CN103128439A - Lens unit and laser processing device - Google Patents
Lens unit and laser processing device Download PDFInfo
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- CN103128439A CN103128439A CN2012104521920A CN201210452192A CN103128439A CN 103128439 A CN103128439 A CN 103128439A CN 2012104521920 A CN2012104521920 A CN 2012104521920A CN 201210452192 A CN201210452192 A CN 201210452192A CN 103128439 A CN103128439 A CN 103128439A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Abstract
The invention provides a lens unit and a laser processing device. In the laser processing device (100), the lens unit (20) capable of measuring temperature change of optical lenses (11a, 11b) resulted from instant absorption of high-energy laser beams (2) by using temperature detectors (14) is used in a f[theta] lens. A plurality of temperature detectors (14) are disposed in non-irradiation part of the laser beams of the optical lenses (11a, 11b). A control device (9) corrects converged spot positions of the laser beams (2) according to temperature signals measured by the temperature detectors (14) to perform control.
Description
Technical field
The present invention relates to processed object vertically the focus irradiation laser beam lens unit and used the laser processing device of this lens unit.
Background technology
Utilized the laser processing device of current scanning device (galvano scanner) to be used in laser engraving machine, laser beam marking machine etc. in the past, be commonly referred to as laser marking machine (lasermarker) and known by masses.
Recently, in the past construction method meticulous and the processing method at a high speed and flexibly of drilling machine etc. instead, this laser processing device is used to the perforate manufacturing process of multilayer printed board, precise electronic parts etc.
In recent years, be accompanied by the raising of semi-conductive miniaturization, integrated level, the high-precision refinement of electronic circuit, electronic unit becomes remarkable.In the laser processing device that uses in the processing of the electronic circuit of so high-precision refinement, electronic unit, the Working position precision of the μ m unit that requires that the laser marking machine etc. by in the past can't realize.
Laser processing device as corresponding with the requirement of the machining accuracy of such superhigh precision has proposed following laser processing device, and this laser processing device possesses: the temperature detecting unit of current mirror (galvanomirror); The lens temperature detecting unit; And the control module of the deflection displacement operating position of current mirror, this control module moves according to the temperature signal from these temperature detecting units.
Such laser processing device can be proofreaied and correct the variations in temperature due to the heating of the optics that accompanies by the variations in temperature that environment is set, with the absorption of high-octane laser beam or consist of the skew (for example, with reference to patent documentation 1) of the Working position that the variations in temperature of the laser processing device of the unit of laser processing device or the variations in temperature in the parts rank etc. causes.
Patent documentation 1: No. 4320524 communique of Japan Patent (4-5 page, Fig. 1)
Summary of the invention
In the laser processing device in the past of patent documentation 1 record, the Temperature Detector that utilization is installed on the plane of structure of lens unit detects the temperature as the f θ lens of lens unit.
Generally, f θ lens possess optical lens and keep the lens barrel of optical lens, so in laser processing device in the past, be provided with Temperature Detector and refer on the plane of structure of f θ lens, are provided with Temperature Detector at the lateral parts of lens barrel.
Laser processing device is in the past measured temperature by the Temperature Detector that arranges in the lens barrel side as the f θ lens of lens unit.Therefore, the optical lens transient absorption (for example, msec unit's precision) high-octane laser beam, rise in the situation that moment, temperature occured, measuring point for the temperature is away from the laser beam irradiation area, the thermal capacity of lens barrel is large, so there are the following problems: can't measure accurately variations in temperature, the skew that can't proofread and correct Working position.
The present invention completes in order to solve problem as described above, its the 1st purpose is to obtain a kind of lens unit, even rise in the situation that the high-octane laser beam of optical lens transient absorption and moment, temperature occured, also can measure accurately by Temperature Detector the variations in temperature of optical lens.
The 2nd purpose is to obtain a kind of laser processing device, and this lens unit is used as f θ lens, can proofread and correct accurately the skew of the Working position that occurs due to the high-octane laser beam of optical lens moment ground absorption that forms f θ lens.
Lens unit of the present invention is to the lens unit of object focus irradiation laser beam, possesses:
Optical lens;
Lens barrel keeps optical lens; And
A plurality of Temperature Detectors, wherein,
A plurality of Temperature Detectors are arranged at the non-illuminated portion of laser beam that exists between the periphery of the laser beam irradiation area of optical lens and optical lens, to being used for obtaining the mean temperature of optical lens or being used for obtaining the mean temperature of optical lens and the temperature signal of the Temperature Distribution in face is measured.
