CN103146946A - Rolled copper foil - Google Patents

Rolled copper foil Download PDF

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Publication number
CN103146946A
CN103146946A CN2012100924481A CN201210092448A CN103146946A CN 103146946 A CN103146946 A CN 103146946A CN 2012100924481 A CN2012100924481 A CN 2012100924481A CN 201210092448 A CN201210092448 A CN 201210092448A CN 103146946 A CN103146946 A CN 103146946A
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Prior art keywords
face
copper foil
rolled copper
cold rolling
mentioned
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Inventor
室贺岳海
关聪至
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SH Copper Products Co Ltd
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Hitachi Cable Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B1/00Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005Copper or its alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B2261/00Product parameters
    • B21B2261/02Transverse dimensions
    • B21B2261/04Thickness, gauge

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Metal Rolling (AREA)

Abstract

The invention provides rolled copper foil which exhibits low rigidness and also exhibits excellent bending properties after a recrystallization annealing process. The diffraction peak intensity of a plurality of crystal faces, parallel to a main surface, of the rolled copper foil is: I{022}/(I{022}+I{022}+I{113}+I{111}+I{133})>=0.50, (I{002}+I{113})/(I{111}+I{133})>=1.0, I{022}/I{002}<=8.0, I{022}/I{113}<=30, I{022}/I{111}>=7.0, I{022}/I{133}>=10, 1.0<=I{002}/I{113}<=15, I{111}/I{133}<=10, I{113}/I{111}>=0.30, 1.0<=I{002}/I{111}<=20, 1.0<=I{002}/I{133}<=75, and 0.50<=I{113}/I{133}<=20.

Description

Rolled copper foil
Technical field
The present invention relates to a kind of rolled copper foil, particularly a kind of rolled copper foil that uses in flexible printing patch panel.
Background technology
Flexible printed circuit board (FPC:Flexible Printed Circuit) is owing to having thin thickness, characteristic that pliability is good, thereby its degree of freedom to the installation form of electronics etc. is very high.Therefore, now, distribution of the moving part of the equipment of the relevant dish such as the first-class moving part of the dogleg section of Collapsible mobile telephone, digital camera, printer, hard disk drive (HDD:Hard Disk Drive), digital multi disk (DVD:Digital Versatile Disk), compact disk (CD:Compact Disk) etc. has used FPC.Therefore, the rolled copper foil that uses as FPC, its wiring material is required excellent curved characteristic.
FPC makes through hot rolling, the operation such as cold rolling with rolled copper foil, waits on the Ranvier's membrane (base material) that directly is fitted in the FPC that is made of resins such as polymeric amide the surface working such as enforcement etching and become distribution by caking agent or by heating.By the recrystallize after annealing become softening state with cold rolling after the state that becomes hard by work hardening compare, improved more significantly the curved characteristic of rolled copper foil.Here can adopt: for example in above-mentioned manufacturing process, use the rolled copper foil after cold rolling, for fear of distortion such as extension, wrinkle, with the rolled copper foil severing, be superimposed on base material, afterwards, the heating of the recrystallization annealing by having rolled copper foil concurrently makes rolled copper foil and base material driving fit carry out integrated manufacture method together.
So far, take the manufacturing process of above-mentioned FPC as prerequisite, rolled copper foil, its manufacture method excellent on curved characteristic various researchs have been carried out, a lot of reports point out on the surface of rolled copper foil as the cubes orientation { 002} face ({ 200} face) reaches all the more, improves curved characteristic.
Here, for example in patent documentation 1, be to carry out final annealing before cold rolling under the condition of 5 μ m~20 μ m in the median size of recrystallize grain, final cold rolling rolling degree of finish is made as more than 90%.Thus, recrystallized structure is being carried out under modified state, obtaining obtaining the intensity (I of (200) face with respect to micropowder copper by X-ray diffraction 0) intensity (I) of (200) face of being obtained by X-ray diffraction of rolling surface is I/I 0>20 cubes texture.
In addition, for example in patent documentation 2, in order to improve the flourishing degree of final cubes texture before cold rolling, final cold rolling degree of finish is made as more than 93%, by further enforcement recrystallization annealing, the integrated intensity that obtains (200) is I/I 0Rolled copper foil 〉=40, that cubes texture is significantly flourishing.
In addition, for example in patent documentation 3, the total degree of finish in final cold rolling process is made as more than 94%, and the degree of finish of every 1 passage is controlled to be 15~50%.In addition, by recrystallization annealing, obtain by the X-ray diffraction pole graph measure the rolling surface obtain { the 111} face is with { in the face of 200} face, orientation degree Δ β is below 10 ° and the ratio of [a] and [b] is the crystal grain state of orientation of [a]/[b] 〉=3, described [a] for in rolling surface as cubes texture the carrying out of 200} face standardized diffraction peak intensity, described [b] for have that { crystal region of the twin relation of 200} face has carried out standardized diffraction peak intensity.
So in the prior art, by improving total degree of finish of final cold rolling process, make the cubes texture prosperity of the rolled copper foil after the recrystallization annealing operation attempt to improve curved characteristic.
Prior art
Patent documentation
Patent documentation 1: No. 3009383 communique of Japanese Patent
Patent documentation 2: No. 3856616 communique of Japanese Patent
Patent documentation 3: No. 4285526 communique of Japanese Patent
Summary of the invention
But, even patent documentation described above 1~3 develops cubes texture like that in a large number, in the rolled copper foil as polycrystalline structure, as cubes texture { the 002} face can not occupy 100% yet.That is, can think: in rolled copper foil, { crystal face beyond the 002} face is not suppressed but a plurality of mixed in together, and the crystal grain with these a plurality of crystal faces can exert an influence to every characteristic of rolled copper foil.
In addition, be accompanied by in recent years miniaturization, the slimming of electronics, the viewpoint of the easness of packing into of the distribution during from assembling etc., with respect to the FPC rolled copper foil, not only require high curved characteristic, and require the requirement of low rigidity (ス テ Off ネ ス) (low bounce (low anti-development)).
The object of the present invention is to provide a kind of rolled copper foil that possesses low rigidity and have simultaneously excellent curved characteristic after the recrystallization annealing operation.
By the 1st mode of the present invention, a kind of rolled copper foil is provided, to possess major surfaces and have rolled copper foil with a plurality of crystal faces of described major surfaces in parallel, it is the rolled copper foil after final cold rolling process, before the recrystallization annealing operation, described a plurality of crystal face comprises { 022} face, { 002} face, { 113} face, { 111} face and { the 133} face is respectively I by the diffraction peak intensity of measuring described each crystal face that obtains by the X-ray diffraction of 2 θ/θ method for described major surfaces { 022}, I { 002}, I { 113}, I { 111}And I { 133}The time,, I { 022}/ (I { 022}+ I { 002}+ I { 113}+ I { 111}+ I { 133}) 〉=0.50, (I { 002}+ I { 113})/(I { 111}+ I { 133}) 〉=1.0, I { 022}/ I { 002}≤ 8.0, I { 022}/ I { 113}≤ 30, I { 022}/ I { 111}〉=7.0, I { 022}/ I { 133}〉=10,1.0≤I { 002}/ I { 113}≤ 15, I { 111}/ I { 133}≤ 10, I { 113}/ I { 111}〉=0.30,1.0≤I { 002}/ I { 111}≤ 20,1.0≤I { 002}/ I { 133}≤ 75 and 0.50≤I { 113}/ I { 133}≤ 20.
