CN103187624B - 介质天线以及天线模块 - Google Patents
介质天线以及天线模块 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/20—Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/24—Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave constituted by a dielectric or ferromagnetic rod or pipe
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/20—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a curvilinear path
- H01Q21/205—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a curvilinear path providing an omnidirectional coverage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
Abstract
一种介质天线以及天线模块,该介质天线包括至少一个介质单元。每一个介质单元分为第一区域与第二区域,且第二区域可有一弯折部分。一导体覆盖在介质单元的第二区域的表面形成一波导结构,此波导结构第一端与第一区域相连,第二端为信号馈入端,用以馈入或接收信号。本发明的介质天线,能与芯片封装在一起,可适用于譬如毫米波高增益天线模块等。
Description
技术领域
本发明涉及一种天线技术,特别是一种介质天线以及天线模块。
背景技术
天线在无线通信中是必备元件。随着无线通信对于数据传输量需求的增加,毫米波频段具有很大的可用频宽,例如60GHz频段可以有7GHz的频宽,允许通信上有各种应用。另一方面,由于半导体工艺的进步,射频前端单芯片得以实现。相对于以往使用离散元件所制作的模块,整合芯片可以缩小模块尺寸、降低组装复杂度,降低成本,并且提供波束切换的重要功能。
以毫米波为例,由于60GHz毫米波在大气中的传输损耗很大,需要较大的有效等向辐射功率(EquivalentIsotropicallyRadiatedPower,EIRP)来补足传输损耗并达成高速传输的需求,EIRP是发射机输出功率(PTX)与天线增益(Gain)的乘积,即是EIRP=PTx×Gain。然而,目前毫米波频段硅基半导体功率放大器的最大转换效率(Power-addedefficiency,PAE)多在10%上下,功率输出也很有限,因此提高天线增益就变成提高EIRP最有效的方法。
天线的尺寸与波长呈比例关系。毫米波的波长较微波短,以60GHz为例,真空中的波长仅约5mm。传统上,制作在介电质载板上的一般平板天线(patchantenna)的边长大约仅2mm,因此制作精度与组装对准精度的要求会比一般微波频带的天线要来得高,而阵列天线的模块由于单元数目多,精度控制的困难度更高。
搭配芯片的天线技术,相对于芯片技术的蓬勃发展,在体积、成本与整合性的考量下,例如一般是使用多层的低温共烧陶瓷(LowTemperatureCo-firedCeramic,LTCC)技术制作天线模块。LTCC多层技术可以作为射频前端芯片的承载板,低损耗的特性可以提供毫米波射频信号的走线以及制作平面阵列天线。不过由于LTCC的介电常数较高,例如约5~8之间,且层板厚度较薄,因此传统单一平板天线的增益仅约4-6dBi左右,其需要较多的单元组成阵列才能达到系统的需求,其常见的阵列数目在16个至64个。虽然单一平板天线可以利用阵列方式达到较高的功率,但是天线主波束角度可涵盖范围不大,较难因应复杂多变的无线通信使用环境。
