CN103160238B - Adhesive composite, film-like adhesive, adhesive sheet and connection structural bodies - Google Patents
Adhesive composite, film-like adhesive, adhesive sheet and connection structural bodies Download PDFInfo
- Publication number
- CN103160238B CN103160238B CN201210548890.0A CN201210548890A CN103160238B CN 103160238 B CN103160238 B CN 103160238B CN 201210548890 A CN201210548890 A CN 201210548890A CN 103160238 B CN103160238 B CN 103160238B
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- Prior art keywords
- adhesive composite
- mass
- adhesive
- composition
- electroconductive particle
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- 239000000853 adhesive Substances 0.000 title claims abstract description 350
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 350
- 239000002131 composite material Substances 0.000 title claims abstract description 266
- 150000001875 compounds Chemical class 0.000 claims abstract description 106
- 150000003839 salts Chemical class 0.000 claims abstract description 45
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 41
- 125000003118 aryl group Chemical group 0.000 claims abstract description 38
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 37
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 33
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 24
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 23
- 150000001768 cations Chemical class 0.000 claims abstract description 14
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 7
- 125000005496 phosphonium group Chemical group 0.000 claims abstract description 5
- -1 imidazoles Ion Chemical class 0.000 claims description 147
- 239000000203 mixture Substances 0.000 claims description 145
- 239000000758 substrate Substances 0.000 claims description 135
- 239000002245 particle Substances 0.000 claims description 113
- 239000000463 material Substances 0.000 claims description 52
- 229920002554 vinyl polymer Polymers 0.000 claims description 50
- 239000007767 bonding agent Substances 0.000 claims description 48
- 238000009826 distribution Methods 0.000 claims description 45
- 229910019142 PO4 Inorganic materials 0.000 claims description 34
- 239000010452 phosphate Substances 0.000 claims description 34
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 33
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 29
- 239000002253 acid Substances 0.000 claims description 28
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 23
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 16
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 14
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 14
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 12
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 12
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 230000009477 glass transition Effects 0.000 claims description 9
- 125000001931 aliphatic group Chemical group 0.000 claims description 7
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 125000004122 cyclic group Chemical group 0.000 claims description 6
- 235000021003 saturated fats Nutrition 0.000 claims description 6
- 125000005843 halogen group Chemical group 0.000 claims description 5
- 229920006287 phenoxy resin Polymers 0.000 claims description 5
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- 229920000728 polyester Polymers 0.000 claims description 5
- 239000009719 polyimide resin Substances 0.000 claims description 5
- 238000010526 radical polymerization reaction Methods 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 4
- 150000001451 organic peroxides Chemical class 0.000 claims description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 4
- 229940117958 vinyl acetate Drugs 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- 125000004185 ester group Chemical group 0.000 claims description 2
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 claims description 2
- OSFBJERFMQCEQY-UHFFFAOYSA-N propylidene Chemical group [CH]CC OSFBJERFMQCEQY-UHFFFAOYSA-N 0.000 claims description 2
- 229920006395 saturated elastomer Polymers 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims 7
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 claims 6
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 claims 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims 1
- 239000004327 boric acid Substances 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 57
- 239000002585 base Substances 0.000 description 54
- 229920001296 polysiloxane Polymers 0.000 description 35
- 238000003860 storage Methods 0.000 description 33
- 210000004027 cell Anatomy 0.000 description 32
- 239000004531 microgranule Substances 0.000 description 32
- 238000012360 testing method Methods 0.000 description 18
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 17
- 150000002148 esters Chemical class 0.000 description 17
- 239000003795 chemical substances by application Substances 0.000 description 15
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 15
- 239000000470 constituent Substances 0.000 description 13
- 229920001971 elastomer Polymers 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 13
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- 238000007711 solidification Methods 0.000 description 12
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
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- 239000011347 resin Substances 0.000 description 10
- 229920000459 Nitrile rubber Polymers 0.000 description 9
- 150000004693 imidazolium salts Chemical class 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 239000005062 Polybutadiene Substances 0.000 description 8
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 8
- 229920002857 polybutadiene Polymers 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
- 238000001723 curing Methods 0.000 description 7
- 239000010419 fine particle Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 125000001424 substituent group Chemical group 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000007792 addition Methods 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 235000019400 benzoyl peroxide Nutrition 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 239000011162 core material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 150000003254 radicals Chemical class 0.000 description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 5
- 150000001639 boron compounds Chemical class 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
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- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 5
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- 229920001195 polyisoprene Polymers 0.000 description 5
- 238000013112 stability test Methods 0.000 description 5
- 239000003381 stabilizer Substances 0.000 description 5
- 229920003048 styrene butadiene rubber Polymers 0.000 description 5
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 4
- 239000004342 Benzoyl peroxide Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
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- 210000004899 c-terminal region Anatomy 0.000 description 4
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- 239000003822 epoxy resin Substances 0.000 description 4
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 4
- 125000001207 fluorophenyl group Chemical group 0.000 description 4
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- 125000002757 morpholinyl group Chemical group 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
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- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical group CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 3
- 125000004172 4-methoxyphenyl group Chemical group [H]C1=C([H])C(OC([H])([H])[H])=C([H])C([H])=C1* 0.000 description 3
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- 238000000016 photochemical curing Methods 0.000 description 1
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- 239000010944 silver (metal) Substances 0.000 description 1
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- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
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- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000002769 thiazolinyl group Chemical group 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C09J171/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S30/00—Structural details of PV modules other than those related to light conversion
- H02S30/10—Frame structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2471/00—Presence of polyether
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Chemical & Material Sciences (AREA)
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- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Wire Bonding (AREA)
Abstract
The present invention relates to adhesive composite, film-like adhesive, adhesive sheet and connection structural bodies, described adhesive composite contains (a) thermoplastic resin, (b) free-radical polymerised compound, (c) radical polymerization initiator and the salt of (d) boracic, wherein, the salt of described (d) boracic is the compound shown in following formula (A), in formula (A), R1、R2、R3And R4Represent hydrogen atom, the alkyl of carbon number 1 ~ 18 or aryl, X independently of one another+Represent the cation comprising quaternary phosphonium atom and/or quaternary nitrogen atoms.
Description
Technical field
The present invention relates to the system of adhesive composite, film-like adhesive, adhesive sheet, connection structural bodies, connection structural bodies
Make the application of method and adhesive composite.
Background technology
In semiconductor element and liquid crystal display cells, the purpose combined for the various parts made in element, always with
Use various bonding agent.For the requirement of bonding agent, relate under cementability and thermostability, humid tropical condition
The many aspects such as reliability.Above-mentioned bonding agent be used for liquid crystal display cells and TCP(COF) connection, FPC and TCP(COF) company
Connect, TCP(COF) with the connection of printed substrate, the connection etc. of FPC and printed substrate.Additionally, above-mentioned bonding agent be additionally operable to by
Semiconductor element mounting is in the situation of substrate.
As for bonding adherend, use printed substrate or polyimides, polyethylene terephthalate
(PET), the organic substrate such as Merlon (PC), PEN (PEN), cyclic olefin polymer (COP), and
The metal such as copper, aluminum, or ITO(indium and the composite oxides of stannum), IZO(Indium sesquioxide. and the complex of zinc oxide), AZO(zinc-aluminium
Oxide), SiN(silicon nitride), SiO2(silicon dioxide) etc. have the base material of various apparent condition.Accordingly, it would be desirable to it is suitable
MOLECULE DESIGN together in the adhesive composite of each adherend.
Recently, along with highly integrated, the high-precision refinement of liquid crystal display cells of semiconductor element, element spacings and
Wiring closet spacing is just narrowing.Additionally, the most gradually application employs the low organic substrate of the thermostabilitys such as PET, PC, PEN
Semiconductor element, liquid crystal display cells or touch pad.If the adhesive composite solidification for such semiconductor element etc.
Time heating-up temperature high and curing rate slow, the most desired connecting portion, even peripheral parts also can be heated excessively, have
Become the tendency of the main cause of peripheral parts damage etc., therefore, for adhesive composite, it is desirable under low-temperature setting
Bonding.
All the time, as above-mentioned semiconductor element or bonding agent used for liquid crystal display element, application always employs table
The thermosetting resin (for example, referring to following patent documentation 1) of the epoxy resin of existing high adhesiveness and high reliability.As resin
Constituent, generally uses epoxy resin and epoxy resin has the firming agent such as reactive phenolic resin, promotes epoxy resin
The hot potentiality catalyst of the reaction with firming agent.Hot potentiality catalyst be not react under the storage temperatures such as room temperature but
When heating, the material of performance high response, becomes decision solidification temperature and the key factor of curing rate, from bonding agent in room
Various compound is used from the viewpoint of curing rate when the storage stability under Wen and heating.In actual operation,
By solidifying the condition of cure of 1 ~ 3 hour at a temperature of 170 ~ 250 DEG C, obtain desired bonding.But, above-mentioned for making
Bonding agent low-temperature setting, needs the hot potentiality catalyst using activation energy low, but making it have storage stability concurrently is to be stranded very much
Difficult.
In recent years, and with the free-radical polymerised compound such as acrylate derivative or methacrylate derivative and work
Radical-curable bonding agent for the peroxide of radical polymerization initiator attracts attention.For radically curing,
Owing to the free radical as chain carrier is imbued with reactivity, therefore, it is possible to realize the short time solidification (for example, referring to following specially
Profit document 2).For such radical-curable bonding agent, proposed and with benzoyl peroxide (BPO), amine compound,
Organoboron compounds etc. are as the method (for example, referring to following patent documentation 3) of radical polymerization initiator.
Prior art literature
Patent documentation 1: Japanese Unexamined Patent Publication 1-113480 publication
Patent documentation 2: International Publication the 98/44067th
Patent documentation 3: Japanese Unexamined Patent Publication 2000-290121 publication
Summary of the invention
The problem that invention is to be solved
In order to make above-mentioned radical-curable bonding agent low-temperature setting, need use radical polymerization initiator, but for
For existing radical-curable bonding agent, have curability at low temperatures concurrently and storage stability is extremely difficult.Such as, when making
With above-mentioned benzoyl peroxide (BPO), amine compound, organoboron compound etc. as acrylate derivative or metering system
During the radical polymerization initiator of the free-radical polymerised compounds such as acid ester derivant, even if at room temperature (25 DEG C, following identical)
Under also can carry out curing reaction, therefore have the situation that storage stability reduces.
Thus, it is an object of the invention to provide curability at low temperatures and the adhesive composite of storage stability excellence.Additionally,
It is an object of the invention to provide and use the film-like adhesive of such adhesive composite, adhesive sheet, connection structural bodies, connection
The manufacture method of structure and the application of adhesive composite.
The technical scheme of solution problem
The present inventor conducts in-depth research for solving above-mentioned technical problem, it was found that by using specific boron
Compound, as the constituent of adhesive composite, can obtain curability at low temperatures and the storage stability of excellence, thus complete
Become the present invention.
That is, the adhesive composite of the present invention contains (a) thermoplastic resin, (b) free-radical polymerised compound, (c) certainly
By base polymerization initiator and the salt of (d) boracic, wherein, the salt of (d) boracic is the compound shown in following formula (A).
[changing 1]
In formula (A), R1、R2、R3And R4Represent hydrogen atom, the alkyl of carbon number 1 ~ 18 or aryl, X independently of one another+Table
Show the cation comprising quaternary phosphonium atom and/or quaternary nitrogen atoms.
In the present invention, by making adhesive composite contain the salt of (d) boracic, it is possible to promote low temperature (such as 80 ~ 120
DEG C) under the decomposition of (c) radical polymerization initiator, therefore the curability at low temperatures of adhesive composite is excellent.Additionally, at this
In bright, owing to the salt of above-mentioned (d) boracic is the compound shown in formula (A), storage stability (the such as room of adhesive composite
Storage stability under (such as-20 ~ 25 DEG C) near temperature) excellent, even if in the case of preserving adhesive composite for a long time, also can
Access the adhesive strength of excellence and connect resistance (such as, at connection structural bodies or the solar module of circuit block
In adhesive strength and connect resistance).As it has been described above, the curability at low temperatures of the adhesive composite of the present invention and storage stability
Excellent.
And then, in the present invention, preserve adhesive composite for a long time, can obtain excellence adhesive strength and
Connect resistance.Additionally, in the present invention, preserve adhesive composite for a long time, even if trying in long reliability
It also is able to maintain stable performance (adhesive strength and connection resistance) after testing (high temperature and humidity test).
For the adhesive composite of the present invention, as the salt of (d) boracic, can be containing shown in following formula (A1)
Compound, in this case, curability at low temperatures and storage stability can be made to improve further.
[changing 2]
In formula (A1), R1、R2、R3、R4、R5a、R6a、R7aAnd R8aRepresent hydrogen atom, carbon number 1 ~ 18 independently of one another
Alkyl or aryl.
R in above-mentioned formula (A)5a、R6a、R7aAnd R8aIn preferably any one and only one be hydrogen atom.This situation
Under, curability at low temperatures can be made to improve further.
For the adhesive composite of the present invention, as the salt of (d) boracic, can be containing shown in following formula (A2)
Compound, in this case, curability at low temperatures and storage stability can be made to improve further.
[changing 3]
In formula (A2), R1、R2、R3And R4Represent hydrogen atom, the alkyl of carbon number 1 ~ 18 or aryl independently of one another,
R5b、R6b、R7b、R8bAnd R9bRepresent hydrogen atom, halogen atom, alkyl, aryl or alkoxyl, R independently of one another8bAnd R9bCan be mutual
Combine and form ring.
Additionally, in the adhesive composite of the present invention, (b) free-radical polymerised compound can be containing having phosphate
Free-radical polymerised compound beyond vinyl compound and this vinyl compound.In this case, under low-temperature setting
Bonding become easy, meanwhile, it is capable to make to improve further with the adhesive strength with the substrate being connected terminal.
Additionally, the fusing point of the salt of (d) boracic can be more than 60 DEG C less than 300 DEG C.In this case, stability is (such as,
The stability of near room temperature) improve further, storage stability improves further.
Additionally, (a) thermoplastic resin can be containing from by phenoxy resin, polyurethane resin, polyester urethane resin, contracting
Butyral resin, acrylic resin, polyimide resin and polyamide and there is vinylacetate as construction unit
At least one selected in the group of copolymer composition.In this case, thermostability and cementability improve further, even if when long
Between reliability test (high temperature and humidity test) after also be able to easily maintain the characteristic of these excellences.
Additionally, the adhesive composite of the present invention can contain (e) electroconductive particle further.In this case, it is possible to
Imparting adhesive composite, with good electric conductivity or anisotropic conductive, therefore can more appropriately be used for having connection end
The circuit block bonding purposes each other of son or solar module etc..Additionally, electrically connect via above-mentioned adhesive composite
The connection resistance of the connection structural bodies obtained can reduce the most fully.
Additionally, the inventors discovered that, above-mentioned adhesive composite is effectively used for the company with the parts connecting terminal
Connect.The adhesive composite of the present invention may be used for first on the interarea being configured at first substrate is connected terminal and be configured at
The second connection terminal on the interarea of second substrate is electrically connected, it is also possible to for having on the interarea being configured at substrate
This connection terminal of the solar battery cell connecting terminal is electrically connected with distribution component.
