CN103153036A - Circuit board operation machine - Google Patents
Circuit board operation machine Download PDFInfo
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- CN103153036A CN103153036A CN 201210526151 CN201210526151A CN103153036A CN 103153036 A CN103153036 A CN 103153036A CN 201210526151 CN201210526151 CN 201210526151 CN 201210526151 A CN201210526151 A CN 201210526151A CN 103153036 A CN103153036 A CN 103153036A
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- upstream portion
- information
- stop position
- circuit substrate
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Abstract
The invention provides a circuit board operation machine which is an improvement from a conventional circuit board operation machine which enables a plurality of parts formed through segmentation of a circuit board in conveying direction to be located in an operation area for operation. A multi-chamfer board is segmented into a downstream side and an upstream side in the conveying direction, the position of the downstream side of the multi-chamfer board for conveying should be consistent with the position of the downstream side of an installation operation area, reference marks of the downstream side are shot and stop position error is obtained. A defective product mark attachment part on the downstream side is shot and detection whether defective product marks exist or not is performed on all unit boards. When the multi-chamfer board is conveyed to the position, which is consistent with the upstream side end of the installation operation area, of the upstream side end of the upstream side, the obtained stop position error is applied to actuating quantity control of a driving motor of a substrate conveying device so that the stop position error can be reduced. Shooting of reference marks and installation of electronic circuit parts are not performed on the unit boards with the defective product marks on the upstream side.
Description
Technical field
The present invention relates to operation that circuit substrate is stipulated to working machine for circuit board, a plurality of parts that are divided on throughput direction that particularly make circuit substrate be positioned at successively the operating area and to the part that is positioned at this operating area carry out operation to working machine for circuit board.
Background technology
In a kind of electronic circuit component mounter of conduct to working machine for circuit board, patent documentation 1 described as follows is described, and regulation has the installation exercise zone that suction nozzle and base plate keeping device is relatively moved and carry out installing to circuit substrate electronic circuit component.Thus, in the situation that the size of the direction parallel with throughput direction of the circuit substrate of being carried by base board delivery device is the length in Length Ratio installation exercise zone is long, circuit substrate exceeds from the installation exercise zone.Therefore, in the electronic circuit component mounter of patent documentation 1 record, circuit substrate is divided into two parts on throughput direction, is positioned at successively the installation exercise zone from the partitioning portion in downstream, thereby each partitioning portion is installed electronic circuit component.Respectively be provided with two reference marks for two partitioning portions on circuit substrate, taken being positioned at two set reference marks of partitioning portion in installation exercise zone by camera head, obtain the site error of the element installation position in partitioning portion, thereby precision is carried out the installation of electronic circuit component well.
In addition, following patent documentation 2 records that a screen process press and many electronic circuit component mounters form a line and the electronic circuit component hookup wire that consists of.The electronic circuit component mounter of this electronic circuit component mounter and patent documentation 1 record is same, and the circuit substrate of the length that will exceed from the installation exercise zone is divided into two parts at throughput direction and carries out the installation of electronic circuit component.But, in the electronic circuit component mounter of patent documentation 2 records, in two reference marks of being taken a by side of camera head a to(for) partitioning portion is made as the set mark that sets in advance in circuit substrate, and the opposing party uses features through hole, pad, the wiring pattern reference mark instead for example on the formation of circuit substrate.The operating area of screen process press is that the presswork zone is regional larger than installation exercise, and the configurable circuit substrate is whole, therefore two reference marks only is set on circuit substrate and gets final product.On the other hand, in electronic circuit component mounter, an orientation of two set reference marks can be taken by camera head in the installation exercise zone, but the opposing party exceeds and can not be taken from the installation exercise zone.Therefore, in screen process press, be set with two set reference marks and be located on replacement reference mark in the installation exercise zone in pairs and with set reference mark one respectively, send to electronic circuit component mounter and replace the reference mark data to use.Replace the reference mark data further send to the electronic circuit component mounter in downstream and use from the electronic circuit component mounter of upstream side.
Following patent documentation 3 records the electronic circuit component hookup wire that is divided into backward many chamferings substrate installation electronic circuit component of a plurality of unit substrate by a plurality of electronic circuit component mounters.In this electronic circuit component hookup wire, in the electronic circuit component mounter of upstream, under the state of circuit substrate by the alignment pin location, two reference marks that a plurality of unit substrate arrange are respectively separately taken, calculate the site error of the part of the position deviation of circuit substrate integral body and unit substrate.In addition, the defective products mark appendix that is arranged at respectively a plurality of unit substrate is taken, detect and whether have the defective products mark, to carry out the installation of electronic circuit component without the unit substrate of defective products mark, not to carry out the installation of electronic circuit component with the unit substrate of defective products mark.And, from the electronic circuit component mounter electronic circuit component mounter delivery circuit substrate that side is adjacent downstream of upstream, with this conveying job parallelism ground, data and the defective products flag data of the site error of the part of unit substrate is transferred to the adjacent electronic circuit component mounter in downstream.In the electronic circuit component mounter in downstream, do not carry out the reference mark of unit substrate and the detection of defective products mark, but carry out the installation of electronic circuit component with the data of passing on, not to carry out the installation of electronic circuit component with the unit substrate of defective products mark.Local position error data and defective products flag data further downstream the electronic circuit component mounter of side pass on.
Patent documentation 1: TOHKEMY 2004-103828 communique
Patent documentation 2: TOHKEMY 2008-218538 communique
Patent documentation 3: TOHKEMY 2000-124676 communique
Summary of the invention
The present invention completes take above-mentioned situation as background, and its problem is, provides a kind of a plurality of parts that are divided on throughput direction that make circuit substrate to be positioned at the operating area successively and carries out the improvement to working machine for circuit board of operation.
above-mentioned problem namely, comprising by forming following solving to working machine for circuit board: (a) apparatus for work, the operating area with regulation, the operation that the part that is positioned at described operating area of circuit substrate is scheduled to, (b) base board delivery device is carried described circuit substrate along throughput direction, and what make described circuit substrate stops at target stop position in described operating area successively in a plurality of parts that are divided on this throughput direction from the part in downstream, (c) base plate keeping device, the circuit substrate of fixing and keeping this to stop, (d) information acquisition device is obtained the relevant information of this circuit substrate from the downstream sidepiece of the described circuit substrate that stops, and wherein said downstream sidepiece is to be in the part in downstream in the described a plurality of parts that are divided into, (e) information use device, the information that will be obtained by this information acquisition device is used at least one party of the operation of the conveying of described base board delivery device that upstream portion is carried out and described apparatus for work, wherein said upstream portion is for to be in the more part of upstream side than described downstream sidepiece, and, described information acquisition device comprises upstream portion information obtaining section, described upstream portion information obtaining section obtains upstream portion information from the upstream portion information recording part that records upstream portion information, described upstream portion information recording part is located at the described downstream sidepiece of the circuit substrate of described base plate keeping device maintenance, described upstream portion information is the information relevant to described upstream portion, and described information use device comprises operation utilized section, describedly utilizes section that the information that described upstream portion information obtaining section obtains is used for the operation that described apparatus for work carries out described upstream portion to operation.
