CN103219578A - 感应式电子装置的制作方法 - Google Patents
感应式电子装置的制作方法 Download PDFInfo
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Abstract
一种感应式电子装置的制作方法,是在一个绝缘的薄板表面设置一个由导电材料构成的感应电路,接着将设置有该感应电路的薄板夹置入一个模具装置的一个模芯内,经该模具装置注入一个绝缘的填充材料于该模芯中而使该填充材料与该设置有该感应电路的薄板连结,制得一个射出成型品,最后自该模芯取出该射出成型品,制得该感应电子装置。本发明直接将设置有该感应电路的薄板在注入填充材料的同时与填充材料连结,除了简化制作程序外,还借由与填充材料间无间隙地连结而防止水汽进入其内部,进一步地增加所制得感应式电子装置的可靠度。
Description
技术领域
本发明涉及一种电子装置的制作方法,特别是涉及一种感应式电子装置的制作方法。
背景技术
传统的携带式手持话机的天线通常是凸出于话机本体上方而为长条状,不仅笨重,外观也不够简洁。因此,在电子装置讲求轻、薄、短、小的潮流中,目前应用于具有天线的手机,抑或是具备触控式电路的感应式电子装置,也是不断地改良天线自身的方式与微缩体积,以期可配合整体电子装置的形态。
目前感应式电子装置通常是将一个具有感应电路的印刷电路板(例如手机的天线金属板)收纳于话机的机壳中,而使电子装置的外观更为简约,且线条更为流畅;除此之外,更确实有效降低电子装置的整体体积。
参阅图1,上述感应式电子装置的制作方法主要是先压制两片塑胶壳11,再将一个印刷电路板12锁固、卡制、粘着或压合于所述塑胶壳11间。
此外,参阅中国台湾专利第M323120号关于「手机金属线天线标本」所揭示的技术内容,是先准备一个易于切割的薄片模板,且此薄片模板略大于手机壳体预置天线金属板的体积,再根据手机壳体的天线金属板的预定位置尺寸及形状裁切该薄片模板,以取得天线金属板的形状标本,而供后续塑胶壳的模具制作的依据。
然而,虽然此种方式确实达到将印刷电路板12隐藏于塑胶壳11间的目的,但是由于塑胶壳11与印刷电路板12是先分别制作再结合,除了程序繁多外,再者,薄片模板只能粗略地裁量出天线金属板的尺寸面积,所以也常因分别制作天线金属板与塑胶壳11时,尺寸无法精确地配合而形成空隙,造成结合后天线金属板的表面仍与外界空气接触,导致印刷电路板受潮而短路或损坏。
发明内容
本发明的目的在于提供一种增进产品整体可靠度的感应式电子装置的制作方法。
本发明的感应式电子装置的制作方法,包含:
(a)在一个绝缘的薄板表面设置一个由导电材料构成的感应电路。
(b)将设置该感应电路的薄板夹置入一个模具装置的一个模芯内,经该模具装置注入的一个绝缘的填充材料于该模芯中而使该填充材料与该设置有该感应电路的薄板连结,制得一个射出成型品。
(c)自该模芯取出该射出成型品,制得该感应电子装置。
较佳地,前述感应式电子装置的制作方法,其中该步骤(c)是待该模芯中的填充材料降温至硬化时取出该射出成型品,并修除毛边。
较佳地,前述感应式电子装置的制作方法,其中该步骤(a)将该薄板表面欲成为该感应电路的预定区域形成一层活性层,再通过化学镀的方式将该预定区域的活性层转换成为以金属构成的感应电路。
较佳地,前述感应式电子装置的制作方法,其中该步骤(a)先在该薄板整面表面以活性物质形成该活性层,并移除该感应电路的预定区域周围的活性层,直到该预定区域周围的薄板表面裸露,再依序通过化学镀及电镀的方式将该预定区域的活性层转换成增厚的感应电路。
较佳地,前述感应式电子装置的制作方法,其中,该步骤(a)是以激光的方式移除该预定区域周围的活性层,并在电镀增厚该感应电路后,以剥除剂移除该预定区域外而未经电镀增厚的金属。
较佳地,前述感应式电子装置的制作方法,其中,该步骤(a)是先在该薄板整面表面形成一层具有催化性的活性准备层,再活化位于该感应电路的预定区域的活性准备层而成该活性层。