发明内容
本发明所要解决的技术问题是提供一种能与芯片封装在一起,可适用于譬如毫米波高增益天线模块等的介质天线以及天线模块。
为了实现上述目的,本发明提供了一种介质天线,其中,包括:
多个介质单元,每一个该介质单元分为第一区域与第二区域;
至少一个导体,覆盖在每一个该多个介质单元的该第二区域的表面,成为一波导结构,该波导结构的第一端与该第一区域相连,该波导结构的第二端是一信号馈入端;
至少一个连接结构,连结该至少一个波导结构使成为至少一积体结构,其中该至少一个连接结构的一横截面宽度小于一临界尺寸;以及
一信号馈入结构,有一端点邻近该波导结构的该信号馈入端,用以馈入或接收信号,
其中,临界尺寸的大小不大于操作信号的半波长。
本发明还提供了一种介质天线,其中,包括:
一介质单元,分为第一区域与第二区域,该第二区域有一弯折部分;以及
一导体,覆盖该第二区域包括该弯折部分的一表面,成为一波导结构,该波导结构的第一端与该第一区域相连,该波导结构的第二端是一信号馈入端。
本发明还提供了一种天线模块,其中,包括:
一载板,包括多个导体层,该些导体层包括:
第一导体层,在载板一面用于接地,其中该第一导体层包括多个开孔;以及
第二导体层,包括多个信号馈入结构,分别有一端点对应该第一导体层的该多个开孔;
多个介质单元,分别配置在该第一导体层的该多个开孔上方,其中每一个该介质单元分为第一区域与第二区域;以及
至少一个导体,覆盖在该介质单元的该第二区域的表面,分别成为一波导结构,每一个该波导结构的一信号馈入端分别对应至该第一导体层的该开孔之一,
其中该信号馈入结构的该端点分别与对应的该波导结构配置,以从每一个该波导结构的该信号馈入端馈入或接收信号。
本发明的一种介质天线,包括多个介质单元、一或多个导体、一或多个连接结构以及多个信号馈入结构。每一个该介质单元分为第一区域与第二区域。一或多个导体覆盖在每一个介质单元的该第二区域的表面,使该第二区域成为一波导结构,该波导结构的第一端与该第一区域相连,以及该波导结构的第二端是一信号馈入端。
一或多个连接结构连结一或多个该波导结构使成为至少一积体结构,其中该一或多个连接结构的一横截面宽度小于一临界尺寸。信号馈入结构有一端点邻近该波导结构的该信号馈入端,用以馈入或接收信号。
本发明的另一种介质天线,包括一介质单元与一导体。介质单元分为第一区域与第二区域,该第二区域有一弯折部分。导体覆盖该第二区域,使该第二区域成为一波导结构,该波导结构的第一端与该第一区域相连,以及该波导结构的第二端是一信号馈入端。
本发明的天线模块,包括一载板、多个介质单元、以及一或多个导体。载板包括多个导体层,该些导体层包括第一导体层在载板一面用于接地,该第一导体层包括多个开孔,以及第二导体层,包括多个信号馈入结构,分别有一端点对应该些开孔。介质单元分别配置在该些开孔上方,其中每一个该介质单元分为第一区域与第二区域,一或多个导体覆盖在该些介质单元的第二区域的表面,使这些第二区域分别成为波导结构,每一个波导结构的一信号馈入端分别对应至该第一导体层的该些开孔之一。信号馈入结构的端点分别对应波导结构配置,以从每一个波导结构的该信号馈入端馈入或接收信号。
本发明的技术效果在于:本发明的介质天线(DielectricAntenna),能与芯片封装在一起,可适用于譬如毫米波高增益天线模块等。另亦可配合低温共烧陶瓷技术,制成多层线路载板(carrier)。本发明介质天线的结构以及其所组成的天线模块,易于组装达到精度需求,另外也允许有多种发射角度的组合,达到因应使用环境的多样装置的位置变化有较容易的操作效率。本发明的天线模块的构造简单,单元密度高,可与现有平面载板整合,而天线单元增益高,实施时可随需求调整。天线单元结合了波导结构与介质单元(即辐射体),实施时可将天线单元往垂直的方向延展,以达到高密集度以及与平面载板整合的需求。介质单元的增益随长度增加,可以增加天线单元增益。而波导结构可弯折且保持低损耗的特性,不受限于现有技术在整合天线基础波束角度的束缚。天线模块结构也可能使用塑胶射出成形等的方式来制作,使能量产与降低成本。
