CN103221461A - Flexible transparent film and manufacturing method thereof - Google Patents
Flexible transparent film and manufacturing method thereof Download PDFInfo
- Publication number
- CN103221461A CN103221461A CN2010800702184A CN201080070218A CN103221461A CN 103221461 A CN103221461 A CN 103221461A CN 2010800702184 A CN2010800702184 A CN 2010800702184A CN 201080070218 A CN201080070218 A CN 201080070218A CN 103221461 A CN103221461 A CN 103221461A
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- China
- Prior art keywords
- inorganic layer
- flexible film
- transparent flexible
- transparent substrate
- alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000010410 layer Substances 0.000 claims description 98
- 238000000034 method Methods 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 38
- 239000012044 organic layer Substances 0.000 claims description 36
- -1 polyethylene Polymers 0.000 claims description 25
- 125000000217 alkyl group Chemical group 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 22
- 230000002269 spontaneous effect Effects 0.000 claims description 20
- 125000003118 aryl group Chemical group 0.000 claims description 18
- 229910052799 carbon Inorganic materials 0.000 claims description 16
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 150000008040 ionic compounds Chemical class 0.000 claims description 14
- 229920003023 plastic Polymers 0.000 claims description 14
- 239000011575 calcium Substances 0.000 claims description 13
- 239000011777 magnesium Substances 0.000 claims description 13
- 239000004033 plastic Substances 0.000 claims description 13
- 239000011734 sodium Substances 0.000 claims description 13
- 239000010936 titanium Substances 0.000 claims description 13
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 229920001665 Poly-4-vinylphenol Polymers 0.000 claims description 10
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 10
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 8
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 8
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 8
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 8
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 8
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 8
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052788 barium Inorganic materials 0.000 claims description 8
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052797 bismuth Inorganic materials 0.000 claims description 8
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 8
- 229910052796 boron Inorganic materials 0.000 claims description 8
- 229910052791 calcium Inorganic materials 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000011737 fluorine Substances 0.000 claims description 8
- 229910052731 fluorine Inorganic materials 0.000 claims description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- 229910052732 germanium Inorganic materials 0.000 claims description 8
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 229910052744 lithium Inorganic materials 0.000 claims description 8
- 229910052749 magnesium Inorganic materials 0.000 claims description 8
- 229910021645 metal ion Inorganic materials 0.000 claims description 8
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 8
- 229910052700 potassium Inorganic materials 0.000 claims description 8
- 239000011591 potassium Substances 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 229910052708 sodium Inorganic materials 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 7
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 6
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 6
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 6
- 239000011368 organic material Substances 0.000 claims description 6
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 6
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 6
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000004697 Polyetherimide Substances 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229920001601 polyetherimide Polymers 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 229920002223 polystyrene Polymers 0.000 claims description 5
- 150000003457 sulfones Chemical class 0.000 claims description 5
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 3
- 229910052742 iron Inorganic materials 0.000 claims 3
- 229910052725 zinc Inorganic materials 0.000 claims 3
- 239000011701 zinc Substances 0.000 claims 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 18
- 239000001301 oxygen Substances 0.000 abstract description 18
- 229910052760 oxygen Inorganic materials 0.000 abstract description 18
- 150000002736 metal compounds Chemical class 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 230000035699 permeability Effects 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- YPFNIPKMNMDDDB-UHFFFAOYSA-K 2-[2-[bis(carboxylatomethyl)amino]ethyl-(2-hydroxyethyl)amino]acetate;iron(3+) Chemical compound [Fe+3].OCCN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O YPFNIPKMNMDDDB-UHFFFAOYSA-K 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
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- 230000002950 deficient Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- NRTLIYOWLVMQBO-UHFFFAOYSA-N 5-chloro-1,3-dimethyl-N-(1,1,3-trimethyl-1,3-dihydro-2-benzofuran-4-yl)pyrazole-4-carboxamide Chemical compound C=12C(C)OC(C)(C)C2=CC=CC=1NC(=O)C=1C(C)=NN(C)C=1Cl NRTLIYOWLVMQBO-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- HXWJFEZDFPRLBG-UHFFFAOYSA-N Timnodonic acid Natural products CCCC=CC=CCC=CCC=CCC=CCCCC(O)=O HXWJFEZDFPRLBG-UHFFFAOYSA-N 0.000 description 1
- JAZBEHYOTPTENJ-JLNKQSITSA-N all-cis-5,8,11,14,17-icosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O JAZBEHYOTPTENJ-JLNKQSITSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229960005135 eicosapentaenoic acid Drugs 0.000 description 1
- 235000020673 eicosapentaenoic acid Nutrition 0.000 description 1
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical group C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
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- 230000002441 reversible effect Effects 0.000 description 1
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- 230000000930 thermomechanical effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/048—Forming gas barrier coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
- C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03923—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIBIIICVI compound materials, e.g. CIS, CIGS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/24—Condition, form or state of moulded material or of the material to be shaped crosslinked or vulcanised
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0065—Permeability to gases
- B29K2995/0067—Permeability to gases non-permeable
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
- Y10T428/24975—No layer or component greater than 5 mils thick
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a flexible transparent film and a manufacturing method thereof, and more specifically, to a flexible transparent film used for solar cells which has a low moisture rate and a low oxygen permeation rate by forming an inorganic layer which is coated with metal compounds and naturally cured by being reacted with moisture in the air, and a manufacturing method thereof.