The film-like adhesive that the present invention relates to comprises above-mentioned adhesive composite.The adhesive sheet that the present invention relates to possesses base
Material and above-mentioned film-like adhesive, film-like adhesive is configured on base material.
The connection structural bodies that one aspect of the present invention relates to possesses: has first substrate and is configured at this first substrate
First circuit block of the first connection terminal on interarea, there is second substrate and be configured on the interarea of this second substrate the
Two connect the second circuit parts of terminals and are configured at the connection member between the first circuit block and second circuit parts,
Connection member contains the solidfied material of above-mentioned adhesive composite, and the first connection terminal and second connects terminal and is electrically connected.
In the connection structural bodies related in one aspect of the invention, connection member contains the solidfied material of above-mentioned adhesive composite, by
This, it is possible to improve connection resistance and the adhesive strength of connection structural bodies.
In the connection structural bodies related in one aspect of the invention, at least one party in first substrate and second substrate can
To be made up of the base material comprising the thermoplastic resin that glass transition temperature is less than 200 DEG C.In this case, bonding agent is used
The adhesive strength of the connection structural bodies of compositions can improve further.
In the connection structural bodies related in one aspect of the invention, at least one party in first substrate and second substrate can
With by comprising from by polyethylene terephthalate, Merlon, PEN and cyclic olefin polymer group
The base material of at least one selected in the group become is constituted.In this case, even with having by above-mentioned specific material structure
First circuit block of the substrate become or the situation of second circuit parts, combined by the bonding agent using the invention described above to relate to
Thing, it is also possible to realize low-temperature setting, therefore, it is possible to reduce for the first circuit block or the hot injury of second circuit parts.This
Outward, the wettability of the substrate being made up of above-mentioned specific material and adhesive composite improves, and it is possible to improve further viscous
Connect intensity.Thus, when using the substrate being made up of above-mentioned specific material, it is possible to obtain the connection reliability of excellence.
The connection structural bodies that one aspect of the present invention relates to can be following manner: first substrate is by comprising from by poly-right
PET, Merlon, PEN and cyclic olefin polymer composition group in select to
Few a kind of base material is constituted, and second substrate is by comprising from the group being made up of polyimide resin and polyethylene terephthalate
In the base material of at least one selected constitute.In this case, even with having the base being made up of above-mentioned specific material
First circuit block of plate or the situation of second circuit parts, by the adhesive composite using the invention described above to relate to, also
Low-temperature setting can be realized, therefore, it is possible to reduce for the first circuit block or the hot injury of second circuit parts.Additionally, by
Substrate and the wettability of adhesive composite that above-mentioned specific material is constituted improve and can improve adhesive strength further.By
This, when using the substrate being made up of above-mentioned specific material, it is possible to obtains the connection reliability of excellence.
The connection structural bodies that other aspects of the present invention relate to possesses: have substrate and the company being configured on the interarea of this substrate
The solar battery cell of connecting terminal, distribution component and the connection being configured between solar battery cell and distribution component
Parts, connection member contains the solidfied material of above-mentioned adhesive composite, and makes connection terminal and distribution component electrical connection.At this
Inventing in the connection structural bodies that other aspects relate to, connection member contains the solidfied material of above-mentioned adhesive composite, thereby, it is possible to
Improve connection resistance and the adhesive strength of connection structural bodies.
The present invention provides the manufacture method of connection structural bodies, and the method is by making above-mentioned adhesive composite between having
One substrate and be configured on the interarea of this first substrate first connection terminal the first circuit block and have second substrate and
Between the second circuit parts of the second connection terminal being configured on the interarea of this second substrate, this is made to glue in such a state
Meet the solidification of agent compositions, thus bonding first circuit part when making the first connection terminal and second connect terminal electrical connection
Part and second circuit parts.It addition, the present invention provides the manufacture method of connection structural bodies, the method is by making above-mentioned bonding agent group
Compound between have substrate and the solar battery cell and the distribution component that connect terminal that are configured on the interarea of this substrate it
Between, make this adhesive composite solidify in such a state, thus make connection terminal and the state of distribution component electrical connection
Under bonding solar battery cell and distribution component.
The present invention provides the application of above-mentioned adhesive composite, and it is for making be configured on the interarea of first substrate first
Connection terminal is connected terminal with second on the interarea being configured at second substrate and is electrically connected.The present invention provides above-mentioned bonding agent
The application of compositions, it is used for manufacturing connection member, and this connection member is for making be configured on the interarea of first substrate first
Connection terminal is connected terminal with second on the interarea being configured at second substrate and is electrically connected.
The present invention provides the application of above-mentioned adhesive composite, and it is for making the connection having on the interarea being configured at substrate
This connection terminal of the solar battery cell of terminal is electrically connected with distribution component.The present invention provides above-mentioned bonding agent to combine
The application of thing, it is used for manufacturing connection member, and this connection member is for making the connection terminal having on the interarea being configured at substrate
This connection terminal of solar battery cell be electrically connected with distribution component.
The present invention provides above-mentioned adhesive composite, and it becomes the connection member in connection structural bodies, this connection structural bodies
Possess: there is first substrate and first be configured on the interarea of this first substrate connects the first circuit block of terminal, has
Second substrate connects the second circuit parts of terminal with second be configured on the interarea of this second substrate and is configured at first
Connection member between circuit block and second circuit parts, the first connection terminal and second connects terminal and is electrically connected.
The present invention provides above-mentioned adhesive composite, and it becomes the connection member in connection structural bodies, and this connection structural bodies possesses: have
Substrate and be configured on the interarea of this substrate connect the solar battery cell of terminal, distribution component and be configured at the sun
Connection member between energy battery unit and distribution component, connects terminal and distribution component is electrically connected.
Beneficial effect
In accordance with the invention it is possible to provide curability at low temperatures and the adhesive composite of storage stability excellence.Such viscous
Connect agent compositions, compared with the situation using alkyl boron compound described in above-mentioned patent documentation 3, it is possible to increase stable storing
Property.Additionally, the balance of the curability at low temperatures of the adhesive composite that the present invention relates to and storage stability is excellent.Due to this
The storage stability of the bright adhesive composite related to is excellent, therefore, even if in the case of long-term preservation adhesive composite,
It also is able to obtain the adhesive strength of excellence and connect resistance.And then, for the adhesive composite that the present invention relates to, no matter
Preserve adhesive composite for a long time, the adhesive strength of excellence can be obtained and connect resistance.Additionally, relate to for the present invention
And adhesive composite for, preserve adhesive composite for a long time, though (high in long reliability test
The high wet test of temperature) after, it is also possible to maintain stable performance (adhesive strength and connection resistance).The present invention can provide use so
The film-like adhesive of adhesive composite, adhesive sheet, connection structural bodies, the manufacture method of connection structural bodies and bonding
The application of agent compositions.
Accompanying drawing explanation
Fig. 1 is the schematic sectional view of the connection structural bodies representing that first embodiment of the present invention relates to.
Fig. 2 is the schematic sectional view of the manufacture method representing the connection structural bodies shown in Fig. 1.
Fig. 3 is the schematic sectional view of the connection structural bodies representing that second embodiment of the present invention relates to.
Fig. 4 is the schematic sectional view of the manufacture method representing the connection structural bodies shown in Fig. 3.
Fig. 5 is the schematic sectional view of the connection structural bodies representing that third embodiment of the present invention relates to.
Description of reference numerals
10 is circuit block (the first circuit block)；12 is circuit substrate (first substrate)；12a is interarea；14 is to connect
Terminal (first connects terminal)；20 is circuit block (second circuit parts)；22 is circuit substrate (second substrate)；22a is main
Face；24 is to connect terminal (second connects terminal)；30,40 is connection member；30a, 40a are adhesive composites；44 is conduction
Property particle；100,200 is the connection structural bodies of circuit block；300 is solar module (connection structural bodies)；310a、
310b is solar battery cell；312 is substrate；312a is surface (interarea)；312b is the back side (interarea)；314 is surface electricity
Pole；316 is backplate；320 is distribution component；330 is connection member.
Detailed description of the invention
Hereinafter, being preferred embodiment described in detail the present invention.Here, in this manual, " (methyl)
Acrylic acid " the meaning be acrylic acid and corresponding methacrylic acid, the meaning of " (methyl) acrylate " is acrylate
And corresponding methacrylate, the meaning of " (methyl) acryloyl group " is acryloyl group and methylacryloyl, " (first
Base) acryloxy " the meaning be acryloxy and corresponding methacryloxy.
Additionally, in this manual, the temperature that the method meaning that the K0064 record according to JIS standard of " fusing point " obtains
Degree, or, weighing 5.0mg sample in non-hermetic type specimen disc, with differential scanning calorimeter, (DSC7 PERKIN ELMER is public
Department's system) under a nitrogen with the temperature of the endotherm peak of the determination of heating rate of 10 DEG C/min.
Additionally, in this manual, " weight average molecular weight " refers to pass through gel permeation chromatography according to condition as follows
Method (GPC) uses by the value of the calibrating curve determining of polystyrene standard.
(condition determination)
Device: TOSOH Co., Ltd GPC-8020
Detector: TOSOH Co., Ltd RI-8020
Chromatographic column: Hitachi Chemical Co., Ltd. Gelpack GL-A-160-S+GL-A150
Sample solution concentration: 120mg/3ml
Solvent: oxolane
Injection rate: 60 μ l
Pressure: 30kgf/cm2
Flow: 1.00ml/min
The adhesive composite of present embodiment contains (a) thermoplastic resin, (b) free-radical polymerised compound, (c) certainly
By base polymerization initiator and the salt of (d) boracic.
((a) thermoplastic resin)
A () thermoplastic resin refers to the resin (macromolecule) with following character: heated become high liquid of viscosity
State and with external force Free Transform, keep its shape when cooling down and remove external force and hardening, this process can be repeated.Additionally,
A () thermoplastic resin can also be the resin (macromolecule) with the reactive functional groups possessing above-mentioned character.(a) thermoplastic resin
The glass transition temperature (Tg) of fat is such as preferably more than-30 DEG C, more preferably more than-25 DEG C, more preferably-20 DEG C
Above.A the glass transition temperature (Tg) of () thermoplastic resin is such as preferably less than 190 DEG C, more preferably less than 170 DEG C,
More preferably less than 150 DEG C.
A () thermoplastic resin can comprise such as from by phenoxy resin, polyurethane resin, polyester urethane resin, contracting
Butyral resin (such as polyvinyl butyral resin), acrylic resin, polyimide resin and polyamide and have
Vinylacetate is as copolymer (vinyl acetate co-polymer, the such as ethylene-vinyl acetate copolymer) group of construction unit
At least one selected in the group become.These can be individually a kind of or mix two or more use.And then, these (a) thermoplasticity
Resin can also comprise siloxane bond or fluoro substituents.For them, preferably mixed resin mixes the most completely
State or there is microphase-separated and the state of nebulousurine.
When adhesive composite is with membranaceous application, the weight average molecular weight of (a) thermoplastic resin is the biggest, is more readily obtained good
Film formative, furthermore, it is possible to the viscosity that dissolves of the mobility affecting film-like adhesive compositions is set in a wide range
Fixed.The weight average molecular weight of (a) thermoplastic resin such as preferably more than 5000, more preferably more than 7000, more preferably
More than 10000.If (a) weight average molecular weight of thermoplastic resin is more than 5000, has and be readily obtained good film formative
Tendency.The weight average molecular weight of (a) thermoplastic resin such as preferably less than 150000, more preferably less than 100000, further
It is preferably less than 80000.If (a) weight average molecular weight of thermoplastic resin is less than 150000, it is readily obtained and becomes with other
The tendency of the good intermiscibility divided.
The use level of (a) thermoplastic resin in adhesive composite, (eliminates in adhesive composite with bonding agent composition
The composition of electroconductive particle) all-mass on the basis of, more than the most preferably 5 mass %, more than more preferably 15 mass %.As
Really the use level of (a) thermoplastic resin is more than 5 mass %, especially adhesive composite when with membranaceous application, and there have to be easy
Tendency to good film formative.A () thermoplastic resin use level, (eliminates in adhesive composite with bonding agent composition
The composition of electroconductive particle) all-mass on the basis of, below the most preferably 80 mass %, below more preferably 70 mass %.
If (a) use level of thermoplastic resin is below 80 mass %, there is the mobility being readily obtained good adhesive composite
Tendency.
((b) free-radical polymerised compound)
B () free-radical polymerised compound refers to issue the change of raw radical polymerization in the effect of radical polymerization initiator
Compound but it also may be himself to produce the compound of free radical by giving the activation energy such as light or heat.As (b) free radical
Polymerizable compound, can use aptly and such as have vinyl, (methyl) acryloyl group, pi-allyl, dimaleoyl imino
Deng the compound being carried out the functional group being polymerized by living radical.
As (b) free-radical polymerised compound, specifically can enumerate epoxy (methyl) acrylate oligomer, gather
Urethane (methyl) acrylate oligomer, polyethers (methyl) acrylate oligomer, polyester (methyl) acrylate oligomer etc.
Oligomer, trimethylolpropane tris (methyl) acrylate, Polyethylene Glycol two (methyl) acrylate, poly alkylene glycol two
(methyl) acrylate, (methyl) acrylic acid dicyclopentenyl ester, (methyl) acrylic acid dicyclopentenyl oxygen ethyl ester, neopentyl glycol
Modified two senses (methyl) acrylate of two (methyl) acrylate, dipentaerythritol six (methyl) acrylate, isocyanuric acid,
Isocyanuric acid modification trifunctional (methyl) acrylate, two phenyl phenol fluorenes acrylate, (methyl) acrylic acid is added to
The glycidyl of bisphenol fluorene diglycidyl ether and obtain epoxy radicals (methyl) acrylate, by ethylene glycol or propylene glycol
The compound being added to the glycidyl of bisphenol fluorene diglycidyl ether and obtain imports (methyl) acryloxy and obtains
The compound arrived, following formula (B) or the compound etc. shown in formula (C).
[changing 4]
In formula (B), R9And R10Representing hydrogen atom or methyl independently of one another, a and b represents the integer of 1 ~ 8 independently of one another.
[changing 5]
In formula (C), R11And R12Represent hydrogen atom or methyl independently of one another, c and d represent independently of one another 0 ~ 8 whole
Number.