较佳地,前述感应式电子装置的制作方法,其中,该步骤(a)以照射紫外光的方式活化该预定区域的活性准备层而成该活性层。
较佳地,前述感应式电子装置的制作方法,其中,该步骤(a)的活性层是氯化钯,该感应电路选自铜、镍,及前述的一组合。
较佳地,前述感应式电子装置的制作方法,其中,该步骤(a)以一个粘胶将一层金属层粘着于该薄板表面,并于该金属层表面先以黄光程序定义将成为该感应电路的预定区域,再移除非为该预定区域的金属层,而在该薄板表面形成该感应电路。
较佳地,前述感应式电子装置的制作方法,其中,该步骤(a)在该薄板上设置一个已定义出该感应电路的印刷电路板。
本发明的有益效果在于:先在绝缘的薄板上设置感应电路,再在射出成型时同时将该薄板封置于其中,除了可简化制作步骤,还可避免感应电路受潮,进而增加产品的可靠度。
附图说明
图1是说明目前感应式电子装置的制作流程的剖视示意图;
图2是说明本发明感应式电子装置的制作方法的流程图;
图3是说明一第一较佳实施例的步骤21的立体示意图;
图4是说明该第一较佳实施例的步骤22的剖视示意图;
图5是说明该第一较佳实施例的步骤23的剖视示意图;
图6是说明一第二较佳实施例的步骤21的立体示意图;
图7是说明一第三较佳实施例的步骤21的立体示意图;
图8是说明一第四较佳实施例的步骤21的立体示意图;
图9是说明一第五较佳实施例的步骤21的立体示意图。
具体实施方式
下面结合附图及实施例对本发明进行详细说明:
参阅图2,为本发明感应式电子装置的制作方法的一第一较佳实施例。
参阅图2、图3,首先,进行该步骤21,先准备一个绝缘的薄板31,在该第一较佳实施例中,是以碳酸聚酯(polycarbonate)膜为例,但不以此为限,接着,利用激光粗化的方式粗化该薄板31的表面(在图示中以点状表示)。
接着,将该薄板31浸置于一含有活性金属的溶液,在该第一较佳实施例中,是浸置于氯化钯的水溶液。而在该薄板31的整面表面形成一层以氯化钯构成的活性层32。
再则,在形成有该活性层32的薄板31表面定义一个将成为一个感应电路的预定区域33,并利用激光移除的方式移除该感应电路的预定区域33周围的活性层32,且直到该预定区域33周围的薄板31表面裸露,而在该预定区域33形成该活性层32,并通过该裸露的薄板31表面而使该预定区域33的活性层32与远离该预定区域33的活性层32间隔而不相互接触。
接着,将设置有该活性层32的薄板31浸置于一化学镀(chemical plating)溶液,并利用氧化还原的原理,借由化学镀法将该活性层32转换成为一金属34,且该预定区域定义为该感应电路。在该第一较佳实施例中,是将该薄板31浸置于一含有镍离子的化学镀溶液中,并浸置进行化学镀法1~5分钟,化学镀溶液的温度范围控制在40℃~65℃,而将该预定区域33的活性层32以化学镀法转换为以金属构成的感应电路35,此时,由于氧化还原的化学镀反应仅被限制地在该活性层32进行,则该金属34除了构成该感应电路35外,还形成于远离该感应电路35的区域,并借由裸露的薄板31表面作为间隔。
需说明的是,该化学镀溶液不以镍的化学镀溶液为限,也可是铜的化学镀溶液,当使用铜的化学镀溶液进行化学时,化学镀溶液的温度范围需控制在40℃~65℃,且需进行化学镀法的时间范围也为1~5分钟。
再则,将已形成该金属34的薄板31浸置于一电镀溶液,并将该感应电路35的表面连接一个电极(图未示出),而作为一个电镀电极,再利用电镀法以金属增厚该感应电路35,且以电镀法电镀所镀覆的金属异于化学镀法所形成的金属。由于电镀增厚该感应电路35时,该感应电路35周围的金属34与该感应电路35间隔,则无法与电镀电极电连接而未被增厚,所以可通过金属的材质区别已增厚的感应电路35,及非为感应电路的金属34。
