CN103212763A - LTCC (Low Temperature Co-fired Ceramic) device assembly welding method - Google Patents
LTCC (Low Temperature Co-fired Ceramic) device assembly welding method Download PDFInfo
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- CN103212763A CN103212763A CN2013101250067A CN201310125006A CN103212763A CN 103212763 A CN103212763 A CN 103212763A CN 2013101250067 A CN2013101250067 A CN 2013101250067A CN 201310125006 A CN201310125006 A CN 201310125006A CN 103212763 A CN103212763 A CN 103212763A
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Abstract
The invention discloses an LTCC (Low Temperature Co-fired Ceramic) device assembly welding method, which comprises the steps of firstly producing high-lead welding flux into welding balls with a diameter of 1.2-1.8mm; under the condition of 235-250DEG C, welding the welding balls on an LTCC device by using tin, silver and copper welding flux; and under the condition of 208-225DEG C, welding one surface, which is welded with the welding balls, of the LTCC device onto a printed circuit board by using tin and lead welding flux. By adopting the LTCC device assembly welding method, the LTCC device can bear impact of high-temperature and low-temperature tests after the LTCC device is welded on the printed circuit board.
Description
Technical field
The present invention relates to a kind of microcircuit package technique, particularly a kind of assembling and welding process of LTCC device.
Background technology
Along with the microelectronics science and technology development, complete electronic set is in the demand of aspects such as miniaturization, portable, multi-functional, digitlization and high reliability, high-performance, further having promoted electronic component develops to direction microminiaturized, integrated and high frequencyization day by day, the LTCC of rising in recent years (Low Temperature Co-fired Ceramics, LTCC) technology has satisfied above-mentioned requirements, therefore comes into one's own more and more in the world at home.LTCC (LTCC) technology is passive in recent years integrated major technique, applied to widely simultaneously also promote the microwave circuit technology and developed in miniaturization, lightweight, highly reliable microwave device, the assembly to directions such as monolithic integrated microwave circuit, microwave multi chip sheet modules.Use the LTCC device can obviously reduce the volume of assembly, outstanding electrical property is provided, can be applied to the various aspects of information technology.The slurry that the LTCC technology is used mainly contains and contains silver paste and contain the gold paste material.At present, less with the LTCC device application that contains the silver paste manufacturing, one of reason is that the LTCC device adopts QFN(quad flat no-lead usually) packing forms, using the SMT technology is directly welded on the microwave circuit boards, behind the process thermocycling, the pad of device just comes off from device, causes component failure.Therefore, be necessary to inquire into a kind of assembling method effectively and reliably, solve the application difficult problem of such LTCC device, this case produces thus.
Summary of the invention
Purpose of the present invention is to provide a kind of LTCC device assembling and welding process, after it can guarantee that the LTCC device is welded in printed board, and the impact that can bear thermocycling.
In order to reach above-mentioned purpose, solution of the present invention is:
A kind of LTCC device assembling and welding process comprises the steps:
(1) high kupper solder is made into the soldered ball that diameter is 1.2-1.8mm;
(2) under 235-250 ℃ temperature conditions, soldered ball is welded in the LTCC device with the SAC scolder;
(3) under 208-225 ℃ temperature conditions, the one side that LTCC is welded with soldered ball is welded in printed board with tin-lead solder.
In the above-mentioned steps (1), the optimum diameter size of soldered ball is 1.4mm.
In the above-mentioned steps (2), best welding temperature is 245 ℃.
In the above-mentioned steps (3), best welding temperature is 215 ℃.
After adopting such scheme, the present invention has improved the reliability after the LTCC device erection welding that contains the silver paste manufacturing, guarantees that device normally using through behind the thermocycling, has obtained applications well in the L-band microwave components, and preparation method is simple, convenient, and it is good to criticize producing property.After measured, adopt the present invention to make the LTCC device that contains the silver paste manufacturing can bear bigger shearing force, surpassed the LTCC device and directly adorned the anti-shearing force that is welded in printed board.
Description of drawings
Fig. 1 is the structural representation of 3db coupler in the embodiment of the invention;
Fig. 2 is the structural representation of soldered ball in the embodiment of the invention;
Fig. 3 is the schematic diagram that in the embodiment of the invention soldered ball is welded in the 3db coupler;
Fig. 4 is the schematic diagram that the 3db coupler that will have soldered ball in the embodiment of the invention is welded in printed board.