Description
Technical field
The present invention relates to a kind of transparent flexible film and manufacture method thereof.Have more ground, by metallizing ionic compound on the surface of transparent substrate film, and spontaneous curing, to form inorganic layer with airborne reaction of moisture.Therefore, this transparent flexible film that is used for solar cell has low water and oxygen permeability.
Background technology
Traditional solar module is made by glass and is had the solid transparency and barrier property, but that they exist is frangible, lack snappiness, thickness is limited and unit weight is high problem.Be suggested as a kind of selectable flexiplast base material that can overcome the shortcoming of above-mentioned traditional glass base material.
At nearest 1 year, the development of solar module made vapour lock type film (gas-barrier type film) be applied to have in the flexible solar cell light and handy and good choke defencive function and the folding advantage of free bend.Therefore, transparent plastics or resin molding have been studied as base material and have replaced glass baseplate frangible, that be restricted in large-area applications.
Have excellent mechanical handiness and gas barrier property at display equipment, as the LCD(liquid-crystal display), OLED(Organic Light Emitting Diode (OLED), the demand on the electronic-paper display screen (EPD) etc. is rising.
The gas barrier properties of plastics or resin molding is poor than glass baseplate, thereby steam or oxygen permeable base material have reduced the life-span and the quality of solar cell template.Be difficult to overcome its problem by the performance of improving plastic basis material self, therefore, can utilize the method for coated film on the surface of plastic basis material to prevent for example infiltration of oxygen and this class gas of water vapour about gas permeability.
Recently, inorganic materials Si oxide, the aluminum oxide transparent choke type film by formation such as vacuum deposition method, splash method, ion plating method (ion planting method) and chemical vapour depositions causes great concern as the barrier material of oxygen and water vapour.Yet by by having the transparent vapour lock type film that the deposition inorganic oxide forms on the base material that the high biaxially stretched polyester of transparency and stiffness makes, resin layer may limber up.In other words, formation of deposits film at high temperature, resin layer is because the deliquescing of thermal load possibility, therefore, can only utilize for example heat resistant type plastics such as polyethylene terephthalate, polybutylene terephthalate (polybutylene terephtahlate), polyethylene terephthalate (polyethylene terepthalate), polyethylene naphthalate or polyimide.And, when with the resin of low Young's modulus, exist since in deposition process the tensile strength of resin reduce and sedimentary film splits easily so synthetic film vapour lock performance defective that may descend.
Because deposition must be carried out, and also has such defective in this operating process, promptly need to use heaviness and expensive equipment in vacuum unit.Therefore, need a kind of simpler and make the method for choke type film easily.
Technical problem
The present inventor has finished the present invention, comes to be devoted to develop a kind of by metallizing ionic compound on the surface of transparent substrate film, and spontaneous curing is with the inorganic layer that forms with airborne reaction of moisture.
Therefore, an object of the present invention is to provide and a kind ofly have the transparent flexible film and the manufacture method thereof of low water and oxygen permeability by forming inorganic layer, wherein, inorganic layer is by metallizing ionic compound on the surface of transparent substrate film, and spontaneous curing, to form with airborne reaction of moisture.
Another object of the present invention provides a kind of transparent flexible film and manufacture method thereof that need not to use expensive depositing device and can low cost production.
A further object of the present invention provides a kind of because its excellent mechanical flexibility and low water and oxygen permeability and can improve the transparent flexible film in the life-span of solar module.
Purpose of the present invention is not limited to the above-mentioned purpose of mentioning, and those skilled in the art can clearly explain the purpose that other are not mentioned by following description.
Technical scheme
Embodiments of the present invention provide a kind of method of making transparent flexible film, this method comprises (a) metallizing ionic compound on the surface of transparent substrate film, and spontaneous curing, with with airborne reaction of moisture, form first inorganic layer and (b) on first inorganic layer, apply one deck organic layer.