Additionally, as (b) free-radical polymerised compound, even individually showing as wax-like (ワ ッ Network when standing for 30 DEG C
ス shape), wax oil shape (ろ う shape), crystalloid, glassy, powdery etc. there is no the material of solid state of mobility, it is also possible to do not have
Have and use to restriction especially.As such (b) free-radical polymerised compound, specifically, N, N '-methylene can be enumerated
Diacrylamine, diacetone acrylamide, N hydroxymethyl acrylamide, N-phenyl methacrylamide, 2-acrylamide-2-first
Base propane sulfonic acid, three (2-acrylyl oxy-ethyl) isocyanuric acid ester, N-phenylmaleimide, N-(o-methyl-phenyl-) maleimide
Aminomethyl phenyl between amine, N-() maleimide, N-(p-methylphenyl) maleimide, N-(o-methoxyphenyl) maleimide
Amine, N-(m-methoxyphenyl) maleimide, N-(p-methoxyphenyl) maleimide, N-methylmaleimido, N-
Ethyl maleimide, N-octyl group maleimide, 4,4 '-diphenyl-methane dimaleimide, metaphenylene two maleimide
Amine, 3,3 '-dimethyl-5,5 '-diethyl-4,4 '-diphenyl-methane dimaleimide, 4-methyl isophthalic acid, 3-phenylene two Malaysia
Acid imide, N-methacryloxy maleimide, N-acryloxy maleimide, 1,6-dimaleimide-(2,
2,4-trimethyl) hexane, N-methacryloxysuccinimide, N-acryloxy succinimide, 2-naphthyl methyl
Acrylate, 2-naphthyl acrylate, tetramethylol methane tetraacrylate, divinyl ethylidene-urea, divinyl propylidene urea,
The polystyrene-based ethylmethyl acrylate of 2-, N-phenyl-N '-(3-methacryloxy-2-hydroxypropyl)-to phenylene two
Amine, N-phenyl-N '-(3-acryloxy-2-hydroxypropyl)-P-pHENYLENE dI AMINE, tetramethyl piperidine methyl acrylate, four
Methyl piperidine base acrylate, pentamethvl methyl acrylate, pentamethvl base acrylate, octadecyl propylene
Acid esters, N tert butyl acrylamide, diacetone acrylamide, N-(methylol) acrylamide, shown in following formula (D) ~ (M)
Compound etc..
[changing 6]
In formula (D), e represents the integer of 1 ~ 10.
[changing 7]
[changing 8]
In formula (F), R13And R14Representing hydrogen atom or methyl independently of one another, f represents the integer of 15 ~ 30.
[changing 9]
In formula (G), R15And R16Representing hydrogen atom or methyl independently of one another, g represents the integer of 15 ~ 30.
[changing 10]
In formula (H), R17Represent hydrogen atom or methyl.
[changing 11]
In formula (I), R18Representing hydrogen atom or methyl, h represents the integer of 1 ~ 10.
[changing 12]
In formula (J), R19Represent the organic group shown in hydrogen atom or following formula are (i) or (ii), i represent 1 ~ 10 whole
Number.
[changing 13]
[changing 14]
[changing 15]
In formula (K), R20Representing the organic group shown in hydrogen atom or following formula are (iii) or (iv), j represents 1 ~ 10
Integer.
[changing 16]
[changing 17]
[changing 18]
In formula (L), R21Represent hydrogen atom or methyl.
[changing 19]
In formula (M), R22Represent hydrogen atom or methyl.
Additionally, as (b) free-radical polymerised compound, it is possible to use urethane acrylate.Urethane acrylate
Can be used alone, it is also possible to (b) free-radical polymerised compound beyond urethane acrylate using.By individually making
With urethane acrylate or with urethane acrylate beyond (b) free-radical polymerised compound and use, flexibility is able to
Improve, adhesive strength can be improved further.
As urethane acrylate, have no particular limits, but the polyurethane propylene shown in the most following formula (N)
Acid esters.Herein, the urethane acrylate shown in following formula (N), can be by fat family diisocyanate or ester ring type
It it is diisocyanate and from by aliphatic ester system glycol and ester ring type ester system's glycol and aliphatic acid ester carbonate system glycol and alicyclic ring
The condensation reaction of at least one selected in the group of formula carbonic ester system glycol composition and obtain.
[changing 20]
In formula (N), R23And R24Represent hydrogen atom or methyl, R independently of one another25Represent ethylidene or propylidene, R26Represent
Representative examples of saturated aliphatic base or saturated fat cyclic group, R27Represent representative examples of saturated aliphatic base or saturated fat cyclic group containing ester group or contain
Having representative examples of saturated aliphatic base or the saturated fat cyclic group of carbonate group, k represents the integer of 1 ~ 40.Here, in formula (N), R25Each other,
R26Each other can be the most identical or different.
Constitute the fatty family diisocyanate of above-mentioned urethane acrylate, tetramethylene two Carbimide. can be selected from
Ester, hexamethylene diisocyanate, lysinediisocyanate, 2-methylpentane-1,5-diisocyanate, 3-methylpentane-
1,5-diisocyanate, 2,2,4-tri-methyl hexamethylene-1,6-diisocyanate, 2,4,4-tri-methyl hexamethylene-1,6-
Diisocyanate, isophorone diisocyanate, cyclohexyl diisocyanate, hydrogenated xylene diisocyanate, hydrogenation hexichol
Dicyclohexylmethane diisocyanate, hydrogenation trimethyl XDI etc..
Additionally, constitute the aliphatic ester system glycol of above-mentioned urethane acrylate, can be selected from ethylene glycol, propylene glycol,
1,2-propylene glycol, 1,3-propylene glycol, 1,3 butylene glycol, 1,4-butanediol, neopentyl glycol, 1,2-pentanediol, 1,4-pentanediol, 1,
5-pentanediol, 2,4-PD, 2-methyl-2,4-PD, 2,4-dimethyl-2,4-PD, 2,2,4-trimethyl-1,3-
Pentanediol, 1,2-hexanediol, 1,5-hexanediol, 1,6-HD, 2,5-HD, 2-ethyl-1,3-hexanediol, 2,5-diformazan
Base-2,5-HD, 1,2-ethohexadiol, 1,8-ethohexadiol, 1,7-heptandiol, 1,9-nonanediol, Decane-1,2-diol, 1,10-last of the ten Heavenly stems
Glycol, 1,12-dodecanediol, dodecanediol, pinacol, 1,4-butynediols, 2,2'-ethylenedioxybis(ethanol)., diethylene glycol, dipropylene glycol, ring
The saturated low-molecular-weight diol classes such as hexane dimethanol, 1,4-CHDM, adipic acid, 3-methyl adipic acid, 2,2,5,5-
Tetramethyl adipic acid, maleic acid, fumaric acid, succinic acid, 2,2-dimethyl succinate, 2-Ethyl-2-Methyl succinic acid, 2,3-first
Base succinic acid, oxalic acid, malonic acid, Isosuccinic acid, ethyl malonic acid, butylmalonic acid, dimethyl malonic acid, 1,3-propanedicarboxylic acid, 2-
Methylglutaric acid, 3-methylglutaric acid, 2,2-dimethylated pentanedioic acid, 3,3-dimethylated pentanedioic acid, 2,4-dimethylated pentanedioic acid, heptan
Binary acid such as diacid, suberic acid, Azelaic Acid, decanedioic acid or corresponding to polyester-diol obtained by their anhydride dehydrating condensation
Class, polyester-diol class obtained by the cyclic ester compounds ring-opening polymerisation such as 6-caprolactone.Above-mentioned aliphatic ester system glycol can be independent
A kind of or mix two or more use.
Additionally, constitute the aliphatic acid ester carbonate system glycol of above-mentioned urethane acrylate, can be selected from by least one
Plant PCDL class obtained by above above-mentioned glycols and phosgene reaction.Obtained by above-mentioned glycols and phosgene reaction
Polycarbonate-based glycol, can be individually a kind of or mix two or more use.
The weight average molecular weight of above-mentioned urethane acrylate is such as preferably more than 5000, more preferably more than 8000, enters
One step is preferably more than 10000.The weight average molecular weight of above-mentioned urethane acrylate, the most preferably less than 30000, more preferably
For less than 25000, further preferably less than 20000.Additionally, above-mentioned urethane acrylate, bonding by force from raising further
From the viewpoint of degree, can 5000 less than 30000 in the range of freely adjust weight average molecular weight and use aptly.
If the weight average molecular weight of above-mentioned urethane acrylate is within the above range, flexibility can be obtained fully and cohesive force is double
Side, improves further with the adhesive strength of the organic substrate such as PET, PC, PEN, it is possible to obtain more excellent connection reliability.This
Outward, from the viewpoint of obtaining such effect more fully, the weight average molecular weight of above-mentioned urethane acrylate is the most preferred
Being 8000 less than 25000, more preferably 10000 less than 20000.Additionally, from obtaining such effect more fully
From the viewpoint of, the weight average molecular weight of above-mentioned urethane acrylate is preferably 10000 less than 25000.Here, if weighed
Average molecular weight is more than 5000, has and is readily obtained the most flexible tendency, if weight average molecular weight is less than 30000, having can
The tendency that the mobility of suppression adhesive composite reduces.
Additionally, the use level of above-mentioned urethane acrylate, (adhesive composite eliminates conduction with bonding agent composition
The composition of property particle) all-mass on the basis of, more than the most preferably 5 mass %, more than more preferably 10 mass %, further
It is preferably more than 15 mass %.If above-mentioned use level is more than 5 mass %, there is inclining of sufficient thermostability after being readily obtained solidification
To.Additionally, the use level of above-mentioned urethane acrylate, (adhesive composite eliminates electric conductivity grain with bonding agent composition
Son composition) all-mass on the basis of, below the most preferably 95 mass %, below more preferably 80 mass %, the most excellent
Elect below 70 mass % as.If above-mentioned use level is below 95 mass %, adhesive composite is made as film-like adhesive
Used time, there is the tendency being readily obtained good film formative.
B vinyl compound that () free-radical polymerised compound can comprise containing phosphate (has the second of phosphate
Alkenyl compound) and should containing phosphate vinyl compound beyond free-radical polymerised compound each more than one.
B () free-radical polymerised compound can also comprise from by N-vinyl compound and N, N-dialkyl group vinyl compound forms
Group in free-radical polymerised compound beyond the N-vinyl compound selected and this N-vinyl compound each
From more than one.By and with the vinyl compound containing phosphate, it is possible to improve adhesive composite further for tool
There is the cementability of the substrate connecting terminal.Additionally, pass through and use N-vinyl compound, it is possible to increase adhesive composite
Crosslinking rate.
As the vinyl compound containing phosphate, as long as the compound with phosphate and vinyl does not just have spy
Other restriction, but the compound shown in the most following formula (O) ~ (Q).
[changing 21]
In formula (O), R28Represent (methyl) acryloxy, R29Representing hydrogen atom or methyl, l and m represents independently of one another
The integer of 1 ~ 8.Here, in formula (O), R28Each other, R29Each other, l is each other and m is the most identical or different.
[changing 22]
In formula (P), R30Representing (methyl) acryloxy, n, o and p represent the integer of 1 ~ 8 independently of one another.Here, formula
(P) in, R30Each other, n is each other, each other and p is the most identical or different for o.
[changing 23]
In formula (Q), R31Represent (methyl) acryloxy, R32Representing hydrogen atom or methyl, q and r represents independently of one another
The integer of 1 ~ 8.
As the vinyl compound containing phosphate, specifically, acid phosphate base ethyl-methyl propylene can be enumerated
Acid esters (acid phosphooxy ethyl methacrylate), acid phosphate base ethyl propylene acid esters, acid phosphate base third
Methyl acrylate, acid phosphate base polyoxyethylene glycol monomethacrylates, acid phosphate base polyoxypropylene glycol monomethyl
Acrylate, 2,2 '-two (methyl) acryloxy diethylphosphate, EO modified phosphate dimethylacrylate, phosphoric acid change
Property epoxy acrylate, 2-(methyl) acryloyl-oxyethyl phosphate ester, phosphoric acid vinyl acetate etc..
As N-vinyl compound, specifically, N-vinyl imidazole, N-vinylpyridine, N-second can be enumerated
Vinyl pyrrolidone, N-vinyl formamide, N-caprolactam, 4,4 '-ethenylidene two (N, accelerine),
N-vinyl acetamide, N, N-DMAA, N, N-acrylamide etc..
About the above-mentioned vinyl compound containing phosphate and the respective use level of N-vinyl compound, and contain
The use level of the free-radical polymerised compound beyond the vinyl compound of phosphate and N-vinyl compound independently,
On the basis of the all-mass of bonding agent composition (eliminating the composition of electroconductive particle in adhesive composite), such as, it is preferably
More than 0.2 mass %, more than more preferably 0.3 mass %, more preferably more than 0.5 mass %.If above-mentioned use level is
More than 0.2 mass %, there is the tendency being readily obtained high adhesive strength.Above-mentioned vinyl compound containing phosphate and N-second
The respective use level of thiazolinyl based compound, with bonding agent composition (eliminating the composition of electroconductive particle in adhesive composite)
On the basis of all-mass, below the most preferably 15 mass %, below more preferably 10 mass %, more preferably 5 mass % with
Under.If above-mentioned use level is below 15 mass %, the physical property after adhesive composite solidification is had to be difficult to reduce it is easy to ensure that can
Tendency by property.
Additionally, about except meeting the above-mentioned vinyl compound containing phosphate or the chemical combination of N-vinyl compound
The use level of (b) free-radical polymerised compound beyond thing, (eliminates electric conductivity with bonding agent composition in adhesive composite
The composition of particle) all-mass on the basis of, more than the most preferably 5 mass %, more than more preferably 10 mass %, the most excellent
Elect more than 15 mass % as.If above-mentioned use level is more than 5 mass %, there is inclining of sufficient thermostability after being readily obtained solidification
To.The use level of (b) free-radical polymerised compound in addition to meeting the compound of above-mentioned vinyl compound, with viscous
On the basis of connecing the all-mass of agent composition (eliminating the composition of electroconductive particle in adhesive composite), the most preferably 95 matter
Amount below %, below more preferably 80 mass %, more preferably below 70 mass %.If above-mentioned use level be 95 mass % with
Under, when being used as film-like adhesive by adhesive composite, there is the tendency being readily obtained good film formative.
((c) radical polymerization initiator)
As (c) radical polymerization initiator, it is possible to use existing known organic peroxide and azo-compound etc.
The compound of free radical is produced by giving external energy.As (c) radical polymerization initiator, from stability, reactivity, phase
From the viewpoint of dissolubility, preferably 1 minute half life temperature is 90 ~ 175 DEG C and weight average molecular weight is the organic peroxy of 180 ~ 1000
Compound.By 1 minute half life temperature within the range, storage stability is more excellent, free-radical polymerised also the highest, it is possible to
Solidification in short time.