The specific embodiment
Below with reference to accompanying drawing, technical scheme of the present invention and beneficial effect are elaborated.
Contain after the LTCC device erection welding of silver paste manufacturing through the main phenomenon that lost efficacy behind the thermocycling be the LTCC device behind thermocycling, come off from printed board.The main cause that produces this problem is the different generation shearing forces with the printed board thermal coefficient of expansion of device, causes the pad of device to come off, thereby causes device to come off.At aforementioned analysis, the inventor considers that solution route is: 1. increase the space that distance between device and the printed board reserves plastic deformation, reduce the shearing force that acts on device bonding pad that produces because of coefficient of thermal expansion differences; 2. select thermal coefficient of expansion between between the two and the material that has than the forced plasticity deforming ability reduce the shearing force that acts on device bonding pad.Method at above-mentioned approach is: 1. soldered ball is welded in device bonding pad, the device that soldered ball will be housed again is welded in printed board, thereby reaches the purpose that increases the distance between device and the printed board; 2. when device is welded in printed board, for guaranteeing the distance between device and the printed board and avoid short circuit between the adjacent pad, soldered ball can not fusion; 3. consider argentiferous in the pad material of LTCC device,, cause pad adhesive force to reduce, determine to answer in the welding material argentiferous for avoiding powering up and moist environment silver migration down; In addition, because except that the SnPb scolder, all lead-free solders are bigger than the shear strength of SnPb eutectic solder, so consider to select for use unleaded SAC scolder; When 4. device is welded in printed board,, except that having good solderability, also be convenient to make in batches with conventional tin lead welding cream.
According to above-mentioned analysis, the invention provides a kind of LTCC device assembling and welding process, comprise following content:
(1) high kupper solder is made into the soldered ball that diameter is 1.2-1.8mm, the optimum diameter size of described soldered ball is 1.4mm;
(2) under 235-250 ℃ temperature conditions, soldered ball is welded in the LTCC device with the SAC scolder; In the present embodiment, best welding temperature is 245 ℃;
(3) one side that LTCC is welded with soldered ball under 208-225 ℃ temperature conditions, is welded in printed board with tin-lead solder with the LTCC device towards printed board, and in the present embodiment, best welding temperature is 215 ℃.
To be example below, technical scheme of the present invention will further be introduced with dress weldering 3db coupler.
Three-dB coupler is the device that adopts the LTCC technology to make, but device surface one deck is the AgPd layer, as shown in Figure 1.Earlier high kupper solder (composition 5Sn95Pb) is made into soldered ball, diameter is about 1.4mm, as shown in Figure 2.Use scolder (composition 96.5Sn3Ag0.5Cu) that ball bonding is connected to three-dB coupler then, as shown in Figure 3, in printed board, print soldering paste (composition 63Sn37Pb) at last again,, the three-dB coupler that welds ball is welded in printed board, as shown in Figure 4 by reflow welding.
Result of the test proves, adopts disclosed welding material combination and erection welding method, and the anti-shearing force of three-dB coupler reaches 3.3Kg, surpasses the shearing force (2.88Kg) that three-dB coupler is directly welded in printed board; Simultaneously, adopt new welding material combination and erection welding method, the LTCC device can bear the impact of thermocycling.
Above embodiment only for explanation technological thought of the present invention, can not limit protection scope of the present invention with this, every technological thought that proposes according to the present invention, and any change of being done on the technical scheme basis all falls within the protection domain of the present invention.
Claims (4)
1. a LTCC device assembling and welding process is characterized in that comprising the steps:
(1) high kupper solder is made into the soldered ball that diameter is 1.2-1.8mm;
(2) under 235-250 ℃ temperature conditions, soldered ball is welded in the LTCC device with the SAC scolder;
(3) under 208-225 ℃ temperature conditions, the one side that LTCC is welded with soldered ball is welded in printed board with tin-lead solder.
2. a kind of LTCC device assembling and welding process as claimed in claim 1 is characterized in that: in the described step (1), the optimum diameter size of soldered ball is 1.4mm.
3. a kind of LTCC device assembling and welding process as claimed in claim 1 is characterized in that: in the described step (2), best welding temperature is 245 ℃.