According to certain embodiments of the present invention, after (b) step, further comprise (c) metallizing ionic compound on the surface of organic layer, and spontaneous curing, with airborne reaction of moisture, form second inorganic layer.
According to certain embodiments of the present invention, in (a) step, wherein, described inorganic layer is expressed from the next:
Formula
M(OR)
n+nH
2O→M(OH)
X+nROH
Wherein, M is selected from any one in the group of being made up of silicon (Si), boron (B), lithium (Li), sodium (Na), potassium (K), magnesium (Mg), calcium (Ca), titanium (Ti), aluminium (Al), barium (Ba), zinc (Zn), gallium (Ga), germanium (Ge), bismuth (Bi) and iron (Fe), the aryl that R represents to contain the alkyl of 1-20 carbon atom or contains 6-20 carbon atom, and wherein, represent at R under the situation of alkyl that the Hydrogen Energy in the alkyl is enough to be replaced by fluorine.
According to certain embodiments of the present invention, (a) first inorganic layer in the step and (c) second inorganic layer in the step be expressed from the next:
Formula
M(OR)
n+nH
2O→M(OH)
X+nROH
Wherein, M is selected from any one in the group of being made up of silicon (Si), boron (B), lithium (Li), sodium (Na), potassium (K), magnesium (Mg), calcium (Ca), titanium (Ti), aluminium (Al), barium (Ba), zinc (Zn), gallium (Ga), germanium (Ge), bismuth (Bi) and iron (Fe), and, the aryl that R represents to contain the alkyl of 1-20 carbon atom or contains 6-20 carbon atom, and wherein, represent at R under the situation of alkyl that the Hydrogen Energy in the alkyl is enough to be replaced by fluorine.
According to certain embodiments of the present invention, the transparent substrate film is made by polymkeric substance or plastic material.
According to certain embodiments of the present invention, polymkeric substance or plastic material are selected from by polyester sulfone, polyethylene, polycarbonate, polystyrene, polyethylene terephthalate, PEN, polybutylene terephthalate, polyphenylene sulfide, polypropylene, aromatic poly, polyamidoimide, polyimide, aromatic polyimide, polyetherimide, acrylonitrile-butadiene-styrene copolymer (acrylonitrile butadienestyrene has another name called ABS resin), at least a in the group that ethylene-tetrafluoroethylene copolymer (ethylene tetrafluoroethylene) and polyvinylchloride rope (polyvinylechoride) are formed.
According to certain embodiments of the present invention, the organic materials that is used for applying organic layer is selected from least a of the group be made up of benzocyclobutene (BCB), acrylic resin, Resins, epoxy, polyvinylphenol (PVP) and polyvinyl alcohol (PVA).
According to certain embodiments of the present invention, (a) thickness of first inorganic layer in the step is 0.5 μ m-30 μ m.
According to certain embodiments of the present invention, (a) first inorganic layer in the step and (c) thickness of second inorganic layer in the step be 0.5 μ m-30 μ m.
Some embodiments in according to the present invention, (a) step, (b) step and (c) step a time course or repeatedly carry out in the one or both sides of transparent substrate film.
Embodiments of the present invention provide transparent flexible film, and this transparent flexible film comprises: the transparent substrate film is formed on first inorganic layer and the organic layer that is formed on first inorganic layer on the transparent substrate film.In this case, first inorganic layer is the M (OH) by metal ion compound and airborne reaction of moisture to spontaneous curing are formed
X, as shown in the formula expression:
Formula
M(OR)
n+nH
2O→M(OH)
X+nROH
Wherein, M is selected from any one in the group of being made up of silicon (Si), boron (B), lithium (Li), sodium (Na), potassium (K), magnesium (Mg), calcium (Ca), titanium (Ti), aluminium (Al), barium (Ba), zinc (Zn), gallium (Ga), germanium (Ge), bismuth (Bi) and iron (Fe), and, the aryl that R represents to contain the alkyl of 1-20 carbon atom or contains 6-20 carbon atom, and, represent at R under the situation of alkyl that the Hydrogen Energy in the alkyl is enough to be replaced by fluorine.
According to certain embodiments of the present invention, described transparent flexible film further comprises second inorganic layer on the organic layer.In this case, be M (OH) at second inorganic layer by metal ion compound and airborne reaction of moisture to spontaneous curing are formed
X
According to certain embodiments of the present invention, the transparent substrate film is made by polymkeric substance or plastic material.
According to certain embodiments of the present invention, polymkeric substance or plastic material are selected from least a in the group of being made up of polyester sulfone, polyethylene, polycarbonate, polystyrene, polyethylene terephthalate, PEN, polybutylene terephthalate, polyphenylene sulfide, polypropylene, aromatic poly, polyamidoimide, polyimide, aromatic polyimide, polyetherimide, acrylonitrile-butadiene-styrene copolymer, ethylene-tetrafluoroethylene copolymer and polyvinylchloride rope.