Laser processing device of the present invention possesses:
Laser oscillator;
Current mirror makes from the laser beam deflection of laser oscillator output;
The current scanning device, driven current mirror;
Lens unit, have optical lens, keep the lens barrel of optical lens and be arranged at the non-illuminated portion of laser beam that exists between the periphery of the laser beam irradiation area of optical lens and optical lens and to being used for obtaining the mean temperature of optical lens or being used for obtaining the mean temperature of optical lens and a plurality of Temperature Detectors that the temperature signal of the Temperature Distribution in face is measured, pass through the laser beam of current mirror deflection and incident towards the object focus irradiation;
The XY platform, the mounting object also moves in horizontal plane;
Current driver (galvano driver), the drive current scanner;
Control device is controlled laser oscillator, current driver and XY platform; And
Holding wire is connected to control device with Temperature Detector, wherein,
Control device is according to the temperature signal of being measured by a plurality of Temperature Detectors, obtain optical lens ascending temperature mean value or obtain the mean value of ascending temperature of optical lens and the Temperature Distribution in face, and according to resulting result, the focal point position of calibration of laser wave beam.
Lens unit of the present invention consists of as described above, so can measure accurately the mean temperature of the optical lens due to the absorption of moment of high-octane laser beam.
Laser processing device of the present invention consists of as described above, so even the processing under high-octane Laser output, position skew that also can calibration of laser wave beam focal point can realize high-precision Laser Processing.
Description of drawings
Fig. 1 is the overall structure figure of the laser processing device of embodiments of the present invention 1.
Fig. 2 is the schematic top plan view of a side of the side generalized section of the lens unit that uses in the f θ lens of laser processing device of embodiments of the present invention 1 and laser beam incident.
Fig. 3 is the schematic top plan view of a side of the side generalized section of the lens unit that uses in the f θ lens of laser processing device of embodiments of the present invention 2 and laser beam incident.
Fig. 4 is the side generalized section of the lens unit that uses in the f θ lens of laser processing device of embodiments of the present invention 3 and the schematic diagram of the A-A section in this side generalized section.
Fig. 5 is the side generalized section of the lens unit that uses in the f θ lens of laser processing device of embodiments of the present invention 4 and the schematic diagram of the A-A section in this side generalized section.
The specific embodiment
Embodiment 1.
Fig. 1 is the overall structure figure of the laser processing device of embodiments of the present invention 1.
As shown in Figure 1, the laser processing device 100 of the present embodiment f θ lens 5, XY platform 7, current driver 8 and the control device 9 that possess laser oscillator 1, the 1st current mirror 3a, the 2nd current mirror 3b, the 1st current scanning device 4a, the 2nd current scanning device 4b, consisted of by lens unit.
The 1st current mirror 3a makes the laser beam 2 of the output from laser oscillator 1 to horizontal direction at the horizontal plane intrinsic deflection.
The laser beam 2 that the 2nd current mirror 3b has made by the 1st current mirror 3a deflection is further at the vertical plane intrinsic deflection.
The 1st current scanning device 4a drives the 1st current mirror 3a, and the 2nd current scanning device 4b drives the 2nd current mirror 3b.
XY platform 7 loads workpiece 6 and shift action in horizontal plane.
8 pairs the 1st of current drivers, the 2nd current scanning device 4a, 4b drive.
Control device 9 is controlled laser oscillator 1, current driver 8 and XY platform 7.
In Fig. 1, arrow X represents the moving direction of XY platform 7 in horizontal plane, and arrow Y represents another moving direction as the direction vertical with the directions X of XY platform 7 in horizontal plane.In addition, all directions of X, Y are also the machine directions of workpiece 6.
In addition, in the laser processing device 100 of present embodiment, be provided with Temperature Detector 14(with reference to Fig. 2 in f θ lens 5), Temperature Detector 14 is connected with control device by holding wire 10 connections.And control device 9 is controlled current driver 8 according to the temperature signal of inputting from Temperature Detector 14, thereby controls the 1st, the 2nd current scanning device 4a, 4b.
After, the integral body of the 1st, the 2nd current mirror 3a, 3b, the 1st, the 2nd current scanning device 4a, 4b and current driver 8 is generically and collectively referred to as electric current mechanism.
(a) of Fig. 2 is the side generalized section of the lens unit that uses in the f θ lens 5 of laser processing device of embodiments of the present invention 1, and (b) of Fig. 2 is the schematic top plan view of lens unit of a side of laser beam 2 incidents.