Consist of as mentioned above to working machine for circuit board in, obtain upstream portion information under the state of downstream side part in the operating area of circuit substrate.Therefore, for example, when the upstream portion that makes circuit substrate is positioned at the operating area and carries out operation, obtaining of upstream portion information can be do not carried out, operating efficiency can be improved.Obtain the upstream portion informational needs time under the state of downstream side part in the operating area of circuit substrate, but for example by together obtaining with the information relevant to the downstream sidepiece, with carry out respectively obtaining with the situation about obtaining of upstream portion information of downstream sidepiece information and compare, can shortening obtain the time, to the activity duration shortening of circuit substrate integral body.Perhaps, even in the time of can not obtaining upstream portion information under upstream portion is positioned at the state of operating area, also can obtain upstream portion information, can be used in operation.
The form of invention
Below, be considered in illustration the application to require Patent right invention (below, be sometimes referred to as " can require the invention of right ".Can require the invention of right to comprise that the invention of claims record is the subordinate concept invention of the present application, the upperseat concept of the present application or the invention of other concepts) some modes, and these modes are described.Each mode and claim are similarly divided into item, and be every with sequence number, as required, puts down in writing with the form of the sequence number of quoting other.This is can require the invention of right for easy understanding eventually, is not the combination that consists of the inscape of the invention that can require right to be defined in the record of the following.Namely, can require the invention of right to explain with reference to the record of every subsidiary record, execution mode, prior art, technology general knowledge etc., explain as long as follow it, further be attached with in every mode other inscapes mode, also have the mode of deletion inscape from every mode all can become a mode of the invention that can require right.
In addition, in below every, (3) item is equivalent to the technical scheme 1 in claims, and (5) item is equivalent to technical scheme 2, and (8) item is equivalent to technical scheme 3, and (9) item is equivalent to technical scheme 4.
(1) a kind of to working machine for circuit board, comprising:
Apparatus for work, the operating area with regulation, the operation that the part that is positioned at described operating area of circuit substrate is scheduled to;
Base board delivery device is carried described circuit substrate along throughput direction, and what make described circuit substrate stops at target stop position in described operating area successively in a plurality of parts that are divided on this throughput direction from the part in downstream;
Base plate keeping device, the circuit substrate of fixing and keeping this to stop;
Information acquisition device, the downstream sidepiece that is in the part in downstream from the described a plurality of parts that are divided into of conduct of the described circuit substrate that stops is obtained the relevant information of this circuit substrate;
Information use device, the information that will be obtained by this information acquisition device are used at least one party as the operation of the conveying that is in the described base board delivery device that the upstream portion of the part of upstream side more carries out than described downstream sidepiece and described apparatus for work.
In to working machine for circuit board such as electronic circuit component mounter, solder printing machine, adhesive coating machine, circuit substrate testing machine etc. are arranged.
Circuit substrate both can be divided into two parts on throughput direction, also can be divided into the part more than three.
Be not positioned in upstream portion under the state of operating area, can obtain the information to this upstream portion utilization, utilize by this, such as the raising of the stop position precision that can access circuit substrate, the raising of workability, the various effects such as the change carried out of operation.
(2) as described to working machine for circuit board in (1) item, wherein, described information acquisition device comprises upstream portion information obtaining section, described upstream portion information obtaining section obtains upstream portion information from the upstream portion information recording part that records upstream portion information, described upstream portion information recording part is located at the described downstream sidepiece of the circuit substrate of described base plate keeping device maintenance, and described upstream portion information is the information relevant to described upstream portion.
The upstream portion information exchange is crossed the detection in the hole of reading, be opened in circuit substrate of mark, bar code, two-dimension code for example or is write IC(Integrated Circuit with antenna) chip is (for example, the reception of information label chip) obtains, and the upstream portion information recording part is made of mark of circuit substrate etc., the IC chip that is arranged at circuit substrate.
(3) as described to working machine for circuit board in (2) item, wherein, described information use device comprises operation utilized section, describedly utilizes section that the information that described upstream portion information obtaining section obtains is used for the operation that described apparatus for work carries out described upstream portion to operation.
(4) as described to working machine for circuit board in (2) item or (3) item, wherein, described circuit substrate is divided into many chamferings substrate of a plurality of unit substrate after being, described upstream portion information obtaining section comprises bad unit substrate information obtaining section, and described bad unit substrate information obtaining section obtains the bad unit substrate information of the bad unit substrate in the contained more than one unit substrate of the described upstream portion of expression.
The circuit substrate of the technical scheme of applicable (2) item and (3) item can not be also many chamferings substrate.But many chamferings substrate is larger, and the size of the direction parallel with throughput direction surpasses the operating area mostly, and therefore being divided into a plurality of parts on throughput direction, to carry out operation be effectively, can both effectively bring into play effect of the present invention in a lot of situations.
Circuit substrate is that many chamferings substrate and upstream portion information comprise that bad unit substrate information is not must adopt together all the time, for example, circuit substrate is many chamferings substrate, and both can adopt together with upstream portion information comprises the operation appointed information, also can together with comprising stop position error obtaining section, adopt information acquisition device.
(5) as described to working machine for circuit board in (4) item, wherein, described the operation section of utilization is comprised bad unit substrate operation prohibition unit, described bad unit substrate operation prohibition unit is forbidden the bad unit substrate that described bad unit substrate information represents is carried out the operation of described apparatus for work.
Bad unit substrate has certain defectives such as unfavorable condition of wiring pattern, even utilize apparatus for work to carry out operation, is also the substrate that can not use as product, by forbidding of operation, can avoid invalidly carrying out operation.
(6) as described to working machine for circuit board in (3) item, wherein, described upstream portion information obtaining section comprises the upstream portion operation appointed information obtaining section that obtains the operation appointed information, the operation that described operation appointed information specifies the described upstream portion of reply to carry out as described upstream portion information; Carry out assignment enforcement division by the operation of described operation appointed information appointment to described upstream portion the described operation section of utilization is comprised.
(7) as described to working machine for circuit board in any one in the item of (1) item～(6), wherein, described base board delivery device is by the conveyer belt supporting circuit substrate of rotation, and the control of the fed distance of the described circuit substrate of realizing by the control by the actuating quantity of the CD-ROM drive motor that makes this conveyer belt rotation comes the stop position of control circuit substrate; Described information acquisition device comprises stop position error obtaining section, described stop position error obtaining section is taken the reference mark of the described downstream sidepiece setting of the circuit substrate that stops at described stop position, according to this shooting results, obtain as the actual stop position of this downstream sidepiece stop position error with respect to the error of described target stop position.
