CN103202107B - The manufacture method of printed wiring board and printed wiring board - Google Patents
The manufacture method of printed wiring board and printed wiring board Download PDFInfo
- Publication number
- CN103202107B CN103202107B CN201180052339.0A CN201180052339A CN103202107B CN 103202107 B CN103202107 B CN 103202107B CN 201180052339 A CN201180052339 A CN 201180052339A CN 103202107 B CN103202107 B CN 103202107B
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- China
- Prior art keywords
- copper
- wiring board
- printed wiring
- substrate
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 72
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 72
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 claims abstract description 59
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- SYOANZBNGDEJFH-UHFFFAOYSA-N 2,5-dihydro-1h-triazole Chemical compound C1NNN=C1 SYOANZBNGDEJFH-UHFFFAOYSA-N 0.000 claims abstract description 10
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- 229910000679 solder Inorganic materials 0.000 description 3
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- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
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- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 2
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
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- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
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- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
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- 150000001880 copper compounds Chemical class 0.000 description 1
- AEJIMXVJZFYIHN-UHFFFAOYSA-N copper;dihydrate Chemical compound O.O.[Cu] AEJIMXVJZFYIHN-UHFFFAOYSA-N 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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- 150000004693 imidazolium salts Chemical class 0.000 description 1
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- 238000001802 infusion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The object of this invention is to provide the manufacture method of the printed wiring board of the insulating reliability excellence of wiring closet.The manufacture method of printed wiring board of the present invention comprises: layer forming step, the copper making there is substrate and be configured on substrate or the core substrate of copper alloy distribution, with comprise 1,2,3-triazoles and/or 1,2,4-triazole and the treatment fluid contact of pH value display 5 ~ 12, then by solvent clean core substrate, and formed on the surface in copper or copper alloy distribution and comprise 1,2, the copper ion diffusion inhibiting layer of 3-triazole and/or 1,2,4-triazole; And dielectric film forming step, after layer forming step, on the core substrate being provided with copper ion diffusion inhibiting layer, form dielectric film.
Description
Technical field
The present invention relates to a kind of manufacture method and printed wiring board of printed wiring board.
Background technology
In recent years, along with the requirement such as multifunction of electronic equipment, and the high density of electronic component is amassed body, high-density installation etc. and is made progress, and the printed wiring board that those electronic components use etc. also make progress in miniaturized and densification aspect.Under this kind of situation, the interval of the distribution in printed wiring board becomes narrow and small more, in order to prevent the short circuit of wiring closet, also requires the insulating reliability improving wiring closet further.
Hinder the one of the main reasons of the insulating properties of the wiring closet of copper or copper alloy, the migration of known so-called copper ion.It is following phenomenon: produce potential difference if wait between wiring circuit, then the copper forming distribution, because moisture exists, ionization occurs, and the copper ion of stripping moves to adjacent distribution.Due to this kind of phenomenon, along with time process, reduction becomes copper compound to the copper ion of institute's stripping, and grows into ingotism (dendritic crystal) shape, and result causes wiring closet short circuit.
Anti-method of planting here migration proposes there is the technology (patent documentation 1 and patent documentation 2) forming the inhibition of metastasis layer using BTA (benzotriazole).More specifically, point out in those documents, wiring substrate is formed the layer suppressing copper ion migration, improve the insulating reliability of wiring closet.
[prior art document]
[patent documentation]
[patent documentation 1] Japanese Patent Laid-Open 2001-257451 publication
[patent documentation 2] Japanese Patent Laid-Open 10-321994 publication
Summary of the invention
On the other hand, as mentioned above, in recent years, the miniaturization of distribution obtains rapid progression, and improves further the requirement of the insulating reliability of wiring closet.
The inhibition of metastasis layer of the people such as present inventor to the use BTA described in patent documentation 1 and patent documentation 2 is studied, and the effect of this inhibition of metastasis layer of result is less, and the insulating reliability of wiring closet must be made to meet recently required level.
The present invention completes in view of above-mentioned actual conditions, its objective is the manufacture method providing a kind of printed wiring board of insulating reliability excellence of wiring closet and the printed wiring board obtained by the method.
The people such as present inventor study with keen determination, found that, can solve above-mentioned problem by following formation.
(1) manufacture method for printed wiring board, it comprises: layer forming step, the copper making there is substrate and be configured on described substrate or the core substrate of copper alloy distribution, with comprise 1,2,3-triazole and/or 1,2,4-triazole and the treatment fluid contact of pH value display 5 ~ 12, then by solvent clean core substrate, and formed on the surface in copper or copper alloy distribution and comprise 1,2,3-triazoles and/or 1, the copper ion diffusion inhibiting layer of 2,4-triazole; And
Dielectric film forming step, after layer forming step, forms dielectric film on the core substrate being provided with copper ion diffusion inhibiting layer.
(2) manufacture method of the printed wiring board recorded as (1), wherein 1,2,3-triazoles and the adhesion amount of 1,2,4-triazole on copper or copper alloy distribution surface are 5 × 10
-9g/mm
2~ 1 × 10
-6g/mm
2.
(3) manufacture method of the printed wiring board recorded as (1) or (2), wherein after layer forming step and before dielectric film forming step, comprises the drying steps of the core substrate heat drying by being provided with copper ion diffusion inhibiting layer.
(4) manufacture method of the printed wiring board recorded any one of (1) to (3), wherein the pH value for the treatment of fluid is 5 ~ 9.
(5) manufacture method of printed wiring board recorded any one of (1) to (4), wherein solvent comprise select Free water, alcohol series solvent and methyl ethyl ketone form in group at least a kind.
(6) printed wiring board, its by such as any one of (1) to (5) record printed wiring board manufacture method and manufacture.
[effect of invention]
According to the present invention, the manufacture method that the printed wiring board of the insulating reliability excellence of wiring closet can be provided and the printed wiring board obtained by the method.
Accompanying drawing explanation
Fig. 1 (A)-(D) be each step sequentially represented in the manufacture method of printed wiring board of the present invention from the schematic cross sectional view of substrate to printed wiring board.
Embodiment
Below, the manufacture method of printed wiring board of the present invention and the printed wiring board that obtains by the method are described.