The rolled copper foil that provides a kind of the 1st mode to put down in writing by the 2nd mode of the present invention is that to make thickness be below 20 μ m for described final cold rolling process more than 90% by total degree of finish.
The rolled copper foil that provides the a kind of the 1st or the 2nd mode to put down in writing by the 3rd mode of the present invention is that oxygen free copper more than 99.96% or purity are that tough pitch copper more than 99.9% is as principal constituent with purity.
By the rolled copper foil that the 4th mode of the present invention provides a kind of the 1st~the 3rd mode to put down in writing, be added with any at least of silver, boron, titanium, tin.
The application of rolled copper foil in flexible printing patch panel that provides a kind of the 1st~the 4th mode to put down in writing by the 5th mode of the present invention.
According to the present invention, after the recrystallization annealing operation, when possessing low rigidity, has excellent curved characteristic.
Description of drawings
Fig. 1 is the schema of the rolled copper foil manufacturing process that shows that one embodiment of the present invention is related.
Fig. 2 is the schematic diagram of slip bend test device of the curved characteristic of the related rolled copper foil of embodiments of the invention.
Fig. 3 is the summary of the test method of the rigidity of the related rolled copper foil of expression embodiments of the invention.
Fig. 4 is the antipole point diagram of fine copper shaped metal, (a) for showing the antipole point diagram because of the crystallization turning direction of tensile deformation, (b) for showing the antipole point diagram because of the crystallization turning direction of compression set.
Fig. 5 is the antipole point diagram of the crystal orientation of the rolled copper foil after showing final cold rolling process, before the recrystallization annealing operation.
Nomenclature
10 slip bend test devices
11 sample retaining plates
12 screws
13 vibration reception and registration sections
14 vibratory drive sections
21 pressure head plates
22 retaining plates
The S coupons
Embodiment
The resulting opinion of the inventor
In order to obtain the rolled copper foil of desired high curved characteristic in the FPC purposes, the cubes orientation of rolling surface is reached all the more better as above-mentioned.The various experiments that the inventor has also carried out making the occupation rate in cubes orientation to increase.Confirmed by experimental result up to the present, exist after final cold rolling process { the 022} face is if the recrystallization annealing by is thereafter become { 002} face, i.e. cubes orientation by modified one-tenth recrystallize.
And on the other hand, because rolled copper foil is polycrystalline, therefore, rolling surface integral body can not be to account for 100% by a crystal face, and for example under the state after final cold rolling process, mixing has a plurality of { crystal faces in the secondary orientation beyond the 022} face as main orientation.Here, the crystal face in the secondary orientation that the inventor is conceived to up to the present to be considered to useless has been inquired into when keeping high curved characteristic, whether can give new performance by the crystal face in these secondary orientation.
As sharp-pointed result of study, the inventor found, reduces to control the ratio of the crystal face in secondary orientation by the occupation rate that does not make main orientation, can give low rigidity (low bounce) as new value added to rolled copper foil.
The present invention is the invention of the above-mentioned opinion found based on the contriver.
One embodiment of the present invention
(1) formation of rolled copper foil
At first, the formations such as crystalline texture of the rolled copper foil that relevant an embodiment of the invention are related are described.
The related rolled copper foil of present embodiment for example constitutes possesses tabular as the rolling surface of major surfaces.This rolled copper foil is to such as implementing hot-rolled process described later, cold rolling process etc. take oxygen free copper (OFC:Oxygen-Free Copper), tough pitch copper as raw-material ingot bar, make the rolled copper foil of specific thickness, and be the rolled copper foil after final cold rolling process, before the recrystallization annealing operation.Namely, in the present embodiment, rolled copper foil, for example, be more than 90% by total degree of finish, more preferably to make thickness be below 20 μ m to the final cold rolling process more than 94%, thereby the flexual distribution material purposes that is used for FPC,, as described above for example implement have recrystallization annealing operation with the bonding process of the base material of FPC, attempt to possess excellent curved characteristic by recrystallize thereafter.
Become raw-material oxygen free copper such as the purity that is regulation in JIS C1020, H3100 etc. and be the copper material more than 99.96%.Oxygen level can be not exclusively zero, for example can contain the oxygen of several ppm degree.In addition, tough pitch copper such as the purity that is the regulations such as JIS C1100, H3100 is the copper material more than 99.9%.During tough pitch copper, oxygen level is for example 100ppm~600ppm degree.The interpolation material that also adds silver regulations such as (Ag) in oriented these copper materials is made copper alloy, becomes the situation of the rolled copper foil of having adjusted every characteristics such as thermotolerance.With regard to the related rolled copper foil of present embodiment, can contain fine copper and copper alloy, raw-material copper material, interpolation material almost do not affect the effect of present embodiment.
The thickness of the workpiece before final cold rolling process (sheet material of copper) is T B, when the thickness of the workpiece after final cold rolling process is TA, with total degree of finish (%)=[(T B-T A)/T BTotal degree of finish in the final cold rolling process of] * 100 expression.By total degree of finish is made as more than 90%, more preferably more than 94%, can obtain having the rolled copper foil of high curved characteristic.
The rolling Copper Foil has a plurality of crystal faces that are parallel to rolling surface.Concrete, under the state after final cold rolling process, before the recrystallization annealing operation, comprise { 022} face, { 002} face, { 113} face, { 111} face and { 133} face at a plurality of crystal faces.In addition, for the major surfaces of rolled copper foil, undertaken that X-ray diffraction is measured and the diffraction peak intensity of each crystal face of obtaining is respectively I by 2 θ/θ method { 022}, I { 002}, I { 113}, I { 111}And I { 133}The time, the diffraction peak intensity of each crystal face has the relation that all set up following formula (1)~(12).
I {022}/(I {022}+I {002}+I {113}+I {111}+I {133})≥0.50...(1)
(I {002}+I {113})/(I {111}+I {133})≥1.0...(2)
I {022}/I {002}≤8.0...(3)
I {022}/I {113}≤30...(4)
I {022}/I {111}≥7.0...(5)
I {022}/I {133}≥10...(6)
1.0≤I {002}/I {113}≤15...(7)
I {111}/I {133}≤10...(8)
I {113}/I {111}≥0.30...(9)
1.0≤I {002}/I {111}≤20...(10)
1.0≤I {002}/I {133}≤75...(11)
0.50≤I {113}/I {133}≤20...(12)
As mentioned above, the 022} face after the recrystallization annealing operation to { the 002} face changes, and improves the curved characteristic of rolled copper foil.This { diffraction peak intensity I of 022} face in above-mentioned formula (1) { 022}More than the diffraction peak intensity of crystal face in orientation beyond it is in a ratio of 5 one-tenths, show height fully.