Above-mentioned " shooting of the reference mark that the downstream sidepiece arranges " both can be carried out after the circuit substrate that stops is kept by base plate keeping device, also can carry out before maintenance.
(8) as described to working machine for circuit board in (7) item, wherein, described information use device comprises stop position error employing section, in the control of the actuating quantity of the described CD-ROM drive motor of the described base board delivery device of the conveying use of the target stop position of the described upstream portion that the described stop position error that described stop position error employing section will obtain uses described circuit substrate in the described operating area.
The stop position error of upstream portion can produce because of a variety of causes, due to these reasons, situation, appearance and the fed distance that the stop position error that is directly proportional to the fed distance of circuit substrate can occur producing is irrelevant and produce the situation of constant stop position error.In addition, even during to the conveying of assigned position, can produce the stop position error at the downstream of circuit substrate sidepiece, but during to the conveying of assigned position, sometimes do not produce the stop position error of same cause in upstream portion yet yet.Therefore, it is desirable to, the reason that stop position error employing section occurs according to the stop position error uses by the stop position error with the downstream sidepiece in the control of actuating quantity of CD-ROM drive motor of conveying use of upstream portion, and the stop position error of upstream portion is reduced.
By the employing of stop position error, can reduce the stop position error in the operating area of upstream portion.Can access following effect thus: for example, the site error of the reference mark that the upstream portion of circuit substrate arranges reduces, when camera head carries out the shooting of reference mark, reference mark is difficult for breaking away from the visual field, easily take, perhaps reference mark is from taking the reduction that departs from center, and the position of reference mark is obtained precision and improved.In addition, in the king-sized situation of stop position error, should be in normally head moving device that the operation head the moves job position in can moving range has been broken away from can moving range, the state of affairs of operation will occur to carry out, perhaps, even be not that the state of affairs that homework precision descends so seriously also can occur, but the present invention can avoid the generation of the sort of state of affairs.
In addition, above-mentioned " target stop position " both can in the situation that the downstream sidepiece is transported to the operating area and upstream portion is transported to the operating area identical, also can be different.
In addition, as CD-ROM drive motor, preferably adopt impulse motor, servo motor etc. can realize the motor of the accurate control of rotation amount, but be not essential, the control of the operate time by common alternating current motor or DC motor also can the control action amount.For example, also the displacement of circuit substrate can be obtained as the product of the operate time of the translational speed of ribbon conveyer and CD-ROM drive motor, this CD-ROM drive motor has low-cost advantage, but opposite one side is difficult to the displacement of control circuit substrate exactly.Changing a kind of view is exactly, and can say that also this invention is just effective especially in this case.
(9) as described to working machine for circuit board in (8) item, wherein, described stop position error employing section comprises simple addition operation division, the actuating quantity addition of the described CD-ROM drive motor of the conveying use of the actuating quantity that described simple addition operation division will value that obtain be corresponding with the symbol of described stop position error is conversely positive and negative and the described upstream portion of the described circuit substrate assigned position in the described operating area.
As described in (8) item, it is desirable to adopt according to the occurrence cause of the stop position error of circuit substrate the stop position error of downstream sidepiece, therefore but the stop position error of downstream sidepiece occurs in fact already, it is desirable to this error at least and is cancelled during to the conveying of assigned position in upstream portion.
Description of drawings
Fig. 1 means as the plane graph that can require the electronic circuit component mounter of right working of an invention mode;
Fig. 2 means the side view of the installation unit of the erecting device that consists of above-mentioned electronic circuit component mounter;
Fig. 3 is the block diagram that conceptually represents the formation of control device that above-mentioned electronic circuit component mounter is controlled;
Fig. 4 means the plane graph of many chamferings substrate that electronic circuit component is installed in above-mentioned electronic circuit component mounter;
Fig. 5 (a) means that above-mentioned many chamferings substrate stops at the plane graph of the state of first object stop position, and Fig. 5 (b) means that above-mentioned many chamferings substrate stops at the plane graph of the state of the second target stop position;
Fig. 6 means the flow chart of the substrate conveying-element set-up routine that the RAM of the control computer of the main body that consists of above-mentioned control device stores;
Fig. 7 means the plane graph that many chamferings substrate of LED and resistor is installed in electronic circuit component mounter as other execution modes;
Fig. 8 (a) means that many chamferings substrate shown in Figure 7 stops at the plane graph of the state of first object stop position, and Fig. 8 (b) means that this many chamferings substrate stops at the plane graph of the state of the second target stop position.
Description of reference numerals
40 circuit substrates (many chamferings substrate)
150 unit substrate
162,164 partitioning portions
184 defective products marks
The substrate of chamfering more than 200
202 unit substrate
222 downstream sidepieces
224 upstream portion
Embodiment
Below, describe with reference to several execution modes of accompanying drawing to the invention that can require right.In addition, can require the invention of right except following execution mode, can also in the every described mode of above-mentioned (form of invention) as main, implement in the mode of having implemented various changes based on those skilled in the art's knowledge.
Fig. 1 represents the electronic circuit component mounter as embodiment of the present invention.This electronic circuit component mounter possesses: the support 10, base board delivery device 12, base plate keeping device 14, loader formula component supplying apparatus 16, pellet type element supplying device 18, the apparatus for work that are the fitting machine main body as the working rig main body are that erecting device 20, reference mark camera head 22(are with reference to Fig. 2), element camera head 24 and control device 26(be with reference to Fig. 3).
In the present embodiment, base board delivery device 12 is made of ribbon conveyer, comprises: rotatably remaining in respectively what represent in ring-type conveyer belt 32(Fig. 2 of a pair of side frame 30 is frame 30 and the conveyer belt 32 of a side) and band whirligig 34(with reference to Fig. 3).Band whirligig 34 possesses: drive source is CD-ROM drive motor 36, around a plurality of rollers (not shown) of hanging conveyer belt 32, its both side edges of circuit substrate 40 section respectively by conveyer belt 32 from the below supporting, carry with flat-hand position by the rotation of conveyer belt 32.In the present embodiment, CD-ROM drive motor 36 is that impulse motor consists of by a kind of electronic rotation motor as electro-motor, is the control of rotation amount by its actuating quantity, comes the fed distance of control circuit substrate 40, makes circuit substrate 40 stop at position arbitrarily.As CD-ROM drive motor, also can use the servo motor with encoder to replace impulse motor.