As shown in Fig. 2 (a), the lens unit 20 that uses in the f θ lens 5 of present embodiment possesses the 1st optical lens 11a and the 2nd optical lens 11b, protects window 12, lens barrel 13 and 2 Temperature Detectors 14.
The interval that separates regulation has configured to two-stage the 1st optical lens 11a and the 2nd optical lens 11b.
2 Temperature Detectors 14 are arranged at the surface of a side of laser beam 2 incidents of the 1st optical lens 11a.
In addition, as shown in Fig. 2 (b), be provided with Temperature Detector 14 in each of the both ends of the string of the central point by the 1st optical lens 11a (center of the circle on surface).
About " string " that uses in later explanation, as long as no specifying, just refer to the string by the central point of optical lens, " both ends of string " refer to, is positioned near the zone the two ends of string in the non-illuminated portion 16 of laser beam.
After, with the 1st optical lens 11a, the 2nd optical lens 11b and the protection window 12 integral body be generically and collectively referred to as the optical system components group.
In addition, in the situation that the 1st optical lens 11a and the 2nd optical lens 11b are carried out general name, be recited as optical lens.
In addition; in the lens unit 20 of present embodiment; one side of laser beam 2 incidents of the upper side from Fig. 2 (a); the side that the laser beam 2 of the lower side in Fig. 2 (a) penetrates configures according to the order of the 1st optical lens 11a, the 2nd optical lens 11b, protection window 12.
That is, configure the 1st optical lens 11a in the laser beam incident section, configured protection window 12 at the laser beam injection part.
Usually, in laser processing device, make 2 current mirror deflections and to the scope that workpiece is processed be the square, so the zone of the illuminated laser beam in the face of the optical lens of f θ lens is square or rectangle.
Therefore, in the situation that the lens unit 20 of present embodiment is used as f θ lens, as shown in Fig. 2 (b), in the non-illuminated portion 16 of laser beam that exists, be provided with 2 Temperature Detectors 14 between the periphery of the square of the 1st optical lens 11a or the circle of rectangular laser beam irradiation area 15 and the 1st optical lens 11a.
Particularly, in each of the non-illuminated portion 16 of laser beam at place, the both ends of the string of 2 relative limit quadratures of in the 1st optical lens 11a and side laser beam irradiation area 15, set 1 Temperature Detector 14.
Perhaps, in each of the non-illuminated portion 16 of laser beam at place, the both ends of the string of 2 relative limit quadratures of in the 1st optical lens 11a and the opposing party laser beam irradiation area 15, set 1 Temperature Detector 14.
In addition, with the direction of 2 relative limit quadratures of a side of laser beam irradiation area 15 with make the direction of the 2nd current mirror 3b deflection consistent, with the direction of 2 relative limit quadratures of the opposing party of laser beam irradiation area 15 with make the direction of the 1st current mirror 3a deflection consistent.
The the 1st, the 2nd optical lens 11a, 11b in the lens unit 20 of present embodiment is that one side is that aspheric surface and one side are the lens on plane, but can be also that the two sides is that lens, the two sides of aspherical shape is the lens of sphere, can be also any in convex lens or concave lens in addition.
In addition, in the lens unit 20 of present embodiment, used 2 optical lenses, but can be also 1 optical lens, can also use the optical lens more than 3, and separated the interval of regulation and configure multistagely.
In addition, the two sides of protection window 12 is planes.
The lens unit 20 of present embodiment is in the situation that as the f θ lens of laser processing device, in the non-illuminated portion 16 of laser beam in the 1st little optical lens 11a of ratio of heat capacities lens barrel 13, set Temperature Detector 14.Therefore, the non-illuminated portion 16 of laser beam is near laser beam irradiation area 15, even so due to the absorption of moment of high-octane laser beam 2 (for example, msec unit's precision) make in the situation that temperature moment of the 1st optical lens 11a rises, also can measure accurately the 1st optical lens 11a temperature and as temperature signal.
In addition, owing to having used 2 Temperature Detectors 14, so can measure the temperature signal of the mean temperature of obtaining the 1st optical lens 11a that temperature rises.
In the present embodiment, in order to measure the temperature signal of the mean temperature of obtaining the 1st optical lens 11a, use 2 Temperature Detectors 14, but also the Temperature Detector 14 more than 2 can be arranged at the non-illuminated portion 16 of laser beam of the 1st optical lens 11a.