As (c) radical polymerization initiator, specifically, can enumerate for 1,1,3,3-tetramethyl butyl peroxidating new last of the ten Heavenly stems
Acid esters, two (4-tert-butylcyclohexyl) peroxy dicarbonate, two (2-ethylhexyl) peroxy dicarbonate, cumenyl peroxide
Change neodecanoic acid ester, 1,1,3,3-tetramethyl butyl new decanoate ester peroxide, dilauroyl peroxide, 1-cyclohexyl-1-methyl
Ethyl new decanoate ester peroxide, tertiary hexyl new decanoate ester peroxide, tert-butyl hydroperoxide neodecanoic acid ester, tert-butyl hydroperoxide new penta
Acid esters, 1,1,3,3-tetramethyl butyl peroxidating-2-ethylhexanoate, 2,5-dimethyl-2,5-two (2-ethyihexanoylperoxy
Change) hexane, tertiary hexyl peroxidating-2-ethylhexanoate, tert-butyl hydroperoxide-2-ethylhexanoate, tert-butyl hydroperoxide new heptan
Acid esters, t-amyl peroxy-2-ethylhexanoate, di-tert-butyl peroxide hexahydro terephthalate, t-amyl peroxy-3,
5,5-tri-methyl hexanoic acid ester, 3-hydroxyl-1,1-dimethylbutyl new decanoate ester peroxide, 1,1,3,3-tetramethyl butyl peroxide
Change-2-ethylhexanoate, t-amyl peroxy neodecanoic acid ester, t-amyl peroxy-2-ethylhexanoate, two (3-methylbenzene first
Acyl) peroxide, dibenzoyl peroxide, two (4-toluyl) peroxide, tertiary hexyl isopropyl peroxide list carbon
Acid esters, tert-butyl hydroperoxide maleic acid, tert-butyl hydroperoxide-3,5,5 Trimethylhexanoic acid ester, tert-butyl hydroperoxide laurate,
2,5-dimethyl-2,5-two (3-toluyl peroxidating) hexane, tert-butyl hydroperoxide-2-ethylhexyl monocarbonate, uncle
Hexyl peroxide benzoate, 2,5-dimethyl-2,5-two (benzoyl peroxidating) hexane, tert butyl peroxy benzoate,
Dibutyl peroxidating trimethyladipic acid ester, t-amyl peroxy caprylic acid ester, the different pelargonate of t-amyl peroxy, tertiary pentyl mistake
The organic peroxides such as Oxybenzene formic acid esters, 2,2 '-azo two-2,4-methyl pentane nitrile, 1,1 '-azo two (1-acetoxyl group-
1-diphenylphosphino ethane), 2,2 '-azodiisobutyronitrile, 2,2 '-azo two (2-methylbutyronitrile), dimethyl-2,2 '-azo two isobutyl
The azo-compounds etc. such as nitrile, 4,4 '-azo two (4-cyanopentanoic acid), 1,1 '-azo two (1-cyclohexanenitrile).These compounds are permissible
Individually a kind of or mix two or more use.
Additionally, as (c) radical polymerization initiator, it is possible to use irradiated by the light of 150 ~ 750nm and be produced from by base
Compound.As such compound, irradiate light is highly sensitive, therefore can enumerate such as,
Photoinitiation,Photopolymerization,and Photocuring,J.-P.Fouassier,Hanser
Publishers(1995, p17 ~ p35) described in alpha-aminoacetophenone derivant and phosphine oxide derivant.These chemical combination
Thing, can individually a kind of use, it can in addition contain be used in mixed way with above-mentioned organic peroxide or azo-compound.
The use level of above-mentioned (c) radical polymerization initiator, (eliminates conduction with bonding agent composition in adhesive composite
The composition of property particle) all-mass on the basis of, more than the most preferably 0.5 mass %, more than more preferably 1 mass %, enter one
Step is preferably more than 2 mass %.If above-mentioned use level is more than 0.5 mass %, adhesive composite is had the most fully to solidify
Tendency.The use level of above-mentioned (c) radical polymerization initiator, (eliminates electric conductivity with bonding agent composition in adhesive composite
The composition of particle) all-mass on the basis of, below the most preferably 40 mass %, below more preferably 30 mass %, further
It is preferably below 20 mass %.If above-mentioned use level is below 40 mass %, storage stability is had to be difficult to the tendency reduced.
The salt of (d) boracic
D the salt (hereinafter referred to as " (d) composition ") of () boracic is the compound shown in following formula (A).D () composition contains boron
The counter cation X of phosphate compounds and borate compound+。
[changing 24]
In formula (A), R1、R2、R3And R4Represent hydrogen atom, the alkyl of carbon number 1 ~ 18 or aryl, X independently of one another+Table
Show the cation comprising quaternary phosphonium atom and/or quaternary nitrogen atoms.
As the borate compound included in (d) composition, can enumerate tetraalkyl borate, four aromatic yl acid salts,
Trialkyl aromatic yl acid salt, dialkyl group diarylborinic acid salt, alkyl triaryl borate.Borate compound preferably comprises virtue
The borate of base, more preferably four aromatic yl acid salts.As borate compound, can be that intramolecular has these chemical combination multiple
The compound of thing or there is the compound of above-claimed cpd at the main chain of polymer and/or side chain.
As the alkyl being incorporated into boron atom in borate compound, it is possible to use straight chain, side chain or ring-type alkyl.
As the concrete example of the alkyl of carbon number 1 ~ 18, methyl, trifluoromethyl, ethyl, butyl, hexyl, octyl group, 2-second can be enumerated
Base hexyl, decyl, dodecyl, octadecyl, propyl group, isopropyl, isobutyl group, sec-butyl, the tert-butyl group, amyl group, 1-ethyl penta
Base, cyclopenta, cyclohexyl, isopentyl, heptyl, nonyl, undecyl, t-octyl etc..The carbon number of alkyl can be 1 ~ 12.
Additionally, as the concrete example of the aryl being incorporated into boron atom in borate compound, phenyl can be enumerated, to first
Phenyl, a tolyl,Base, xylyl, to tert-butyl-phenyl, p-methoxyphenyl, xenyl, naphthyl, to fluorophenyl, five
Fluorophenyl, rubigan, Chloro-O-Phenyl, 3,5-bis-(trifluoromethyl) phenyl etc..In these aryl, preferably phenyl.
Additionally, be incorporated into the alkyl of boron atom in borate compound and aryl is the most identical or different.
As comprising the cation of quaternary phosphonium atom, ion etc. can be enumerated.As comprising the cation of quaternary nitrogen atoms, can
To enumerate ammonium ion, imidazol ion, imidazoline ion etc..
For the adhesive composite involved by present embodiment, as (d) composition, preferably comprise following formula
(A1) compound shown in and/or the compound shown in following formula (A2).Compound shown in formula (A1) contains chemical combination
Thing is as the counter cation of borate compound.Compound shown in formula (A2) contains imidazolium compounds as borate
The counter cation of compound.
[changing 25]
In formula (A1), R1、R2、R3And R4Represent hydrogen atom, the alkyl of carbon number 1 ~ 18 or aryl independently of one another.Separately
Outward, R5a、R6a、R7aAnd R8aRepresent hydrogen atom, the alkyl of carbon number 1 ~ 18 or aryl independently of one another.Here, aryl is permissible
There is substituent group.
[changing 26]
In formula (A2), R1、R2、R3And R4Represent hydrogen atom, the alkyl of carbon number 1 ~ 18 or aryl independently of one another,
R5b、R6b、R7b、R8bAnd R9bRepresent hydrogen atom, halogen atom, alkyl, aryl or alkoxyl, R independently of one another8bAnd R9bCan be mutual
Combine and form ring.Aryl can have substituent group.
As being used as the compound of counter cation in (d) composition, trialkyl, di alkylaryl can be enumerated
, alkyl diaryl, triaryl, tetraalkyl, four aryl, trialkyl aryl, dialkyl group diaryl, alkyl three
Aryl.As compound, can be that intramolecular has the compound of these compounds multiple or at the main chain of polymer
And/or side chain has the compound of above-claimed cpd.
Especially, in above-claimed cpd, from the viewpoint of curability at low temperatures and storage stability are more excellent, preferably
Use at least one three replacement selected from the group being made up of trialkyl, di alkylaryl and alkyl diaryl.
I.e., preferably R5、R6、R7And R8In any one and only one be hydrogen atom.By using three replacements, can make and borated
The reactive raising of compound, can improve curability at low temperatures further.
Trialkyl additionally, compound is preferably alkyl, in the most above-mentioned three replacements.
Alkyl as the substituent group as compound, it is possible to use straight chain, side chain or ring-type alkyl.Former as carbon
The concrete example of the alkyl of subnumber 1 ~ 18, can enumerate methyl, trifluoromethyl, ethyl, butyl, hexyl, octyl group, 2-ethylhexyl,
Decyl, dodecyl, octadecyl, propyl group, isopropyl, isobutyl group, sec-butyl, the tert-butyl group, amyl group, 1-ethyl pentyl group, ring penta
Base, cyclohexyl, isopentyl, heptyl, nonyl, undecyl, t-octyl etc..The carbon number of alkyl can be 1 ~ 12.At these
In alkyl, the preferably tert-butyl group.
As the concrete example of the aryl of the substituent group as compound, phenyl, p-methylphenyl, a toluene can be enumerated
Base,Base, xylyl, to tert-butyl-phenyl, p-methoxyphenyl, xenyl, naphthyl, to fluorophenyl, pentafluorophenyl group, to chlorine
Phenyl, Chloro-O-Phenyl etc..
Additionally, the alkyl of substituent group and aryl as compound are the most identical or different.
As being used as the imidazolium compounds of counter cation in (d) composition, imidazoles can be enumerated and imidazoles spreads out
Biological.As imdazole derivatives, such as, can enumerate 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole
, benzimidazole, 1-tolimidazole, 1-propyl group-5-chloro benzimidazole, 1-ethyl-5,6-dichloro benzimidazole
Deng.As imidazolium compounds, can be to there is the compound of these compounds multiple or at polymer in intramolecular
Main chain and/or side chain have the compound of above-claimed cpd.
In imidazolium compounds, for the viewpoint that curability at low temperatures and storage stability are excellent further, it is preferably
There is the imidazolium compounds of the alkyl or phenyl being incorporated into imidazole ring, more preferably 2-methylimidazole, 2-phenylimidazole
, 2-ethyl-4-methylimidazole.
As the halogen atom of the substituent group as imidazolium compounds, bromine, chlorine, fluorine etc. can be enumerated.As alkyl, can
With enumerate methyl, trifluoromethyl, ethyl, butyl, hexyl, octyl group, 2-ethylhexyl, decyl, dodecyl, octadecyl, third
Base, isopropyl, isobutyl group, sec-butyl, the tert-butyl group, amyl group, 1-ethyl pentyl group, cyclopenta, cyclohexyl, isopentyl, heptyl, nonyl
Base, undecyl, t-octyl etc..As aryl, can enumerate phenyl, p-methylphenyl, a tolyl,Base, xylyl, right
Tert-butyl-phenyl, p-methoxyphenyl, xenyl, naphthyl, to fluorophenyl, pentafluorophenyl group, rubigan, Chloro-O-Phenyl, 3,5-
Two (trifluoromethyl) phenyl etc..As alkoxyl, methoxyl group, ethyoxyl, butoxy etc. can be enumerated.R8bAnd R9bCan be mutual
In conjunction with and form aromatic rings, heterocycle, alicyclic ring etc..The substituent group of imidazolium compounds is each mutually identical or different.
As (d) composition, preferably comprise the borate of aryl and the combination of alkyl and the borate comprising aryl
Combination with imidazolium compounds.By make (d) composition be the salt being made up of the borate comprising aryl and alkyl or
The salt being made up of the borate comprising aryl and imidazolium compounds, it is possible to more balancedly obtain the low-temperature solid of adhesive composite
The raising of the property changed and the raising of storage stability.
Specifically, (d) composition can use the salt obtained by existing synthetic method.Such as, at alkali metal or alkaline earth
In the mixture of metal and alkyl halide or aryl halide, after instilling the etherate solution of boron trifluoride, instill hydrogen
Sodium oxide and generate tetraalkyl boric acid sodium salt or four aryl boric acid sodium salts, then by with displacement reaction can be obtained by boron
Hydrochlorate-salt.It addition, such as, by adding the aqueous solution being dissolved with aryl boric acid sodium or alkylboronic acids sodium to Methylimidazole.
Hydrochloric acid 10mol(10mol) solution in carry out salt exchange, it is possible to obtain borate-imidazole salts.
The salt obtained by these compounds can be individually a kind of or mix two or more use.
The fusing point of (d) composition, from the viewpoint of storage stability improves further, the most preferably more than 60 DEG C, more
It is preferably more than 70 DEG C, more preferably more than 80 DEG C.The fusing point of (d) composition, the sight improved further from storage stability
Point considers, the most preferably less than 300 DEG C, more preferably less than 270 DEG C, more preferably less than 250 DEG C.Bonding agent combines
When thing comprises multiple (d) composition, the fusing point of a kind of salt meets above-mentioned scope, and more preferably all the fusing point of salt is the most satisfied
Above-mentioned scope.
D the use level of () composition, with bonding agent composition (eliminating the composition of electroconductive particle in adhesive composite)
On the basis of all-mass, more than the most preferably 0.1 mass %, more than more preferably 0.5 mass %.If (d) cooperation of composition
Amount is more than 0.1 mass %, has the tendency of the reactive effect being easily fully promoted radical polymerization initiator.D () becomes
Point use level, with the all-mass of bonding agent composition (eliminating the composition of electroconductive particle in adhesive composite) as base
Standard, below the most preferably 20 mass %, below more preferably 15 mass %, more preferably below 10 mass %.If (d)
The use level of composition is below 20 mass %, has the storage stability of adhesive composite to be difficult to the tendency reduced.
((e) electroconductive particle)
As long as e () electroconductive particle has the particle of electric conductivity in its entirety or surface, but connect being used for having
During the connection of the parts of connecting terminal, the particle that preferably mean diameter is less than the distance connected between terminal.
As (e) electroconductive particle, can enumerate be made up of the metal such as Au, Ag, Ni, Cu, Pd or scolding tin metallic,
And the particle being made up of carbon etc..Additionally, (e) electroconductive particle can also be with dielectric glass, pottery or plastics etc.
As core, this core is coated with the particle of above-mentioned metal, metallic or carbon.As (e) electroconductive particle, at the core of plastics
On be coated with the particle of above-mentioned metal, metallic or carbon and thermosol melts metallic, have owing to being pressurizeed by heating
Morphotropism, when therefore connecting, the contact area with electrode increases and reliability raising, the most preferably.E () electroconductive particle is such as
It can be the particle being coated with silver on the metallic being made up of copper.Additionally, as (e) electroconductive particle, it is possible to use as
In Japanese Unexamined Patent Publication 2005-116291 publication described, there is many minute metal particles with the gold of the connected shape of chain
Belong to powder.
Additionally, by use the microgranule the most coating by macromolecule resin etc. on the surface of these (e) electroconductive particle,
Or have in the surface configuration of (e) electroconductive particle via methods such as hydridization (hybridization) and be made up of insulating properties material
The microgranule of insulating barrier, contact with each other caused short circuit due to particle when electroconductive particle use level can be suppressed to increase so that
Insulating properties between telegraph circuit improves, and therefore can it individually or be used in mixed way with (e) electroconductive particle.
About the mean diameter of (e) electroconductive particle, from the standpoint of dispersibility and electric conductivity, the most preferably 1 ~ 18
μm.During containing such (e) electroconductive particle, adhesive composite can be used as anisotropic conductive aptly bonding
Agent.The mean diameter of (e) electroconductive particle, it is possible to use laser diffraction formula particle size distribution device (such as, Co., Ltd. island
Laser diffraction formula SALD-2100 manufactured by the making of Tianjin) it is measured.