Characteristic point of the present invention can be enumerated: make to comprise the azole compounds such as 1,2,3-triazoles and/or 1,2,4-triazole and the treatment fluid of display regulation pH value, contact with the core substrate with copper or copper alloy Wiring pattern after, then to clean.The people such as present inventor finds, if remaining azoles (azole) compound on substrate, is then arranged to produce between dielectric film on core substrate and substrate and touches bad etc., and cause short circuit.In addition, if clean after making the azole compounds such as the BTA beyond described azole compounds (benzotriazole) contact with described core substrate, then the azole compounds on copper or copper alloy distribution also can be removed simultaneously, and can not show desired effect.And, if use the treatment fluid beyond regulation pH value territory or comprise the treatment fluid of composition of the dissolved coppers such as etchant, after then making azole compounds and copper or copper alloy wiring contacts, the epithelium of the misfit thing comprising azole compounds and copper ion can be formed on distribution, and the effect suppressing migration cannot be showed.
Study according to above-mentioned discovery, found that, by enforcement as process of the present invention, the azole compounds on substrate can be removed and can form the copper ion diffusion inhibiting layer of energy suppressed copper migration on copper or copper alloy distribution.
The manufacture method of printed wiring board of the present invention is preferably has following steps.In addition, following drying steps is arbitrary step, can be implemented as required.
The core substrate of the copper that (layer forming step) makes to have substrate and be configured on described substrate or copper alloy distribution, with comprise 1,2,3-triazole and/or 1,2,4-triazole and the treatment fluid contact of pH value display 5 ~ 12, then by solvent clean core substrate, and formed on the surface in copper or copper alloy distribution and comprise 1,2,3-triazoles and/or 1, the layer forming step of the copper ion diffusion inhibiting layer of 2,4-triazole
(drying steps) will be provided with the step of the core substrate heat drying of copper ion diffusion inhibiting layer
(dielectric film forming step), after described drying steps, forms the step of dielectric film on the core substrate being provided with copper ion diffusion inhibiting layer
Below, the order with reference to graphic material to using in each step and step is described.
< layer forming step >
In this step, first the copper making there is substrate and be configured on substrate or the core substrate of copper alloy distribution, with comprise 1,2,3-triazoles and/or 1,2,4-triazole (both general names are also referred to as azole compounds below) and pH value display 5 ~ 12 treatment fluid contact (contact procedure).Then, clean core substrate by solvent (cleaning solvent), and formed on the surface in copper or copper alloy distribution and comprise 1,2,3-triazoles and/or 1,2, the copper ion diffusion inhibiting layer (cleaning step) of 4-triazole.In other words, contact procedure is that core substrate (being more specifically the surface with the side of copper or copper alloy distribution of core substrate) is contacted with treatment fluid, and covers the substrate surface of core substrate and the step on copper or copper alloy distribution surface by azole compounds.In addition, cleaning step is the step using solvent clean core substrate and remove the azole compounds on substrate surface.By this step, in the mode on the surface of covering copper or copper alloy distribution, form copper ion diffusion inhibiting layer, and suppress the migration of copper.
First, the material used in layer forming step (core substrate, treatment fluid etc.) is described, then the order of layer forming step is described.
< core substrate (substrate of attached distribution) >
The core substrate (internal substrate) used in this step has substrate and the copper that is configured on substrate or copper alloy distribution.In other words, core substrate is the lamination structure at least with substrate and metal wiring, as long as and outermost layer is configured with metal wiring.Fig. 1 (A) represents a form of core substrate, and core substrate 10 has substrate 12 and the copper be configured on substrate 12 or copper alloy below distribution 14(also referred to as distribution 14).Distribution 14 only can be arranged at the one side of substrate in Fig. 1 (A), also can be arranged at two sides.That is, core substrate 10 can be single substrate, also can be two sides substrate.
As long as substrate is the substrate can supporting distribution, then there is no particular restriction, is generally insulated substrate.Insulated substrate such as can use: organic substrate, ceramic substrate, silicon substrate, glass substrate etc.
The material of organic substrate can enumerate resin, such as, be preferably and use thermosetting resin, thermoplastic resin or the resin by those mixed with resin.Thermosetting resin can use: phenol resin, carbamide resin, melmac, alkyd resins, acrylic resin, unsaturated polyester resin, diallyl phthalate resin, epoxy resin, silicone resin, furane resins, ketone resin, xylene resin, benzocyclobutane olefine resin etc.Thermoplastic resin can be enumerated: polyimide resin, polyphenylene oxide resin, polyphenylene sulfide, aromatic polyamide resin, liquid crystal polymer etc.
In addition, the material of organic substrate also can use: glass woven fabric, glass adhesive-bonded fabric, aromatic polyamide are weaved cotton cloth, aromatic polyamide adhesive-bonded fabric, aromatic polyamide are weaved cotton cloth or material etc. that described resin impregnated is obtained in those materials.
Distribution is made up of copper or copper alloy.When distribution is made up of copper alloy, metal contained beyond copper include, for example: silver, tin, palladium, gold, nickel, chromium etc.
There is no particular restriction for the formation method of the distribution on substrate, can adopt known method.Representational is to enumerate: utilize the subtractive process of etch processes or utilize the semi-additive process of plating.
There is no particular restriction for the width of distribution, with regard to the aspect of the Gao Jitiization of printed wiring board, is preferably 1 μm ~ 1000 μm, is more preferred from 3 μm ~ 25 μm.
There is no particular restriction at the interval of wiring closet, with regard to the aspect of the Gao Jitiization of printed wiring board, is preferably 1 μm ~ 1000 μm, is more preferred from 3 μm ~ 25 μm.
In addition, there is no particular restriction for the pattern form of distribution, can be arbitrary pattern.Include, for example linearity, curve-like, rectangular-shaped, round shape etc.
There is no particular restriction for the thickness of distribution, with regard to the aspect of the Gao Jitiization of printed wiring board, is preferably 1 μm ~ 1000 μm, is more preferred from 3 μm ~ 25 μm.
There is no particular restriction for the surface roughness Rz of distribution, with regard to the viewpoint of the adhesion with dielectric film described later, is preferably 0.001 μm ~ 15 μm, is more preferred from 0.3 μm ~ 3 μm.
The method of the surface roughness Rz of adjustment distribution can use known method, include, for example: chemical roughen process, polishing milled processed etc.
In addition, Rz is according to JISB0601(1994) measure.