According to certain embodiments of the present invention, the organic materials that is used for applying organic layer is selected from least a of the group be made up of benzocyclobutene (BCB), acrylic resin, Resins, epoxy, polyvinylphenol (PVP) and polyvinyl alcohol (PVA).
According to certain embodiments of the present invention, the thickness of first inorganic layer is 0.5 μ m-30 μ m.
According to certain embodiments of the present invention, the thickness of first inorganic layer and second inorganic layer is 0.5 μ m-30 μ m.
According to certain embodiments of the present invention, first inorganic layer, organic layer and second inorganic layer stack gradually in a side of transparent substrate film.
According to certain embodiments of the present invention, first inorganic layer, organic layer and second inorganic layer stress again stacked at one of transparent substrate film.
According to certain embodiments of the present invention, first inorganic layer, organic layer and second inorganic layer stack gradually in the both sides of transparent substrate film.
According to certain embodiments of the present invention, first inorganic layer, organic layer and second inorganic layer repeat stacked in the both sides of transparent substrate film.
Beneficial effect
The present invention has following effect:
At first, by metallizing ionic compound on the surface of transparent substrate film, and spontaneous curing, with airborne reaction of moisture, form inorganic layer with excellent vapour lock.Therefore, can form transparent flexible film with low water and oxygen permeability.
And, because inorganic layer is to utilize spraying printing or spraying and spontaneous curing to form with airborne reaction of moisture, therefore need not expensive depositing device, reduce the technology cost thus and simplified process.
In addition, solar module can not only be applied to, and liquid-crystal display (LCD), Organic Light Emitting Diode (OLED) and electronic-paper display screen (EPD) can be applied to according to transparent flexible film of the present invention.
In addition, transparent flexible film according to the present invention has low water and oxygen permeability and mechanical flexibility, thus the life-span of the solar module that has improved.
Description of drawings
Fig. 1 is the cross-sectional structure synoptic diagram according to the transparent flexible film of one embodiment of the present invention.
Fig. 2 is the cross-sectional structure synoptic diagram according to the transparent flexible film of another embodiment of the invention.
Fig. 3 is the cross-sectional structure synoptic diagram according to the transparent flexible film of another embodiment of the present invention.
Fig. 4 is the cross-sectional structure synoptic diagram according to the transparent flexible film of another embodiment of the present invention.
The brief description of accompanying drawing major portion
100: 110: the first inorganic layers of transparent flexible film
120,140: 130: the second inorganic layers of organic layer
Best mode
The present invention the common term that uses will be used for reaching and describe rather than the purpose of restriction.In addition, used term and the word of applicant can be used for special situation.In this case, must understand the term or the vocabulary meaning in this manual neatly, rather than only consider the basic meaning of term and vocabulary.
Hereinafter, technical pattern of the present invention will be described in detail with reference to the preferred implementation of explanation in the accompanying drawings.
The present invention can implement with different forms, yet, should not be interpreted as only limiting to aforementioned embodiment of setting forth.Identical reference marker is used to refer to similar element of generation.
The purpose of term such as " pact ", " substantially " is to consider under the situation of error as used herein, on the mathematics accuracy, allow some leeway, this is acceptable in trade, and can prevent that any no good violator from too utilizing the accurate or absolute value that wherein discloses to understand the present invention.
According to transparent flexible film of the present invention, this transparent flexible film comprises that (a) is by metallizing ionic compound on the surface of transparent substrate film, and spontaneous curing, first inorganic layer that forms to react and the organic layer that (b) on first inorganic layer, applies with airborne moisture.In addition, after (b) step, further comprise (c) by metallizing ionic compound on the surface of organic layer, and second inorganic layer of spontaneous curing to form with airborne reaction of moisture.
In (a) step, described first inorganic layer is formed on the transparent substrate film.First inorganic layer is to be used to stop gas, as the blocking layer of oxygen or steam.
Polymkeric substance or plastics can be used as the transparent substrate film.Suitable polymers of the present invention is, but be not limited to polyester sulfone, polyethylene, polycarbonate, polystyrene, polyethylene terephthalate, PEN, polybutylene terephthalate, polyphenylene sulfide, polypropylene, aromatic poly, polyamidoimide, polyimide, aromatic polyimide, polyetherimide, acrylonitrile-butadiene-styrene copolymer, ethylene-tetrafluoroethylene copolymer and polyvinyl muriate.