E the use level of () electroconductive particle has no particular limits, but (get rid of in adhesive composite with bonding agent composition
The composition of electroconductive particle) whole volumes on the basis of, the most preferably 0.1 more than volume %, more preferably 0.2 volume % with
On.If above-mentioned use level is 0.1 more than volume %, there is the tendency that can suppress electric conductivity step-down.Joining of (e) electroconductive particle
Resultant, on the basis of whole volumes of bonding agent composition (eliminating the composition of electroconductive particle in adhesive composite), such as
It is preferably 30 below volume %, more preferably 10 below volume %.If above-mentioned use level is 30 below volume %, has and be difficult to produce
The tendency of short circuit.Here, " volume % " is that the volume of each composition before solidification based on 23 DEG C determines, the body of each composition
Amassing to utilize proportion to be converted into volume by weight.Further, it is also possible to do not make this composition dissolve or swelling in middle additions such as graduated cylinders
And make the suitable solvent (water, alcohol etc.) of the abundant moistening of this composition, put into this composition wherein and using the volume that increases as this
The volume of composition is obtained.
(other compositions)
For adhesive composite of the present embodiment, for controlling curing rate and for making storage stability
Improve further, stabilizer can be added.As such stabilizer, known chemical combination can be used without particular limitation
Thing, the preferably quinone derivative such as benzoquinone and hydroquinone；The phenol derivativess such as 4-methoxyphenol and 4-tert-butyl catechol；2,
The aminooxy groups (aminoxyl) such as 2,6,6-tetramethyl piperidine-1-epoxide and 4-hydroxyl-2,2,6,6-tetramethyl piperidine-1-epoxide spread out
Biological；The hindered amine derivative etc. such as tetramethyl piperidine methacrylate.Stabilizer can be individually a kind of or mix two or more
Use.
About the use level of stabilizer, with bonding agent composition (adhesive composite eliminates the composition of electroconductive particle)
All-mass on the basis of, more than the most preferably 0.005 mass %, more than more preferably 0.01 mass %, more preferably
More than 0.02 mass %.If above-mentioned use level is more than 0.005 mass %, it is easily controlled curing rate and storage stability
The tendency easily improved.About the use level of stabilizer, (adhesive composite eliminates electroconductive particle with bonding agent composition
Composition) all-mass on the basis of, below the most preferably 10 mass %, below more preferably 8 mass %, more preferably
Below 5 mass %.If above-mentioned use level is below 10 mass %, the intermiscibility with other compositions is had to be difficult to the tendency reduced.
Additionally, in adhesive composite of the present embodiment, it is also possible to it is properly added and derives with alkoxy silane
The bonding auxiliary agent such as thing and coupling agent, closely sealed accelerator and levelling agent that silazane derivatives is representative.As coupling agent, specifically
For, the compound shown in the most following formula (R).Coupling agent can be individually a kind of or mix two or more use.
[changing 27]
In formula (R), R33、R34And R35Represent hydrogen atom, the alkyl of carbon number 1 ~ 5, carbon number 1 ~ 5 independently of one another
Alkoxyl, the alkoxy carbonyl of carbon number 1 ~ 5 or aryl, R36Represent (methyl) acryloyl group, vinyl, isocyanates
Base, imidazole radicals, sulfydryl, amino, methylamino, dimethylamino, benzyl amino, phenylamino, Cyclohexylamino, morpholino base, piperazinyl, urea
Base or glycidyl, s represents the integer of 1 ~ 10.
Adhesive composite of the present embodiment, relaxes for stress and the purpose of cementability raising, can contain
Rubber constituent.So-called rubber constituent, refers to the composition of the status and appearance caoutchouc elasticity (JIS K6200) with itself or by anti-
The composition of caoutchouc elasticity should be showed.Rubber constituent room temperature (25 DEG C) both can be solid-state can also be aqueous, but from improve stream
From the viewpoint of dynamic property, the most aqueous.As rubber constituent, it is however preferred to have the compound of polybutadiene skeleton.Rubber becomes
Divide and can have cyano group, carboxyl, hydroxyl, (methyl) acryloyl group or morpholinyl.Additionally, from the viewpoint of improving cementability,
It is preferably and comprises the cyano group as highly polar group, the rubber constituent of carboxyl at side chain or end.Wherein, even if having polybutadiene
Alkene skeleton, is categorized as (a) thermoplastic resin during performance thermoplasticity, is categorized as (b) radical polymerization when showing free-radical polymerised
Property compound.
As rubber constituent, specifically, polyisoprene, polybutadiene, carboxyl terminal polybutadiene, hydroxyl can be enumerated
Base end polybutadiene, 1,2-polybutadiene, carboxyl terminal 1,2-polybutadiene, C-terminal 1,2-polybutadiene, acrylic acid
Rubber, SBR styrene butadiene rubbers, C-terminal SBR styrene butadiene rubbers, acrylonitrile-butadiene rubber, polymer end
End is containing carboxyl, hydroxyl, (methyl) acryloyl group or the acrylonitrile-butadiene rubber of morpholinyl, carboxylated nitrile rubber, hydroxyl
End poly-(propylene oxide), alkoxysilyl end poly-(propylene oxide), poly-(tetramethylene ether) glycol, polyolefin diols
Deng.
Additionally, as there is above-mentioned highly polar group and being aqueous rubber constituent in room temperature, specifically, can enumerate
Aqueous acrylonitrile-butadiene rubber, contain the aqueous of carboxyl, hydroxyl, (methyl) acryloyl group or morpholinyl in polymer ends
Acrylonitrile-butadiene rubber, aqueous carboxylated nitrile rubber etc., as the use level of the acrylonitrile of polar group be preferably 10 ~
60 mass %.
These rubber constituents can be individually a kind of or mix two or more use.
Additionally, in adhesive composite of the present embodiment, relax for stress and the purpose of cementability raising,
Organic fine particles can also be added.The mean diameter of organic fine particles is such as preferably 0.05 ~ 1.0 μm.Here, when organic fine particles is by upper
When stating rubber constituent composition, classify in rubber constituent rather than organic fine particles, when organic fine particles is by above-mentioned (a) thermoplastic resin structure
Cheng Shi, classifies in (a) thermoplastic resin rather than organic fine particles.
As organic fine particles, specifically, can enumerate by polyisoprene, polybutadiene, carboxyl terminal polybutadiene,
C-terminal polybutadiene, 1,2-polybutadiene, carboxyl terminal 1,2-polybutadiene, acrylic rubber, styrene-butadiene rubber
Glue, acrylonitrile-butadiene rubber, contain carboxyl, hydroxyl, (methyl) acryloyl group or the propylene of morpholinyl in polymer ends
Nitrile-butadiene rubber, carboxylated nitrile rubber, C-terminal poly-(propylene oxide), the poly-(oxidation third of alkoxysilyl end
Alkene), poly-(tetramethylene ether) glycol, polyolefin diols, (methyl) alkyl acrylate-BS, (first
Base) having of constituting of alkyl acrylate-silicone copolymer or silicone-(methyl) acrylic copolymer or their complex
Machine microgranule.
Additionally, the adhesive composite that can be used for connection structural bodies described later can also contain silicone microgranule, in above-mentioned company
Connecing in structure, substrate is by containing from by polyethylene terephthalate, Merlon, PEN and ring
The base material of at least one selected in the group of olefin polymer composition is constituted.
By making substrate by containing from by polyethylene terephthalate, Merlon, PEN
With the bonding agent group used in the connection structural bodies of the base material of at least one composition selected in the group of cyclic olefin polymer composition
Compound contains silicone microgranule, it is possible to fully relax internal stress, therefore for polyethylene terephthalate, poly-carbonic acid
The adhesive strength of ester, PEN and cyclic olefin polymer improves further, can improve further for having
Connect the adhesive strength of the parts of terminal.Even if additionally, also can maintain the most stable after long reliability test
Performance.
As above-mentioned silicone microgranule, it is known to have the microgranule of the organic poly sesquisiloxane resin of caoutchouc elasticity, permissible
Use spherical or atypic silicone microgranule.Additionally, from the viewpoint of dispersibility and internal stress relax, preferably silicone microgranule
There is the weight average molecular weight of more than 1,000,000.Furthermore it is preferred that silicone microgranule has three-dimensional crosslinking structure.Such silicone microgranule pair
High in the dispersibility of resin, the stress retentivity after solidification is more excellent.The silicone of the weight average molecular weight with more than 1,000,000 is micro-
Grain and/or there is the silicone microgranule of three-dimensional crosslinking structure, all for the polymer such as thermoplastic resin, monomer, the dissolubility of solvent
Low, therefore can significantly more obtain the effect above.Herein, so-called " there is three-dimensional crosslinking structure ", refer to that polymer chain has three
Dimension network structure.Additionally, the glass transition temperature of silicone microgranule is such as preferably more than-130 DEG C less than-20 DEG C, more preferably
For more than-120 DEG C less than-40 DEG C.Such silicone microgranule, can fully relax the adhesive composite as circuit connection material
Internal stress.
As the silicone microgranule having a structure in which, specifically, it is possible to use following silicone microgranule: by making tool
There is the organopolysiloxane of at least two vinyl, there is the poly-silica of organic hydrogen that at least two is incorporated into the hydrogen atom of silicon atom
The silicone microgranule (such as, Japanese Laid-Open Patent Publication 62-257939 publication) that the reaction of alkane and platinum group catalyst obtains；Make apparatus
There is the silicone microgranule that the organopolysiloxane of alkenyl, the organopolysiloxane with silicon hydrogen-based and platinum group catalyst obtain
(such as, Japanese Laid-Open Patent Publication 63-77942 publication)；With two organosiloxanes, single organic sesqui siloxane, three organosiloxanes
And the silicone microgranule (such as, Japanese Laid-Open Patent Publication 62-270660 publication) that platinum group catalyst obtains；By methyl-monosilane triol
And/or the water/alcoholic solution of its partial condensate is added dropwise in aqueous alkali, carry out silicone microgranule that polycondensation reaction obtains (such as,
No. 3970453 publications of Japanese Patent Publication No.) etc..Additionally, for making dispersibility and the adaptation with base material improve, it is also possible to use and add
Or the copolymerization silicone microgranule of epoxide (such as, Japanese Unexamined Patent Publication 3-167228), add or copolymerization acroleic acid esterification
The silicone microgranule etc. of compound.
Additionally, in order to improve dispersibility further, the silicone microgranule with coreshell type structure is preferably used.As hud typed
Structure, has and is formed with the surface layer with the glass transition temperature higher than the glass transition temperature on core material (stratum nucleare) surface
The structure of (shell) and there is the structure of grafting layer (shell) in the outside of core material (stratum nucleare), it is possible to use stratum nucleare and shell
Form different silicone microgranules.Specifically, it is possible to use: in the aqueous dispersions of silicone rubber spheroidal particle, add alkalescence
Material or alkaline aqueous solution and organotrialkoxysilane, and be hydrolyzed, hud typed silicone microgranule (example that condensation reaction obtains
As, Japanese Patent Publication No. 2832143), such as No. WO2009/051067 described hud typed silicone microgranule.In addition it is possible to use
Molecular end or intramolecular side chain contain the silicone microgranule of the functional groups such as hydroxyl, epoxy radicals, ketimide, carboxyl, sulfydryl.Such
Silicone microgranule improves, the most preferably due to the dispersibility for film forming component and free-radical polymerised material.
The mean diameter of above-mentioned silicone microgranule is such as preferably 0.05 ~ 25 μm, more preferably 0.1 ~ 20 μm.If average particle
Footpath is more than 0.05 μm, has the tendency suppressing adhesive composite mobility to reduce owing to surface area increases.If it is additionally, flat
All particle diameters are below 25 μm, have the tendency of the alleviation effects easily giving full play to internal stress.
About the use level of above-mentioned silicone microgranule, (adhesive composite eliminates electroconductive particle with bonding agent composition
Composition) all-mass on the basis of, more than the most preferably 3 mass %, more than more preferably 5 mass %.If silicone microgranule
Use level be more than 3 mass %, have the tendency that internal stress the most fully relaxes.About the use level of silicone microgranule, with bonding
On the basis of the all-mass of agent composition (eliminating the composition of electroconductive particle in adhesive composite), the most preferably 40 matter
Amount below %, below more preferably 30 mass %.If the use level of silicone microgranule is below 40 mass %, has and can suppress bonding
The flexibility (elastic modelling quantity, percentage elongation) of agent compositions reduces, and adhesive strength is difficult to the tendency that reduces.
These silicone microgranules individually one can also mix two or more use.
For adhesive composite of the present embodiment, this adhesive composite when room temperature is aqueous, energy
Enough with pasty state use.Adhesive composite, when room temperature is solid, is used by heating, and solvent additionally can be used to stick with paste
Change.As the solvent that can use, it is preferably and does not has reactivity and performance sufficiently to dissolve with adhesive composite and additive
Property solvent, be preferably the solvent that boiling point is 50 ~ 150 DEG C the most at ambient pressure.If boiling point is more than 50 DEG C, when room temperature is placed
The situation of volatilization reduces, and has the use in open system to become readily and is inclined to.If additionally, boiling point is less than 150 DEG C, hold
Easily make solvent volatilize, have bonding after reliability be difficult to the tendency that reduces.
Additionally, adhesive composite of the present embodiment can also be configured to membranaceous and be used as film-like adhesive.This
The film-like adhesive that embodiment relates to contains above-mentioned adhesive composite.To add molten as required in adhesive composite
Solution obtained by agent etc., after being coated on the fissility base materials such as fluororesin film, polyethylene terephthalate film, processing release paper,
Or on the base materials such as non-woven fabrics, impregnate above-mentioned solution and after being placed on fissility base material, removing solvent etc. can make as film
With.If used with the shape of film, then more convenient from the standpoint of operability etc..Can be provided with according to present embodiment
Base material and the adhesive sheet of film-like adhesive.In adhesive sheet, film-like adhesive is configured on base material, such as, formed bonding
Oxidant layer.
Adhesive composite of the present embodiment can be used together heating and pressurization comes bonding.Heating-up temperature is preferably
The temperature of 100 ~ 200 DEG C.Adherend preferably will not be caused the scope of damage by pressure, it is however generally that, preferably 0.1 ~
10MPa.These heating and pressurization were preferably carried out in the range of 0.5 ~ 120 second, it is also possible to 120 ~ 190 DEG C, 3MPa, 10 seconds
Carry out bonding under heating.
Adhesive composite of the present embodiment can be used in making be configured on the interarea of first substrate first to connect
Connecting terminal is connected terminal with second on the interarea being configured at second substrate and is electrically connected.According to present embodiment, it is provided that use
It is connected end with second on the interarea being configured at second substrate in making the be configured on the interarea of first substrate first connection terminal
The application of adhesive composite, film-like adhesive or adhesive sheet that son is electrically connected.According to present embodiment, it is provided that be used for
Preparation makes the be configured on the interarea of first substrate first connection terminal be connected with second on the interarea being configured at second substrate
The application of the adhesive composite of the connection member that terminal is electrically connected, film-like adhesive or adhesive sheet.