As long as the core substrate used in this step has distribution at outermost layer, other metal wirings (Wiring pattern) and interlayer insulating film sequentially can be had between substrate and distribution.In addition, other metal wirings and interlayer insulating film sequentially alternating packets can contain each layer of more than 2 layers between substrate and distribution.Namely core substrate can be so-called multi-layered wiring board, increases laminar substrate.
Interlayer insulating film can use known insulating material, include, for example: phenol resin, naphthalene resin, carbamide resin, amine resin, alkyd resins, epoxy resin, acrylate etc.
In addition, core substrate can be so-called rigidity (rigid) substrate, flexibility (flexible) substrate, rigid and flexible (rigid-flexible) substrate.
In addition, through hole (thoughhole) can be formed in substrate.When the two sides of substrate arranges distribution, such as can by filling metal (such as copper or copper alloy) in this through hole, and by the distribution conducting on two sides.
< treatment fluid >
The treatment fluid used in this step comprises 1,2,3-triazoles and/or 1,2,4-triazole, and pH value display 5 ~ 12.
Treatment fluid individually can comprise 1,2,3-triazoles or 1,2,4-triazole, also can comprise two kinds.In addition, in the present invention, regulation effect can being obtained by this azole compounds of use, such as, when using amido triazole to replace described azole compounds, desired effect cannot be obtained.
There is no particular restriction for the total content of the azole compounds in treatment fluid, with regard to copper ion diffusion inhibiting layer formation easiness and control copper ion diffusion inhibiting layer adhesion amount aspect with regard to, relative to treatment fluid total amount, be preferably 0.01 quality % ~ 10 quality %, be more preferred from 0.1 quality % ~ 5 quality %, special good is 0.25 quality % ~ 5 quality %.If the total content of azole compounds is too much, be then difficult to the accumulating amount controlling copper ion diffusion inhibiting layer.If the total content of azole compounds is very few, then to reaching the accumulating amount of desired copper ion diffusion inhibiting layer, need spended time, productivity is poor.
Treatment fluid can contain solvent (particularly dissolving the solvent of azole compounds).There is no particular restriction for the kind of the solvent used, and include, for example: water, alcohol series solvent (such as methyl alcohol, ethanol, isopropyl alcohol), ketone series solvent (such as acetone, methyl ethyl ketone, cyclohexanone), acid amides series solvent (such as formamide, dimethylacetylamide, 1-METHYLPYRROLIDONE), nitrile series solvent (such as acetonitrile, propionitrile), ester series solvent (such as methyl acetate, ethyl acetate), carbonate-based solvent (such as dimethyl carbonate, diethyl carbonate), ether series solvent, halogen series solvent etc.Two or more those solvent can be mixed and use.
Wherein, with regard to the aspect that the fail safe in printed wiring board manufacture is more excellent, be preferably water, alcohol series solvent.If particularly use water as solvent, then when adopting infusion process when making core substrate contact with treatment fluid, due to specific azole compounds, easily oneself's accumulation (self-stacking) is in copper or copper alloy distribution surface, therefore better.
There is no particular restriction for the content of the solvent in treatment fluid, relative to treatment fluid total amount, is preferably 90 quality % ~ 99.99 quality %, is more preferred from 95 quality % ~ 99.9 quality %, and special good is 95 quality % ~ 99.75 quality %.
On the other hand, with regard to improving the aspect of the insulating reliability of the wiring closet in printed wiring board, to be preferably in treatment fluid not copper ions in fact.If containing excessive copper ion, then when forming copper ion diffusion inhibiting layer due to this layer in containing copper ion, and suppress the effect of copper ion migration more weak, and undermine the insulating reliability of wiring closet.
In addition, what is called not copper ions in fact, refers to that the content of the copper ion in treatment fluid is 1 μm of below ol/l, is more preferred from 0.1 μm of below ol/l.The best is 0mol/l.
In addition, with regard to improving the aspect of the insulating reliability of the wiring closet in printed wiring board, to be preferably in treatment fluid the etchant of not cupric or copper alloy in fact.If containing etchant in treatment fluid, then when making core substrate contact with treatment fluid, can stripping copper ion in treatment fluid.Therefore, result owing to containing copper ion in copper ion diffusion inhibiting layer, and suppresses the effect of copper ion migration more weak, and undermines the insulating reliability of wiring closet.
Etchant include, for example: organic acid (such as sulfuric acid, nitric acid, hydrochloric acid, acetic acid, formic acid, hydrofluoric acid), oxidant (such as hydrogen peroxide, the concentrated sulfuric acid), chelate (such as imido oxalic acid, nitrilo base triacetic acid, ethylenediamine tetra-acetic acid, ethylenediamine, monoethanolamine, aminopropanol), mercaptan compound etc.In addition, etchant also comprises as imidazoles or imidazole derivatives compounds etc. self have the etchant of the etching action of copper.
In addition, if in fact not containing etchant, then the content of the etchant in treatment fluid refers to relative to treatment fluid total amount, and is below 0.01 quality %, with regard to improving the aspect of the insulating reliability of wiring closet further, is more preferred from below 0.001 quality %.The best is 0 quality %.
The pH value display 5 ~ 12 for the treatment of fluid.Wherein, with regard to the aspect that the insulating reliability of the wiring closet in printed wiring board is more excellent, being preferably pH value is 5 ~ 9, and being more preferred from pH value is 6 ~ 8.
If the pH value for the treatment of fluid is less than 5, then promote that copper ion is from copper or the stripping of copper alloy distribution, and containing a large amount of copper ions in copper ion diffusion inhibiting layer, the effect of result suppressed copper migration reduces, the insulating reliability of wiring closet is poor.If the pH value for the treatment of fluid is more than 12, then Kocide SD is separated out, and easy oxidation dissolution, the insulating reliability of result wiring closet is poor.
In addition, the adjustment of pH value can use known acid (such as hydrochloric acid, sulfuric acid) or alkali (such as NaOH) to carry out.In addition, the mensuration of pH value can use known measuring means (such as pH meter (during aqueous solvent)) to implement.
In addition, other additives (such as pH value adjusting agent, interfacial agent, anticorrisive agent, anti-precipitation agent etc.) can be contained in described treatment fluid.