其中,当以化学镀法形成的金属为镍时,电镀法可电镀铜,且电镀时间为2~50分钟,温度20~45℃,但不以铜电镀为限;当化学镀法所形成的金属为铜时,也可电镀镍来增厚该感应电路,且电镀镍所需的电镀时间为2~50分钟,所需的电镀温度控制于40℃~60℃。
再则,以剥除剂移除远离该已增厚的感应电路35的金属34(也就是与感应电路35间隔的金属34),而使该薄板31表面仅构成该感应电路35。其中,该剥除剂的选择条件为:仅可移除化学镀法所形成的金属34;例如,当化学镀法形成的金属层为镍,电镀法增厚的金属为铜时,所使用的剥除剂为剥镍剂。
参阅图2、图4,继续,进行该步骤22,准备一个具有一个模芯42的模具装置41,该模芯42具有一个供薄板31放置的空穴43,并将已设置该感应电路35的薄板31置于该模芯42的空穴43中,而使该薄板31夹置入该模芯42内;接着,再经由该模具装置41注入一个绝缘的填充材料36于该模芯42中,直到该填充材料36与该薄板31连结,并覆盖该感应电路35的整面表面,而制得一个射出成型品。该填充材料为熔化的类塑料,例如是聚乙炔(polyacetylene,简称PA)或聚碳酸酯(polycarbonate,简称PC),但不以此为限。
较佳地,为了使该感应电路35及该薄板31皆与外界完全隔离,经由该模具装置41所注入的填充材料36至该模芯42的动作持续到该填充材料36封闭该薄板31。
参阅图2、图5,最后,进行该步骤23,当该模芯42中的填充材料36降温至硬化时,再自该模芯42取出该射出成型品,再修除该射出成型品的毛边,而制得如图5的一个感应式电子装置。
当该感应式电子装置的感应电路35为天线时,天线可通过无线传输(例如蓝牙传输或红外线传输)的方式接收及传送感应电信号;当该感应式电子装置为触控面板时,可调整该感应电路上的填充材料36至较薄的厚度,并通过按压时对该触控面板产生压电效应,而感应产生电信号。
因此,若将本发明所制得的感应式电子装置应用作为手机机壳时,可在不增加机壳厚度情况下,将感应电路35作为隐藏式天线,此外,由于该感应电路是直接封装于该填充材料36中,可隔绝外界的环境变化(例如水汽)对该感应电路35的影响,进而有效增加感应电路35的可靠度与使用寿命。
本发明直接将设置有感应电路35的薄板31夹置于模芯42,再注入填充材料36而将薄板31封装于其中,除了可简化目前还需先制得塑胶壳,再将设置有感应电路的薄板锁固或粘结于塑胶壳的繁复手续外,还可再次减缩应用于手机等产品时的体积,并通过填充材料36完全包覆该设置感应电路35的薄板31,而避免其受潮而导致电路受损,进而大幅提升感应式电子装置的可靠度与使用寿命。
再者,由于该步骤21是以电镀增厚的方式增厚该感应电路35,并覆盖下方经化学镀的金属,同时,可区隔该感应电路35,及非为感应电路的金属34,则可直接利用剥除剂移除非为该感应电路区域的金属34。
参阅图2、图6,为本发明一第二较佳实施例,该第二较佳实施例与该第一较佳实施例类似,其不同的地方主要在于该步骤21。
在该第二较佳实施例中,该步骤21是以喷印法直接在一个薄板31喷印氯化钯(PdCl2)而形成该活性层32,且由于喷印法的喷印原理是类似打印机的输出原理,所以所形成的活性层32即为该感应电路的预定区域(图未示出),也就是在进行喷印法的过程中直接在该预定区域形成活性层32:其中,形成该活性层32的方式不限定于喷印法,也可是以印刷的方式,也可直接在薄板31表面直接形成已定义预定区域的活性层32,其目的在于以自动控制的方式,且不需额外的光掩膜定义该感应电路35的预定区域,即可形成该活性层32。
接着,将形成该活性层32的薄板31浸置于一化学镀溶液中,以化学镀法形成一个以金属构成的感应电路35。由于化学镀法是以氧化还原的方式将活性层32转换为金属,所以感应电路35选择地形成于喷印有该活性层32区域。
较佳地,该感应电路35选自镍、铜,及前述的一组合。