It addition, adhesive composite of the present embodiment may be used to the company having on the interarea being configured at substrate
This connection terminal of the solar battery cell of connecting terminal is electrically connected with distribution component.There is provided according to present embodiment and be used for
This connection terminal with the solar battery cell connecting terminal on the interarea being configured at substrate is made to carry out with distribution component
The application of adhesive composite, film-like adhesive or the adhesive sheet of electrical connection.There is provided according to present embodiment and make for manufacture
This connection terminal with the solar battery cell connecting terminal on the interarea being configured at substrate carries out electricity with distribution component
The application of the adhesive composite of connection member, film-like adhesive or the adhesive sheet that connect.
Adhesive composite of the present embodiment, can serve as the bonding agent of homogeneity adherend, and can serve as
The bonding agent of the heterogeneous adherend that thermal coefficient of expansion is different.Specifically, adhesive composite of the present embodiment is permissible
As anisotropic conductive adhesive, silver paste, silverskin etc. be representative circuit connection material, CSP elastomer, at the bottom of CSP
The semiconductor element adhesives that layer filler material, LOC band etc. are representative.
Such as, will there is the first circuit substrate and the first connection terminal being arranged on the interarea of this first circuit substrate
First circuit block and there is second circuit substrate and the second connection terminal being arranged on the interarea of this second circuit substrate
Second circuit parts, with first connect terminal and second connect terminal mutually relatively to and first connect terminal and the second connection end
The state of son electrical connection, configures via the adhesive composite of present embodiment, thus can constitute the connection of circuit block
Structure.In this case, adhesive composite of the present embodiment can effectively serve as adhesive for circuit connection.
(connection structural bodies)
It follows that the connection structural bodies and manufacture method thereof using above-mentioned adhesive composite is illustrated.According to this
Embodiment provides the manufacture method of connection structural bodies, and the method is by making adhesive composite between having first substrate and joining
First circuit block of the first connection terminal being placed on the interarea of this first substrate and have second substrate and be configured at this
Between the second circuit parts of the second connection terminal on the interarea of two substrates, make this adhesive composite in such a state
Solidification, thus bonding first circuit block and the second electricity when making the first connection terminal and second connect terminal electrical connection
Circuit unit.It addition, provide the manufacture method of connection structural bodies according to present embodiment, the method is situated between by making adhesive composite
In having between substrate and the solar battery cell and the distribution component that connect terminal that are configured on the interarea of this substrate, at this
Make this adhesive composite solidify under the state of sample, thus when make connection terminal and distribution component electrical connection bonding too
Sun can battery unit and distribution component.
Fig. 1 is the schematic sectional view of the connection structural bodies representing that the first embodiment relates to.Fig. 2 represents shown in Fig. 1
The schematic sectional view of the manufacture method of connection structural bodies.The connection structural bodies 100 of the circuit block shown in Fig. 1 uses and does not contains
E the adhesive composite of () electroconductive particle obtains.
The connection structural bodies 100 of the circuit block shown in Fig. 1 possesses circuit block (the first circuit block) 10, circuit block
(second circuit parts) 20 and connection member 30.Circuit block 10 has circuit substrate (first substrate) 12 and is configured at circuit
Connection terminal (first connects terminal) 14 on the interarea 12a of substrate 12.Circuit block 20 has circuit substrate (second substrate)
22 and the connection terminal (second connect terminal) 24 that is configured on the interarea 22a of circuit substrate 22.
Connection member 30 is configured between circuit block 10 and circuit block 20.Connection member 30 is with interarea 12a and interarea
22a be generally parallel to each other to mode connect circuit block 10 and circuit block 20.In connection structural bodies 100, connect terminal
14 is oppositely disposed with connection terminal 24, and electrically connects by contacting with each other.Connection member 30 is combined by bonding agent described later
The solidfied material of thing 30a is constituted.
Connection structural bodies 100 such as can proceed as follows manufacture.First, as in figure 2 it is shown, prepare circuit block 10,
Circuit block 20 and the adhesive composite 30a being made up of above-mentioned adhesive composite.Adhesive composite 30a such as by
Above-mentioned adhesive composite is configured to membranaceous and obtains.It follows that at the interarea 22a being formed with connection terminal 24 of circuit block 20
On lay adhesive composite 30a.And, by connect terminal 14 and connect terminal 24 to in the way of at adhesive composite
Circuit block 10 is laid on 30a.Then, across circuit block 10 and circuit block 20, adhesive composite 30a is carried out
Heating is while make adhesive composite 30a solidify, and pressurizes in the direction vertical with interarea 12a, 22a, edge, circuit block 10,
Connection member 30 is formed between 20.Thus, connection structural bodies 100 is obtained.
When above-mentioned adhesive composite comprises electroconductive particle, by such adhesive composite being used to make
Anisotropic conductive film heats pressurization between opposite connection terminal, makes connection terminal each other via electroconductive particle
Electrical connection, makes circuit block be bonded to each other simultaneously, thus can obtain the connection structural bodies of circuit block.Fig. 3 is to represent that second is real
The schematic sectional view of the connection structural bodies that the mode of executing relates to.Fig. 4 is the showing of manufacture method representing the connection structural bodies shown in Fig. 3
Meaning sectional view.The connection structural bodies 200 of the circuit block shown in Fig. 3 uses the adhesive composite containing (e) electroconductive particle
Obtain.
The connection structural bodies 200 of the circuit block shown in Fig. 3 possess the circuit block 10 identical with connection structural bodies 100 and
Circuit block 20 and connection member 40.In connection structural bodies 200, connect terminal 14 and be connected terminal 24 to be mutually isolated
State oppositely disposed.
Connection member 40 is arranged between circuit block 10 and circuit block 20.Connection member 40 is by bonding agent group described later
The solidfied material of compound 40a is constituted, and it has bonding agent composition 42 and the electroconductive particle 44 being scattered in bonding agent composition 42.Viscous
Connect agent composition 42 to be made up of the solidfied material of bonding agent composition 42a described later.In connection structural bodies 200, to connection end
Between son 14 and connection terminal 24, electroconductive particle 44 contacts with connecting terminal 14,24, thus, connects terminal 14,24 via leading
Conductive particles 44 is electrically connected to each other.
Connection structural bodies 200 such as can proceed as follows manufacture.First, as shown in Figure 4, prepare circuit block 10,
Circuit block 20 and the adhesive composite 40a being made up of above-mentioned adhesive composite.Adhesive composite 40a such as by
Above-mentioned adhesive composite is configured to membranaceous and obtains.Adhesive composite 40a has bonding agent composition 42a and is scattered in viscous
Connect the electroconductive particle 44 in agent composition 42a.Hereafter, by the side with the connection structural bodies 100 obtaining above-mentioned circuit block
The method that method is identical, connects circuit block 10 and circuit block 20 via adhesive composite 40a.Thus, attachment structure is obtained
Body 200.
At least one party in the circuit substrate 12 of the connection structural bodies 100,200 of foregoing circuit parts and circuit substrate 22,
Can be made up of the base material containing the thermoplastic resin that glass transition temperature is less than 200 DEG C.Such as, circuit substrate 12 and electricity
At least one party in base board 22, can be by comprising from by polyethylene terephthalate, Merlon, poly-naphthalenedicarboxylic acid second
The organic substrate of at least one selected in the group of diol ester and cyclic olefin polymer composition is constituted.Thus, poly-to benzene in use
During the organic substrates such as naphthalate, Merlon, PEN and cyclic olefin polymer, circuit substrate
Improve with the wettability of adhesive composite, thus, even if the adhesive strength of excellence also can be obtained under the condition of cure of low temperature.
Therefore, even if after long reliability test (high temperature and humidity test), it is also possible to maintain stable performance (adhesive strength and company
Connecting resistance), the connection reliability of excellence can be obtained.
Additionally, the side's circuit substrate in circuit substrate 12 and circuit substrate 22 is by containing from by poly terephthalic acid second two
The base material of at least one selected in the group of alcohol ester, Merlon, PEN and cyclic olefin polymer composition
During composition, the opposing party's circuit substrate in circuit substrate 12 and circuit substrate 22 can be by containing from by polyimides and poly-to benzene
The base material of at least one selected in the group of naphthalate composition is constituted.Thus, circuit substrate and adhesive composite
Wettability and adhesive strength improve further, more excellent connection reliability can be obtained.
Here, circuit substrate 12,22 can be by containing inanimate matter, poly terephthalic acid second such as quasiconductor, glass or potteries
The Organic substances such as diol ester, PEN, cyclic olefin polymer, polyimides or Merlon, glass/epoxy etc.
The base material of these composite is constituted.Additionally, circuit substrate 12,22 can be flexible base board.
Fig. 5 is the schematic sectional view of the connection structural bodies representing that the 3rd embodiment relates to.Solaode shown in Fig. 5
Module 300 possesses solar battery cell 310a, 310b and distribution component 320 and connection member 330.
Solar battery cell 310a, 310b have substrate 312, are configured on surface (interarea) 312a of substrate 312
Surface electrode (connection terminal) 314 and the backplate (connection terminal) being configured on the back side (interarea) 312b of substrate 312
316.Substrate 312 is made up of composites such as the such as inanimate matter such as quasiconductor, glass or pottery, glass/epoxies.Additionally, substrate
312 can be flexible base board.Surface 312a is sensitive surface.
Distribution component 320 is the parts for being electrically connected with miscellaneous part by solar battery cell 310a, such as, by one
Individual solar battery cell electrically connects with other solar battery cells.In Figure 5, by distribution component 320, solar-electricity is made
The surface electrode 314 of pool unit 310a electrically connects with the backplate 316 of solar battery cell 310b.
Connection member 330 is respectively arranged between solar battery cell 310a and distribution component 320 and solar-electricity
Between pool unit 310b and distribution component 320, and solar battery cell 310a, 310b is made to be connected with distribution component 320.Connect
The parts 330 solidfied material containing above-mentioned adhesive composite, and containing insulating properties material.Connection member 330 can contain further
Conductive particle, it is also possible to do not contain electroconductive particle.When connection member 330 is containing electroconductive particle, solaode
The surface electrode 314 of unit 310a can electrically connect via electroconductive particle with distribution component 320.Additionally, solaode
The backplate 316 of unit 310b can also electrically connect via electroconductive particle with distribution component 320.When connection member 330
When not containing electroconductive particle, such as, the surface electrode 314 of solar battery cell 310a and/or solar battery cell
The backplate 316 of 310b can contact with distribution component 320.
For solar module 300, connection member 330 is made up of the solidfied material of above-mentioned adhesive composite.By
This, the company between solar battery cell 310a and distribution component 320 and between solar battery cell 310b and distribution component 320
The adhesive strength of relay part 330 is the highest, and the connection resistance between solar battery cell 310a and distribution component 320 is abundant
Little.Even if during additionally, place for a long time under hot and humid environment, also can fully suppress the reduction of adhesive strength and connect electricity
The increase of resistance.And then, connection member 330 can be formed by the heat treated between low-temperature short-time.Thus, the sun shown in Fig. 5
Can not make when connecting solar battery cell 310a, 310b deterioration manufacture by battery module, can have ratio existing
There is high reliability.
Solar module 300, can replace with solar battery cell 310a, 310b and distribution component 320
State the circuit block 10 in the manufacture method of connection structural bodies 100,200 and circuit block 20, with above-mentioned connection structural bodies
The method that manufacture method is identical manufactures.
Here, in connection structural bodies 100,200 and solar module 300, above-mentioned as connection member is glued
Connect agent compositions to need not be fully cured (solidification of the top that can reach under regulation condition of cure), as long as on Chan Shenging
Stating characteristic can be then partially cured state.
Embodiment
Hereinafter, according to embodiment, the present invention is specifically described, but the invention is not restricted to this.
＜ thermoplastic resin ＞
(preparation of PAUR)
By polyester urethane resin (Co., Ltd.'s system, UR-4800(trade name are spun by Japan), weight average molecular weight: 32000,
Glass transition temperature: 106 DEG C) it is dissolved in the 1:1 mixed solvent of butanone and toluene, prepare resinous principle 30 mass %
Mixed solvent dissolves product.
(preparation of phenoxy resin)
By phenoxy resin (trade name: YP-50(Toto Kasei KK system), weight average molecular weight: 60000, vitrification turns
Temperature: 80 DEG C) 40 mass parts are dissolved in butanone 60 mass parts, prepare the solution of solid constituent 40 mass %.
＜ free-radical polymerised compound ＞
(synthesis of urethane acrylate (UA1))
Possessing agitator, thermometer, there is the reflux condensing tube of calcium chloride tube and the reaction of nitrogen ingress pipe
In container, instilled poly-(1,6-hexanediol carbonic ester) (trade name: Duranol of number-average molecular weight 1000 equably with 3 hours
T5652, Asahi Chemical Corp's system) 2500 mass parts (2.50mol) and isophorone diisocyanate (Sigma-
Aldrich system) 666 mass parts (3.00mol), after importing nitrogen fully in reaction vessel, 70 ~ 75 DEG C heat into
Row reaction.In reaction vessel, add hydroquinone monomethyl ether (Sigma-Aldrich company system) 0.53 mass parts and tin dilaurate two
After butyl tin (Sigma-Aldrich company system) 5.53 mass parts, (Sigma-Aldrich is public to add 2-Hydroxy ethyl acrylate
Department's system) 238 mass parts (2.05mol), react 6 hours at 70 DEG C under air ambient, obtain urethane acrylate (UA1).
The weight average molecular weight of urethane acrylate is 15000.
(there is the preparation of the vinyl compound (P-2M) of phosphate)
As having the vinyl compound of phosphate, prepare 2-(methyl) acryloyl-oxyethyl phosphate ester (trade name:
Light Ester P-2M, Kyoeisha Chemical Co., Ltd.'s system).
The preparation ＞ of ＜ boron compound
As boron compound, prepare tri-tert tetraphenyl borate salts and (be called for short: TBPTB, Tokyo chemical conversion industry strain formula meeting
Society's system, fusing point: 261 DEG C), di-t-butyl methyl tetraphenyl borate salts (is called for short: DBMPTB, Tokyo HuaCheng Industry Co., Ltd
System, fusing point: 158 DEG C).
It addition, as boron compound, be synthesized as follows 2-ethyl-4-methylimidazole tetraphenyl borate salts (EMI-B).First
First, agitating device, thermometer and return channel are assemblied in the four-hole boiling flask of 30ml.It follows that by sodium tetraphenylborate
(Aldrich system) 3.4g(10mmol) it is dissolved in distilled water 100ml and the solution that obtains, add 2-ethyl-4-methyl to
Imidazoles (Aldrich system) 1.1g(10mmol) 1mol/l hydrochloric acid 10mol(10mol) solution in.Little 25 DEG C of stirrings 1
Shi Hou, separates oily mater.After obtained oily mater butanone (MEK) dilution, washing, and then use rotary evaporator
Concentrate.By obtained solid hexane washing, obtain white solid 2-ethyl-4-methylimidazole tetraphenyl borate salts (molten
Point: 200 DEG C), yield 35%.
The preparation ＞ of ＜ amines
As amines, prepare DMA (being called for short: DMA, Aldrich system).