< solvent (cleaning solvent) >
The solvent (cleaning solvent) used in the cleaning step of cleaning core substrate, if removings such as the unnecessary azole compounds wiring closet on substrate can piled up, then there is no particular restriction.Wherein, the solvent dissolving azole compounds is preferably.By this solvent of use, and more effectively can remove the unnecessary azole compounds etc. on unnecessary azole compounds or distribution that substrate is piled up.
Solvent include, for example: water, alcohol series solvent (such as methyl alcohol, ethanol, propyl alcohol), ketone series solvent (such as acetone, methyl ethyl ketone, cyclohexanone), acid amides series solvent (such as formamide, dimethylacetylamide, 1-METHYLPYRROLIDONE), nitrile series solvent (such as acetonitrile, propionitrile), ester series solvent (such as methyl acetate, ethyl acetate), carbonate-based solvent (such as dimethyl carbonate, diethyl carbonate), ether series solvent, halogen series solvent etc.Two or more those solvent can be mixed and use.
Wherein, with regard to the aspect that the permeability for liquids in fine wiring closet is more excellent, be preferably comprise select Free water, alcohol series solvent and methyl ethyl ketone form the solvent of at least a kind in group, be more preferred from the mixed liquor of alcohol series solvent and water.
There is no particular restriction for the boiling point (25 DEG C, 1 atmospheric pressure) of the solvent used, and with regard to the aspect that fail safe is more excellent, is preferably 75 DEG C ~ 100 DEG C, is more preferred from 80 DEG C ~ 100 DEG C.
There is no particular restriction for the surface tension (25 DEG C) of the solvent used, and with regard to the aspect that the cleaning with regard to wiring closet is more excellent, the insulating reliability of wiring closet improves further, is preferably 10mN/m ~ 80mN/m, is more preferred from 15mN/m ~ 60mN/m.
The order > of < layer forming step
Layer forming step is divided into following 2 steps to be described.
The core substrate of the copper that (contact procedure) makes to have substrate and be configured on substrate or copper alloy distribution, with comprise 1,2,3-triazoles and/or 1,2,4-triazole and the step that contacts of the treatment fluid that pH value shows 5 ~ 12
(cleaning step) by solvent clean core substrate, and is formed on the surface in copper or copper alloy distribution and comprises 1,2,3-triazoles and/or 1,2, the step of the copper ion diffusion inhibiting layer of 4-triazole
(contact procedure)
By making described core substrate (more specifically, being configured with the surface of the core substrate of the side of copper or copper alloy distribution), contacting with described treatment fluid, and as Suo Shi Fig. 1 (B), on core substrate 10, form the layer 16 comprising azole compounds.In other words, this contact procedure uses described treatment fluid, and cover substrate 12 surface of core substrate 10 and the step on distribution 14 surface by the layer 16 comprising azole compounds.This layer 16 is formed on substrate 12 and on distribution 14.
Comprise the layer 16 of azole compounds containing azole compounds.Its content etc. and the content synonym in copper ion diffusion inhibiting layer described later.In addition, there is no particular restriction for its adhesion amount, is preferably the adhesion amount obtaining the copper ion diffusion inhibiting layer of desired adhesion amount as caning be passed through cleaning step described later.
There is no particular restriction for the contact method of core substrate and described treatment fluid, can adopt known method.Include, for example: soak dipping, spray, spraying coating, spin coating etc., with regard to the easiness of the simplicity of process, the adjustment in processing time, be preferably immersions (dip) dipping, spray (shower) spraying, spraying is coated with.
In addition, the liquid temperature for the treatment of fluid during contact, with regard to more easily can controlling the aspect of the adhesion amount of copper ion diffusion inhibiting layer, is preferably the scope of 5 DEG C ~ 60 DEG C, is more preferred from the scope of 15 DEG C ~ 50 DEG C, and You Jia is the scope of 20 DEG C ~ 40 DEG C.
In addition, time of contact with regard to productivity and control copper ion diffusion inhibiting layer adhesion amount aspect with regard to, be preferably the scope of 10 seconds ~ 30 minutes, be more preferred from the scope of 15 seconds ~ 10 minutes, You Jia is the scope of 30 seconds ~ 5 minutes.
(cleaning step)
Then, by solvent clean core substrate, and formed on the surface in copper or copper alloy distribution and comprise 1,2,3-triazoles and/or 1,2, the copper ion diffusion inhibiting layer of 4-triazole.By carry out this step, and the azole compounds on removing substrate surface capable of washing.If particularly use the solvent dissolving azole compounds as solvent, then more easily can dissolve the azole compounds (azole compounds particularly on substrate surface) beyond the azole compounds on removing copper or copper alloy distribution surface.Specifically, by the core substrate 10 being provided with the layer 16 comprising azole compounds utilizing described cleaning solvent to clean gained in Fig. 1 (B), and as Suo Shi Fig. 1 (C), the layer 16 comprising azole compounds on removing substrate 12 and the unnecessary azole compounds on distribution 14, and on distribution 14, only form the layer comprising azole compounds.The layer comprising azole compounds on this distribution 14 is equivalent to copper ion diffusion inhibiting layer 18.
There is no particular restriction for cleaning method, can adopt known method.Include, for example: on core substrate, be coated with the method for cleaning solvent, in cleaning solvent, flood the method etc. of core substrate.
In addition, the liquid temperature of cleaning solvent, with regard to more easily controlling the aspect of the adhesion amount of copper ion diffusion inhibiting layer, is preferably the scope of 5 DEG C ~ 60 DEG C, is more preferred from the scope of 15 DEG C ~ 30 DEG C.
In addition, time of contact of core substrate and cleaning solvent with regard to productivity and more easily control copper ion diffusion inhibiting layer adhesion amount aspect with regard to, be preferably the scope of 10 seconds ~ 10 minutes, be more preferred from the scope of 15 seconds ~ 5 minutes.
(copper ion diffusion inhibiting layer)
By through described step, and as Suo Shi Fig. 1 (C), can be formed on the surface in copper or copper alloy distribution and comprise 1,2,3-triazoles and/or 1,2, the copper ion diffusion inhibiting layer 18 of 4-triazole.
In addition, as shown in Fig. 1 like this (C), be preferably the layer 16 removing on substrate 12 in fact and comprise azole compounds.Namely be preferably, in fact only form copper ion diffusion inhibiting layer on the surface in copper or copper alloy distribution.