由于该第二较佳实施例的活性层32仅形成于该感应电路35的预定区域,所以,以化学镀法所形成的金属即为该感应电路35。因此,该第二较佳实施例在进行化学镀时具可直接将该活性层32转换成为该感应电路35。
参阅图2、图7,为本发明一第三较佳实施例,该第三较佳实施例与该第二较佳实施例类似,其不同的地方主要在于该步骤21的活性层32的形成方式。
该步骤21是先在该薄板31的同一表面整面性地涂布一层具催化性的活性准备层37,接着,定义该感应电路的预定区域33。其中,定义的方式可通过一个掩膜(mask)遮蔽非为该感应电路的预定区域,并供该感应电路的预定区域裸露,但不以此方式为限制。
继续,再以活化的方式将位于该感应电路的预定区域33的活性准备层37转换成为活性层32,在该第三较佳实施例中,该活性准备层37以锡钯胶体为主;锡钯胶体主要是以胶团包覆钯金属,所以需要一道额外的活化程序,才可使团聚的胶团不再包覆钯金属,进而将该锡钯胶体活化成可供后续化学镀的活性层32,才能有效率的发生化学镀反应。
又,在该第三较佳实施例中,是以波长范围为200~400nm的紫外光照射该活性准备层37,达到活化该活性准备层37并转换为该活性层32的目的,但不以照射紫外光进行活化为限,照射紫外光只是活化的其中一种方式;再者,照射紫外光的方式除了以掩膜遮蔽该感应电路的预定区域33外的区域,而供该感应电路的预定区域33裸露,也可以使用单束的激光进行活化,并控制紫外光只能照射该感应电路的预定区域33的活性准备层37。
接着,再将设置该活性层32的薄板31浸置于一化学镀溶液中,以化学镀法将该活性层32转换成为金属34,且由于化学镀法的原理为氧化还原,所以化学镀法仅选择地在该活性层32进行,而不会在该活性准备层37进行氧化还原,因此,以化学镀法形成的金属仅形成于该感应电路的预定区域33,而构成该感应电路35。
在完成该感应电路35后,再移除感应电路区域外的活性准备层37。
较佳地,该金属34选自镍、铜,及前述的一组合。最后,再依序进行该步骤22及该步骤23后,可制得该感应式电子装置。
该第三较佳实施例利用化学镀法必须选择地在活性层32作用的特性,先活化预定区域33的活性准备层37而成活性层32,供后续化学镀溶液仅能在该预定区域33的活性层32产生化学镀的氧化还原反应,而构成该感应电路35。
参阅图2、图8,为本发明一第四较佳实施例,该第四较佳实施例与该第一较佳实施例类似,其不同的地方主要在于该步骤21。
该步骤21先以一个粘胶51将一层以铜构成的金属层52粘着于该薄板31表面。
接着,在该金属层52表面先以黄光程序,利用一光阻掩膜覆盖定义为将成为该感应电路35的预定区域,再以蚀刻程序移除非为该预定区域的金属层52,而在该薄板表面设置成该感应电路35。最后,再依续进行该步骤22及该步骤23后,可制得该感应式电子装置。
参阅图2、图9,为本发明一第五较佳实施例,该第五较佳实施例与该第一较佳实施例类似,其不同的地方主要在于该步骤21。
该步骤21是先准备一个印刷电路板61,该印刷电路板具有一个感应电路35,且该印刷电路板61可选自单层或多层印刷电路板。此外,该印刷电路板61也可为软性而具可挠曲性的印刷电路板。
接着,再在该薄板31上粘结已具有该感应电路35的印刷电路板61,而供该感应电路35设置于该薄板31表面。最后,再依续进行该步骤22及该步骤23后,可制得该感应式电子装置。
综上所述,本发明是直接将设置有感应电路35的薄板31夹置于该模具装置41的模芯42中,并在注入填充材料36时便直接封闭该感应电路35于该填充材料36中,除了简化制作流程,并减少所制得感应式电子装置的体积外;更在不增加机壳厚度情况下,将感应电路35应用作为隐藏式天线或触控元件,且进一步地避免该感应电路35与外界的水汽接触而受潮的机率,进而增加感应电路35的可靠度与寿命,再者,还配合创新的感应电路的制作方法,所以确实能达成本发明的目的。
惟以上所述的内容,只为本发明的较佳实施例而已,应当不能以此限定本发明实施的范围,即凡依本发明申请专利范围及发明说明内容所作的简单的等效变化与修饰,皆仍属本发明专利涵盖的范围内。