＜ radical polymerization initiator ＞
As radical polymerization initiator, prepare dibenzoyl peroxide (trade name: NYPER BW, day oil strain formula meeting
Society's system) and dilauroyl peroxide (trade name: PEROYL L, Japan Oil Co's system).
＜ electroconductive particle ＞
(making of electroconductive particle)
At the nickel dam of surface configuration thickness 0.2 μm of the particle with polystyrene as core, then the outside at this nickel dam sets
Put the layer gold of thickness 0.02 μm, make mean diameter 10 μm, the electroconductive particle of proportion 2.5.
[embodiment 1 ~ 8 and comparative example 1 ~ 4]
(making of adhesive for circuit connection)
Thermoplastic resin, free-radical polymerised compound and radical polymerization is coordinated to draw as shown in table 1 by solid masses ratio
Send out agent and boron compound or amines, and then, (adhesive for circuit connection eliminates electric conductivity with bonding agent composition
The composition of particle) whole volumes on the basis of, coordinate dispersed electro-conductive particle 1.5 volume %, obtain adhesive for circuit connection.
Obtained adhesive for circuit connection painting frock is put on the fluororesin film being coated on thickness 80 μm, by 70 DEG C, 10 points
The hot air drying of clock obtains the membranaceous adhesive for circuit connection that the thickness of bond layer is 20 μm.
Table 1
| UR-4800 | YP-50 | UA1 | P-2M | TBPTB | DBMPTB | EMI-B | DMA | NYPER BW | PEROYL L | |
| Embodiment 1 | 50 | - | 50 | 3 | 5 | - | - | - | 8 | - |
| Embodiment 2 | 50 | - | 50 | 3 | - | 5 | - | - | 8 | - |
| Embodiment 3 | 50 | - | 50 | 3 | 5 | - | - | - | - | 8 |
| Embodiment 4 | 50 | - | 50 | 3 | - | 5 | - | - | - | 8 |
| Embodiment 5 | - | 50 | 50 | 3 | 3 | - | - | - | 8 | - |
| Embodiment 6 | - | 50 | 50 | 3 | - | 3 | - | - | - | 8 |
| Embodiment 7 | 50 | - | 50 | 3 | - | - | 5 | - | 8 | - |
| Embodiment 8 | 50 | - | 50 | 3 | - | - | 5 | - | - | 8 |
| Comparative example 1 | 50 | - | 50 | 3 | - | - | - | 3 | 8 | - |
| Comparative example 2 | 50 | - | 50 | 3 | - | - | - | 3 | - | 8 |
| Comparative example 3 | 50 | - | 50 | 3 | - | - | - | - | 8 | - |
| Comparative example 4 | 50 | - | 50 | 3 | - | - | - | - | - | 8 |
(connecting resistance, the mensuration of adhesive strength)
The adhesive for circuit connection making embodiment 1 ~ 8 and comparative example 1 ~ 4 has 500 lines on polyimide film
Wide 25 μm, spacing 50 μm, the flexible PCB (FPC) of copper circuit of thickness 8 μm and be formed with the thickness of thin layer of ITO of 0.2 μm
Between the glass (ITO, sheet resistance 20 Ω/) of degree 1.1mm.With thermo-compression bonding device (mode of heating: permanent pattern of fever, eastern beautiful engineering
Company's system), 120 DEG C, heating pressurization 10 seconds under 2MPa, carry out the connection that width is 2mm, make connection structural bodies A.Connecting
After immediately and 85 DEG C, the constant temperature and humidity cabinet of 85%RH keeps 240 hours after (after high temperature and humidity test), use circuit tester
Measure the resistance value between the adjacent circuit of this connection structural bodies A.Resistance value averagely carrys out table with 37 resistance between adjacent circuit
Show.
Additionally, the most immediately with high temperature and humidity test after, measure with 90 degree of stripping methods according to JIS-Z0237 and connect knot
The adhesive strength of structure body A.Herein, as the determinator of adhesive strength, use BALDWIN Co., Ltd. of Japan TENSILON
UTM-4(peeling rate 50mm/min, 25 DEG C).
Make the adhesive for circuit connection of embodiment 1 ~ 8 and comparative example 1 ~ 4 between the upper tool of polyimide film (Tg350 DEG C)
There is the flexible PCB (FPC) of the copper circuit of 80 live width 150 μm, spacing 300 μm, thickness 8 μm and be formed with thickness 5 μm
Between the pet substrate (Ag) of thickness 0.1 μm of the thin layer that Ag sticks with paste.With thermo-compression bonding device (mode of heating: permanent pattern of fever, eastern beautiful engineering
Company's system), 120 DEG C, heating pressurization 20 seconds under 2MPa, carry out the connection that width is 2mm, make connection structural bodies B.Connecting
After immediately and 85 DEG C, the constant temperature and humidity cabinet of 85%RH keeps 240 hours after (after high temperature and humidity test), use circuit tester
Measure the resistance value between the adjacent circuit of connection structural bodies B being made up of the pet substrate of FPC and the thin layer being formed with Ag paste.
Resistance value averagely represents with 37 resistance between adjacent circuit.
Additionally, the most immediately with high temperature and humidity test after, under conditions of identical with above-mentioned connection structural bodies A survey
Fixed, the adhesive strength of evaluation connection structural bodies B.
As above connection structural bodies A, the measurement result connecting resistance and adhesive strength of B that measure are shown in table 2 below.
Table 2
(storage stability test)
The adhesive for circuit connection of embodiment 1 ~ 2,7 and comparative example 1 ~ 2 is joined (Asahi Chemical Industry in gas-barrier container
PAX Co., Ltd. system, trade name: Polyflexbag(Port リ Off レ ッ Network ス バ ッ グ) flying dragon, model: N-9, material: nylon
Thickness 15 μm/PE thickness 60 μm, size: 200mm × 300mm), after removing the air in gas-barrier container, by heat-sealing secret
Envelope, then places 48 hours under 40 DEG C of environment.By placing under above-mentioned environment, with 5 phases of the moons of placement under-10 DEG C of environment
When.Hereafter, make the adhesive for circuit connection of embodiment 1 ~ 2,7 and comparative example 1 ~ 2 each between FPC same as described above and shape
Become have ITO thin layer glass between and FPC and be formed Ag stick with paste thin layer pet substrate between.To be connected electricity with above-mentioned
Hinder the method identical with during determining bonding strength and condition adds thermo-compressed to make connection structural bodies to it.With with above-mentioned phase
Same method measures connection resistance and the adhesive strength of this connection structural bodies.
The measurement result connecting resistance and adhesive strength of the connection structural bodies as above measured is shown in table 3 below.
Table 3
Additionally, for the connection structural bodies using in embodiment 3 ~ 6,8 adhesive for circuit connection obtained, be also carried out with
The identical test of embodiment 1 ~ 2,7 is as a result, identical with embodiment 1 ~ 2,7, and curability at low temperatures and storage stability are good.
Use connection structural bodies A of the FPC/ITO of the adhesive for circuit connection obtained in embodiment 1 ~ 8, whether
Carry out storage stability test, after heating-up temperature 120 DEG C connects immediately and 85 DEG C, the constant temperature and humidity cabinet of 85%RH keeps
After 240 hours (after high temperature and humidity test), it is demonstrated by good connection resistance and more than the 580N/m of about 4.0 below Ω
Good adhesive strength.Additionally, in connection structural bodies B of FPC/Ag, after heating-up temperature 120 DEG C connects immediately and
85 DEG C, the constant temperature and humidity cabinet of 85%RH keeps 240 hours after (after high temperature and humidity test), be also demonstrated by about 1.6 below Ω's
Good connects resistance and the good adhesive strength of more than 590N/m.Can confirm that the circuit that embodiment 1 ~ 8 obtains connects
Curability at low temperatures and storage stability with bonding agent are excellent.
On the other hand, the connection structural bodies of the adhesive for circuit connection obtained in comparative example 1 ~ 2 is used, although using
Good connection performance can be obtained during adhesive for circuit connection before storage stability test, but owing to circuit connects with viscous
Connect agent and do not comprise the salt of (d) boracic, therefore during adhesive for circuit connection after using storage stability test, can confirm that
After keeping 240 hours in constant temperature and humidity cabinet, the connection resistance of (after high temperature and humidity test) increases.Additionally, use comparative example 3 ~ 4
In the connection structural bodies of adhesive for circuit connection that obtains, do not comprise the salt of (d) boracic due to adhesive for circuit connection, because of
Even this is not in the case of carrying out storage stability test, it is also possible to after confirming to keep 240 hours in constant temperature and humidity cabinet
The connection resistance of (after high temperature and humidity test) increases.
Claims (85)
1. an adhesive composite, it contains (a) thermoplastic resin, (b) free-radical polymerised compound, (c) radical polymerization
Close initiator and the salt of (d) boracic,
Wherein, the salt of described (d) boracic is the compound shown in following formula (A),
In formula (A), R1、R2、R3And R4Represent hydrogen atom, the alkyl of carbon number 1～18 or aryl, X independently of one another+Represent
Comprise the cation of quaternary nitrogen atoms.
Adhesive composite the most according to claim 1, wherein, described cation X+Comprise quaternary phosphonium atom further.
Adhesive composite the most according to claim 1, wherein, the salt of described (d) boracic comprises from by ammonium ion, imidazoles
Ion and imidazoline select in molecular group at least one as the described cation comprising quaternary nitrogen atoms.
Adhesive composite the most according to claim 2, wherein, the salt of described (d) boracic comprises from by ammonium ion, imidazoles
Ion and imidazoline select in molecular group at least one as the described cation comprising quaternary nitrogen atoms.
Adhesive composite the most according to claim 1, wherein, as the salt of described (d) boracic, containing following formula
(A2) compound shown in,
In formula (A2), R1、R2、R3And R4Represent hydrogen atom, the alkyl of carbon number 1～18 or aryl, R independently of one another5b、
R6b、R7b、R8bAnd R9bRepresent hydrogen atom, halogen atom, alkyl, aryl or alkoxyl, R independently of one another8bAnd R9bCan be mutual
In conjunction with and form ring.
Adhesive composite the most according to claim 2, wherein, as the salt of described (d) boracic, containing following formula
(A2) compound shown in,
In formula (A2), R1、R2、R3And R4Represent hydrogen atom, the alkyl of carbon number 1～18 or aryl, R independently of one another5b、
R6b、R7b、R8bAnd R9bRepresent hydrogen atom, halogen atom, alkyl, aryl or alkoxyl, R independently of one another8bAnd R9bCan be mutual
In conjunction with and form ring.
7. according to the adhesive composite according to any one of claim 1～6, wherein, the salt of described (d) boracic comprise from by
Tetraalkyl borate, four aromatic yl acid salts, trialkyl aromatic yl acid salt, dialkyl group diarylborinic acid salt and alkyl triaryl boric acid
At least one selected in the group of salt composition is as borate compound.
8. according to the adhesive composite according to any one of claim 1～6, wherein, the salt of described (d) boracic comprises and has
The borate of aryl is as borate compound.
9. according to the adhesive composite according to any one of claim 1～6, wherein, the salt of described (d) boracic comprises four virtues
Ylboronic acid salt is as borate compound.
10. according to the adhesive composite according to any one of claim 1～6, wherein, the fusing point of the salt of described (d) boracic
It it is more than 60 DEG C less than 300 DEG C.
11. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of the salt of described (d) boracic is more than 0.1 mass %.
12. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of the salt of described (d) boracic is more than 0.5 mass %.
13. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of the salt of described (d) boracic is below 20 mass %.
14. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of the salt of described (d) boracic is below 15 mass %.
15. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of the salt of described (d) boracic is below 10 mass %.
16. according to the adhesive composite according to any one of claim 1～6, wherein, described (b) free-radical polymerisedization
Compound comprises the free-radical polymerised compound having beyond the vinyl compound of phosphate and this vinyl compound.
17. adhesive composites according to claim 16, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, described in there is phosphate the use level of vinyl compound be more than 0.2 mass %.
18. adhesive composites according to claim 16, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, described in there is phosphate the use level of vinyl compound be more than 0.3 mass %.
19. adhesive composites according to claim 16, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, described in there is phosphate the use level of vinyl compound be more than 0.5 mass %.
20. adhesive composites according to claim 16, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, described in there is phosphate the use level of vinyl compound be below 15 mass %.
21. adhesive composites according to claim 16, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, described in there is phosphate the use level of vinyl compound be below 10 mass %.
22. adhesive composites according to claim 16, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, described in there is phosphate the use level of vinyl compound be below 5 mass %.
23. according to the adhesive composite according to any one of claim 1～6, wherein, described (b) free-radical polymerisedization
Compound comprises from by N-vinyl compound and N, the N-ethylene base system selected in the group of N-dialkyl group vinyl compound composition
Free-radical polymerised compound beyond compound and this N-vinyl compound.
24. adhesive composites according to claim 23, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, the use level of described N-vinyl compound is more than 0.2 mass %.
25. adhesive composites according to claim 23, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, the use level of described N-vinyl compound is more than 0.3 mass %.
26. adhesive composites according to claim 23, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, the use level of described N-vinyl compound is more than 0.5 mass %.
27. adhesive composites according to claim 23, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, the use level of described N-vinyl compound is below 15 mass %.
28. adhesive composites according to claim 23, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, the use level of described N-vinyl compound is below 10 mass %.
29. adhesive composites according to claim 23, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, the use level of described N-vinyl compound is below 5 mass %.
30. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, except meeting the vinyl compound with phosphate or N-ethylene base system
The use level of described (b) free-radical polymerised compound beyond the compound of compound is more than 5 mass %.
31. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, except meeting the vinyl compound with phosphate or N-ethylene base system
The use level of described (b) free-radical polymerised compound beyond the compound of compound is more than 10 mass %.
32. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, except meeting the vinyl compound with phosphate or N-ethylene base system
The use level of described (b) free-radical polymerised compound beyond the compound of compound is more than 15 mass %.
33. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, except meeting the vinyl compound with phosphate or N-ethylene base system
The use level of described (b) free-radical polymerised compound beyond the compound of compound is below 95 mass %.
34. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, except meeting the vinyl compound with phosphate or N-ethylene base system
The use level of described (b) free-radical polymerised compound beyond the compound of compound is below 80 mass %.
35. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, except meeting the vinyl compound with phosphate or N-ethylene base system
The use level of described (b) free-radical polymerised compound beyond the compound of compound is below 70 mass %.
36. according to the adhesive composite according to any one of claim 1～6, wherein, as described (b) radical polymerization
Property compound, containing urethane acrylate.
37. adhesive composites according to claim 36, wherein, as described urethane acrylate, containing following
Urethane acrylate shown in formula (N),
In formula (N), R23And R24Represent hydrogen atom or methyl, R independently of one another25Represent ethylidene or propylidene, R26Represent saturated
Fatty group or saturated fat cyclic group, R27Represent the representative examples of saturated aliphatic base containing ester group or saturated fat cyclic group or containing carbon
The representative examples of saturated aliphatic base of perester radical or saturated fat cyclic group, k represents the integer of 1～40, here, in formula (N), R25Each other, R26That
This can be the most identical or different.