In the present invention, after the cleaning implementing described solvent, also can obtain the copper ion diffusion inhibiting layer of the abundant adhesion amount that can suppress copper ion migration.Such as change into use BTA etc. time, by the cleaning of described solvent, and the BTA of the majority on distribution surface is rinsed out, and desired effect cannot be obtained.Contain the BTA of etchant in treatment fluid or have in the imidazolium compounds of etch functions, can be formed at containing copper ion in the organic coating on distribution, and without copper ion diffusion inhibit feature, and desired effect cannot be obtained.
The content of the azole compounds in copper ion diffusion inhibiting layer, with regard to can suppressing the aspect of copper ion migration further, is preferably 0.1 quality % ~ 100 quality %, is more preferred from 20 quality % ~ 100 quality %, and You Jia is 50 quality % ~ 90 quality %.Particularly copper ion diffusion inhibiting layer is preferably and comprises azole compounds in fact.If the content of azole compounds is very few, then the inhibition of metastasis effect of copper ion reduces.
Not copper ions or metallic copper is in fact preferably in copper ion diffusion inhibiting layer.If containing copper ion more than ormal weight or metallic copper in copper ion diffusion inhibiting layer, then have the situation that effect of the present invention is poor.
1,2,3-triazoles on copper or copper alloy distribution surface and the adhesion amount (total adhesion amount) of 1,2,4-triazole, with regard to can suppressing the aspect of copper ion migration further, relative to the total surface area of copper or copper alloy distribution, be preferably 5 × 10
-9g/mm
2~ 1 × 10
-6g/mm
2, be more preferred from 5 × 10
-9g/mm
2~ 2 × 10
-7g/mm
2, You Jia is 5 × 10
-9g/mm
2~ 6 × 10
-8g/mm
2.
In addition, adhesion amount can measure by known method (such as absorbance method).Specifically, the copper ion diffusion inhibiting layer (extraction of water) of wiring closet is first present in by water cleaning.Then, by the copper ion diffusion inhibiting layer on organic acid (such as sulfuric acid) extracting copper or copper alloy distribution, measure absorbance and calculate adhesion amount according to liquid measure and spreading area.
In addition, as mentioned above, be preferably in fact on substrate removing comprise the layer of azole compounds, but the layer that a part comprises azole compounds can be remained in the scope not undermining effect of the present invention.
< drying steps >
In this step, heat drying is carried out to the core substrate being provided with copper ion diffusion inhibiting layer.If residual moisture on core substrate, then may promote the migration of copper ion, be therefore preferably by arranging this step and remove moisture.In addition, this step is arbitrary step, during the solvent that the solvent in the treatment fluid used in layer forming step is volatility excellence etc., can not implement this step.
Heat drying condition, with regard to suppressing the aspect of the oxidation of copper or copper alloy distribution, is preferably and implements 15 seconds ~ 10 minutes (being preferably 30 seconds ~ 5 minutes) in 70 DEG C ~ 120 DEG C (being preferably 80 DEG C ~ 110 DEG C).If baking temperature is too low or drying time is too short, then there is the situation that the removing of moisture is insufficient, if baking temperature is too high or drying time is long, then may form cupric oxide.
The dry device used is not particularly limited, and can use the known heater such as thermostat layer, heater.
< dielectric film forming step >
In this step, on the core substrate being provided with copper ion diffusion inhibiting layer, form dielectric film.As Suo Shi Fig. 1 (D), dielectric film 20 is that the mode contacted with the distribution 14 being arranged at surface with copper ion diffusion inhibiting layer 18 is arranged on core substrate 10.By arranging dielectric film 20, and the insulating reliability between distribution 14 can be guaranteed.In addition, because substrate 12 can directly contact with dielectric film 20, therefore the adhesion of dielectric film 20 is excellent.
First, used dielectric film is described, then the formation method of dielectric film is described.
Dielectric film can use known Ins. ulative material.Such as can be used as so-called interlayer insulating film and the material used, specifically can enumerate: epoxy resin, aromatic polyamide resin, crystalline polyolefin resin, amorphous polyolefins resin, fluorine-containing resin (polytetrafluoroethylene, perfluorinate polyimides, perfluorinate amorphous resin etc.), polyimide resin, polyethersulfone resin, polyphenylene sulfide, polyether-ether-ketone resin, acrylate etc.Interlayer dielectric include, for example: the ABFGX-13 etc. that aginomoto fine chemistry (AjinomotoFine-Techno) (stock) manufactures.
In addition, dielectric film can use so-called solder mask layer.Solder resist can use commercially available product, include, for example: sun ink manufactures PFR800, PSR4000(trade name that (stock) manufactures), Hitachi changes into the SR7200G etc. that industry (stock) manufactures.
On core substrate, forming the formation method of dielectric film, there is no particular restriction, can adopt known method.Include, for example: by the method for film contact laminating on core substrate of dielectric film, the method etc. that maybe will comprise the dielectric film formation constituent of composition that forms dielectric film and coat the method on core substrate or core substrate be impregnated in this dielectric film formation constituent.
In addition, solvent can be contained as required in described dielectric film formation constituent.When using the dielectric film formation constituent containing solvent, this constituent being configured at after on substrate, heat treated can being implemented as required to remove desolventizing.
In addition, dielectric film is arranged at after on core substrate, energy can be implemented to dielectric film as required and give (such as exposure or heat treated).
There is no particular restriction for the thickness of the dielectric film formed, and with regard to the aspect that the insulating reliability of wiring closet is more excellent, is preferably 5 μm ~ 50 μm, is more preferred from 15 μm ~ 40 μm.
In Fig. 1 (D), dielectric film 20 is recited as one deck, also can be sandwich construction.
< printed wiring board >
By through described step, and as Suo Shi Fig. 1 (D), printed wiring board 30 can be obtained, it has substrate 12, the distribution 14 be configured on substrate 12, the dielectric film 20 be configured on distribution 14, and to be situated between every copper ion diffusion inhibiting layer 18 between distribution 14 and dielectric film 20.Insulating reliability between the distribution 14 of the printed wiring board 30 of gained is excellent, and dielectric film 20 is also excellent with the adhesion of core substrate 10.
In addition, as Suo Shi Fig. 1 (D), described in list one deck distribution structure printed wiring board be example, but be certainly not limited thereto example.Such as by being used in the multilayer wired core substrate sequentially replacing other metal wirings of lamination (metallic wiring layer) and interlayer insulating film between substrate 12 and distribution 14, and the printed wiring board of multi-layer wiring structure can be manufactured.