Claims (10)
1.一种感应式电子装置的制作方法,其特征在于,包含:(a)在一个绝缘的薄板表面设置一个由导电材料构成的感应电路;(b)将该设置有该感应电路的薄板夹置入一个模具装置的一个模芯内,经该模具装置注入一个绝缘的填充材料于该模芯中而使该填充材料与该设置有该感应电路的薄板连结,制得一个射出成型品;及(c)自该模芯取出该射出成型品后,制得该感应式电子装置。
2.如权利要求1所述的感应式电子装置的制作方法,其特征在于:该步骤(c)是待该模芯中的填充材料降温至硬化时取出该射出成型品,并修除毛边。
3.如权利要求2所述的感应式电子装置的制作方法,其特征在于:该步骤(a)将该薄板表面欲成为该感应电路的预定区域形成一层活性层,再通过化学镀的方式将该预定区域的活性层转换成为以金属构成的感应电路。
4.如权利要求2所述的感应式电子装置的制作方法,其特征在于:该步骤(a)先在该薄板整面表面以活性物质形成该活性层,并移除该感应电路的预定区域周围的活性层,直到该预定区域周围的薄板表面裸露,再依序通过化学镀及电镀的方式将该预定区域的活性层转换成增厚的感应电路。
5.如权利要求4所述的感应式电子装置的制作方法,其特征在于:该步骤(a)是以激光的方式移除该预定区域周围的活性层,并在电镀增厚该感应电路后,以剥除剂移除该预定区域外而未经电镀增厚的金属。
6.如权利要求3所述的感应式电子装置的制作方法,其特征在于:该步骤(a)是先在该薄板整面表面形成一层具有催化性的活性准备层,再活化位于该感应电路的预定区域的活性准备层而成该活性层。
7.如权利要求6所述的感应式电子装置的制作方法,其特征在于:该步骤(a)以照射紫外光的方式活化该预定区域的活性准备层而成该活性层。
8.如权利要求3所述的感应式电子装置的制作方法,其特征在于:该步骤(a)的活性层是氯化钯,该感应电路选自铜、镍,及前述的一组合。
9.如权利要求2所述的感应式电子装置的制作方法,其特征在于:该步骤(a)以一个粘胶将一层金属层粘着于该薄板表面,并在该金属层表面先以黄光程序定义将成为该感应电路的预定区域,再移除非为该预定区域的金属层,而在该薄板表面形成该感应电路。
10.如权利要求2所述的感应式电子装置的制作方法,其特征在于:该步骤(a)在该薄板上设置一个已定义出该感应电路的印刷电路板。
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2013
- 2013-01-23 JP JP2013009939A patent/JP2013151158A/ja active Pending
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CN108582643A (zh) * | 2018-05-16 | 2018-09-28 | 深圳汉华科技股份有限公司 | 一种塑胶水位条制造工艺方法、塑胶水位条及其注塑模具 |
CN109546325A (zh) * | 2018-12-13 | 2019-03-29 | 泉州萃思技术开发有限公司 | 一种5g天线加工方法 |
CN109599664A (zh) * | 2018-12-13 | 2019-04-09 | 泉州萃思技术开发有限公司 | 一种网络天线生产方法 |
Also Published As
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TW201332211A (zh) | 2013-08-01 |
JP2013151158A (ja) | 2013-08-08 |
US20130187813A1 (en) | 2013-07-25 |
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