In addition, in the laser processing device 100 of present embodiment, used lens unit 20 in f θ lens 5, by being arranged at 2 Temperature Detectors 14 of the 1st optical lens 11a, measure the temperature of the 1st optical lens 11a when making temperature increase by the 1st optical lens 11a transient absorption (for example, msec unit's precision) the high-octane laser beam 2 of f θ lens 5.Then, will be input to control device 9 as temperature signal by the temperature that these 2 Temperature Detectors 14 are measured.
Then, control device 9 is according to the temperature signal from 14 inputs of 2 Temperature Detectors, the mean value of the temperature difference before and after the temperature of obtaining the 1st optical lens 11a rises (after, be recited as ascending temperature).
And then control device 9 is controlled current driver 8 according to the mean value of the ascending temperature of optical lens 11a, thereby controls the 1st, the 2nd current scanning device 4a, 4b.
Namely, in the laser processing device 100 of present embodiment, by measuring typically the mean temperature of the 1st optical lens 11a, and control the 1st, the 2nd current scanning device 4a, 4b according to this temperature signal, due to calibration of laser the wave beam 2 and temperature optical system components group the skew of Working position (be recited as focal point position) of workpiece 6 of the laser beam 2 that variations in refractive index together causes of rising thus.
The concrete method that rises in 100 pairs of f θ lens 5 of laser processing device of present embodiment and the temperature optical system components group the skew of focal point position of laser beam 2 together proofreaies and correct is described.
At first, keep in control device 9 according in the situation that the correcting value data Δ X(X of the directions X of each processing stand of the workpiece 6 that the skew of the focal point position of the laser beam 2 that the mean value of the ascending temperature of the 1st optical lens 11a is Δ ta to be occured is obtained, Y, Δ ta) and the correcting value data Δ Y(X of Y-direction, Y, Δ ta), and as primary data.
Next, utilize 2 Temperature Detectors 14 to measure the temperature of the 1st optical lens 11a when carrying out Laser Processing by 100 pairs of workpiece of laser processing device 6 as temperature data, this temperature data is input to control device 9 as temperature signal, obtains the mean value Δ Ta of ascending temperature.
Next, use the correcting value data of the processing stand of the workpiece 6 that keeps in advance in control device 9, the correcting value data Δ X(X of the directions X when calculating Δ ta=Δ Ta, Y, Δ Ta) and the correcting value data Δ Y(X of Y-direction, Y, Δ Ta).
Next, utilize the correcting value data Δ X(X of directions X, Y, Δ Ta) revise the position Xs of directions X of the focal point of the laser beam 2 that position before proofreading and correct has been offset, the position of the directions X of the focal point of laser beam 2 becomes the Xr shown in following (1) formula.
Simultaneously, utilize the correcting value data Δ Y(X of Y-direction, Y, Δ Ta) revise the position Ys of Y-direction of the focal point of the laser beam 2 that position before proofreading and correct has been offset, the position of the Y-direction of the focal point of laser beam 2 becomes the Yr shown in following (2) formula.
That is, so that the position of the directions X of the focal point of laser beam 2 becomes the mode that the position of Xr, Y-direction becomes Yr, control the skew that the 1st, the 2nd current scanning device 4a, 4b come the focal point position of calibration of laser wave beam 2.
Xr=Xs+ΔX（X，Y，ΔTa）（1）
Yr=Ys+ΔY（X，Y，ΔTa）（2）
That is, control/proofread and correct by the action to electric current mechanism, implement thus the correction of skew of the focal point position of laser beam 2.
In fact, carry out by the following: consider that the position of predicting according to temperature data is offset, in order to shine desired locations, to output to current driver 8 from control device 9 with the target location after the correcting value data correction, and indicate from 8 pairs the 1st of current drivers, the 2nd current scanning device 4a, 4b.
In the laser processing device 100 of present embodiment, even the processing under high-octane Laser output, the skew of focal point position that also can calibration of laser wave beam 2 is so can realize the Laser Processing of high-precision workpiece 6.
In the present embodiment, control device 9 also can be according to controlling XY platform 7 from the temperature signal of Temperature Detector 14 inputs.
In addition, in the present embodiment, also the Temperature Detector 14 that arranges in the non-illuminated portion 16 of the laser beam of the 1st optical lens 11a can be made as more than 2, control device 9 is controlled the 1st, the 2nd current scanning device 4a, 4b according to the mean value that will be input to from the temperature signal of these a plurality of Temperature Detectors 14 ascending temperature that control device 9 obtains, and proofreaies and correct thus.
In the present embodiment, as the mechanism that makes laser beam 2 deflections, use the 1st, the 2nd current mirror 3a, 3b, but so long as make the mechanism of laser beam 2 deflections, just be not limited to this.