The printed wiring board obtained by manufacture method of the present invention can be used for various uses and structure, include, for example: internet device (MID in motherboard substrate or base plate for encapsulating semiconductor, mould, MoldedInterconnectDevice) substrates etc., can be used for rigid substrates, flexible base, board, flexible rigid substrate, shaping circuit substrate etc.
In addition, by the dielectric film removing part in the printed wiring board of gained, and semiconductor wafer is installed, and can be made into printed circuit board (PCB) to use.
Such as when using solder resist to make dielectric film, the shade of predetermined pattern shape being configured on dielectric film, giving energy and making it harden, will the dielectric film removing in the region of energy do not given and distribution be exposed.Then, after cleaning (such as using sulfuric acid or interfacial agent to clean) by the surface of known method to exposed distribution, semiconductor wafer is installed on distribution on the surface.
When using known interlayer dielectric as dielectric film, by drill bit processing or laser processing, dielectric film can be removed.
In addition, the dielectric film of the printed wiring board of gained can arrange metal wiring (Wiring pattern) further.There is no particular restriction for the method for formation metal wiring, can use known method (plating process, sputter process etc.).
In the present invention, the substrate that also can obtain arranging metal wiring (Wiring pattern) on the dielectric film of the printed wiring board of gained is further used as new core substrate (internal substrate), and which floor is by dielectric film and metal wiring lamination again.
[example]
Below, by example, the present invention will be described in more detail, but the present invention is not limited to those examples.
(example 1)
Use copper foil laminates (Hitachi changes into MCL-E-679F, the substrate that company manufactures: glass epoxy substrate), form the core substrate with the copper wiring of L/S=23 μm/27 μm by semi-additive process (semi-additive).Core substrate makes by following methods.
Copper foil laminates is carried out acid cleaning, washing, after drying, by vacuum attaching machine under the pressure of 0.2MPa under the condition of 70 DEG C, by dry film photoresist (DFR, trade name; RY3315, Hitachi change into Industries, Inc and manufacture) be laminated on copper foil laminates.After lamination, by the exposure machine of centre wavelength 365nm in 70mJ/cm
2condition under, copper pattern forming portion shade is exposed.Then, develop by 1% sodium bicarbonate aqueous solution, and carry out washing and obtain plating corrosion-resisting pattern (resistpattern).
Through plating (plating) preliminary treatment, washing, and the copper exposed between corrosion-resisting pattern implements plating.Now, electrolyte use copper sulphate (II) sulfuric acid solution, using purity be the blister copper plate of about 99% as anode, using copper foil laminates as negative electrode.By with 50 DEG C ~ 60 DEG C, 0.2V ~ 0.5V carries out electrolysis, and separate out copper on the copper of negative electrode.Then carry out washing, dry.
In order to peel off corrosion-resisting pattern, and in the 4%NaOH aqueous solution of 45 DEG C, substrate was flooded for 60 seconds.Then the substrate of gained is washed, and flooded for 30 seconds in 1% sulfuric acid.And then washing.
By the etching solution being principal component with hydrogen peroxide, sulfuric acid, fast-etching is carried out to the copper of the conducting between copper pattern, and carry out washing, dry.The surface roughness of the copper wiring of gained is Rz=0.3 μm.
Then, by pretreating agent (CA-5330 that Meike (MEC) company manufactures) by after the removings such as the dirt on copper wiring surface, the roughening treatment on copper wiring surface is implemented by roughening treatment agent (CZ-8100 that Meike (MEC) company manufactures).The surface roughness of the copper wiring of gained is Rz=1.0 μm.
Then, by the core substrate of gained in the aqueous solution (solvent: the content of water, 1,2,3-triazoles: be 2.5 quality %, liquid temperature relative to aqueous solution total amount: 25 DEG C, pH value: dipping 2 minutes 30 seconds 7) comprising 1,2,3-triazoles.Then, the core substrate of ethanol to gained is used to clean (time of contact: 2 minutes, liquid temp: 25 DEG C).And then core substrate is carried out dry process in 2 minutes in 100 DEG C.
By carrying out measuring reflectance, and confirm the copper ion diffusion inhibiting layer being formed on copper wiring and comprise 1,2,3-triazoles.By absorbance measurement, the adhesion amount of this azole compounds is 5.6 × 10
-8g/mm
2.
In addition, the substrate surface between copper wiring, by the absorbance measurement of wiring closet extract utilizing water, cannot confirm copper ion diffusion inhibiting layer, and confirms and remove by ethanol purge.
Lamination dielectric film (PFR-800 that sun ink Inc. makes) on the core substrate implementing dry process, then carries out exposing, toasting, and manufactures printed wiring board (thickness of dielectric film: 35 μm).About the printed wiring board of gained, carry out following biometrics.
(the substrate biometrics by HAST test)
Use the printed wiring board of gained, carry out biometrics (operative installations: the manufacture of Ace peck (espec) company, EHS-221MD) with the condition of humidity 85%, temperature 130 degree, pressure 1.2atm, voltage 100V.
Evaluation method is the test of enforcement 20 rod (rod), is 1 × 10 by the resistance value of wiring closet
9Ω is as reference resistor value.By from on-test when 120 hours resistance value display reference resistor value more than rod (rod) be set to qualified.
The result of the printed wiring board of gained in example 1 is shown in table 1.
(example 2)
Use 1, the content of 2,4-triazole relative to aqueous solution total amount be 2.5 quality % comprise 1,2, the aqueous solution (the solvent: water, liquid temperature: 25 DEG C, pH value: 6) of 4-triazole, replace the aqueous solution comprising 1,2,3-triazoles used in example 1, and core substrate is flooded 45 seconds in this aqueous solution, in addition, according to the order identical with example 1, manufacture printed wiring board.Result is gathered and is shown in table 1.
(example 3)
Use comprises 1,2,3-triazoles and 1, and 2, (solvent: water, liquid temperature: 25 DEG C, pH value: 6), replaces the aqueous solution comprising 1,2,3-triazoles used in example 1 to the aqueous solution of 4-triazole, in addition, according to the order identical with example 1, manufacture printed wiring board.Result is gathered and is shown in table 1.