In addition, final cold rolling process etc. rolling adds man-hour, and rolling copper material is applied stress under compression and the tensile stress more weak than stress under compression.The stress of copper crystallization in copper material during by the rolling process phenomenon that rotates, by number of ways to { the 022} face changes.Stress under compression is larger, and is easier of { the 002} face, { the 113} face, tensile stress is larger, and is easier of { the 111} face, { the 133} face is respectively to { the 022} face changes.
Therefore, above-mentioned formula (2), (I { 002}+ I { 113}) ratio than (I { 111}+ I { 133}) height, demonstrate stress under compression and preponderate.
In addition, above-mentioned formula (3)~(6) have shown respectively { diffraction peak intensity of 022} face and rotation inadequate { 002} face, { 113} face, { the 111} face and the { ratio of the diffraction peak intensity of 133} face of turning to.
In addition, above-mentioned formula (7), (8) have shown respectively by to { approach separately that the 022} face changes viewed { 002} face and { 113} face and { 111} face and the { ratio of the diffraction peak intensity of 133} face.
In addition, above-mentioned formula (9)~(12) show respectively the ratio with the viewed crystal face of different approach diffraction peak intensity each other.That is, if formula (9)~(12) are considered together with above-mentioned formula (7), (8), all shown not turn to { the ratio of the crystal face of 022} face diffraction peak intensity each other.
As mentioned above, based on the inventor's experiment experience, confirm that the ratio of the crystal face in rigidity and each secondary orientation has close relationship.That is, can think that the balance of diffraction peak intensity of each crystal face is influential to rigidity.Concrete, before the related recrystallization annealing operation of present embodiment, when the ratio of the diffraction peak intensity of the crystal face in each of rolled copper foil secondary orientation satisfies the aforementioned proportion relational expression, can obtain the effect of the low rigidity on crystal orientation after the recrystallization annealing operation.In addition, before recrystallization annealing, the impact on rigidity that needs consideration to produce because of work hardening.
Namely, in present embodiment, in the recrystallization annealing operation as main orientation { 022} is towards { the 002} face changes, but { 002} face, { 113} face, { 111} face and { the 133} face does not almost change before and after the recrystallization annealing operation, and the ratio of the diffraction peak intensity of each crystal face in secondary orientation is also almost identical after the recrystallization annealing operation as secondary orientation.By being made work hardening be relaxed (that is, by eliminate strain) by the recrystallization annealing operation, thereby make secondary orientation itself not change, but bring into play the effect that secondary orientation has.
So, with regard to the related rolled copper foil of the present embodiment before the recrystallization annealing operation, just passable as long as the ratio of the diffraction peak intensity of the crystal face in each secondary orientation satisfies the aforementioned proportion relational expression.That is, as long as control the rolled copper foil of the state before recrystallization annealing, namely the secondary orientation of the rolled copper foil after final cold rolling process just can become well.
In addition, it should be noted that the proportionlity of diffraction peak intensity of each crystal face shown in above-mentioned formula (1)~(12) as long as one or more the scope of formula changes, the scope of other formula also links.That is, for example dwindle the scope of the upper limit of formula (3), for example with I { 022}Value diminish just passable.But the molecule of this up-to-date style (5) also diminishes, and the value of formula (5) probably becomes lower than lower value 7.0.Such a relation is suitable for the whole of above-mentioned formula (1)~(12).
Therefore, all satisfy above-mentioned (1)~(12) defined specified range for optimum condition.Become above-mentioned formation by the rolled copper foil that present embodiment is related, can become after the recrystallization annealing operation have low rigidity in, have the possible rolled copper foil of excellent curved characteristic.
(2) manufacture method of rolled copper foil
Then, use Fig. 1 that the manufacture method of the rolled copper foil that an embodiment of the invention are related is described.Fig. 1 is the schema of the manufacturing process of the related rolled copper foil of demonstration present embodiment.
The preparatory process S10 of ingot bar
As shown in Figure 1, at first prepare oxygen free copper (OFC:Oxygen-Free Copper), tough pitch copper are cast the ingot bar (ingot) that forms as starting material.Ingot bar for example forms has the tabular of specific thickness, Rack.The interpolation material that can add regulation in becoming raw-material oxygen free copper, tough pitch copper is adjusted every characteristic of rolled copper foil.
By adding in the adjustable above-mentioned every characteristic of material, thermotolerance is for example arranged.As mentioned above, for the FPC rolled copper foil, the recrystallization annealing operation that is used for obtaining high curved characteristic is for example carried out the operation with the applying of the base material of FPC with having concurrently.Heating temperature during applying is such as setting in conjunction with solidification value of the caking agent of the solidification value of the base material that is comprised of resin etc. of FPC, use etc., and the scope of temperature condition is very wide varied.The Heating temperature that to so set sometimes combines with the softening temperature of rolled copper foil, adds the stable on heating interpolation material of capable of regulating rolled copper foil.The typical example of the interpolation material that makes thermotolerance increase or descend is such as being recorded in following technical literature (a)~(c) etc.In addition, following table 1 illustration add material for without the ingot bar that adds, added the ingot bar of interpolation material of several types as the ingot bar that uses in present embodiment.
(a) Japanese kokai publication hei 04-056754
(b) TOHKEMY 2011-001622
(c) hole ProMos etc., " having influence on the impact of interpolation element of the recrystallization temperature of copper ", stretch copper technology research association will,, 20 volumes, P205-218 in 1981
Table 1
Figure BDA0000149192500000081
In addition, the temperature condition in process annealing operation S32 described later and blank anneal operation S40 according to copper material, add material thermotolerance and suitable change.Be that the temperature condition of above-mentioned copper material, interpolation material, each annealing operation S32, S40 etc. exert an influence hardly to the effect of present embodiment.
Hot-rolled process S20
Then, the ingot bar of preparing is implemented hot rolling, make the sheet material of the thickness of slab thinner than the specific thickness after casting.
Operation S30 repeatedly
Then, repeatedly implement the cold rolling process S31 of stipulated number and the S30 of operation repeatedly of process annealing operation S32.That is, by above-mentioned sheet material enforcement anneal work hardening is annealed to sheet material to implementing cold rolling, thereby work hardening is relaxed.By with its stipulated number repeatedly, be called as the copper bar of " blank ".When copper material add is adjusted stable on heating interpolation material etc., according to the temperature condition of the suitable change anneal of thermotolerance of copper material.
Blank anneal operation S40
Next, above-mentioned copper bar (blank) is implemented blank anneal process, obtain the blank of annealing.Even in blank anneal is processed, also can be according to the thermotolerance of copper material suitable change temperature condition.At this moment, blank anneal operation S40 preferably results from the temperature condition of processing strain of above-mentioned each operation can relax fully, for example implements processing under roughly the same temperature condition with Full Annealing.