By metallizing ionic compound on the surface of transparent substrate film, and spontaneous curing, to form first inorganic layer with airborne reaction of moisture.At this moment, the formation of described first inorganic layer is expressed from the next:
Formula
M(OR)
n+nH
2O→M(OH)
X+nROH
Wherein, M is selected from any one in the group of being made up of silicon (Si), boron (B), lithium (Li), sodium (Na), potassium (K), magnesium (Mg), calcium (Ca), titanium (Ti), aluminium (Al), barium (Ba), zinc (Zn), gallium (Ga), germanium (Ge), bismuth (Bi) and iron (Fe), and, the aryl that R represents to contain the alkyl of 1-20 carbon atom or contains 6-20 carbon atom.Represent at R under the situation of alkyl that the Hydrogen Energy in the alkyl is enough to be replaced by fluorine.
Applying solvent is by M (OR) by fusing
nThe metallic compound of expression adds then that catalyzer makes.Stir the coating solvent in predetermined temperature with in the regular hour to form metal ion compound.Normally, can utilize various types of materials, for example tetraethoxy (Si[O.C
2H
5]
4) can use.
Can adopt the most frequently used method metallizing ionic compound on the surface of transparent substrate film.Typical example is dipping, print roll coating, intaglio printing (gravure court), oppositely coating (reverse court), air knife method (air knife court), comma method (comma court), modulus method (die court), screen printing, spray method (spray court) and indirect gravure (gravure offset) etc.Adopt these ceramic methods, can be coated in the one or both sides of transparent substrate film.
Be coated in the lip-deep metal ion compound spontaneous curing of transparent substrate film with airborne reaction of moisture.Because spontaneous curing, nROH material (containing alcohol in the material) volatilization forms first inorganic layer on the transparent substrate film.
When forming first inorganic layer, do not use as drying meanss such as high frequency irradiation, infrared ray radiation, UV irradiations.Therefore, inorganic layer can form by process low-cost and that simplify because of low price.Preferably, the thickness of first inorganic layer is 0.5 μ m-30 μ m.
In (b) step, organic layer is formed on first inorganic layer.Smooth and stable in order to make on the transparent substrate film surface that comprises first inorganic layer, formed organic layer.In other words, the organic layer of coating not only has and plugs the gap and the rimose function, has also improved smoothness (Ra〉2nm) and complete compact composition.
Any organic materials can be used for as organic layer.According to the present invention, be suitable for most but be not limited only to being benzocyclobutene (BCB), acrylic resin, Resins, epoxy, polyvinylphenol (PVP), polyvinyl alcohol (PVA) as organic materials.
Can apply organic layer with the most frequently used method.Typical example is dipping, print roll coating, intaglio printing, oppositely coating, air knife method, comma method, modulus method, screen printing, spray method and indirect gravure etc.
Then, in (c) step, on organic layer, form second inorganic layer.Specifically be, metallizing ionic compound on the surface of organic layer, and spontaneous curing, with airborne reaction of moisture, form second inorganic layer.Second inorganic layer is for stoping second barrier layer for gases as oxygen or steam.Second inorganic layer stops gas to have barrier properties with first inorganic layer.The same with the manufacture method of first inorganic layer, the manufacture method of second inorganic layer is as shown in the formula expression:
Formula
M(OR)
n+nH
2O→M(OH)
X+nROH
Wherein, M is selected from any one in the group of being made up of silicon (Si), boron (B), lithium (Li), sodium (Na), potassium (K), magnesium (Mg), calcium (Ca), titanium (Ti), aluminium (Al), barium (Ba), zinc (Zn), gallium (Ga), germanium (Ge), bismuth (Bi) and iron (Fe), the aryl that R represents to contain the alkyl of 1-20 carbon atom or contains 6-20 carbon atom, represent at R under the situation of alkyl that the Hydrogen Energy in the alkyl is enough to be replaced by fluorine.
Applying solvent is by M (OR) by fusing
nThe metallic compound of expression adds then that catalyzer makes.Stir the coating solvent in predetermined temperature with in the regular hour to form metal ion compound.Normally, can utilize various types of materials, for example C can use.
Preferably, the thickness of second inorganic layer is 0.5 μ m-30 μ m.
Have the protective capacities and the excellent transparency and the mechanical flexibility of excellent oxygen and steam with the transparent flexible film of aforesaid method manufacturing, therefore can be applicable to solar battery module.According to an embodiment of the present invention, on the SUS base material, formed transparent flexible film.Cigs layer stacks on the transparent flexible film.Form the electrode of the monocell that can prepare solar cell then.According to the present invention, when the transparent flexible film of making is applied to solar module, because of it has low water and oxygen permeability and significant mechanical flexibility, the therefore life-span of having improved solar cell.