(a) of Fig. 3 is the side generalized section of the lens unit that uses in the f θ lens of laser processing device of embodiments of the present invention 2, and (b) of Fig. 3 is the schematic top plan view (b) of lens unit of a side of laser beam incident.
As shown in Figure 3, the lens unit 30 that uses in the f θ lens of present embodiment is except the surface in a side of laser beam 2 incidents of the 1st optical lens 11a is provided with 4 Temperature Detectors, and is identical with the lens unit 20 of embodiment 1.
And, as shown in Fig. 3 (b), in each of the both ends of the 2 mutually orthogonal strings in the 1st optical lens 11a, be provided with the 1st, the 2nd, the 3rd, the 4th Temperature Detector 14a, 14b, 14c, 14d.
In the situation that the lens unit 30 of present embodiment is used as f θ lens, as shown in Fig. 3 (b), in the non-illuminated portion 16 of laser beam that exists, be provided with 4 Temperature Detectors between the periphery of the square of the 1st optical lens 11a or the circle of rectangular laser beam irradiation area 15 and the 1st optical lens 11a.
For example, in the 1st optical lens 11a, the 1st Temperature Detector 14a is arranged in the dial plate of clock and the non-illuminated portions 16 of laser beam 12 suitable positions.
The 2nd Temperature Detector 14b is arranged in the dial plate of clock and the non-illuminated portions 16 of laser beam 6 suitable positions.
The 3rd Temperature Detector 14c is arranged in the dial plate of clock and the non-illuminated portions 16 of laser beam 9 suitable positions.
The 4th Temperature Detector 14d is arranged in the dial plate of clock and the non-illuminated portions 16 of laser beam 3 suitable positions.
Namely, in the lens unit 30 of present embodiment, so that the string (being recited as D1) by the 1st Temperature Detector 14a and the 2nd Temperature Detector 14b, with the mode of string (being recited as D2) quadrature by the 3rd Temperature Detector 14c and the 4th Temperature Detector 14d, configured each Temperature Detector in the 1st optical lens 11a.
And the direction parallel with D1 is consistent with the direction that makes the 1st current mirror 3a deflection, and the direction parallel with D2 is consistent with the direction that makes the 2nd current mirror 3b deflection.
Particularly, 4 non-illuminated portions 16 of laser beam that Temperature Detector is arranged at the 1st optical lens 11a so the deviation of the mean value of the ascending temperature of the 1st optical lens 11a that is obtained by control device 9 is little, can further improve the mensuration precision of ascending temperature.
In addition, in the lens unit 30 of present embodiment, the both ends of 1 string D1 in 2 strings of the quadrature of the 1st optical lens 11a have configured the 1st Temperature Detector 14a and the 2nd Temperature Detector 14b, and have configured the 3rd Temperature Detector 14c and the 4th Temperature Detector 14d at the both ends of another 1 string D2.
Therefore, the temperature signal of the 1st Temperature Detector 14a due to can rising according to the temperature of the 1st optical lens 11a and the temperature signal of the 2nd Temperature Detector 14b are obtained the Temperature Distribution on the D1 direction.And, can according to the temperature signal of the 3rd Temperature Detector 14c and the temperature signal of the 4th Temperature Detector 14d, obtain the Temperature Distribution of D2 direction.
The laser processing device of present embodiment is except having used lens unit 30 in f θ lens 5, identical with the laser processing device of embodiment 1.
In the laser processing device of present embodiment, used lens unit 30 in f θ lens 5, utilize the 1st, the 2nd, the 3rd, the 4th Temperature Detector 14a, 14b, 14c, 14d, measure the 1st optical lens 11a transient absorption (for example, msec unit's precision) the high-octane laser beam 2 of f θ lens 5 and the temperature of the 1st optical lens 11a when making temperature increase.Then, these temperature are input to control device 9 as temperature signal.
In addition, in the laser processing device of present embodiment, control device 9 is obtained the mean value of the ascending temperature of the 1st optical lens 11a according to each temperature signal from the 1st, the 2nd, the 3rd, the 4th Temperature Detector 14a, 14b, 14c, 14d of inputting.
In addition, control device 9 is obtained the Temperature Distribution of the D1 direction of the 1st optical lens 11a according to the temperature signal of the 1st Temperature Detector 14a that inputs and the temperature signal of the 2nd Temperature Detector 14b.Then, according to the temperature signal of the 3rd Temperature Detector 14c that inputs and the temperature signal of the 4th Temperature Detector 14d, obtain the Temperature Distribution of the D2 direction of the 1st optical lens 11a.