As shown in Figure 1, circuit substrate 40 is that substrate is sent into transducer 44 and detected to sending into of this electronic circuit component mounter by substrate detection apparatus.In the present embodiment, it is that transmission-type photoelectric sensor consists of by a kind of photoelectric sensor as non-contact sensor that substrate is sent into transducer 44, comprises illuminating part 46 and light accepting part 48.What illuminating part 46 and light accepting part 48 were arranged at respectively a pair of side frame 30 toward each other is in the end of upstream side on the throughput direction of circuit substrate 40, the Width of circuit substrate 40 (with a plane parallel as a kind of face that is mounted of the scope of operation in the direction of throughput direction quadrature) on be separated by ground in opposite directions, be subjected at light accepting part 48 under the state of light, output ON signal, under the state that is not subjected to light, output OFF signal.
Though base plate keeping device 14 omits diagram, but possess from the support unit of below supporting circuit substrate 40 and with parallel with the throughput direction both side edges section of circuit substrate 40 fastening secure component respectively, circuit substrate 40 is fixed and keeps with the posture that its face that is mounted that electronic circuit component is installed becomes level.In the present embodiment, the throughput direction of the circuit substrate 40 of base board delivery device 12 is made as X-direction, will be in horizontal plane on the plane parallel with the face that is mounted of the circuit substrate 40 that remains in base plate keeping device 14 and the direction of X-direction quadrature is made as Y direction.
As shown in Figure 1, loader formula component supplying apparatus 16 is to be supplied with the device of electronic circuit component by a plurality of loaders 50.A plurality of loaders 50 are located respectively and are remained in a plurality of loader maintaining parts that the set loader of support 10 keeps platform 52, arrange along the state of the straight line parallel with X-direction with each component feeding section.Pellet type element supplying device 18 is to be shown with one by figure in a plurality of pallet 54(Fig. 2) supply with the device of electronic circuit component. Component supplying apparatus 16,18 is arranged at the part corresponding with central portion substrate transport path support 10 on X-direction, be arranged at the both sides of base board delivery device 12 on Y direction.Aforesaid substrate holding device 14 be arranged at substrate transport path midway, support 10 with component supplying apparatus 16,18 corresponding parts.
As shown in Figure 1, erecting device 20 comprises a kind of mounting head 60 and the head moving device 62 as the operation head.It is roughly the same that the structure of this erecting device 20 and Unexamined Patent 6-291490 communique are put down in writing, and it is roughly the same that the structure of mounting head 60 and Unexamined Patent 4-372199 communique are put down in writing, and is briefly described at this.
As shown in Figure 2, mounting head 60 mainly comprises: mounting head main body 70; Be that suction nozzle 74 keeps and keeper holding member rotatable and that liftably remain in mounting head main body 70 is suction nozzle retainer 76, makes the retainer lowering or hoisting gear 80 of suction nozzle retainer 76 liftings take CD-ROM drive motor 78 as drive source, makes suction nozzle retainer 76 around the support whirligig 82 of its axis rotation take not shown CD-ROM drive motor as drive source at leading section to the element keeper of adsorbable maintenance electronic circuit component 72.Suction nozzle 74 is connected with not shown negative pressure source, comes attract electrons circuit element 72 by negative pressure.
Head moving device 62 make mounting head 60 to have in a plane parallel with the face that is mounted of the circuit substrate 40 that remains in base plate keeping device 14 cross one another both direction namely in the present embodiment the direction of the composition of at least one party in mutually orthogonal both direction move.X-direction is a direction in mutually orthogonal both direction, and Y direction is another direction, and as shown in Figure 1, head moving device 62 possesses X-direction mobile device 90 and Y direction mobile device 92.X-direction mobile device 90 is arranged at support 10, comprises a kind of namely as the X-axis sliding part 94 of moving-member, the X-axis sliding part drive unit 96 that X-axis sliding part 94 is moved along X-direction of movable member.Y direction mobile device 92 is arranged at X-axis sliding part 94, the Y-axis sliding part drive unit 100 that comprises Y-axis sliding part 98, Y-axis sliding part 98 is moved along Y direction.
It is CD-ROM drive motor 102,104 and feed screw mechanism 106,108 that X-axis, Y-axis sliding part drive unit 96,100 comprise respectively drive source.Feed screw mechanism 106,108 comprises respectively externally threaded item and the nut that mutually screws togather, and in the present embodiment, is made as ball screw framework.In addition, as CD-ROM drive motor 102,104, for example use the servo motor with encoder.Mounting head 60 is arranged at Y-axis sliding part 98, move by head moving device 62 along continuous straight runs, namely move as the optional position in the installation exercise zone (with reference to Fig. 1) of regulation operating area to the moving area across component supplying apparatus 16, each component feeding section of 18 and base plate keeping device 14.Head moving device 62 is make relative movement device that mounting head 60 and base plate keeping device 14 relatively move along the directions parallel with the face that is mounted of the circuit substrate 40 that remains in base plate keeping device 14 a kind of, relative movement device both can adopt the device that base plate keeping device and an operation both sides are moved, and also can adopt the device that base plate keeping device is moved.
Said reference mark camera head 22 is that the CCD camera consists of by image pick-up device, as shown in Figure 2, is arranged at Y-axis sliding part 98.Reference mark camera head 22 together moves by head moving device 62 with mounting head 60, can take the circuit substrate 40 that is positioned at the installation exercise zone comprise the face of being mounted surperficial or above the optional position.Head moving device is also the camera head mobile device.As image pick-up device, also can use the CMOS camera.
Said elements camera head 24 possesses CCD camera (not shown) and guiding device (in Fig. 1, only figure is shown with the speculum 110 that consists of guiding device), be arranged at respectively the base board delivery device 12 of X-axis sliding part 94 and the part between component supplying apparatus 16,18.
As shown in Figure 3, above-mentioned control device 26 consists of as main body to control computer 120, and via driving loop 122, the drive source etc. that CD-ROM drive motor 36 grades is consisted of the various devices of this electronic circuit component mounter is controlled.Be connected with on controlling the input/output interface of computer 120 substrate send into transducer 44, to taking by reference mark camera head 22 and element camera head 24 in encoder 132(Fig. 3 that the pattern process computer 130 that the data that obtain process, the CD-ROM drive motor 102 of X-axis sliding part drive unit 96 etc. arrange, figure is shown with one typically) etc.In addition, store for the various programs that electronic circuit component is installed to circuit substrate 40 and data etc. as main with the routine of flowcharting take Fig. 6 in the RAM that controls computer 120.
In this electronic circuit component mounter, as shown in the schematic diagram of Fig. 4, the circuit substrate 40 that electronic circuit component is installed is for example the many chamferings substrate that is split into a plurality of unit substrate after making electronic circuit.After, circuit substrate 40 is called many chamferings substrate 40.Many chamferings substrate 40 shown in Figure 4 is split into four unit substrate 150.The size of these unit substrate 150 and circuit pattern (wiring pattern) are identical, keep the periphery of many chamferings substrate 40 and respectively be provided with respectively two on the direction parallel with throughput direction of many chamferings substrate 40 and Width.