Fig. 1 to Fig. 4 is the cross-sectional structure synoptic diagram of transparent flexible film according to the embodiment of the present invention.
As shown in Figure 1, first inorganic layer 110, organic layer 100 and second inorganic layer 120 can stack gradually in a side of transparent substrate film 100.As shown in Figure 2, first inorganic layer 110, organic layer 100 and second inorganic layer 120 can stress again stacked at one of transparent substrate film 100.In other words, first inorganic layer 110, the organic layer 120 and second inorganic layer 120 can repeat stacked at transparent substrate film 100 last layers or multilayer.In addition, as illustrated in fig. 1 and 2, they can be stacked in the one or both sides of transparent substrate film, and this is within the scope that the present invention considers.
The present invention will explain the latter in detail.Yet, should be understood that scope of the present invention is not limited to disclosed embodiment.
Embodiment
Embodiment 1
For forming first inorganic layer, with tetraethoxy (Si[O.C
2H
5]
4) be initiator and IPA(timnodonic acid) after the fusing, this mixture is added catalyzer forming metal ion compound at 25 ℃ after stirring 2h down.After by rotational method (spin court manner) at thickness being the side metallizing ionic compound of transparent substrate film (PET) of 100 μ m, room temperature spontaneous curing 6h carries out transition process, forms the first inorganic layer Si[OH thus]
4The thickness that records first inorganic layer by alpha's stepping (alpha stepper) is 3 μ m.Adopt rotational method on the surface of first inorganic layer, to apply the coating agent that comprises benzocyclobutene (BCB), behind 120 ℃ of dry 2h, form organic layer.After the drying, the thickness that records organic layer by alpha's stepping is 100 μ m.Second inorganic layer forms on the organic layer surface, and is identical with the reaction conditions of the first inorganic layer manufacture method, therefore formed a kind of multiwalled transparent flexible film.
When being applied to the base material of display equipment for the multi-layer transparent flexible membrane that forms among the embodiment 1, its main performance-OTR oxygen transmission rate, vapour transmission rate, texturing temperature, light transmission rate, pencil hardness and mean roughness are in order to method test down, and the result is as shown in table 1.
The test of OTR oxygen transmission rate
The value of the OTR oxygen transmission rate of transparent flexible film is utilized the OTR oxygen transmission rate instrument, and (Oxtran2/20MB, Mocon) in room temperature, relative humidity is to test under 0% the condition.Detection is limited to 0.01g/m
2. day, if be less than detectability, be designated as 0.01g/m
2. day.
The test of vapour transmission rate
The value of the vapour transmission rate of transparent flexible film is utilized vapour transmission rate tester (Permatran-w-3/33, ASTM F1249) 1h test under the relative humidity of room temperature and 100%.Detection is limited to 0.01g/m
2. day, if be less than detectability, be designated as 0.01g/m
2. day.
The test of texturing temperature
The texturing temperature of transparent flexible film utilizes thermomechanical analyzer (TMA) to test, and wherein, flex point jumpy takes place at the 5gf place length variation.
The test of light transmission rate
The UV spectrograph of light transmission rate test by utilizing varian company to make of transparent flexible film is according to ASTM D1003 test, visible rays 380 μ m-780 μ m.
The test of pencil hardness
The test of the pencil hardness of transparent flexible film: the pencil with different hardness is loaded following stroke more than twice at 200g, by visual inspection, is pencil hardness when the no marking of transparent flexible film surface.
The test of mean roughness and maximal roughness
Mean roughness of transparent flexible film (Ra) and maximal roughness (Rmax) by atomic force microscope at 20 mu m range build-in tests.
Table 1
| ? | OTR oxygen transmission rate | The vapour transmission rate | Texturing temperature | Light transmission rate | Pencil hardness | Mean roughness |
| Unit | cc/m 2/ day | g/m 2/ day | ℃ | % | H | nm |
| Embodiment 1 | <0.01 | <0.01 | >200 | >92 | >4 | 1.5 |
The present invention has described above-mentioned embodiment and accompanying drawing, but scope of the present invention is by the definition of subsequently claim.Therefore those skilled in the art appended claims disclosed in hold, do not break away from marrow of the present invention, understand and with content carry out various replacements, modifications and variations are possible.Should be appreciated that such replacement, modifications and variations are within the scope of the present invention.
Claims (21)
1. method of making transparent flexible film, this method comprises:
(a) metallizing ionic compound on the surface of transparent substrate film, and spontaneous curing, with airborne reaction of moisture, form first inorganic layer; With
(b) on described first inorganic layer, apply organic layer.
