US6493861B1 (en) 1999-12-28 2002-12-10 Intel Corporation Interconnected series of plated through hole vias and method of fabrication therefor
US6990725B2 (en) * 2001-10-05 2006-01-31 Fontanella Mark D Fabrication approaches for the formation of planar inductors and transformers
US7705421B1 (en) 2005-11-18 2010-04-27 National Semiconductor Corporation Semiconductor die with an integrated inductor
KR100725714B1 (ko) 2006-08-29 2007-06-07 동부일렉트로닉스 주식회사 인덕터 및 인덕터 제조방법
US20100259349A1 (en) 2009-04-09 2010-10-14 Qualcomm Incorporated Magnetic Film Enhanced Inductor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196505A (ja) * 1985-02-26 1986-08-30 Nec Corp インダクタンス構造体
JPH03125412A (ja) * 1989-10-11 1991-05-28 Amorufuasu Denshi Device Kenkyusho:Kk インダクタンス素子
JPH0992538A (ja) * 1995-09-21 1997-04-04 Canon Inc プリントインダクタおよびプリント基板
JPH10233315A (ja) * 1997-02-19 1998-09-02 Citizen Electron Co Ltd 表面実装型コイルおよびその製造方法

Also Published As

Publication number Publication date
TW201230280A (en) 2012-07-16
CN103222054A (zh) 2013-07-24
US8338913B2 (en) 2012-12-25
WO2012064398A1 (en) 2012-05-18
US20120112296A1 (en) 2012-05-10
TWI502713B (zh) 2015-10-01

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