Final cold rolling process S50
Then, implement final cold rolling process S50.Final cold rollingly be also referred to as refining cold rollingly, refining cold rollingly implement finally cold rolling to the annealing blank through becoming for several times.At this moment, total degree of finish is made as more than 90%, more preferably 94%, thus obtain having the rolled copper foil of high curved characteristic.In addition, often repeatedly cold rolling, the attenuation of annealing blank, therefore, the degree of finish of preferred every 1 time (1 passage) slowly diminishes., imitate the example of above-mentioned total degree of finish here, the thickness of the workpiece before n passage rolling is T BnThe thickness of the workpiece after system is T AnThe time, with the degree of finish (%) of every 1 passage=[(T Bn-T An)/T BnThe degree of finish of every 1 passage of] * 100 expression.
Rollingly add man-hour, the workpiece of annealing blank etc. for example is drawn into the gap between 1 relative pair roller, is drawn out from opposition side, thereby increases and decreases thickness.The inlet side of the speed of workpiece before being drawn into roller is slower than the velocity of rotation of roller, faster than the velocity of rotation of roller by the outlet side after pulling out from roller.Therefore, workpiece is applied stress under compression at inlet side, apply tensile stress at outlet side.In order to process workpiece thinner, should make stress under compression>tensile stress.By adjusting the degree of finish of every 1 passage, take stress under compression>tensile stress as prerequisite, can adjust the ratio of the Strenth and stress composition (compression composition and stretching composition) of stress separately.Thus, change as described above to { approach of the variation of 022} face can be adjusted the ratio of the crystal face in secondary orientation.
In addition, in final cold rolling process S50, the preferred every repeatedly cold rolling position of neutrality point is controlled to the mode that the outlet side of roller moves with following explanation.That is, as mentioned above, a certain position of speed between inlet side and outlet side of having reversed the workpiece of magnitude relationship with respect to the velocity of rotation of roller at inlet side and outlet side becomes and equates with the velocity of rotation of roller.This both speed is called neutral point for the position that equates, is maximum at neutrality point to workpiece institute applied pressure.
The position of neutral point can be controlled by combinations such as adjustment the place ahead tension force, rear tension force, roll speed (velocity of rotation of roller), roller footpath, degree of finish, rolling loads.That is, by controlling the position of neutral point, the intensity of stress under compression and tensile stress, the ratio of stress component can be adjusted, the ratio of the crystal face in secondary orientation can be adjusted.
Surface treatment procedure S60
The copper bar that has passed through above operation is implemented the surface treatment of regulation.By with on make the related rolled copper foil of present embodiment.
In present embodiment, in above-mentioned final cold rolling process S50, implementing cold rolling processing, to make total degree of finish be more than 90%, more preferably more than 94%.In addition, control the position of degree of finish and the neutrality point in each passage of every 1 passage.Thus, can adjust the ratio of the crystal face in main orientation and secondary orientation, the diffraction peak intensity of adjusting each crystal face satisfies above-mentioned formula (1)~(12).Thus, can be manufactured on the rolled copper foil that can possess low rigidity after recrystallization annealing operation described later and possess simultaneously excellent curved characteristic.
(3) manufacture method of flexible printing patch panel
Below, the manufacture method of the flexible printing patch panel (FPC) that uses the related rolled copper foil of one embodiment of the present invention is described.
Recrystallization annealing operation (CCL operation)
At first, rolled copper foil severing that present embodiment is related becomes the size of regulation, and fitting such as the base material of the FPC that consists of with resin by polymeric amide etc. forms CCL (copper clad duplexer, Copper Clad Laminate).At this moment, can be with fitting to form the method for 3 layers of CCL by caking agent and not by caking agent carry out directly fitting any in the method that forms 2 layers of CCL.When using caking agent, by heat treated, caking agent is solidified, make rolled copper foil and base material driving fit and carry out integrated.When not using caking agent, carry out driving fit by heating, pressurization.Heating temperature, time can be in conjunction with the suitable selections such as solidification value of caking agent, base material, for example can be in the temperature below 300 ℃ more than 150 ℃, carry out more than 1 minute below 120 minutes.
As mentioned above, adjust the thermotolerance of rolled copper foil in conjunction with the Heating temperature of this moment.Therefore, come the softening rolling Copper Foil to make its recrystallize by above-mentioned heating, can improve significantly the curved characteristic of rolled copper foil.That is, have recrystallization annealing operation for rolled copper foil concurrently to the CCL operation of base material applying rolled copper foil.Thus, in the operation till rolled copper foil is fitted to base material, can operate rolled copper foil under the state that carries out work hardening after cold rolling process, be difficult to produce the distortion of extension when rolled copper foil is fitted to base material, wrinkle, bending etc.
The surface working operation
Then, the rolled copper foil that fits on base material is implemented the surface working operation.In the surface working operation; carry out distribution and form operation, surface treatment procedure and protective membrane formation operation; it is that rolled copper foil is formed copper wiring etc. such as the method for using etching etc. that described distribution forms operation; described surface treatment procedure is the surface treatment that implement to be used for improves the plating etc. of copper wiring and the connection reliability of other electronic unit, and described protective membrane formation operation is the protective membrane of the solder resist that is formed for protecting copper wiring etc. of the mode with the part on the coating copper wiring etc.
Used the FPC of the related rolled copper foil of present embodiment by above manufacturing.
As mentioned above, in the present embodiment, have the CCL operation concurrently, rolled copper foil is implemented the recrystallization annealing operation.Thus, can obtain having the rolled copper foil of recrystallized structure.At this moment, as main orientation { 022} is towards { the 002} face changes.Thus, can obtain the rolled copper foil of curved characteristic excellence.And on the other hand, for { 002} face, { 113} face, { 111} face and { the 133} face as secondary orientation, under state after final cold rolling process in the manufacturing process that keeps rolled copper foil, change hardly ratio, removed the impact of work hardening by the recrystallization annealing operation, can bring into play the effect in secondary orientation in approaching mode to greatest extent thus, obtain the low rigidity of rolled copper foil.Thus, can obtain having low rigidity and have simultaneously the rolled copper foil of excellent curved characteristic.
Other embodiment of the present invention
Above, specifically understand relevant embodiments of the present invention, still, the present invention is not limited in above-mentioned embodiment, can carry out various possible changes in the scope that does not break away from its main idea.
For example, in the above-described embodiment, use Ag as the stable on heating interpolation material of adjusting rolled copper foil, but adding material is not limited to the material that Ag, above-mentioned technical literature etc. are enumerated.In addition, be not limited to thermotolerance by adding the adjustable every characteristic of material, material is added in the suitable selection of the every characteristic that can adjust as required.