In addition, the content of the 1,2,3-triazoles in treatment fluid is the content of 2.5 quality %, 1,2,4-triazole relative to aqueous solution total amount is 2.5 quality % relative to aqueous solution total amount.
(example 4)
Use the mixed solvent of water and ethanol to replace the ethanol used in example 2, in addition, according to the order identical with example 1, manufacture printed wiring board.Result is gathered and is shown in table 1.
In addition, the mixed volume ratio (water/ethanol) of the mixed solvent of water and ethanol is 50/50.
(example 5)
Use pH value be 5 comprise 1, the aqueous solution (the solvent: water, 1,2 of 2,3-triazole, the content of 3-triazole: be 2.5 quality %, liquid temperature relative to aqueous solution total amount: 25 DEG C), replace the aqueous solution comprising 1,2,3-triazoles used in example 1, methyl ethyl ketone is used to replace ethanol, in addition, according to the order identical with example 1, manufacture printed wiring board.Result is gathered and is shown in table 1.
(comparative example 1)
Use pH value be 3 comprise 1, the aqueous solution (the solvent: water, 1,2 of 2,3-triazole, the content of 3-triazole: be 0.005 quality %, liquid temperature relative to aqueous solution total amount: 25 DEG C), replace the aqueous solution comprising 1,2,3-triazoles used in example 1, and core substrate is flooded 15 minutes in this aqueous solution, in addition, according to the order identical with example 1, manufacture printed wiring board.Result is gathered and is shown in table 1.
(comparative example 2)
Use pH value be 3 comprise 1, the aqueous solution (the solvent: water, 1,2 of 2,4-triazole, the content of 4-triazole: be 0.05 quality %, liquid temperature relative to aqueous solution total amount: 25 DEG C), replace the aqueous solution comprising 1,2,3-triazoles used in example 1, and core substrate is flooded 12 minutes in this aqueous solution, in addition, according to the order identical with example 1, manufacture printed wiring board.Result is gathered and is shown in table 1.
(comparative example 3)
Use 1, the content of 2,3-triazole relative to aqueous solution total amount be 2.5 quality % comprise 1,2, the aqueous solution (the solvent: water, liquid temperature: 25 DEG C, pH value: 7) of 3-triazole, replace the aqueous solution comprising 1,2,3-triazoles used in example 1, do not carry out the cleaning of the core substrate using ethanol, in addition, according to the order identical with example 1, manufacture printed wiring board.Result is gathered and is shown in table 1.
(comparative example 4)
Use 1, the content of 2,4-triazole relative to aqueous solution total amount be 1.0 quality % comprise 1,2, the aqueous solution (the solvent: water, liquid temperature: 25 DEG C, pH value: 6) of 4-triazole, replace 1,2, the 4-triazole aqueous solution used in example 2, do not carry out the cleaning of the core substrate using ethanol, in addition, according to the order identical with example 2, manufacture printed wiring board.Result is gathered and is shown in table 1.
(comparative example 5)
Use pH value be 6 the aqueous solution (solvent: the content of water, BTA: be 1 quality %, liquid temperature relative to aqueous solution total amount: 25 DEG C) comprising BTA, what use in replacement example 1 comprises 1,2, the aqueous solution of 3-triazole, core substrate is flooded 5 minutes in this aqueous solution, in addition, according to the order identical with example 1, manufacture printed wiring board.Result is gathered and is shown in table 1.
(comparative example 6)
Use pH value be 10 the aqueous solution (solvent: the content of water, imidazoles: be 1.0 quality %, liquid temperature relative to aqueous solution total amount: 25 DEG C) comprising imidazoles, what use in replacement example 1 comprises 1,2, the aqueous solution of 3-triazole, core substrate is flooded 30 minutes in this aqueous solution, in addition, according to the order identical with example 1, manufacture printed wiring board.Result is gathered and is shown in table 1.
In addition, the pH value of each treatment fluid in example 5, comparative example 1, comparative example 2 uses sulfuric acid to carry out adjusting (content of the sulfuric acid in addition, in example 5 is 0.0025 quality % relative to treatment fluid total amount).In addition, the mensuration of pH value uses pH meter (manufacture of East Asia (DKK-TOA) company).Example 1 ~ example 5 in table 1 and " adhesion amount " of comparative example 1 ~ comparative example 4 refer to azole compounds (1,2,3-triazole and 1,2,4-triazole) the total adhesion amount of per unit area, " adhesion amount " of comparative example 5 and comparative example 6 refers to the adhesion amount of the per unit area of BTA and imidazoles (imidazole) respectively, and it measures above absorbance method and carries out.
Can confirm as shown in Table 1 above, the printed wiring board obtained by the manufacture method of this case invention shows excellent biometrics result, and the insulating reliability of wiring closet is excellent.
On the other hand, in using pH value in the comparative example 1 of the treatment fluid in prescribed limit and comparative example 2 and the comparative example 3 not implementing clean and comparative example 4, the insulating reliability of wiring closet is poor.
In addition, in the comparative example 5 using BTA and imidazoles and comparative example 6, the insulating reliability of wiring closet is also poor.
(example 6)
The roughening treatment on the copper wiring surface by roughening treatment agent (CZ-8100 that Meike (MEC) company manufactures) is not carried out when core substrate manufactures, and use 1, 2, the content of 4-triazole relative to aqueous solution total amount be 1.0 quality % comprise 1, 2, the aqueous solution (the solvent: water of 4-triazole, liquid temperature: 25 DEG C, pH value: 6), what use in replacement example 2 comprises 1, 2, the aqueous solution of 4-triazole, flood 30 seconds, and the ABFGX-13 using aginomoto fine chemistry (stock) to manufacture replaces PFR800 as dielectric film, in addition, according to the order identical with example 2, manufacture printed wiring board.
HAST life assessment method is the test of enforcement 20 rod, is 1 × 10 by the resistance value of wiring closet
10Ω is as reference resistor value.By from on-test when 670 hours resistance value display reference resistor value more than rod be set to qualified.Result is gathered and is shown in table 2.
(comparative example 7)
Use 1, the content of 2,4-triazole relative to aqueous solution total amount be 0.25 quality % comprise 1,2, the aqueous solution (the solvent: water, liquid temperature: 25 DEG C, pH value: 6) of 4-triazole, replace the aqueous solution comprising 1,2,4-triazole used in example 6, do not carry out the cleaning of the core substrate using ethanol, in addition, according to the order identical with example 6, manufacture printed wiring board.Result is gathered and is shown in table 2.