38. adhesive composites according to claim 36, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, the use level of described urethane acrylate is more than 5 mass %.
39. adhesive composites according to claim 36, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, the use level of described urethane acrylate is more than 10 mass %.
40. adhesive composites according to claim 36, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, the use level of described urethane acrylate is more than 15 mass %.
41. adhesive composites according to claim 36, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, the use level of described urethane acrylate is below 95 mass %.
42. adhesive composites according to claim 36, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, the use level of described urethane acrylate is below 80 mass %.
43. adhesive composites according to claim 36, wherein, to eliminate electroconductive particle in adhesive composite
Composition all-mass on the basis of, the use level of described urethane acrylate is below 70 mass %.
44. according to the adhesive composite according to any one of claim 1～6, wherein, as described (c) radical polymerization
Initiator, is 90～175 DEG C and organic peroxide that weight average molecular weight is 180～1000 containing 1 minute half life temperature.
45. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of described (c) radical polymerization initiator be 0.5 mass % with
On.
46. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of described (c) radical polymerization initiator be 1 mass % with
On.
47. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of described (c) radical polymerization initiator be 2 mass % with
On.
48. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of described (c) radical polymerization initiator be 40 mass % with
Under.
49. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of described (c) radical polymerization initiator be 30 mass % with
Under.
50. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of described (c) radical polymerization initiator be 20 mass % with
Under.
51. according to the adhesive composite according to any one of claim 1～6, and wherein, described (a) thermoplastic resin comprises
From by phenoxy resin, polyurethane resin, butyral resin, acrylic resin, polyimide resin and polyamide and tool
At least one selected in the group being made up of as the copolymer of construction unit vinylacetate.
52. according to the adhesive composite according to any one of claim 1～6, and wherein, described (a) thermoplastic resin comprises
Polyester urethane resin.
53. according to the adhesive composite according to any one of claim 1～6, wherein, the weight of described (a) thermoplastic resin
Average molecular weight is more than 5000.
54. according to the adhesive composite according to any one of claim 1～6, wherein, the weight of described (a) thermoplastic resin
Average molecular weight is more than 7000.
55. according to the adhesive composite according to any one of claim 1～6, wherein, the weight of described (a) thermoplastic resin
Average molecular weight is more than 10000.
56. according to the adhesive composite according to any one of claim 1～6, wherein, the weight of described (a) thermoplastic resin
Average molecular weight is less than 150000.
57. according to the adhesive composite according to any one of claim 1～6, wherein, the weight of described (a) thermoplastic resin
Average molecular weight is less than 100000.
58. according to the adhesive composite according to any one of claim 1～6, wherein, the weight of described (a) thermoplastic resin
Average molecular weight is less than 80000.
59. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of described (a) thermoplastic resin is more than 5 mass %.
60. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of described (a) thermoplastic resin is more than 15 mass %.
61. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of described (a) thermoplastic resin is below 80 mass %.
62. according to the adhesive composite according to any one of claim 1～6, wherein, to eliminate in adhesive composite
On the basis of the all-mass of the composition of electroconductive particle, the use level of described (a) thermoplastic resin is below 70 mass %.
63. according to the adhesive composite according to any one of claim 1～6, wherein, contains (e) electric conductivity grain further
Son.
64. adhesive composites according to claim 63, wherein, to eliminate electroconductive particle in adhesive composite
Composition whole volumes on the basis of, the use level of described (e) electroconductive particle is 0.1 more than volume %.
65. adhesive composites according to claim 63, wherein, to eliminate electroconductive particle in adhesive composite
Composition whole volumes on the basis of, the use level of described (e) electroconductive particle is 0.2 more than volume %.
66. adhesive composites according to claim 63, wherein, to eliminate electroconductive particle in adhesive composite
Composition whole volumes on the basis of, the use level of described (e) electroconductive particle is 30 below volume %.
67. adhesive composites according to claim 63, wherein, to eliminate electroconductive particle in adhesive composite
Composition whole volumes on the basis of, the use level of described (e) electroconductive particle is 10 below volume %.
68. according to the adhesive composite according to any one of claim 1～6, and it is for making to be configured at the master of first substrate
The first connection terminal on face is connected terminal with second on the interarea being configured at second substrate and is electrically connected.
69. according to the adhesive composite according to any one of claim 1～6, and it is for making have the master being configured at substrate
This connection terminal of the solar battery cell connecting terminal on face is electrically connected with distribution component.
70. according to the adhesive composite according to any one of claim 1～6, and it becomes the connecting portion in connection structural bodies
Part, described connection structural bodies possesses: have first substrate and the first connection terminal being configured on the interarea of this first substrate
First circuit block, have second substrate and be configured on the interarea of this second substrate second connection terminal second circuit portion
Part and be configured at the described connection member between described first circuit block and described second circuit parts, described first even
Connecting terminal and described second connects terminal and is electrically connected.
71. according to the adhesive composite according to any one of claim 1～6, and it becomes the connecting portion in connection structural bodies
Part, described connection structural bodies possesses: have substrate and the solaode list connecting terminal being configured on the interarea of this substrate
Unit, distribution component and the described connection member being configured between described solar battery cell and described distribution component, described
Connect terminal and described distribution component is electrically connected.
72. 1 kinds of film-like adhesives, it comprises the adhesive composite according to any one of claim 1～67.
73. 1 kinds of adhesive sheets, it possesses the film-like adhesive described in base material and claim 72, wherein, described membranaceous bonding
Agent is configured on described base material.
74. 1 kinds of anisotropic conductive film, it comprises the adhesive composite according to any one of claim 1～67.
75. 1 kinds of connection structural bodies, it possesses: have first substrate and the first connection being configured on the interarea of this first substrate
First circuit block of terminal, there is second substrate and be configured on the interarea of this second substrate the second of the second connection terminal
Circuit block and be configured at the connection member between described first circuit block and described second circuit parts,
Described connection member contains the solidfied material of the adhesive composite according to any one of claim 1～67,
Described first connection terminal and described second connects terminal and is electrically connected.
76. according to the connection structural bodies described in claim 75, wherein, in described first substrate and described second substrate at least
One side is made up of the base material comprising the thermoplastic resin that glass transition temperature is less than 200 DEG C.
77. according to the connection structural bodies described in claim 75, wherein, in described first substrate and described second substrate at least
One side is by comprising from by polyethylene terephthalate, Merlon, PEN and cyclic olefin polymer
The base material of at least one selected in the group of composition is constituted.
78. according to the connection structural bodies described in claim 75, and wherein, described first substrate is by comprising from by poly terephthalic acid
At least one selected in the group of glycol ester, Merlon, PEN and cyclic olefin polymer composition
Base material is constituted, and described second substrate is by comprising choosing from the group being made up of polyimide resin and polyethylene terephthalate
The base material of at least one gone out is constituted.
79. 1 kinds of connection structural bodies, it possesses: have substrate and the solar energy connecting terminal being configured on the interarea of this substrate
Battery unit, distribution component and be configured at the connection member between described solar battery cell and described distribution component,
Described connection member contains the solidfied material of the adhesive composite according to any one of claim 1～67,
Described connection terminal and described distribution component are electrically connected.
The manufacture method of 80. connection structural bodies, the method combines by making the bonding agent according to any one of claim 1～67
Thing between have first substrate and be configured on the interarea of this first substrate first connection terminal the first circuit block and tool
Have second substrate and be configured on the interarea of this second substrate second connection terminal second circuit parts between, such
Make described adhesive composite solidify under state, thus make described first to connect terminal and described second connection terminal electrical connection
State under bonding described first circuit block and described second circuit parts.
The manufacture method of 81. connection structural bodies, the method combines by making the bonding agent according to any one of claim 1～67
Thing between have substrate and be configured on the interarea of this substrate connect terminal solar battery cell and distribution component between,
Make described adhesive composite solidify in such a state, thus make described connection terminal and the electrical connection of described distribution component
State under bonding described solar battery cell and described distribution component.
Adhesive composite according to any one of 82. claim 1～67 is for making to be configured at the interarea of first substrate
First connection terminal be connected the application during terminal is electrically connected with second on the interarea being configured at second substrate.
Adhesive composite according to any one of 83. claim 1～67 makes to be configured at the master of first substrate for manufacture
The first connection terminal on face is connected, with second on the interarea being configured at second substrate, the connection member that terminal is electrically connected
In application.
Adhesive composite according to any one of 84. claim 1～67 is being configured at the interarea of substrate for making to have
This connection terminal and the distribution component of the solar battery cell connecting terminal be electrically connected in application.
Adhesive composite according to any one of 85. claim 1～67 is being configured at the master of substrate for manufacturing to make to have
In the connection member that this connection terminal of the solar battery cell connecting terminal on face and distribution component are electrically connected
Application.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610243761.9A CN105907355B (en) | 2011-12-16 | 2012-12-17 | Adhesive composite |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011275800 | 2011-12-16 | ||
| JP2011-275800 | 2011-12-16 |
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|---|---|---|---|
| CN201610243761.9A Division CN105907355B (en) | 2011-12-16 | 2012-12-17 | Adhesive composite |
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| CN103160238B true CN103160238B (en) | 2016-09-28 |
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| CN201210548890.0A Active CN103160238B (en) | 2011-12-16 | 2012-12-17 | Adhesive composite, film-like adhesive, adhesive sheet and connection structural bodies |
| CN201610243761.9A Active CN105907355B (en) | 2011-12-16 | 2012-12-17 | Adhesive composite |
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| JP (1) | JP5527395B2 (en) |
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| JP6123547B2 (en) * | 2013-07-26 | 2017-05-10 | 日立化成株式会社 | Circuit connection material, circuit connection structure, method for manufacturing circuit connection structure, adhesive composition, and adhesive sheet |
| JP6232855B2 (en) * | 2013-08-30 | 2017-11-22 | デクセリアルズ株式会社 | Radical polymerization type adhesive composition and method for producing electrical connector |
| KR101596655B1 (en) * | 2013-09-05 | 2016-02-22 | 세키스이가가쿠 고교가부시키가이샤 | Curable composition and connection structure |
| JP6330346B2 (en) * | 2014-01-29 | 2018-05-30 | 日立化成株式会社 | Adhesive composition, electronic member using adhesive composition, and method for manufacturing semiconductor device |
| KR101469199B1 (en) * | 2014-04-15 | 2014-12-09 | 한상용 | Solid label, and manufacture method thereof |
| JP2016044222A (en) * | 2014-08-21 | 2016-04-04 | 日立化成株式会社 | Adhesive composition and connection structure |
| JP6461577B2 (en) * | 2014-11-28 | 2019-01-30 | 東洋アルミニウム株式会社 | Inlet antenna for RFID, RFID and manufacturing method thereof |
| JP6487203B2 (en) * | 2014-12-24 | 2019-03-20 | スリーエム イノベイティブ プロパティズ カンパニー | Design transfer sheet, decorative film and method for producing the same |
| CN107429143B (en) * | 2015-04-23 | 2019-08-16 | 日立化成株式会社 | Adhesive composite and connection structural bodies |
| JP6428716B2 (en) * | 2016-07-12 | 2018-11-28 | 千住金属工業株式会社 | Conductive adhesives, joints and joints |
| CN110582840A (en) * | 2017-04-21 | 2019-12-17 | 日立化成株式会社 | Semiconductor device and method for manufacturing the same |
| DE102019121371B4 (en) * | 2018-08-08 | 2022-10-06 | Lg Display Co., Ltd. | Integrated circuit assembly and display device using same |
| JP2019026851A (en) * | 2018-09-19 | 2019-02-21 | 日立化成株式会社 | Adhesive composition and connection structure |
| JP2020111760A (en) * | 2020-04-07 | 2020-07-27 | 日立化成株式会社 | Adhesive composition and connection structure |
| KR20230137445A (en) * | 2021-03-10 | 2023-10-04 | 후지필름 가부시키가이샤 | Underfill composition, coating film, cured film, multilayer wiring board, and method of manufacturing a multilayer wiring board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6127092A (en) * | 1997-06-30 | 2000-10-03 | Siemens Ag | Reaction resin mixtures and use thereof |
| CN101857778A (en) * | 2009-04-08 | 2010-10-13 | 日东电工株式会社 | Thermosetting die bonding film |
| CN101925663A (en) * | 2008-04-17 | 2010-12-22 | 日立化成工业株式会社 | Adhesive composition, adhesive for circuit connection, connected structure, and semiconductor device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2610900B2 (en) | 1987-10-27 | 1997-05-14 | ソニーケミカル 株式会社 | Thermosetting anisotropic conductive adhesive sheet and method for producing the same |
| JP3998737B2 (en) * | 1996-05-22 | 2007-10-31 | 株式会社トクヤマ | Dental adhesive composition |
| KR100333456B1 (en) | 1997-03-31 | 2002-04-18 | 이사오 우치가사키 | Circuit Connecting Material, and Structure and Method of Connecting Circuit Terminal |
| JPH11140383A (en) * | 1997-11-07 | 1999-05-25 | Tokuyama Corp | Adhesive composition |
| US6045895A (en) * | 1997-12-01 | 2000-04-04 | 3M Innovative Properties Company | Multilayer films having pressure sensitive adhesive layers |
| JP4514848B2 (en) | 1999-04-09 | 2010-07-28 | サンメディカル株式会社 | Polymerization initiator and dental material using the same |
| JP5527600B2 (en) * | 2009-10-07 | 2014-06-18 | 日立化成株式会社 | Epoxy resin composition and electronic component device using the same |
| JP4844677B2 (en) * | 2010-01-27 | 2011-12-28 | 日立化成工業株式会社 | Circuit connection material, circuit member connection structure, and circuit member connection method. |
-
2012
- 2012-12-14 TW TW101147591A patent/TWI580745B/en active
- 2012-12-14 JP JP2012273669A patent/JP5527395B2/en active Active
- 2012-12-14 KR KR1020120146237A patent/KR102152474B1/en active IP Right Grant
- 2012-12-17 CN CN201210548890.0A patent/CN103160238B/en active Active
- 2012-12-17 CN CN201610243761.9A patent/CN105907355B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6127092A (en) * | 1997-06-30 | 2000-10-03 | Siemens Ag | Reaction resin mixtures and use thereof |
| CN101925663A (en) * | 2008-04-17 | 2010-12-22 | 日立化成工业株式会社 | Adhesive composition, adhesive for circuit connection, connected structure, and semiconductor device |
| CN101857778A (en) * | 2009-04-08 | 2010-10-13 | 日东电工株式会社 | Thermosetting die bonding film |
Also Published As
| Publication number | Publication date |
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| JP2013144793A (en) | 2013-07-25 |
| CN103160238A (en) | 2013-06-19 |
| CN105907355B (en) | 2019-03-08 |
| KR102152474B1 (en) | 2020-09-04 |
| TWI580745B (en) | 2017-05-01 |
| CN105907355A (en) | 2016-08-31 |
| JP5527395B2 (en) | 2014-06-18 |
| KR20130069499A (en) | 2013-06-26 |
| TW201333133A (en) | 2013-08-16 |
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