2. method according to claim 1, wherein, after (b) step, this method further comprises (c): metallizing ionic compound on the surface of described organic layer, and spontaneous curing, with airborne reaction of moisture, form second inorganic layer.
3. method according to claim 1, wherein, in (a) step, described inorganic layer is represented by following formula:
Formula
M(OR)
n+nH
2O→M(OH)
X+nROH
Wherein, M is selected from any one in the group of being made up of silicon, boron, lithium, sodium, potassium, magnesium, calcium, titanium, aluminium, barium, zinc, gallium, germanium, bismuth and iron, and, the aryl that R represents to contain the alkyl of 1-20 carbon atom or contains 6-20 carbon atom; And
Wherein, represent at R under the situation of alkyl that the Hydrogen Energy in the alkyl is enough to be replaced by fluorine.
4. method according to claim 2, wherein, described first inorganic layer in (a) step and described second inorganic layer in (c) step are expressed from the next:
Formula
M(OR)
n+nH
2O→M(OH)
X+nROH
Wherein, M is selected from any one in the group of being made up of silicon, boron, lithium, sodium, potassium, magnesium, calcium, titanium, aluminium, barium, zinc, gallium, germanium, bismuth and iron, and, the aryl that R represents to contain the alkyl of 1-20 carbon atom or contains 6-20 carbon atom; And
Wherein, represent at R under the situation of alkyl that the Hydrogen Energy in the alkyl is enough to be replaced by fluorine.
5. according to any described method among the claim 1-4, wherein, described transparent substrate film is made by polymkeric substance or plastic material.
6. method according to claim 5, wherein, described polymkeric substance or described plastic material are selected from least a in the group of being made up of polyester sulfone, polyethylene, polycarbonate, polystyrene, polyethylene terephthalate, PEN, polybutylene terephthalate, polyphenylene sulfide, polypropylene, aromatic poly, polyamidoimide, polyimide, aromatic polyimide, polyetherimide, acrylonitrile-butadiene-styrene copolymer, ethylene-tetrafluoroethylene copolymer and polyvinylchloride rope.
7. according to any described method among the claim 1-4, wherein, the organic materials that is used for applying organic layer is selected from least a of the group be made up of benzocyclobutene (BCB), acrylic resin, Resins, epoxy, polyvinylphenol (PVP) and polyvinyl alcohol (PVA).
8. according to any described method among the claim 1-3, wherein, (a) thickness of described first inorganic layer in the step is 0.5 μ m-30 μ m.
9. according to claim 2 or 4 described methods, wherein, (a) described first inorganic layer in the step and (c) thickness of described second inorganic layer in the step be 0.5 μ m-30 μ m.
10. according to the described method of claim 2-4, wherein, (a) step, (b) step and (c) step a time course or repeatedly carry out in the one or both sides of transparent substrate film.
11. a transparent flexible film, this transparent flexible film comprises:
The transparent substrate film;
Be formed on first inorganic layer on the described transparent substrate film; With
Be formed on the organic layer on described first inorganic layer, wherein, described first inorganic layer is the M (OH) by metal ion compound and airborne reaction of moisture to spontaneous curing are formed
X, as shown in the formula expression:
Formula
M(OR)
n+nH
2O→M(OH)
X+nROH
Wherein, M is selected from any one in the group of being made up of silicon, boron, lithium, sodium, potassium, magnesium, calcium, titanium, aluminium, barium, zinc, gallium, germanium, bismuth and iron, and, the aryl that R represents to contain the alkyl of 1-20 carbon atom or contains 6-20 carbon atom, and
Wherein, represent at R under the situation of alkyl that the Hydrogen Energy in the alkyl is enough to be replaced by fluorine.
12. transparent flexible film according to claim 11, wherein, described transparent flexible film further is included in second inorganic layer on the described organic layer, and wherein, described second inorganic layer is the M (OH) by metal ion compound and airborne reaction of moisture to spontaneous curing are formed
X
13. according to claim 11 or 12 described transparent flexible film, wherein, described transparent substrate film is made by polymkeric substance or plastic material.
14. transparent flexible film according to claim 13, wherein, described polymkeric substance or described plastic material are selected from least a in the group of being made up of polyester sulfone, polyethylene, polycarbonate, polystyrene, polyethylene terephthalate, PEN, polybutylene terephthalate, polyphenylene sulfide, polypropylene, aromatic poly, polyamidoimide, polyimide, aromatic polyimide, polyetherimide, acrylonitrile-butadiene-styrene copolymer, ethylene-tetrafluoroethylene copolymer and polyvinylchloride rope.