以下结合附图和具体实施例对本发明进行详细描述,但不作为对本发明的限定。
附图说明
图1为本发明一实施例的天线模块的剖面示意图;
图2为本发明一实施例的天线模块组装后的剖面结构示意图;
图3为本发明一实施例的介质天线的立体结构示意图;
图4a~4d为本发明一实施例的介质天线的结构的剖面示意图;
图5为本发明一实施例的当波导结构覆盖到弯折区域的角度辐射图案示意图;
图6为本发明一实施例的当波导结构没有覆盖到弯折区域的角度辐射图案示意图;
图7为本发明一实施例的相邻二个介质单元之间的连接结构示意图;
图8A-8C为本发明一实施例的天线模块的弯折方式示意图;
图9A-9C为本发明一实施例的天线模块的弯折方式示意图;
图10为本发明一实施例的天线模块具有多个波束的系统应用示意图;
图11为本发明一实施例的天线模块具有多个波束的系统应用示意图;
图12为本发明一实施例的连接结构组成一群组的示意图;
图13A-13E为本发明一实施例的介质天线配合连接结构方式示意图;
图14A-14D为本发明一实施例的介质单元与载板的连接部位的立体透视图以及上视及侧视透视图;
图15为本发明一实施例的天线模块组装后的剖面结构示意图。
其中,附图标记
100载板
102第一导体层
104第二导体层
104’信号馈入结构
104〞端点
105第三导体层
106开孔
107第四导体层
108第一导体柱
109第二导体柱
110介质天线
112连接端点
113导体柱
114连接端点
115焊接结构
116芯片
120介质单元
121介质单元第一区
122介质单元第二区
122’波导结构
123信号馈入端
124连接结构
140a、140b、140c深度
200导体柱
300、302天线阵列
具体实施方式
下面结合附图对本发明的结构原理和工作原理作具体的描述:
本发明提供的天线采用介质天线(DielectricAntenna),能与芯片封装在一起,可适用于譬如毫米波高增益天线模块等。另亦可配合低温共烧陶瓷技术,制成多层线路载板(carrier)。
本发明提供介质天线的结构以及其所组成的天线模块,可以易于组装达到精度需求,另外也允许可以有多种发射角度的组合,达到因应使用环境的多样装置的位置变化有较容易的操作效率。
本发明提供的天线模块的构造简单,单元密度高,可与现有平面载板整合,而天线单元增益高,实施时并可随需求调整。例如,天线结构可弯折角度改变天线波束方向,可以配合相位阵列或是切换天线阵列或群组的架构来满足不同的波束范围规划有利于与薄型装置整合。
天线单元结合了波导结构与介质单元(即辐射体),实施时可将天线单元往垂直的方向延展,以达到高密集度以及与平面载板整合的需求。介质单元的增益随长度增加,可以增加天线单元增益。而波导结构可弯折且保持低损耗的特性,不受限于现有技术在整合天线基础波束角度的束缚。天线模块结构也可能使用塑胶射出成形等的方式来制作,使能量产与降低成本。
以下举一些实施例来说明,但是本发明不限于所举的实施例。另外所举的一些实施例之间也允许有适当的结合。
图1为本发明一实施例天线模块的剖面示意图。参阅图1,天线模块包括载板100以及设置在载板100上的介质天线110。本实施例的介质天线110是由具有弯折的多个介质单元120所构成的阵列,其较详细的结构会描述于图3,而一些实施例中介质天线110可为单一介质单元120所构成。此实施例中由多个介质单元120所构成的阵列结构,可一次将多个介质单元120即介质天线110与载板100组装,使介质天线110较易配置到载板100上的预定位置。载板100具有多个导体层,其中包括作为接地的导体层102(第一导体层),以及作为信号馈入的导体层104(第二导体层)。位于载板100一面的导体层102的结构包括有多个开孔106,导体层104具有多个信号馈入结构104’,信号馈入结构104’分别有一端点104〞对应开孔106。多个介质单元120分别配置在开孔106上方,介质单元120会与开孔106对位,而信号馈入结构104’将信号通过开孔106而馈入介质单元120。