In addition, " adhesion amount " in table 2 refers to the total adhesion amount of the per unit area of azole compounds (1,2,3-triazoles and 1,2,4-triazole).
Can confirm as shown in Table 2 above, the printed wiring board obtained by the manufacture method of this case invention, when using different dielectric films, also show excellent biometrics result, and the insulating reliability of wiring closet is excellent.
On the other hand, in the comparative example 7 not implementing clean, the insulating reliability of wiring closet is poor.
Main element symbol description:
10: core substrate
12: substrate
14: distribution
16: the layer comprising azole compounds
18: copper ion diffusion inhibiting layer
20: dielectric film
30: printed wiring board
Claims (9)
1. a manufacture method for printed wiring board, comprising:
Layer forming step; the copper making there is substrate and be configured on described substrate or the core substrate of copper alloy distribution, with comprise 1,2,3-triazoles and/or 1; 2; 4-triazole and the treatment fluid contact of pH value display 5 ~ 12, then by core substrate described in solvent clean, and formed on the surface in copper or copper alloy distribution and comprise 1; 2; the copper ion diffusion inhibiting layer of 3-triazole and/or 1,2,4-triazole; And
Dielectric film forming step, after described layer forming step, forms dielectric film on the core substrate being provided with described copper ion diffusion inhibiting layer.
2. the manufacture method of printed wiring board according to claim 1, wherein, the adhesion amount on copper or copper alloy distribution surface of described 1,2,3-triazoles and 1,2,4-triazole is 5 × l0
-9g/mm
2~ 1 × 10
-6g/mm
2.
3. the manufacture method of printed wiring board according to claim 1 and 2, wherein, after described layer forming step, before described dielectric film forming step, comprises the drying steps of the core substrate heat drying by being provided with described copper ion diffusion inhibiting layer.
4. the manufacture method of printed wiring board according to claim 1 and 2, wherein, the pH value of described treatment fluid is 5 ~ 9.
5. the manufacture method of printed wiring board according to claim 1 and 2, wherein, described solvent comprise select Free water, alcohol series solvent and methyl ethyl ketone form in group at least a kind.
6. a printed wiring board, its manufacture method by the printed wiring board such as according to any one of claim 1-5 and manufacturing.
7. the manufacture method of printed wiring board according to claim 3, the pH value of wherein said treatment fluid is 5 ~ 9.
8. the manufacture method of printed wiring board according to claim 3, wherein said solvent comprise select Free water, alcohol series solvent and methyl ethyl ketone form in group at least a kind.
9. the manufacture method of printed wiring board according to claim 4, wherein said solvent comprise select Free water, alcohol series solvent and methyl ethyl ketone form in group at least a kind.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010248624 | 2010-11-05 | ||
| JP2010-248624 | 2010-11-05 | ||
| JP2011-071488 | 2011-03-29 | ||
| JP2011071488 | 2011-03-29 | ||
| PCT/JP2011/074675 WO2012060260A1 (en) | 2010-11-05 | 2011-10-26 | Method for manufacturing printed wiring board, and printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103202107A CN103202107A (en) | 2013-07-10 |
| CN103202107B true CN103202107B (en) | 2016-01-20 |
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ID=46024375
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180052339.0A Expired - Fee Related CN103202107B (en) | 2010-11-05 | 2011-10-26 | The manufacture method of printed wiring board and printed wiring board |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5647967B2 (en) |
| KR (1) | KR101590435B1 (en) |
| CN (1) | CN103202107B (en) |
| TW (1) | TWI508637B (en) |
| WO (1) | WO2012060260A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2736076A1 (en) * | 2012-11-23 | 2014-05-28 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Apparatus and method for manufacturing a layered product |
| TWI708996B (en) * | 2016-01-29 | 2020-11-01 | 日商富士軟片股份有限公司 | Photosensitive resin composition, cured film, laminate, cured film manufacturing method, laminate manufacturing method, and semiconductor element |
| TWI576030B (en) * | 2016-06-24 | 2017-03-21 | 南亞電路板股份有限公司 | Printed circuit board and fabricating method thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61266241A (en) * | 1985-05-21 | 1986-11-25 | 株式会社日立製作所 | Surface treating method of copper |
| JPS63160296A (en) * | 1986-12-23 | 1988-07-04 | 日立化成工業株式会社 | Post-treatment of printed wiring board |
| JPH01251785A (en) * | 1988-03-31 | 1989-10-06 | Hitachi Chem Co Ltd | Aftertreatment for printed wiring board |
| JPH10321994A (en) | 1997-05-16 | 1998-12-04 | Senju Metal Ind Co Ltd | Method of preventing migration in conductor parts of electronics |
| JP3463045B2 (en) * | 2000-03-03 | 2003-11-05 | Ｎｅｃエレクトロニクス株式会社 | Anticorrosion treatment stock solution |
| JP2001257451A (en) | 2000-03-09 | 2001-09-21 | Matsushita Electric Ind Co Ltd | Printed wiring board and method of manufacturing the same |
| JP2005072276A (en) * | 2003-08-25 | 2005-03-17 | Fujikura Ltd | Printed-wiring board and manufacturing method thereof |
| WO2009142126A1 (en) * | 2008-05-21 | 2009-11-26 | 日本高純度化学株式会社 | Catalyst-imparting liquid for solder plating |
-
2011
- 2011-10-26 JP JP2011234664A patent/JP5647967B2/en active Active
- 2011-10-26 WO PCT/JP2011/074675 patent/WO2012060260A1/en active Application Filing
- 2011-10-26 CN CN201180052339.0A patent/CN103202107B/en not_active Expired - Fee Related
- 2011-10-26 KR KR1020137011220A patent/KR101590435B1/en active IP Right Grant
- 2011-11-01 TW TW100139832A patent/TWI508637B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW201220992A (en) | 2012-05-16 |
| WO2012060260A1 (en) | 2012-05-10 |
| CN103202107A (en) | 2013-07-10 |
| TWI508637B (en) | 2015-11-11 |
| JP2012216759A (en) | 2012-11-08 |
| KR101590435B1 (en) | 2016-02-01 |
| KR20130132424A (en) | 2013-12-04 |
| JP5647967B2 (en) | 2015-01-07 |
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