The size that many chamferings substrate 40 is made as the direction parallel with throughput direction is that the length in Length Ratio installation exercise zone is long, and than 2 times short of its length.Thus, many chamferings substrate 40 exceeds from the installation exercise zone on throughput direction, and therefore many chamferings substrate 40 is split into two parts 162,164 on throughput direction, and each partitioning portion 162,164 is carried out the installation of electronic circuit component.The length in the Length Ratio installation exercise zone of a unit substrate 150 is short, and many chamferings substrate 40 is split into impartial part take unit substrate 150 as unit.After, according to circumstances, the part that will be positioned at the downstream on throughput direction is that partitioning portion 162 is called downstream sidepiece 162, is that partitioning portion 164 is called upstream portion 164 with the part of upstream side.
As shown in Figure 4, at the periphery that is not provided with unit substrate 150 170 of many chamferings substrate 40, downstream sidepiece 162 and upstream portion 164 respectively are provided with respectively a plurality of for example two reference marks 172,174.As shown in Fig. 5 (a), two reference marks 172 are arranged at respectively under the downstream of the many chamferings substrate 40 side state consistent with the downstream side in installation exercise zone: the part that is arranged in the installation exercise zone of a bight of the end of downstream side of periphery 170 and periphery 170 is with respect to a bight of above-mentioned end of downstream side and the part of being separated by on diagonal.In addition, as shown in Fig. 5 (b), two reference marks 174 are arranged at respectively under the upstream of the many chamferings substrate 40 side state consistent with the upstream side in installation exercise zone: the part that is arranged in the installation exercise zone of a bight of the upstream-side-end of periphery 170 and periphery 170 is with respect to a bight of upstream-side-end and the part of being separated by on diagonal.Two positions that also can be respectively be separated by on diagonal in downstream sidepiece 162, in upstream portion 164 arrange reference mark.
In addition, two bights that are separated by on diagonal respectively on four unit substrate 150 are respectively equipped with reference mark 176.After, reference mark 172 is called downstream sidepiece reference mark 172, reference mark 174 is called upstream portion reference mark 174, reference mark 176 is called unit substrate reference mark 176.
The part that also comprises at downstream sidepiece 162 at the periphery 170 of many chamferings substrate 40, the end that is positioned at the downstream on throughput direction of many chamferings substrate 40 are provided with defective products mark appendix 182.The defective products mark means that unit substrate 150 is the mark of the information of bad unit substrate, be additional to circuit pattern and produced the unit substrate 150 of unfavorable condition, in the present embodiment, send the indication of this unit substrate 150 not being implemented the installation exercise of electronic circuit component.Therefore, the quantity of defective products mark appendix 182 is identical with unit substrate 150, is provided with four in many chamferings substrate 40 shown in Figure 4.Four defective products mark appendix 182 are respectively according to the position in periphery 170 and corresponding with unit substrate 150, in them two are corresponding with two unit substrate 150 that are arranged at upstream portion 164, and on it, additional defective products mark represents that the unit substrate 150 of upstream portion 164 is bad unit substrate.
Before many chamferings substrate 40 is admitted to this electronic circuit component mounter, respectively four unit substrate 150 are checked whether there is the unfavorable condition that can not electronic circuit component be installed and form electronic circuit, if there is the sort of unfavorable condition, by the additional defective products mark 184 of operator.As shown in Figure 5, for example carry out painted by the operator to defective products mark appendix 182 or paste seal and add defective products mark 184.Due to by taking to detect defective products mark 184 by 22 pairs of defective products mark appendix 182 of reference mark camera head, therefore with and the surface of many chamferings substrate 40 between contrast large and mode that can obviously be different from the picture that obtains outwardly defective products mark 184 of many chamferings substrate 40 arranges.In addition, defective products mark appendix 182 for example is made as the whole teat outstanding from the surface of many chamferings substrate 40 or recessed recess, so that the defective products mark Appendage Task that the operator carries out becomes easily, and appends to exactly on the position of setting.
Based on substrate conveying and element set-up routine shown in Figure 6, the conveying of many chamferings substrate 40 and the installation of electronic circuit component are described.
At first, after execution in step 1(, referred to as S1.Other steps are also identical), make base board delivery device 12 actions, send into many chamferings substrate 40 from the device (not shown) of upstream side to electronic circuit component mounter.The detection signal of sending into transducer 44 by substrate becomes the OFF signal from the ON signal, detect the downstream side of many chamferings substrate 40, and then, by becoming the ON signal from the OFF signal, detect many chamferings substrate 40 integral body and be admitted in base board delivery device 12 and be in state by the ribbon conveyer supporting.Many chamferings substrate 40 is sent into the position and is transported to the position that its downstream side should be consistent with the downstream side in installation exercise zone and stops (with reference to Fig. 5 (a)) from this substrate integral body.The downstream of this many chamferings substrate 40 should be called the first object stop position in the position consistent with the downstream side in installation exercise zone.Sending into the position from substrate integral body is to send into the resulting distance of length that distance the downstream side in the substrate detection position of transducer 44 and installation exercise zone deducts many chamferings substrate 40 from being provided with substrate to the fed distance that stops at the many chamferings substrate 40 till the first object stop position, this distance is scaled the umber of pulse of CD-ROM drive motor 36 and presets, to be used for the control of CD-ROM drive motor 36.
After stopping, carrying out S2, many chamferings substrate 40 is kept by base plate keeping device 14.Next, carry out S3, reference mark camera head 22 is moved, respectively two downstream sidepiece reference marks 172 are taken.Photographed data is processed by pattern process computer 130, obtains two downstream sidepiece reference marks 172 with respect to each position data of the mechanical coordinate of electronic circuit component mounter.Calculate the X-axis of two downstream sidepiece reference marks 172, each site error of Y direction, calculate the position of rotation error that comprises many chamferings substrate 40 (around with the site error of the rectangular axis rotation of the face that is mounted) in interior site error.
In addition, calculate the mean value of site error of each X-direction of two downstream sidepiece reference marks 172, be the stop position error as the actual stop position of many chamferings substrate 40 with respect to the error of first object stop position, additional sign symbol and be stored in the stop position error memory that the RAM that controls computer 120 arranges.At this, on throughput direction, the downstream just is made as, upstream side is made as negative.Therefore, if the actual stop position of many chamferings substrate 40 than the stop position more inclined to one side downstream on throughput direction in predetermined design, the stop position error be on the occasion of, if partially lean on upstream side, become negative value.Stop position error memory consists of memory cell.Other memories too.In addition, also the site error of the X-direction of the side in two downstream sidepiece reference marks 172 can be made as the stop position error of many chamferings substrate 40.In S3, the site error of the downstream sidepiece reference mark 172 that is calculated by pattern process computer 130 and the stop position error of many chamferings substrate 40 are read into controls computer 120.