一实施例中载板100可至少具有第三导体层105及第四导体层107,第一导体层102及第三导体层105以第一导体柱108电性连接,第二导体层104及第四导体层107以第二导体柱109电性连接。于第二导体层104的信号馈入结构104’经由载板100内的至少一导体层与至少一导体柱113可构成一信号传输路径与连接端点114相连接。
载板100的另一面可经由连接端点114与至少一芯片116连接整合,以与介质单元120电性耦接,能够经由信号馈入结构104’馈入信号且依照介质单元120决定天线波束方向。至少一芯片116可为例如含有射频模块的芯片、射频芯片(RadioFrequencyIC/Chip)、或前述芯片与其他任何性能芯片的组合等。载板100也可以有其它的连接端点112,作为与其它电路连接。在连接端点112与连接端点114一般会有焊接结构115,于此图例中为锡球,以电性连接其它电路板上。
图2为本发明一实施例天线模块组装后的剖面结构示意图。参阅图2,介质天线110可以对应开孔106的位置设置于载板100上。介质天线110例如可利用塑料射出成型的技术将多个介质单元120对应至开孔106所要的位置成为一积体结构。
图3为本发明一实施例介质天线的立体结构示意图,其中介质天线110可为介质柱状天线(DielectricRodAntenna,DRA),但可实施方式并不限于此。图4a~4d为本发明一实施例的介质天线的结构的剖面示意图。参阅图3与图4a~4d,包括至少一个介质单元120,介质单元120可以分为第一区域121与第二区域122。第二区域122可有一弯折部分。另外,以一或多个导体覆盖在介质单元120的第二区域122的表面,形成一波导结构122’,波导结构122’的第一端与第一区域121相连,波导结构122’的第二端是一信号馈入端123,对应至第一导体层102的该些开孔106其一。当图1的信号馈入结构104’将信号馈入到波导结构122’的信号馈入端123后,由第二区域122将电磁能量导入第一区域121,电磁波经由介质单元的第一区域121辐射出去。信号馈入结构104’的端点104”邻近该波导结构的信号馈入端123,分别对应该些波导结构122’配置,以从该些波导结构122’的信号馈入端123馈入或接收信号。
由于介质单元120可有弯折的部分,通过不同弯折的角度可以达到不同的天线波束方向。由多个介质单元120组成天线阵列,可提高天线的指向性。而每一个介质单元120的波导结构的信号馈入端对位组装到如图1的开孔106位置。当介质天线110的介质单元120的数量与之间的密度增加时,就组装与制造上,亦不排除单一介质单元120可分别组装,但是如果是个别组装,其至少需要分别对位。
本发明还提出由介质单元120所构成的天线模块110一实施例。可利用一或多个连接结构124将介质天线110的一或多个的介质单元120连接一起形成至少一积体结构,此实施例中结构上是单一的积体结构,因此组装到载板100时,此实施例仅要一次对位可简化组装复杂度。于此关于图4a~4d的连接结构124需要附加说明,其仅是示意图以表示与第二区域122的连接关系,其在图3对应图4a~4d的剖面上是不会看到连接结构124。
另外在图4a~4d中,介质单元120的第二区域122被一或多个导体覆盖。在一些实施例中覆盖导体也可以覆盖连接结构124的部分表面或是全部表面,其例如其中的图4a~4d所示。连接结构可使用一或多个导体覆盖,或者覆盖第二区域的导体亦可以延伸覆盖连接结构。另外,介质单元120在信号馈入端的表面也可以有至少一凹曲的形状(图中未显示),作为匹配调整用。
