CN103173807A - 一种电镀锡溶液添加剂 - Google Patents

一种电镀锡溶液添加剂 Download PDF

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Publication number
CN103173807A
CN103173807A CN 201110432771 CN201110432771A CN103173807A CN 103173807 A CN103173807 A CN 103173807A CN 201110432771 CN201110432771 CN 201110432771 CN 201110432771 A CN201110432771 A CN 201110432771A CN 103173807 A CN103173807 A CN 103173807A
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China
Prior art keywords
additive
solution
electrotinning
deionized water
hydrogen peroxide
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CN 201110432771
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English (en)
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黄佩英
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Individual
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Priority to CN 201110432771 priority Critical patent/CN103173807A/zh
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Abstract

本发明公开了一种电镀锡溶液添加剂,有下列成分配比而成,丙氨酸5-15g/L,乙二胺四乙酸钠10-30g/L,氯化亚锡10-50g/L,胱氨酸0.5-2g/L,焦磷酸钾150-300g/L,过氧化氢5-20g/L,余量去离子水。本发明配方合理,镀锡溶液性能稳定使用时间长,所生产的产品焊接性好耐腐蚀,镀层均匀光洁度高。

Description

一种电镀锡溶液添加剂
技术领域
本发明属化学镀锡技术领域,具体涉及一种电镀锡溶液添加剂。
背景技术
金属镀锡可有效防止氧化和抗腐蚀,在电子元件中大量使用以提高焊接性能和使用寿命,目前的镀锡溶液添加剂存在镀层表面光洁度差、不均匀、结合强度低,使镀锡溶液稳定性低易浑浊使用时间短等缺点。
发明内容
本发明的目的在于提供一种配方合理,使镀锡溶液稳定性能好使用效率高,镀锡产品可焊性好耐腐蚀的电镀锡溶液添加剂。
本发明的技术解决方案是:
一种电镀锡溶液添加剂,其特征在于:有下列成分配比而成,丙氨酸5-15g/L,乙二胺四乙酸钠10-30g/L,氯化亚锡10-50g/L,胱氨酸0.5-2g/L,焦磷酸钾150-300g/L,过氧化氢5-20g/L,余量去离子水。
本发明配方合理,镀锡溶液性能稳定使用时间长,所生产的产品焊接性好耐腐蚀,镀层均匀光洁度高。
 具体实施方式:
实施例1
一种电镀锡溶液添加剂,有下列成分配比而成,丙氨酸5g/L,乙二胺四乙酸钠20g/L,氯化亚锡20g/L,胱氨酸1g/L,焦磷酸钾250g/L,过氧化氢5g/L,余量去离子水,PH值5,温度控制在25-30°。

Claims (1)

1.一种电镀锡溶液添加剂,其特征在于:有下列成分配比而成,丙氨酸5-15g/L,乙二胺四乙酸钠10-30g/L,氯化亚锡10-50g/L,胱氨酸0.5-2g/L,焦磷酸钾150-300g/L,过氧化氢5-20g/L,余量去离子水。
CN 201110432771 2011-12-21 2011-12-21 一种电镀锡溶液添加剂 Pending CN103173807A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201110432771 CN103173807A (zh) 2011-12-21 2011-12-21 一种电镀锡溶液添加剂

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201110432771 CN103173807A (zh) 2011-12-21 2011-12-21 一种电镀锡溶液添加剂

Publications (1)

Publication Number Publication Date
CN103173807A true CN103173807A (zh) 2013-06-26

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CN 201110432771 Pending CN103173807A (zh) 2011-12-21 2011-12-21 一种电镀锡溶液添加剂

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CN (1) CN103173807A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018122058A1 (en) 2016-12-28 2018-07-05 Atotech Deutschland Gmbh Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
WO2020239908A1 (en) 2019-05-28 2020-12-03 Atotech Deutschland Gmbh Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
EP3770298A1 (en) 2019-07-24 2021-01-27 ATOTECH Deutschland GmbH Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018122058A1 (en) 2016-12-28 2018-07-05 Atotech Deutschland Gmbh Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
US11274375B2 (en) 2016-12-28 2022-03-15 Atotech Deutschland Gmbh Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
WO2020239908A1 (en) 2019-05-28 2020-12-03 Atotech Deutschland Gmbh Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
EP3770298A1 (en) 2019-07-24 2021-01-27 ATOTECH Deutschland GmbH Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate

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Application publication date: 20130626