In addition, each site error based on two downstream sidepiece reference marks 172, also be set with the operation coordinate as the virtual coordinates that dreams up on circuit substrate except mechanical coordinate, the following action indication relevant to downstream sidepiece 162, operation are indicated by specifying the position in this operation coordinate to carry out.Thus, in the action that is instructed to and operation, the site error on the mechanical coordinate of downstream sidepiece 162 is eliminated.
Next, carry out S4, reference mark camera head 22 is moved, to whole shooting of four defective products mark appendix 182.After shooting, carry out S5, whole about four unit substrate 150, obtain respectively unit substrate well/flame.At first, carry out image by 130 pairs of photographed datas of pattern process computer and process, four defective products mark appendix 182 are detected whether have defective products mark 184, its result is read in by controlling computer 120.And, if with defective products mark 184, determine bad unit substrate 150 by the position with the defective products mark appendix 182 of defective products mark 184, determine the data of bad unit substrate 150 and the data that expression is bad unit substrate be stored in unit substrate that the RAM that controls computer 120 arranges well/the flame memory.If the data that defective products mark appendix 182 with defective products mark 184, is defined as the data of good unit substrate 150 and represents good unit substrate are stored in unit substrate good/flame memory.Be made as at this, a side of two unit substrate 150 of upstream portion 164 is bad unit substrate 150, and the defective products mark appendix 182 corresponding with this bad unit substrate 150 is by additional defective products mark 184.
Next, carry out S6～S10, two unit substrate 150 that downstream sidepiece 162 comprises are carried out the installation of electronic circuit component.Electronic circuit component is preset the erection sequence of these unit substrate 150, in S6, at first to the unit substrate 150 that electronic circuit component is installed read unit substrate good/flame, based on the information of reading, in S7, carry out whether unit substrate 150 is the judgement of bad unit substrate.If not bad unit substrate, S7 is "No", carries out S8, is taken by 22 pairs of two unit substrate reference marks 176 of reference mark camera head, calculates each site error of the element installation position that is set in unit substrate 150.This site error comprises each site error and the position of rotation error of X-axis, Y direction.
Next, carry out S9, at the element installation position installation electronic circuit component of unit substrate 150.Mounting head 60 moves by head moving device 62, takes out electronic circuit component from component supplying apparatus 16, a side of 18, is installed on the element installation position of unit substrate 150.The installation action of electronic circuit component is well-known, and description thereof is omitted.After installation, carry out S 10, whether the contained whole unit substrate 150 of downstream sidepiece 162 have been carried out the judgement of the installation of electronic circuit component.If do not complete, S10 be judged to be "No", the execution of routine turns back to S6.If unit substrate 150 is bad unit substrate, the result of determination of S7 is "Yes", skips S8, S9, carries out S 10.For bad unit substrate 150, forbid and do not carry out the shooting of unit substrate reference mark 176 and the installation exercise of electronic circuit component.
If two unit substrate 150 are carried out S6～S9, the judgement of S10 just becomes "Yes", carries out S11, removes the maintenance of base plate keeping device chamfering substrate 40 more than 14 pairs.And, carry many chamferings substrates 40 by base board delivery device 12, and be transported to the position that the upstream side of many chamferings substrate 40 should be consistent with the upstream side in installation exercise zone and stop (with reference to Fig. 5 (b)).The upstream side of this many chamferings substrate 40 should be called the second target stop position in the position consistent with the upstream side in installation exercise zone.The fed distance of this moment is to deduct the resulting distance of length in installation exercise zone from the length of many chamferings substrate 40.This distance can obtain in design, is scaled the number of drive pulses of CD-ROM drive motor 36 and presets.This setting number of drive pulses is revised based on the stop position error of the first object stop position of many chamferings substrate 40 of obtaining in S3.The stop position error is scaled the number of drive pulses of motor 36, if its symbol is for just, add the value that symbol is become negative gained on the setting number of drive pulses, if symbol is for negative, add the value that symbol is become positive gained on the setting number of drive pulses, come CD-ROM drive motor 36 with the umber of pulse that obtains thus, can reduce the stop position error of many chamferings substrate 40.
After many chamferings substrate 40 stops, carrying out S12, many chamferings substrate 40 is kept by base plate keeping device 14.And, carry out S13, reference mark camera head 22 is moved, take upstream side reference mark 174, calculate the site error of upstream portion 164, to the working space of upstream portion 164 settings as the Virtual Space.At this moment, also can be based on the position deviation of the Y direction of the downstream reference mark 172 that first obtains, the position of the Y direction of reference mark camera head 22 is revised.Next, similarly carry out S14～S18 with S6～S10, carry out the calculating of site error of shooting, element installation position of the unit substrate reference mark 176 of the contained unit substrate of upstream portion 164 150 and the installation of electronic circuit component.About this unit substrate 150, execution by S4 and S5 has obtained unit substrate good/flame, before taking unit substrate reference mark 176, from unit substrate good/the flame memory is read unit substrate good/flame, be used for the judgement of S15.
At this, the side in contained two unit substrate 150 of upstream portion 164 is bad unit substrate, and the judgement of S15 becomes "Yes", skips S16, S17, does not carry out the shooting of unit substrate reference mark 176 and the installation of electronic circuit component.If whole unit substrate 150 has been carried out S14～17, S18 becomes "Yes", carries out S19, removes the maintenance of many chamferings substrate 40 and sends.
By above explanation as can be known, in the present embodiment, defective products mark appendix 182 consists of the upstream portion information recording part.In addition, the part of controlling the execution S3 of computer 120 consists of stop position error obtaining section, the part formation upstream portion information obtaining section of carrying out S4 and S5 is bad unit substrate information obtaining section, and they and reference mark camera head 22 be the configuration information acquisition device together.In addition, the part of the execution S11 of control computer 12 consists of the simple addition operation division as stop position error employing section, the part of carrying out S14, S15 consist of as operation is utilized section to bad unit substrate operation prohibition unit, control computer 120 configuration information use devices.
In addition, different with upstream portion 164 target stop positions at downstream sidepiece 162 in the above-described embodiment, but also can be identical.For example, the target stop position of upstream portion 164 is made as the position that its downstream side should be consistent with the downstream side in installation exercise zone.In addition, the target stop position is not limited to the position consistent with the end of operating area, end of partitioning portion, gets final product so long as carry out the position that the partitioning portion integral body of operation is positioned at the operating area.
Execution mode describes based on Fig. 7 and Fig. 8 and be example in the situation that a plurality of light-emitting diodes (below, referred to as LED) are installed on circuit substrate to be the information different from bad unit substrate information to upstream portion information.