In addition, in the above-described embodiment, the CCL operation in FPC manufacturing process has the recrystallization annealing operation for rolled copper foil concurrently, and still, the recrystallization annealing operation can be used as the operation different from the CCL operation and carries out.
In addition, in the above-described embodiment, although rolled copper foil is used for the FPC purposes, the purposes of rolled copper foil is not limited to this, can needing be used for the purposes of high curved characteristic and low rigidity.For the thickness of rolled copper foil, according to the various uses headed by the FPC purposes, also can surpass 20 μ m.
In addition, in the above-described embodiment, the total degree of finish in final cold rolling process S50 is 90% with first-class, obtains excellent curved characteristic, and the adjustment of the crystal face by secondary orientation obtains the method for low rigidity and can use independently with it.That is, for mainly take low rigidity as the important curved characteristic that need only to a certain degree during with regard to passable situation etc., finally the total degree of finish in cold rolling process such as can think 85%, 70% etc. be no more than 90%.
In addition, in order to realize effect of the present invention, it is necessary being not limited to the whole of the above-mentioned operation of enumerating.The various conditions that above-mentioned embodiment, embodiment described later enumerate are always illustration, can suitablely change.
Embodiment
Then, embodiment involved in the present invention is described together with comparative example.
(1) making of rolled copper foil
Use and added the oxygen free copper of aimed concn as the Ag of 200ppm, with order and the method same with above-mentioned embodiment, make embodiment 1~18 and the related rolled copper foil of comparative example 1~18.That is, at first, preparing to have dissolved the Ag of specified amount and be cast as thickness in oxygen free copper is that 150mm, width are the ingot bar of 500mm.Following table 2 has shown the analytical value of Ag concentration that analyze by inductivity coupled plasma mass spectrometry (ICP:InductiVely Coupled Plasma) Emission Spectrophotometer method, in ingot bar.
Table 2
Figure BDA0000149192500000131
200ppm with respect to aimed concn as shown in table 2, analytical value is 185ppm~210ppm, all is suppressed in the deviation in 200ppm ± 20ppm (10%) degree.Ag contains several ppm~tens of ppm degree as the situation of inevitable impurity except this in the oxygen free copper as main raw material, the various reasons such as deviation during due to cast billets have in metal material field ± deviation in the 20ppm degree usually.
Then, with order and the method same with above-mentioned embodiment, obtain sheet material that thickness is 8mm in hot-rolled process after, repeatedly implement cold rolling process and keep the process annealing operation of 2 minutes the temperature of 700 ℃~800 ℃, make copper bar (blank), by in 750 ℃ of blank anneal operations that keep 1 minute of temperature, obtain the blank of annealing.Here, the temperature condition of each annealing operation etc. is to consider to contain the thermotolerance of anaerobic copper material of Ag of 185ppm~210ppm and definite condition.
At last, to carry out final cold rolling process with same order and the method for above-mentioned embodiment, obtain embodiment 1~18 and the related rolled copper foil of comparative example 1~18.Following table 3 shows the condition of final cold rolling process.
Table 3
Figure BDA0000149192500000132
As shown in table 3 according to the attenuation of thickness of slab in turn from the upper strata to the lower floor, conversion condition as right hurdle is carried out finally cold rolling.That is, making thickness is that 200 μ m following cold rolling processing, degree of finish every 1 passage change with the position of neutral point.The position of the neutrality point as shown in right hurdle (mm) be shown as roller with as the annealing blank of workpiece from the outlet side end of contact surface to neutrality point till length.In addition, in order to obtain excellent curved characteristic, be 95% with embodiment 1~18 and comparative example 1~18 set overall condition for the total degree of finish in final cold rolling process.By above making thickness be 12 μ m embodiment 1~18 and the related rolled copper foil of comparative example 1~18.
(2) evaluation of rolled copper foil
Embodiment 1~18 and the related rolled copper foil of comparative example 1~18 to making as described above carry out following evaluation.
X-ray diffraction by 2 θ/θ method is measured
At first, to embodiment 1~18 and the related rolled copper foil of comparative example 1~18, carry out being measured by the X-ray diffraction of 2 θ/θ method.Related mensuration is used the X-ray diffraction device (model: Ultima IV), carry out with the condition shown in following table 4 of Co., Ltd. Neo-Confucianism's system.
Table 4
Figure BDA0000149192500000141
{ 022} face, { 002} face, { 113} face, { 111} face and the { diffraction peak intensity of 133} face that have shown the copper crystallization of being measured by 2 θ/θ method in following table 5.
Table 5
Figure BDA0000149192500000151
In addition, following table 6,7 shows the scale relation of formula (1)~(12) that the value substitution of the diffraction peak intensity of table 5 is above-mentioned and calculates the result of each value.
Table 6
Figure BDA0000149192500000161
Table 7
Figure BDA0000149192500000171
As mentioned above, in the present embodiment and comparative example, the degree of finish of every 1 passage in final cold rolling process and neutral position of putting are changed.Thus, add man-hour cold rolling, change putting on the compression composition of workpiece and the ratio of the stress component of stretching composition.Its result changes the ratio of each crystal face, also changes the ratio of the diffraction peak intensity of each crystal face as shown in table 6,7.
As can be known, according to the combination of each condition of embodiment 1~18, each value of formula (1)~(12) after the recrystallization annealing operation, obtains having low rigidity and has simultaneously the possible rolled copper foil of excellent curved characteristic all in above-mentioned specialized range.And on the other hand, combination for each condition of comparative example 1~18, the whichever rolled copper foil be all a plurality of values in each values of formula (1)~(12) outside above-mentioned specialized range, even these rolled copper foils pass through recrystallization annealing operations, do not possess low rigidity yet.In table 7, show with the thick word table with underscore the value that departs from above-mentioned specialized range.
The flexible life test
Then, in order to investigate the curved characteristic of each rolled copper foil, use the FPC high speed bend test machine (model: SEK-31B2S) of Shinetsu Eng Co., Ltd. (エ of SHIN-ETSU HANTOTAI Application ジ two ア リ Application グ Co., Ltd.) system, according to IPC (U.S.'s printed wiring industry meeting) standard, carry out the flexible life test.Fig. 2 shows the schematic diagram of the general slip bend test device 10 comprised above-mentioned FPC high speed bend test machine etc.
At first, with order and the method same with above-mentioned recrystallization annealing operation, be that 12.5mm, length are that the coupons S of 220mm implements the recrystallization annealing of 300 ℃, 60 minutes to embodiment 1~18 and the related rolled copper foil of comparative example 1~18 being cut into width.Related condition simulation in the CCL of printing distributing board operation, during with the driving fit of base material, an example of the actual heat that bears of rolled copper foil.
Then, as shown in Figure 2, the sample S of rolled copper foil is fixed on the sample retaining plate 11 of slip bend test device 10 with screw 12.Then, sample S contact with vibration reception and registration section 13, by vibratory drive section 14, vibration reception and registration section 13 is vibrated on above-below direction, vibration is conveyed to sample S, implement flexible life and test.Condition determination as flexible life is made as 1.5mm with bending radius, and stroke is 10mm, and the amplitude number is 25Hz.Under this condition, measure every 5 coupons S that cut from each rolled copper foil, relatively its mean value.Following table 8 has shown result.