In the laser processing device of present embodiment, about the optical system components group due to laser beam 2 with the rise skew of focal point position of laser beam 2 that variations in refractive index together causes of temperature, obtain typically the average data of the ascending temperature of the 1st optical lens 11a.Then, control the 1st, the 2nd current scanning device 4a, 4b according to these data, thereby proofread and correct.
In addition, in the laser processing device of present embodiment, make the direction of the D1 in the 1st optical lens 11a of f θ lens 5 consistent with the directions X of workpiece 6, the Y-direction of the direction of D2 and workpiece 6 is consistent.
Thus, the temperature profile data of D1 direction that can be by obtaining typically the 1st optical lens 11a and the temperature profile data of D2 direction, and control the 1st, the 2nd current scanning device 4a, 4b according to these data, the skew of the focal point position of the laser beam 2 that causes of the variations in refractive index that accompanies of the Temperature Distribution of the Temperature Distribution of the optical system components group due to calibration of laser wave beam 2 and identical with the directions X of workpiece 6 direction and the direction identical with the Y-direction of workpiece thus.
The laser processing device pair that present embodiment is described and the temperature of the optical system components group of the f θ lens 5 concrete method that the skew of focal point position of laser beam 2 is together proofreaied and correct that rises.
At first, keep in control device 9 according in the situation that the correcting value data Δ X(X of the directions X of each processing stand that the skew of the focal point position of the laser beam 2 that the mean value of the ascending temperature of the 1st optical lens 11a is Δ ta to be occured is obtained, Y, Δ ta) and the correcting value data Δ Y(X of Y-direction, Y, Δ ta), and as primary data.
In addition, the correcting value data Δ Xx(X of the directions X of each processing stand of the workpiece 6 that the skew of the Temperature Distribution Δ tx that to preserve the basis in the 1st optical lens 11a in control device 9 be directions X due to the D1 direction occurs laser beam focal point position is obtained, Y, Δ tx) and the correcting value data Δ Yx(X of Y-direction, Y, Δ tx).
And then, the correcting value data Δ Xy(X of the directions X of each processing stand that the skew of the laser beam focal point position that keeps occuring according to the Temperature Distribution Δ ty that is Y-direction due to the D2 direction in control device 9 is obtained, Y, Δ ty) and the correcting value data Δ Yy(X of Y-direction, Y, Δ ty).
Next, in laser processing device, the the 1st, the 2nd, the 3rd, the 4th Temperature Detector 14a, 14b, 14c, 14d in the 1st optical lens 11a when utilization is carried out Laser Processing to workpiece 6 measure temperature, and this temperature data is input to control device 9, obtain the mean value Δ Ta of ascending temperature.
In addition, according to the mensuration temperature in the 1st Temperature Detector 14a and the 2nd Temperature Detector 14b, obtain the Temperature Distribution Δ Tx of the directions X in the 1st optical lens 11a, according to the mensuration temperature in the 3rd Temperature Detector 14c and the 4th Temperature Detector 14d, obtain the Temperature Distribution Δ Ty of the Y-direction in the 1st optical lens 11a.
Next, use the correcting value data of the processing stand that keeps in advance in control device 9, the correcting value data Δ X(X of the directions X when calculating Δ ta=Δ Ta, Y, Δ Ta) and the correcting value data Δ Y(X of Y-direction, Y, Δ Ta).
In addition, the correcting value data Δ Xx(X of the directions X when calculating Δ tx=Δ Tx, Y, Δ Tx) and the correcting value data Δ Yx(X of Y-direction, Y, Δ Tx).
In addition, the correcting value data Δ Xy(X of the directions X when calculating Δ ty=Δ Ty, Y, Δ Ty) and the correcting value data Δ Yy(X of Y-direction, Y, Δ Ty).
Next, utilize the correcting value data Δ X(X of directions X, Y, Δ Ta), Δ Xx(X, Y, Δ Tx) and Δ Xy(X, Y, Δ Ty) revise the position Xs of the directions X of the laser beam focal point that position before proofreading and correct has been offset, the position of the directions X of laser beam focal point becomes the Xr shown in following (3) formula.
Simultaneously, utilize the correcting value data Δ Y(X of Y-direction, Y, Δ Ta), Δ Yx(X, Y, Δ Tx) and Δ Yy(X, Y, Δ Ty) revise the position Ys of the Y-direction of the laser beam focal point that position before proofreading and correct has been offset, the position of the Y-direction of laser beam focal point becomes the Yr shown in following (4) formula.