介质天线110包含连接结构124例如也可以采用陶瓷被动元件的工艺或是塑料射出成型的技术同时完成多个介质单元120的制造。一实施例中连接结构124的横截面的最大尺寸小于或等于一临界值(以下称为临界尺寸),以有效降低相邻连接的介质单元120电磁能量耦合。本实施例的临界尺寸的大小例如是相对操作波长的半波长,于图7有较详细的实施例描述。
图5为本发明一未包括连接结构的实施例,当第二区域122具一90度弯折区域辐射场形模拟图。参阅图5,如果第二区域122包含一弯折区域,其天线主波束与第一区域轴向平行,且指向性较高。弯折区域的曲率半径可例如约为2mm,相对于5mm的操作波长仅为0.4λ。
图6为本发明一未包括连接结构的实施例,当第二区域122未具弯折区域的辐射场形模拟图。参阅图6,第一区域具弯折90度结构,第二区域未具弯折结构。于此状况,天线主波束并未能集中于第一区域直线段轴向(-x方向)且指向性较图5实施例低。
介质单元120的横截面的几何形状,可不限定形状,其例如是方形、矩型、圆形、椭圆或其他形状等也可以。
可用不同方式将相邻或不相邻的二个或二个以上介质单元120之间利用一或多个连接结构124连接构成一体。图7为本发明一实施例,相邻二个介质单元之间的连接结构示意图。连接结构124与第二区域122的材料亦可相同,因此例如可是以一体成型的工艺完成。连接结构124的横截面例如是方形、矩形、圆形或是其它的形状等,以达到机械上的一体。连接结构124除了有助于简易制造成阵列的结构,也可以方便组装到载板时的对位。
此外,连接结构124的连结方式并不以此为限,亦可交叉连结、跳跃连结或任意选择连结二个或二个以上的介质单元120,譬如说连结排列第偶数号或排列第奇数号的介质单元120。
由于连接结构124仍会有导波的效果,因此可能会产生两介质单元120之间电磁能量耦合。但是如果连接结构124的最大横截宽度小于临界尺寸,则连接结构124在该频段为止带(stop-band)无法传播电磁能量,可以减少这些导波结构之间的电磁能量耦合。此外,能量耦合的问题可以通过控制连接结构124横截面宽度的大小而解决。也就是说,连接结构124配合适当尺寸可以减少电磁能量从多个波导结构分别的单一个泄漏。
天线模块其中各子群或各介质单元120的弯折方式可以有多种变化而达到不同角度上的多个波束,各子群组或各介质单元120的波束角度可以不一致,使分别指向不同方向。
图8A-8C为本发明一实施例的天线模块的弯折方式示意图。参阅图8A,以连接结构124的直线延伸方向为x轴,介质单元120第一区域的轴向以虚线表示,其可以与x轴及z轴分别具一夹角ψ及θ。又,于此的弯折角度θ是以90度为例,而夹角ψ是在水平平面上的变化。于此实施例,夹角ψ也是90度。参阅图8B不同第一区域的延伸方向实施例,其夹角ψ可以偏离90度。于此实施例,夹角ψ是以小于90度为例。参阅图8C,其为具不同数目介质单元120组成的介质天线110。也就是说,介质单元120第一区域的延伸方向及介质单元数目可依实际需要来设计。
图9A-9C为本发明一实施例的天线模块的弯折方式示意图。参阅图9A,以连接结构124的直线延伸方向为x轴,介质单元120第一区域的轴向以虚线表示,与x轴及z轴分别具一夹角ψ及θ。又,于此的弯折角度ψ是以90度为例,而夹角θ是在垂直平面上变化,以夹角θ小于90度为例。参阅图9B,其夹角θ是以90度为例。参阅图9C其夹角θ是以大于90度为例。于图9A-9C的实施例,介质单元120第一区域的延伸方向分别与z轴具不同夹角。
换句话说,介质天线110主波束方向可通过第二区域122其弯折角度以及与连接结构124夹角决定。
就更进一步的应用,一介质天线110内介质单元120可分为多子群组,其每一个子群组分别对应一波束角度,如此天线模块可以有多个波束角度,或单一介质天线110仅对应至一波束角度,而载板100多个天线群组,上述两形式皆可达成多波束方向操作的需求。