Table 8
Figure BDA0000149192500000191
As mentioned above, each rolled copper foil is 95% final cold rolling process through total degree of finish, as shown in table 8 like that, the flexible life of embodiment 1~18 and comparative example 1~18, that is, the bending number of times that fractures is all more than 1,000,000 times, to have obtained excellent curved characteristic.
The evaluation of ring stiffness (Le one プ ス テ Off ネ ス)
Then, use Toyo Co., Ltd.'s essence mechanism to make made ring stiffness test machine, investigate the rigidity of each rolled copper foil.Fig. 3 shows the summary of test method.
At first, with above-mentioned be similarly that 10mm, length are that the coupons S of 180mm implements the recrystallization annealing of 300 ℃, 60 minutes to embodiment 1~18 and the related rolled copper foil of comparative example 1~18 being cut width.Then, make as shown in Figure 3 the both ends of coupons S superimposed, make that ring is long to be clipped in coupons S between the pressure head plate 21 and retaining plate 22 of mutual subtend for after the ring-type of 70mm, with pressure head plate 21, the summit of encircling is pressed to retaining plate 22 sides with the stroke of 5mm.With regard to the mensuration of ring stiffness, measure the force of compression (bounce) of this moment.Although the measuring method of measuring rigidity by this ring stiffness not as JIS standard, IPC standard in this wise by stdn, be multiplex in the method for FPC industry in recent years.Show result in following table 9.
Table 9
Figure BDA0000149192500000201
The bounce of embodiment 1~18 as shown in table 9 (ring rigidity (Le one プ ス テ Off ネ ス)) is 0.045g~0.056g, shows low bounce.And with respect to this, the bounce of comparative example 1~18 is 0.067g~0.081g, for higher.The bounce of embodiment 1~18 integral body is with respect to comparative example 1~18 integral body, approximately little by 16%~44% ([(0.067-0.056)/0.067] * 100 ≈ 16%, [(0.081-0.045)/0.081] * 100 ≈ 44%).
So as can be known, the related rolled copper foil of embodiment 1~18 of the ratio of viewed, the crystal face of having adjusted secondary orientation of the scale relation of formula described above (1)~(12) can obtain low rigidity.And on the other hand, can not get hanging down fully rigidity by the resulting a plurality of values in above-mentioned formula (1)~(12) for breaking away from the outer related rolled copper foil of comparative example 1~18 of specialized range.
Below as can be known, if consider together with the result of above-mentioned flexible life test, by implementing recrystallization annealing, the related rolled copper foil of embodiment 1~18 has excellent curved characteristic when possessing low rigidity.And on the other hand, although the related rolled copper foil of comparative example 1~18 has excellent curved characteristic, poor rigidity.
(3) use the rolled copper foil of tough pitch copper
Then, use and added the tough pitch copper of aimed concn as the Ag of 200ppm, with order and the method same with the above embodiments, making thickness is embodiment 19 and the related rolled copper foil of comparative example 19 of 12 μ m.Ag concentration in the ingot bar of embodiment 19 and comparative example 19 is respectively 190ppm and 195ppm with by the resulting analytical value of IPC Emission Spectrophotometer method.In addition, in conjunction with the thermotolerance of the tough copper material of the Ag that contains related concentration, only process annealing operation and blank anneal operation are used and above-mentioned different condition.Particularly, the process annealing operation approximately kept 2 minutes 600 ℃~700 ℃ of temperature, and 700 ℃ of about maintenances of temperature are 1 minute in the blank anneal operation.
For embodiment 19 and the related rolled copper foil of comparative example 19 made as described above, with method and the order same with the above embodiments, carry out being measured by the X-ray diffraction of 2 θ/θ method, in the scale relation of the formula that the diffraction peak intensity substitution of resulting each crystal face is above-mentioned (1)~(12), calculate each value.
With regard to the related rolled copper foil of embodiment 19, the proportionlity of the diffraction peak intensity of each crystal face is in the specialized range of formula (1)~(12).
And on the other hand, with regard to the related rolled copper foil of comparative example 19, the related numerical value of formula (2) is (I { 002}+ I { 113})/(I { 111}+ I { 133}Specialized range is departed from)=0.90.In addition, thus, also depart from specialized range for the proportionlity beyond this.
In addition, for embodiment 19 and the related rolled copper foil of comparative example 19, to carry out the flexible life test with the same order of the above embodiments and method, its result is, with similarly above-mentioned, because the total degree of finish in final cold rolling process is 95%, therefore, embodiment 19 and comparative example 19 have shown that all the crooked number of times that fractures is the curved characteristic of the excellence more than 1,000,000 times.
Further, when estimating ring stiffness with the same order of the above embodiments and method, the bounce of embodiment 19 is 0.051g for embodiment 19 and the related rolled copper foil of comparative example 19, and with respect to this, the bounce of comparative example 19 is 0.072g.Thus, even the rolled copper foil take tough pitch copper as raw-material embodiment 19 also can obtain low rigidity.
(4) use the rolled copper foil of different interpolation materials
Then, use added aimed concn as the Ag of 120ppm and aimed concn as the titanium (Ti) of 40ppm as the oxygen free copper that adds material with order and the method same with the above embodiments, making thickness is embodiment 20 and the related rolled copper foil of comparative example 20 of 12 μ m.Ag concentration in the ingot bar of embodiment 20 and comparative example 20 is used by the resulting analytical value of IPC Emission Spectrophotometer method, is respectively 120ppm and 125ppm.In addition, Ti concentration is respectively 37ppm and 44ppm.Being all the deviation in ± 10% degree, is general deviation in the field of metallic substance.
In addition, in conjunction with the thermotolerance of the anaerobic copper material of the Ag that contains above-mentioned concentration and Ti, only process annealing operation and blank anneal operation are used and above-mentioned different condition.Particularly, the process annealing operation approximately kept 1 minute 650 ℃~700 ℃ of temperature, and 700 ℃ of about maintenances of temperature are 1 minute in the blank anneal operation.
For embodiment 20 and the related rolled copper foil of comparative example 20 made as described above, with method and the order same with the above embodiments, carry out being measured by the X-ray diffraction of 2 θ/θ method, in the scale relation of the formula that the diffraction peak intensity substitution of resulting each crystal face is above-mentioned (1)~(12), calculate each value.
With regard to the related rolled copper foil of embodiment 20, the proportionlity of the diffraction peak intensity of each crystal face is in the specialized range of formula (1)~(12).
And on the other hand, with regard to the related rolled copper foil of comparative example 20, the related numerical value of formula (2) is (I { 002}+ I { 113})/(I { 111}+ I { 133}Specialized range is departed from)=0.95.In addition, thus, also depart from specialized range for the proportionlity beyond this.