That is, so that the position of the directions X of laser beam focal point becomes the mode that the position of Xr, Y-direction becomes Yr, the 1st, the 2nd current scanning device 4a, 4b are controlled the skew of calibration of laser wave beam focal point position.
Xr=Xs+ΔX（X，Y，ΔTa）+ΔXx（X，Y，ΔTx）+ΔXy（X，Y，ΔTy）（3）
Yr=Ys+ΔY（X，Y，ΔTa）+ΔYx（X，Y，ΔTx）+ΔYy（X，Y，ΔTy）（4）
That is, control/proofread and correct by the action of 9 pairs of control device electric current mechanism, implement thus the correction of the skew of laser beam focal point position.
In fact, undertaken by following: consider that the position of predicting according to temperature data is offset, in order to shine desired locations, to utilize the target location after the correcting value data correction to output to current driver 8 from control device 9, and indicate from 8 pairs the 1st of current drivers, the 2nd current scanning device 4a, 4b.
Even in the processing of the laser processing device of present embodiment under high-octane Laser output, the also skew of calibration of laser wave beam focal point position more accurately is so can realize more high-precision Laser Processing.
In the present embodiment, control device 9 also can be according to controlling XY platform 7 from the temperature signal of the 1st, the 2nd, the 3rd, the 4th Temperature Detector 14a, 14b, 14c, 14d input.
In the present embodiment, be provided with 4 Temperature Detectors i.e. the 1st, the 2nd, the 3rd, the 4th Temperature Detector 14a, 14b, 14c, 14d in the 1st optical lens 11a of lens unit 30, but the both ends of string that also can be in the 1st optical lens 11a, namely with respect to the center of the 1st optical lens 11a and symmetrical position respectively arranges 1 and namely adds up to 2 Temperature Detectors.
In addition, as long as can measure the Temperature Distribution of the direction parallel with the D1 direction of optical lens 11a and the Temperature Distribution of the direction parallel with the D2 direction, the Temperature Detector more than 4 can be set also.
In addition, as the mechanism that makes laser beam 2 deflections, use the 1st, the 2nd current mirror 3a, 3b, but so long as make the mechanism of laser beam 2 deflections, just be not limited to this.
Embodiment 3.
(a) of Fig. 4 is the side generalized section of the lens unit that uses in the f θ lens of laser processing device of embodiments of the present invention 3, and (b) of Fig. 4 is the schematic diagram of the A-A section of the lens unit in this side generalized section.
As shown in Figure 4, the lens unit 40 that uses in the f θ lens of present embodiment is except 2 Temperature Detectors 14 are arranged at the surface of a side of laser beam 2 incidents of the 2nd optical lens 11b, and is identical with the lens unit 20 of embodiment 1.
In addition, as shown in Fig. 4 (b), be provided with Temperature Detector 14 in each of the both ends of the string of the central point by the 2nd optical lens 11b.
In the situation that the lens unit 40 of present embodiment is used as f θ lens, as shown in Fig. 4 (b), the zone of the illuminated laser beam 2 in the face of the 2nd optical lens 11b becomes square or rectangle.
Therefore, in the non-illuminated portion 26 of laser beam that exists between the periphery of the laser beam irradiation area 25 in the face of the 2nd optical lens 11b and the circle of the 2nd optical lens 11b, be provided with 2 Temperature Detectors 14.
Particularly, in each of the non-illuminated portion 26 of laser beam at place, the both ends of the string of 2 relative limit quadratures of in the 2nd optical lens 11b and side laser beam irradiation area 25, set 1 Temperature Detector 14.
Perhaps, in each of the non-illuminated portion 26 of laser beam at place, the both ends of the string of 2 relative limit quadratures of in the 2nd optical lens 11b and the opposing party laser beam irradiation area 25, set 1 Temperature Detector 14.
In addition, the direction of in laser beam irradiation area 25 and 2 a relative limit quadratures side with make the direction of the 2nd current mirror 3b deflection consistent, with the direction of 2 relative limit quadratures of the opposing party with make the direction of the 1st current mirror 3a deflection consistent.
The lens unit 40 of present embodiment is in the situation that be used as the f θ lens of laser processing device, in the non-illuminated portion 26 of laser beam in the 2nd little optical lens 11b of ratio of heat capacities lens barrel 13, set Temperature Detector 14, the non-illuminated portion 26 of laser beam is near laser beam irradiation area 25, even so due to the absorption of moment of high-octane laser beam 2 (for example, msec unit's precision) make in the situation that temperature moment of the 2nd optical lens 11b rises, also can measure accurately the temperature of the 2nd optical lens 11b as temperature signal.