4. a kind of LTCC device assembling and welding process as claimed in claim 1 is characterized in that: in the described step (3), best welding temperature is 215 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101250067A CN103212763A (en) | 2013-04-11 | 2013-04-11 | LTCC (Low Temperature Co-fired Ceramic) device assembly welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101250067A CN103212763A (en) | 2013-04-11 | 2013-04-11 | LTCC (Low Temperature Co-fired Ceramic) device assembly welding method |
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| CN103212763A true CN103212763A (en) | 2013-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013101250067A Pending CN103212763A (en) | 2013-04-11 | 2013-04-11 | LTCC (Low Temperature Co-fired Ceramic) device assembly welding method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110465720A (en) * | 2019-09-09 | 2019-11-19 | 中国电子科技集团公司第二十六研究所 | A kind of multichannel SMP connector device matches welding fixture |
| CN110961741A (en) * | 2019-12-19 | 2020-04-07 | 中国科学院电子学研究所 | LTCC substrate brazing method |
Citations (7)
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| US20010004857A1 (en) * | 1999-12-22 | 2001-06-28 | Mitsui Mining And Smelting Co., Ltd | Paste to be fired for forming circuit board and method for preparing surface-modified silver powder |
| US20050146397A1 (en) * | 2003-12-24 | 2005-07-07 | Kyocera Corporation | Surface acoustic wave device and electronic circuit device |
| WO2008073432A2 (en) * | 2006-12-11 | 2008-06-19 | Fry's Metals, Inc. | No flow underfill process, composition, and reflow carrier |
| CN101714543A (en) * | 2009-11-12 | 2010-05-26 | 美新半导体（无锡）有限公司 | Ceramic substrate for three-dimensional packaging of multi-chip system and packaging method thereof |
| CN102130571A (en) * | 2011-03-21 | 2011-07-20 | 华为技术有限公司 | Power supply package and device thereof |
| WO2011104859A1 (en) * | 2010-02-26 | 2011-09-01 | 株式会社日立製作所 | Electronic component, conductive paste, and method for manufacturing electronic component |
| CN102357697A (en) * | 2011-09-29 | 2012-02-22 | 北京时代民芯科技有限公司 | Method for improving melting point of welding spot after reflux welding of ball/column attachment for CBGA (ceramic ball grid array)/CCGA (ceramic column grid array) packaging |
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2013
- 2013-04-11 CN CN2013101250067A patent/CN103212763A/en active Pending
Patent Citations (7)
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| US20010004857A1 (en) * | 1999-12-22 | 2001-06-28 | Mitsui Mining And Smelting Co., Ltd | Paste to be fired for forming circuit board and method for preparing surface-modified silver powder |
| US20050146397A1 (en) * | 2003-12-24 | 2005-07-07 | Kyocera Corporation | Surface acoustic wave device and electronic circuit device |
| WO2008073432A2 (en) * | 2006-12-11 | 2008-06-19 | Fry's Metals, Inc. | No flow underfill process, composition, and reflow carrier |
| CN101714543A (en) * | 2009-11-12 | 2010-05-26 | 美新半导体（无锡）有限公司 | Ceramic substrate for three-dimensional packaging of multi-chip system and packaging method thereof |
| WO2011104859A1 (en) * | 2010-02-26 | 2011-09-01 | 株式会社日立製作所 | Electronic component, conductive paste, and method for manufacturing electronic component |
| CN102130571A (en) * | 2011-03-21 | 2011-07-20 | 华为技术有限公司 | Power supply package and device thereof |
| CN102357697A (en) * | 2011-09-29 | 2012-02-22 | 北京时代民芯科技有限公司 | Method for improving melting point of welding spot after reflux welding of ball/column attachment for CBGA (ceramic ball grid array)/CCGA (ceramic column grid array) packaging |
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| 李建辉等: "LTCC BGA及其封装技术研究", 《2004年中国电子学会第十三届电子元件学术年会论文集》 * |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110465720A (en) * | 2019-09-09 | 2019-11-19 | 中国电子科技集团公司第二十六研究所 | A kind of multichannel SMP connector device matches welding fixture |
| CN110961741A (en) * | 2019-12-19 | 2020-04-07 | 中国科学院电子学研究所 | LTCC substrate brazing method |
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Application publication date: 20130724 |