In addition, together with the related rolled copper foil of embodiment 20 and comparative example 20, with the flexible life test of the same order of the above embodiments and method in, the bending number of times that fractures has shown the curved characteristic of the excellence more than 1,000,000 times.
Further, for with the evaluation of the ring stiffness of the same order of the above embodiments and method, the bounce of embodiment 20 is 0.048g, and with respect to this, the bounce of comparative example 20 is 0.074g.Thus, also can obtain low rigidity even added the rolled copper foil of the embodiment 20 of different materials.
The inventor's investigation
The secondary orientation of crystal face control to(for) passing through is as described above given the principle of low rigidity to rolled copper foil and for the controlling mechanism of the crystal face in secondary orientation in the manufacturing process of above-mentioned rolled copper foil, the below investigation of the explanation inventor to this.
(1) about low rigidity
Opinion, the opinion of Metallkunde and experiment experience so far that the inventor learns from crystal orientation for the principle that obtains low rigidity by the crystal face of controlling secondary orientation, have carried out following investigation.
The inventor thinks, and is to resulting low rigidity in the present invention, relevant to not changing of the variation in main orientation before and after the recrystallization annealing operation and secondary orientation.As mentioned above, in the recrystallization annealing operation, as main orientation { the 022} face becomes { 002} face after recrystallize.And on the other hand, as { 002} face, { 113} face, { the 111} face and { the 133} face does not also roughly change after recrystallize, can think that each slipping plane (the closeest face of copper atom) in these secondary orientation has participated in low rigidity in secondary orientation.
Because the slip of copper crystallization is the movement of copper atom, therefore, as the slipping plane of copper crystallization { the 111} face is to be parallel to rolling surface or during close to parallel state, and slip direction is also for being parallel to rolling surface or for close to parallel direction.Thus, can think, for the bounce of the power vertical with respect to rolling surface, vertical with slip direction or play a role close to vertical direction, the bounce grow.
And on the other hand, the slip direction of copper crystallization and rolling surface angulation are larger, and the direction that bounce plays a role and the difference of slip direction are less.That is, can think, the direction of bounce, exerts an influence with respect to the easier sliding phenomenon to the copper crystallization of bounce that is applied to perpendicular to the power of rolling surface near parallel with the slip direction angulation.Here, each crystal face is with { 111} face (slipping plane) angulation is as follows.
{ 111} face ∠ { 002} face: 54.7 °
111} face ∠ the 113} face: 29.5 °, 58.5 °, 80.0 °
{ 111} face ∠ { 133} face: 22.0 °
{ 111} face ∠ { 022} face: 35.3 ° (reference value)
That is, with respect to rolling surface, { slipping plane that the 002} face becomes the copper crystallization parallel with rolling surface is positioned at 54.7 °.
In addition, with respect to rolling surface, { slipping plane that the 113} face becomes the copper crystallization parallel with rolling surface is positioned at 29.5 °, 58.5 ° or 80.0 °.
In addition, with respect to rolling surface, { slipping plane that the 133} face becomes the copper crystallization parallel with rolling surface is positioned at 22.0 °.
In addition, with respect to rolling surface, { slipping plane that the 111} face becomes the copper crystallization parallel with rolling surface is positioned at 0 °.
The balance of ratio of having inferred the diffraction peak intensity of each above-mentioned crystal face angulation, each crystal face as above exerts an influence to rigidity.So can say, the ratio of the crystal face in low rigidity and each secondary orientation has close relationship.
(2) about the control of the crystal face in secondary orientation
Crystallization is rotated
As mentioned above, rolling the adding of final cold rolling process etc., apply stress under compression and the tensile stress more weak than stress under compression to copper material man-hour.Copper crystallization in the copper material that is rolled produces to { rotation phenomenon of 022} face, together with the progress of rolling processing, the orientation that is parallel to the crystal face of rolling surface mainly forms as { the rolling texture of 022} face by the rolling stress that adds man-hour.At this moment, as mentioned above, by the ratio of stress under compression with tensile stress, change towards { the approach that the 022} face rotates.About this point, use Fig. 4 to describe.
Fig. 4 is the antipole point diagram of the fine copper shaped metal quoted from following technical literature (d), (a) for showing the antipole point diagram because of the crystallization turning direction of tensile deformation, (b) for showing the antipole point diagram because of the crystallization turning direction of compression set.In addition, in the antipole point diagram, { the 002} face is designated as that { the 001} face, { the 022} face is designated as { 011} face.That is, and the 002} face with as be parallel to the minimum value of the face of 002} face the 001} face represents, and the 022} face with as be parallel to the minimum value of the face of 022} face { the 011} face represents.
(d) compile author's length Shanxi one, " texture (Ji He Group
Figure BDA0000149192500000242
) ", ball kind Co., Ltd., clear and on January 20th, 59, Fig. 2 .52 (a) of p96, (c)
As shown in Figure 4, the copper crystallization in copper material when tensile deformation only towards the 111} face rotates, and when compression set only towards { the 011} face rotates.And with regard to rolling processing, owing to carrying out existing compression composition, the distortion of stretching composition is arranged again, and therefore, crystallization turning direction and unlike so simple.Just, proportion by subtraction stretching composition more preponderates to be out of shape owing to being compressed into, rolling processing, occurs on the whole towards { crystallization of 011} face is rotated, and simultaneously, by the ratio of compression composition and stretching composition, a part is also to { the 111} face rotates.At this moment, because compression composition aspect occupies advantage, therefore, towards { crystallization that the 111} face rotates also occurs towards { crystallization that the 011} face returns is rotated.In addition, opposite with it, towards { { crystallization of 011} face also has towards { 133} the face, { situation that the 111} face rotates because of the stretching composition for the crystallization that the 011} face rotates, arrival.
So can think, if compression composition and stretching composition in the relation that keeps compression composition>stretching composition, mixed in togetherly cause the crystallization rotation, so finally become the distribution of the crystal face in main orientation as shown in the antipole point diagram of Fig. 5 and secondary orientation.Can think, due to the compression composition>stretching composition, the crystal face in final main orientation be the 011} face, in addition, because of compression composition and the result that causes crystallization to be rotated mixing of stretching composition, the crystal face in secondary orientation is { 001} face, { 113} face, { 111} face, { 133} face.
, only shown in Fig. 5 that the crystal face of above-mentioned particular orientation distributes here, it be the reasons are as follows.Be the crystallization of face-centred cubic structure due to copper, therefore, in being measured by the X-ray diffraction of 2 θ/θ method, if the h of hkl} face, k, l be all odd number value or be all even number value, do not manifest diffraction peak.If h, k, l mix for odd number value and even number value, disappear according to the extinction rule diffraction peak, can not measure.Therefore, when showing the formation of the rolled copper foil that above-mentioned embodiment etc. is related, { 001} face ({ 002} face), { 113} face, { 111} face and { the 133} face is stipulated to occur as diffraction peak.Can say that the effect of this formation is also clear and definite, if consider that the crystal face in the above-mentioned secondary orientation of enumerating is sufficient from the result of the above embodiments etc.