图10为本发明一实施例的单一载板配置多个天线群组的系统应用示意图。参阅图10,此架构例如是具有四个方向的波束,而设置在投影机上。如此,投影机可以在四个波束方向与其它的装置无线连接。由于投影机允许有四个波束的方向进行数据通信,增加环境配置的灵活度。于此实施例,四个波束的天线群组分别由四个一致弯折的天线阵列所达成。然而并不限于此,这不是唯一的可实施方式。
图11为本发明一实施例的天线模块具有多个波束的系统应用示意图。参阅图11,对于同一个天线群组也可以有不同弯折方向阵列所组成。如此在相同的操作位置上可同时与多个不同装置达成无线连接,构成直接互通的网路型态。
图12为本发明一实施例的连接结构组成一群组的原理示意图。参阅图12,不管介质单元120是否有弯折,连接结构124都可以用来与第二区域122连接达到积体结构。本实施例仅就第二区域122连接结构124达到阵列的结构。阵列结构不限一维的分布,其可以是二维分布的阵列或是其阵列方式。这是由于连接结构124所提供的方便性。
另外,在第二区域122可以都具有弯折结构又或是由弯折与直线的第二区域122的混合所组成。换句话说,第二区域122不必全部都是有弯折。而弯折部分也可以是一致的一弯折角度或是不全部一致的多个弯折角度。
图13A~13E为本发明不同实施例的介质天线配合连接结构方式示意图。参阅图13A,介质单元120的第二区域122配合连接结构124达到阵列的整体结构。于此实施例,第二区域122无需有弯折。
接着参阅图13B,介质单元120配合连接结构124达到阵列的整体结构,而第二区域122可以是由直线区域与弯曲区域的组合。又参阅图13C,介质单元120配合连接结构124达到阵列的整体结构,而第二区域122可以是弯曲结构,没有直线区域。参阅图13D,介质单元120配合连接结构124达到阵列的整体结构,其第二区域122除了如图13B-13C的变化,介质单元120的偏转方向可以不是一致,分别指向不同方向。又参阅图13E,以两个分别的天线阵列组成一个较大的整体天线阵列,其分别的天线阵列的指向方向可以不同。
换句话说,根据前述介质柱状体120的实施例的各种变化组合,可以组成具有多个指向性波束的天线模块。
图14A-14D为本发明一实施例介质单元120与载板的连接部位的立体透视图,以及上视及侧视透视图。参阅图14A-14D实施例,接地的导体层102于本实施例是在表面,也就是深度140a相对表面是零。于本实施例,多个导体柱200埋入在载板100内,其上下两端的位置是处于深度140a、140b,而信号馈入结构104’的深度是在其间的深度140c。当导体柱200的间距小于一个程度,于操作频段下可视为一完整导体面。如此,在作为信号馈入的导体层104馈入的电磁信号能顺利被导入介质单元120。
多个导体柱200分布环绕信号馈入结构104’的端点104〞,该些导体柱200是接地且垂直于信号馈入结构104’的一延伸面。一实施例中载板100并可至少具有第三导体层105及第四导体层107,第一导体层102及第三导体层105以第一导体柱108电性连接,第二导体层104及第四导体层107以第二导体柱109电性连接。
图15为本发明一实施例天线模块组装后的剖面结构示意图。参阅图15,如果天线模块是由多个天线阵列300、302所组成,其也可以由相同的或至少一芯片所控制。利用载板的多层导体层的结构达到电性耦接。芯片的位置也依照设计的电路,由于载板的多层特性,可以设置在载板的适当位置。
一般而言,介质单元120的第一区域,其长短与形状,可以依照所需要的辐射强度与指向需求而变化,不限于特定的几何形状。第二区域如果是采用有弯折的结构,其曲率半径也可以依实际需求做调整。就连接结构124而言,其将各种介质单元120组合达到整体的结构,易于组装减少对位的复杂性。
当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。
Claims (19)
1.一种介质天线,包括:
多个介质单元,每一个该介质单元分为第一区域与第二区域;
至少一个导体,覆盖在每一个该多个介质单元的该第二区域的表面,以形成一波导结构,该波导结构的第一端与该第一区域相连,该波导结构的第二端是一信号馈入端;