15. according to claim 11 or 12 described transparent flexible film, wherein, the organic materials that is used for applying organic layer is selected from least a of the group be made up of benzocyclobutene (BCB), acrylic resin, Resins, epoxy, polyvinylphenol (PVP) and polyvinyl alcohol (PVA).
16. transparent flexible film according to claim 11, wherein, the thickness of described first inorganic layer is 0.5 μ m-30 μ m.
17. transparent flexible film according to claim 12, wherein, the thickness of described first inorganic layer and described second inorganic layer is 0.5 μ m-30 μ m.
18. transparent flexible film according to claim 12, wherein, described first inorganic layer, described organic layer and described second inorganic layer stack gradually in a side of transparent substrate film.
19. transparent flexible film according to claim 12, wherein, described first inorganic layer, described organic layer and described second inorganic layer stress again stacked at one of transparent substrate film.
20. transparent flexible film according to claim 12, wherein, described first inorganic layer, described organic layer and described second inorganic layer stack gradually in the both sides of transparent substrate film.
21. transparent flexible film according to claim 12, wherein, described first inorganic layer, described organic layer and described second inorganic layer repeat stacked in the both sides of transparent substrate film.
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|---|---|---|---|
| KR1020100114833A KR101819094B1 (en) | 2010-11-18 | 2010-11-18 | Transparent flexible film and method for manufacturing thereof |
| PCT/KR2010/008146 WO2012067285A1 (en) | 2010-11-18 | 2010-11-18 | Flexible transparent film and manufacturing method thereof |
| KR10-2010-0114833 | 2010-11-18 |
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|---|---|
| CN103221461A true CN103221461A (en) | 2013-07-24 |
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|---|---|
| US (1) | US20130236713A1 (en) |
| KR (1) | KR101819094B1 (en) |
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|---|---|---|---|---|
| CN103928547A (en) * | 2014-04-28 | 2014-07-16 | 杭州勇电照明有限公司 | Floating type solar cell panel and forming method thereof |
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| KR102296915B1 (en) * | 2014-07-30 | 2021-09-02 | 삼성디스플레이 주식회사 | organic light emitting diode display |
| CN106299149A (en) * | 2015-06-12 | 2017-01-04 | 上海和辉光电有限公司 | Thin-film packing structure, preparation method and there is the organic light emitting apparatus of this structure |
| JP6495754B2 (en) * | 2015-06-12 | 2019-04-03 | 株式会社ジャパンディスプレイ | Display device |
| WO2018004094A1 (en) * | 2016-06-27 | 2018-01-04 | 삼성에스디아이 주식회사 | Display device window film and flexible display device including same |
| CN111278643A (en) | 2017-10-27 | 2020-06-12 | 应用材料公司 | Flexible cover lens film |
| KR20190107805A (en) | 2018-03-13 | 2019-09-23 | 엔아이씨(주) | A Method for Manufacturing Flexible Film |
| CN112055822A (en) | 2018-05-10 | 2020-12-08 | 应用材料公司 | Replaceable cover lens for flexible displays |
| JP2021536030A (en) | 2018-08-14 | 2021-12-23 | アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated | Multi-layer wet and dry hard coat for flexible cover lenses |
| KR20230173748A (en) | 2019-06-26 | 2023-12-27 | 어플라이드 머티어리얼스, 인코포레이티드 | Flexible multi-layered cover lens stacks for foldable displays |
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| JP4429467B2 (en) * | 1999-04-08 | 2010-03-10 | 帝人株式会社 | Transparent conductive film |
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- 2010-11-18 CN CN201080070218.4A patent/CN103221461B/en active Active
- 2010-11-18 WO PCT/KR2010/008146 patent/WO2012067285A1/en active Application Filing
- 2010-11-18 US US13/885,717 patent/US20130236713A1/en not_active Abandoned
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| JP2005254541A (en) * | 2004-03-10 | 2005-09-22 | Fuji Photo Film Co Ltd | Gas-barrier laminated film, its production method, and image display element using the film |
| US20090051272A1 (en) * | 2005-02-17 | 2009-02-26 | Konica Minolta Holdings, Inc. | Gas barrier film, gas barrier film manufacturing method, resin substrate for organic electroluminescent device using the aforesaid gas barrier film, and organic electroluminescent device using the aforementioned gas barrier film |
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| CN103928547A (en) * | 2014-04-28 | 2014-07-16 | 杭州勇电照明有限公司 | Floating type solar cell panel and forming method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120053621A (en) | 2012-05-29 |
| CN103221461B (en) | 2016-03-09 |
| US20130236713A1 (en) | 2013-09-12 |
| WO2012067285A1 (en) | 2012-05-24 |
| KR101819094B1 (en) | 2018-03-02 |
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