Control by degree of finish
Below as can be known, take stress under compression>tensile stress as prerequisite, if adjust the ratio of compression composition and stretching composition, change towards { the approach that the 022} face rotates.Particularly, the compression composition is larger, and is easier of { the 002} face, { the 113} face, the stretching composition is larger, and is easier of { 111} face, { 133} face.The crystal face in main secondary orientation is { 002} face, { 113} face, { 111} face and { 133} face, { the above-mentioned crystal face of 022} face remains in copper material owing to not turning to fully, by being adjusted at compression composition and the stretching composition in final cold rolling process, can adjust the ratio of the crystal face in each secondary orientation remaining in copper material.
Particularly, compression composition and stretching composition can be controlled by changing the rolling rolling condition that adds every 1 passage in man-hour.When regulating the various control parameter of controlling compression composition and stretching composition, embodiment described above, embodiment attempt ground, for example can be conceived to the variation of the degree of finish of every 1 passage.
In order to improve the degree of finish of every 1 passage, for example there is increase rolling load (roller load) to roll the method as the copper material of rolling object, it is large that this situation stress under compression becomes.Thus, the rotation approach of crystallization is that { the 002} face, { the 113} face is towards { the 022} face rotates.
And on the other hand, take stress under compression>tensile stress as prerequisite, also have by increasing the stretching composition to make the copper material attenuation improve the method for degree of finish.Owing to increasing the stretching composition, therefore, the rotation approach of crystallization is that { the 111} face, { the 133} face is towards { the 022} face rotates.In addition, can think, remainingly in copper material after rolling { in the 133} face, comprise by the stretching composition resulting and arrived for the time being by the compression composition that { crystallization of 022} face turns to { the 133} face again by the stretching composition in the rotation way of crystallization.The variation of the degree of finish that causes because of tensile stress in addition, is compared little with the situation that increases compression load.That is, stress under compression is larger to the effect of degree of finish.
In addition, it should be noted here, only material shape can not be processed equably rolling can not carrying out with composition (stress under compression and tensile stress) separately.That is, by stress under compression and tensile stress the two, in the thickness attenuation that makes material, control material shape.
The control of putting by neutrality
In above-mentioned embodiment, embodiment, also carry out the position control of neutral point together with the degree of finish of every 1 passage in final cold rolling process.That is, when adjusting the control parameter of compression composition and stretching composition, for example also can be conceived to the change in location of neutral point.
As mentioned above, as the control elements of the position of controlling neutral point in every 1 passage, the place ahead tension force, rear tension force, roll speed (velocity of rotation of roller), roller footpath, degree of finish, rolling load etc. are arranged.Can make up variedly these control elementss, the position of neutral point is changed.
The position of described neutral point can be calculated by calculating from several observed values.Namely, at first, take following technical literature (e) in the relation of the following formula of reference,
The composition of the composition+force of compression of tension force=2 * shear yield stress ... (13) make the force of compression composition larger than tension force composition, further, use formula (13) is calculated the conditional equilibrium in roll speed and roller footpath, that is, and and the position of the neutrality point in the contact surface of the rolling roller that adds man-hour and copper material.In addition, for the following technical literature of detailed reference (e) of neutrality point.
(e) Japanese plastic working association compile, " Technology of Plastic Processing series 7 plates are rolling ", Ke Ruo sodium society's system (Corona Corporation.), p14, p27 formula (3.3), p28
Above-mentioned formula (13) in these, can become fixing key element and become variable key element by How to choose although the parameter when calculating is above-mentioned control elements, considers polytype control method.In above-mentioned embodiment, embodiment, degree of finish is controlled the position of neutral point as variable control elements, but also can be used the control of the control elements beyond degree of finish.
In addition, above-mentioned control elements is relevant to the formation of roller mill, and the position control of neutral point exists with ... the specification of roller mill greatly.Particularly, because of the difference of formation of the roller of the combining and configuring of the sum of the hop count of roller, roller, roller, each roller footpath, material, condition of surface (surfaceness) etc. etc., be created in the difference on applying method to the stress under compression of copper material, frictional coefficient etc.Because roller mill is different, related its absolute value of each control elements of the condition of enumerating in the above-described embodiment is also different, therefore can adjust aptly each roller mill.

Claims (5)

1. a rolled copper foil, possess major surfaces, and have a plurality of crystal faces with described major surfaces in parallel, is the rolled copper foil after final cold rolling process, before the recrystallization annealing operation, it is characterized in that,
Described a plurality of crystal face comprise the 022} face, the 002} face, the 113} face, the 111} face and the 133} face,
Be respectively I by the diffraction peak intensity that described major surfaces is measured by the X-ray diffraction of 2 θ/θ method described each crystal face that obtains { 022}, I { 002}, I { 113}, I { 111}And I { 133}The time,
Be I { 022}/ (I { 022}+ I { 002}+ I { 113}+ I { 111}+ I { 133}) 〉=0.50,
Be (I { 002}+ I { 113})/(I { 111}+ I { 133}) 〉=1.0,
Be I { 022}/ I { 002}≤ 8.0,
Be I { 022}/ I { 113}≤ 30,
Be I { 022}/ I { 111}〉=7.0,
Be I { 022}/ I { 133}〉=10,
Be 1.0≤I { 002}/ I { 113}≤ 15,
Be I { 111}/ I { 133}≤ 10,
Be I { 113}/ I { 111}〉=0.30,
Be 1.0≤I { 002}/ I { 111}≤ 20,
Be 1.0≤I { 002}/ I { 133}≤ 75, and
Be 0.50≤I { 113}/ I { 133}≤ 20.
2. rolled copper foil according to claim 1, is characterized in that, is that to make thickness be below 20 μ m for described final cold rolling process more than 90% by total degree of finish.
3. rolled copper foil according to claim 1 and 2, is characterized in that, take purity as the oxygen free copper more than 99.96% or purity as the tough pitch copper more than 99.9% as principal constituent.
4. according to claim 1~3 described rolled copper foils of any one, is characterized in that, is added with at least a in silver, boron, titanium and tin.
5. the application of the described rolled copper foil of claim 1~4 any one in flexible printing patch panel.
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CN104801542A (en) * 2015-05-06 2015-07-29 无锡丰元新材料科技有限公司 High-precision rolled copper foil for high-energy environment-friendly battery
CN108998692A (en) * 2017-06-07 2018-12-14 株式会社日立金属新材料 No-oxygen copper plate and ceramic wiring board
CN115279929A (en) * 2020-03-06 2022-11-01 三菱综合材料株式会社 Pure copper plate, copper-ceramic junction body, and insulated circuit board
US12035469B2 (en) 2020-03-06 2024-07-09 Mitsubishi Materials Corporation Pure copper plate, copper/ceramic bonded body, and insulated circuit board

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