至少一个连接结构,连结该至少一个波导结构使成为至少一积体结构,其中该至少一个连接结构的一横截面宽度小于一临界尺寸,连接结构被导体覆盖;以及
一信号馈入结构,有一端点邻近该波导结构的该信号馈入端,用以馈入或接收信号。
2.如权利要求1所述的介质天线,其中该多个介质单元与该连接结构是相同材料且是一体成型的结构。
3.如权利要求1所述的介质天线,其中一或多个该第二区域有一弯折部分。
4.如权利要求3所述的介质天线,其中该多个介质单元分为多个群组,其中每一个个别的该群组有多个波束角度。
5.如权利要求1所述的介质天线,其中该临界尺寸不大于一操作信号的半波长。
6.如权利要求1所述的介质天线,其中还包括多个导体柱分布环绕该信号馈入结构的该端点,该多个导体柱是接地且垂直于该信号馈入结构的一延伸面。
7.如权利要求1所述的介质天线,其中该至少一个导体覆盖该至少一个连接结构的一部分表面或全部表面。
8.一种介质天线,其特征在于,包括:
一介质单元,分为第一区域与第二区域,该第二区域有一弯折部分;以及
一导体,覆盖该第二区域包括该弯折部分的一表面,成为一波导结构,该波导结构的第一端与该第一区域相连,该波导结构的第二端是一信号馈入端;
一连接结构,该连接结构与该波导结构相连,其中该连接结构的一横截面宽度小于一临界尺寸,该连接结构被导体覆盖。
9.如权利要求8所述的介质天线,其中该介质单元是一体成型的结构。
10.如权利要求8所述的介质天线,还包括:
一信号馈入结构,有一端点邻近该波导结构的该信号馈入端,用以馈入或接收信号;以及
多个导体柱分布环绕该信号馈入结构的该端,该些导体柱是接地且垂直于该信号馈入结构的一延伸面。
11.一种天线模块,包括:
一载板,包括多个导体层,该些导体层包括:
第一导体层,在载板一面用于接地,其中该第一导体层包括多个开孔;以及
第二导体层,包括多个信号馈入结构,分别有一端点对应该第一导体层的该多个开孔的其一;
多个介质单元,分别配置在该第一导体层的该多个开孔上方,其中每一个该介质单元分为第一区域与第二区域;以及
至少一个导体,覆盖在该介质单元的该第二区域的表面成为一波导结构,每一个该波导结构的一信号馈入端分别对应至该第一导体层的该开孔之一,
其中该信号馈入结构的该端点分别与对应的该波导结构配置,以从每一个该波导结构的该信号馈入端馈入或接收信号。
12.如权利要求11所述的天线模块,其中一或多个该介质单元的该第二区域有一弯折部分。
13.如权利要求11所述的天线模块,其中该些介质单元是相同材料且是一体成型的结构。
14.如权利要求11所述的天线模块,其中还包括多个导体柱分布环绕该多个信号馈入结构的该端点。
15.如权利要求11所述的天线模块,其中还包括至少一个连接结构,连接该波导结构构成至少一积体结构,该至少一个连接结构的一横截面宽度小于一临界尺寸。
16.如权利要求15所述的天线模块,其中该临界尺寸不大于一操作信号的半波长。
17.如权利要求11所述的天线模块,其中该多个介质单元分为多个群组,其中每该群组的波束角度分别相异。
18.如权利要求11所述的天线模块,其中该介质单元分布成一阵列。
19.如权利要求11所述的天线模块,其中还包括至少一集成电路芯片,通过该载板与该介质单元电性连接。
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US8957819B2 (en) | 2015-02-17 |
CN103187624A (zh) | 2013-07-03 |
TW201328017A (zh) | 2013-07-01 |
TWI496346B (zh) | 2015-08-11 |
US20130169499A1 (en) | 2013-07-04 |
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