LED has a plurality of advantages such as efficiency is high, life-span length, low price, can install on a circuit substrate a plurality of, and as the light source of the backlight of the backlight of the instrument display of the display of television set, computer etc. and vehicle and vehicle, headlamp, general lighting utensil etc.But, in current production technology, but be difficult to make the brightness precision and keep well constant LED, consideration is divided into a plurality of brightness degrees with LED, the LED of same brightness degree is installed respectively in a plurality of zones of a circuit substrate or a circuit substrate, by controlled the supply electric current to these LED by resistor, make the brightness of light-emitting area integral body even.
For example, many chamferings substrate 200 shown in Figure 7 is formed by connecting by frame section 204 by a plurality of unit substrate of growing crosswise 202.This many chamferings substrate 200 by after excise frame section 204 and be split into many LED bars, be assembled into personal computer with the backlight of display, the brightness degree of LED206 also can be different between the LED bar, but to require be identical in a LED bar.And be provided with on the surface of constituent parts substrate 202: all identical a plurality of LED206 electronic circuit component installation region of being mounted to row is LED installation region 210 to brightness degree, other electronic circuit components are installed is that the electronic circuit component installation region of resistor is that resistor installation region 212, information recording area or information additional areas are bar code printing zone 214.In this many chamferings substrate 200, LED installation region 210 is arranged at the central portion of the length direction of unit substrate 202, and resistor installation region 212 and bar code printing zone 214 are arranged at respectively the both sides of the length direction of LED installation region 210.
Many chamferings substrate 200 is that the length direction of unit substrate 202 posture parallel with throughput direction carried with its length direction, and carries with the posture that bar code printing zone 214 is in the downstream.And many chamferings substrate 200 is split on throughput direction: comprise each bar code printing zone 214 of whole unit substrate 202 and LED installation region 210 interior and be downstream sidepiece 222 and comprise resistor installation region 212 interior and be upstream portion 224 than the little partitioning portion in installation exercise zone than the little partitioning portion in installation exercise zone.
LED206 to the LED installation region 210 installation and bar code to the bar code printing zone 214 be printed in an electronic circuit component mounter and carry out.Therefore, electronic circuit component mounter and above-mentioned electronic circuit component mounter are same, comprise erecting device and reference mark camera head, and comprise print head.Print head is for example same with the print head of ink-jet printer, is recording printing word on subject material, figure, symbol etc. from the nozzle ejection ink droplet, can together move to optional position in horizontal plane with mounting head.In addition, mounting head is installed electronic circuit component by three above suction nozzles as the mounting head of for example JP 2006-261325 communique record.
In addition, LED206 supplies with by loader.A loader keeps the LED206 of a plurality of same brightness grades, keep carrying a plurality of loaders on platform at loader, but the brightness degree of the LED206 that these loaders keep is sometimes also different.Contain that the loader that makes each loader keeps the holding position of platform and the brightness degree of the LED206 that supplied with by each loader is set up corresponding brightness degree-loader holding position corresponding data each other at the memory ram of the control computer of the control device of electronic circuit component mounter.
Resistor is 212 be arranged in other electronic circuit component mounters and carry out to the resistor installation region.This electronic circuit component mounter is not except possessing print head, and all the other consist of with the electronic circuit component mounter of the installation of carrying out LED206 same, and resistor is supplied with by loader.A loader keeps the identical resistor of a plurality of resistance values, keeps platform to carry the mutually different a plurality of loaders of resistance value of the resistor that keeps to some extent at loader, for the brightness degree of LED206, prepares the multiple resistor that has expectation to need.Contain that the loader that makes each loader keeps the holding position of platform and the resistance value of the resistor supplied with by each loader is set up corresponding resistance value-loader holding position data each other at the memory ram of controlling computer.
At first many chamferings substrate 200 sends into the electronic circuit component mounter with print head, is transported to the position that the downstream side of many chamferings substrate 200 should be consistent with the downstream side in installation exercise zone and stops (with reference to Fig. 8 (a)).This should consistent position be the first object stop position.After stopping, carrying out LED206 to the installation of each LED installation region 210 of a plurality of unit substrate 202.The LED206 of same brightness grade is installed on a unit substrate 202, about a unit substrate 202, whenever the installation end of LED206, all comprises brightness degree at the bar code of interior information in bar code printing zone 214 printing expressions.The brightness degree that is installed on the LED206 of unit substrate 202 takes out the loader of LED206 based on suction nozzle loader keeps the holding position of platform and brightness degree-loader holding position data to obtain.
If finish to the installation of the LED206 of whole unit substrate 202 and the printing of bar code, many chamferings substrate 200 is sent to other electronic circuit component mounters, and resistor is installed.At this moment, at first when installing with LED same first object stop position carry many chamferings substrate 200 and it stopped as the target stop position.And, taken the bar code that is printed in each bar code printing zone 214 of whole unit substrate 202 by the reference mark camera head, obtain the information that is represented by bar code.Thus, whole unit substrate 202 are obtained respectively the brightness degree of the LED206 that is installed on LED installation region 210, in controlling computer, calculate and the corresponding resistance value of each brightness degree, in order to realize this resistance value, generate one or more resistors of being used for setting each resistor installation region 212 that should be installed on a plurality of unit substrate 202 and the resistor installation data of installation site thereof.
Many chamferings substrate 200 is carried later in whole shootings of each bar code of unit substrate 202, and is transported to the position that the upstream side of many chamferings substrate 200 should be consistent with the upstream side in installation exercise zone and stops (with reference to Fig. 8 (b)).This should consistent position be the second target stop position.And, based on the resistor installation data, at above resistor of each resistor installation region 212 installations of a plurality of unit substrate 202.Be used for the installation of the resistor of upstream portion 224 by the resulting brightness degree information of the bar code that is arranged at downstream sidepiece 222, in the present embodiment, the information of the resistance value of electronic circuit component information being installed being brightness degree information or obtaining based on its brightness degree information or realize the combination of the resistor that its resistance value is used and the information of the installation site of each resistor is upstream portion information, in the erecting device of controlling computer, based on this upstream portion information, the part formation that resistor is installed on unit substrate 202 is utilized section to operation.and, brightness degree information, arbitrary information in the information of the installation site of the information of resistance value and the combination of resistor and each resistor all can think to specify operation appointed information a kind of of the installation exercise of resistor, in the reference mark camera head of controlling computer, can think the part of the bar code that is printed in bar code printing zone 214 being taken and obtained the brightness degree information that is represented by bar code, obtain resistance value information part and obtain the combination of resistor and the part of the information of the installation site of each resistor in arbitrary part to consist of upstream portion information obtaining section be upstream portion operation appointed information obtaining section, in the erecting device of controlling computer, to can be thought the assignment enforcement division by the part that the resistor of this operation appointed information appointment is installed on unit substrate 202.
According to present embodiment, can carry out concurrently can improving the production efficiency of LED bar to the installation of the LED206 of unit substrate 202 and the installation of resistor in different electronic circuit component mounters.In many chamferings substrate 200, though omit diagram, be provided with equally reference mark with above-mentioned execution mode, carry out the obtaining, utilize of the calculating of site error, correction and stop position error of element installation position, the description thereof will be omitted.
In addition, the reference mark of a plurality of partitioning portions of circuit substrate being set respectively also can share between partitioning portion adjacent on throughput direction.
Claims (4)
1. one kind to working machine for circuit board, it is characterized in that, comprising:
Apparatus for work, the operating area with regulation, the operation that the part that is positioned at described operating area of circuit substrate is scheduled to;
Base board delivery device is carried described circuit substrate along throughput direction, and what make described circuit substrate stops at target stop position in described operating area successively in a plurality of parts that are divided on this throughput direction from the part in downstream;
Base plate keeping device, this circuit substrate of fixing and keeping stopping;
Information acquisition device is obtained the information relevant to this circuit substrate from the downstream sidepiece of the described circuit substrate that stops, and wherein said downstream sidepiece is to be in the part in downstream in the described a plurality of parts that are divided into; And
The information use device, the information that will be obtained by this information acquisition device is used for the conveying upstream portion carried out by described base board delivery device and at least one party of the operation upstream portion carried out by described apparatus for work, and wherein said upstream portion is for to be in the more part of upstream side than described downstream sidepiece;
Described information acquisition device comprises upstream portion information obtaining section, described upstream portion information obtaining section obtains upstream portion information from the upstream portion information recording part that records upstream portion information, wherein said upstream portion information recording part is located at the described downstream sidepiece of the circuit substrate of described base plate keeping device maintenance, and described upstream portion information is the information relevant to described upstream portion;
And described information use device comprises operation utilized section, and the described information of utilizing section that described upstream portion information obtaining section is obtained to operation is used for the operation described upstream portion carried out by described apparatus for work.
2. as claimed in claim 1 to working machine for circuit board, wherein,
Described circuit substrate is divided into many chamferings substrate of a plurality of unit substrate after being,
Described upstream portion information obtaining section comprises bad unit substrate information obtaining section, and described bad unit substrate information obtaining section obtains the bad unit substrate information of the bad unit substrate in a contained above unit substrate of the described upstream portion of expression;
Described the operation section of utilization is comprised bad unit substrate operation prohibition unit, describedly bad unit substrate operation prohibition unit is forbidden the operation undertaken by the bad unit substrate that described apparatus for work represents described bad unit substrate information.
3. as claimed in claim 1 or 2 to working machine for circuit board, wherein,
Described base board delivery device makes the actuating quantity of the CD-ROM drive motor of this conveyer belt rotation control the fed distance of described circuit substrate by the conveyer belt supporting circuit substrate of rotation by control, the stop position of control circuit substrate thus,
Described information acquisition device also comprises stop position error obtaining section, described stop position error obtaining section is taken the reference mark of the described downstream sidepiece setting of the circuit substrate that stops at described stop position, and obtain as the actual stop position of this downstream sidepiece stop position error with respect to the error of described target stop position according to this shooting results
Described information use device also comprises stop position error employing section, and described stop position error employing section adopts this obtained stop position error in the target stop position in described operating area is carried the control of actuating quantity of described CD-ROM drive motor of the described base board delivery device that the described upstream portion of described circuit substrate uses.
4. as claimed in claim 3 to working machine for circuit board, wherein,
Described stop position error employing section comprises simple addition operation division, and the actuating quantity that described simple addition operation division will value that obtain be corresponding with the symbol that makes described stop position error is conversely positive and negative and the assigned position in the described operating area are carried the actuating quantity addition of the described CD-ROM drive motor that the described upstream portion of described circuit substrate uses.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011268226A JP6022763B2 (en) | 2011-12-07 | 2011-12-07 | Circuit board working machine |
| JP2011-268226 | 2011-12-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103153036A true CN103153036A (en) | 2013-06-12 |
| CN103153036B CN103153036B (en) | 2017-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210526151.1A Active CN103153036B (en) | 2011-12-07 | 2012-12-07 | To working machine for circuit board |
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| JP (1) | JP6022763B2 (en) |
| CN (1) | CN103153036B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110024510A (en) * | 2016-12-08 | 2019-07-16 | 韩华精密机械株式会社 | Component attachment and bonding apparatus and the component attaching method using the device |
| CN110583102A (en) * | 2017-05-09 | 2019-12-17 | 株式会社富士 | Substrate working machine |
| CN113455118A (en) * | 2019-01-17 | 2021-09-28 | 捷普有限公司 | Apparatus, system and method for providing radial slice identification for pick and place |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5220179B2 (en) * | 2011-12-09 | 2013-06-26 | 株式会社ソディック | Wire electric discharge machine |
| CN106063400B (en) * | 2014-03-05 | 2019-06-25 | 株式会社富士 | The trackability information management system and trackability approaches to IM of component mounting line |
| CN105934091A (en) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | Assembled circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1140999A (en) * | 1997-07-18 | 1999-02-12 | Matsushita Electric Ind Co Ltd | Electronic component mounting method on multiply formed boards |
| JP2002026595A (en) * | 2000-07-07 | 2002-01-25 | Matsushita Electric Ind Co Ltd | Device and method for mounting electronic part |
| CN101071156B (en) * | 2006-05-11 | 2010-04-07 | 鸿骐昶驎科技股份有限公司 | Multi-connecting board bad-product detecting device and method |
| JP2008277770A (en) * | 2007-04-03 | 2008-11-13 | Panasonic Corp | Component mounting method |
| CN101621893B (en) * | 2008-07-02 | 2011-04-13 | 欣兴电子股份有限公司 | Process and equipment thereof for manufacturing imprint dividing board of defective subboard of circuit board |
| JP5597050B2 (en) * | 2010-07-15 | 2014-10-01 | 富士機械製造株式会社 | Substrate stop position control method and apparatus, and substrate mounting position control method |
-
2011
- 2011-12-07 JP JP2011268226A patent/JP6022763B2/en active Active
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110024510A (en) * | 2016-12-08 | 2019-07-16 | 韩华精密机械株式会社 | Component attachment and bonding apparatus and the component attaching method using the device |
| CN110024510B (en) * | 2016-12-08 | 2020-12-04 | 韩华精密机械株式会社 | Component mounting and bonding apparatus and component mounting method using the same |
| CN110583102A (en) * | 2017-05-09 | 2019-12-17 | 株式会社富士 | Substrate working machine |
| CN113455118A (en) * | 2019-01-17 | 2021-09-28 | 捷普有限公司 | Apparatus, system and method for providing radial slice identification for pick and place |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013120853A (en) | 2013-06-17 |
| CN103153036B (en) | 2017-06-09 |
| JP6022763B2 (en) | 2016-11-09 |
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