In addition, the face that arranges of the Temperature Detector 14 of the 2nd optical lens 11b is not the face that contacts with extraneous gas, so can not be subject to the impact that adds the dust that occurs man-hour at workpiece 6.
In addition, owing to having used 2 Temperature Detectors 14, so can measure temperature signal be used to the mean temperature of obtaining the 2nd optical lens 11b that temperature risen.
In the present embodiment, in order to measure the temperature signal be used to the mean temperature of obtaining the 2nd optical lens 11b, use 2 Temperature Detectors 14, but also the Temperature Detector 14 more than 2 can be arranged at the non-illuminated portion 26 of laser beam of the 2nd optical lens 11b.
The laser processing device of present embodiment is except having used lens unit 40 in f θ lens 5, identical with the laser processing device of embodiment 1.
In the laser processing device of present embodiment, due to the absorption of moment of the high-octane laser beam 2 of the 2nd optical lens 11b in f θ lens 5 (for example, msec unit's precision) make in the situation that temperature moment of the 2nd optical lens 11b rises, 2 Temperature Detectors 14 that arrange in also can enough the 2nd optical lens 11b are measured the temperature of the 2nd optical lens 11b, and will be input to control device 9 as temperature signal by the temperature that these 2 Temperature Detectors 14 are measured.
Then, control device 9 is obtained the mean value of the ascending temperature of the 2nd optical lens 11b according to the temperature signal from 14 inputs of 2 Temperature Detectors.
And then control device 9 is controlled current driver 8 according to the mean value of the ascending temperature of the 2nd optical lens 11b, thereby controls the 1st, the 2nd current scanning device 4a, 4b.
In the laser processing device of present embodiment, about the optical system components group due to laser beam 2 by with the rise skew of focal point position of laser beam 2 that variations in refractive index together causes of temperature, measure typically the mean temperature of the 2nd optical lens 11b.Then, controlling the 1st, the 2nd current scanning device 4a, 4b according to this temperature signal proofreaies and correct.
That is, according to the data of the mean value of the ascending temperature in the 2nd optical lens 11b, by the mechanism same with the laser processing device 100 of embodiment 1, control the 1st, the 2nd current scanning device 4a, 4b, thus the skew of calibration of laser wave beam focal point position.
In fact, carry out by the following: the position skew of considering to predict according to temperature data is in order to shine desired locations, to output to current driver 8 from control device 9 with the target location after the correcting value data correction, and indicate from 8 pairs the 1st of current drivers, the 2nd current scanning device 4a, 4b.
Even in the processing of the laser processing device of present embodiment under high-octane Laser output, the also skew of calibration of laser wave beam focal point position accurately is so can realize high-precision Laser Processing.
In the present embodiment, control device 9 also can according to the temperature signal from the Temperature Detector input, be controlled XY platform 7.
In addition, in the present embodiment, also the Temperature Detector 14 that arranges in the non-illuminated portion 26 of the laser beam of the 2nd optical lens 11b can be made as more than 2, control device 9 is according to the mean value that will be input to from the temperature signal of these a plurality of Temperature Detectors 14 ascending temperature that control device 9 obtains, control the 1st, the 2nd current scanning device 4a, 4b, thereby proofread and correct.
In the present embodiment, as the mechanism that makes laser beam 2 deflections, use the 1st, the 2nd current mirror 3a, 3b, but so long as make the mechanism of laser beam 2 deflections, just be not limited to this.
In the lens unit 40 that uses, Temperature Detector 14 is arranged at the 2nd optical lens 11b in the f of present embodiment θ lens 5, as long as but be arranged in the face of the optical lens that does not contact with extraneous gas, just can be arranged at any optical lens.
In addition, the non-illuminated portion of laser beam that also can be in the face of a side opposite to the laser beam outgoing plane of protection window 12, set temperature detector 14.
Embodiment 4.
(a) of Fig. 5 is the side generalized section of the lens unit that uses in the f θ lens of laser processing device of embodiments of the present invention 4, (b) is the schematic diagram of the A-A section of the lens unit in this side generalized section.
As shown in Figure 5, the lens unit 50 that uses in the f θ lens of present embodiment is except 4 Temperature Detector 14a, 14b, 14c, 14d are arranged at the surface of a side of laser beam 2 incidents of the 2nd optical lens 11b, and is identical with the lens unit 30 of embodiment 2.
And as shown in Fig. 5 (b), the 1st, the 2nd, the 3rd, the 4th Temperature Detector 14a, 14b, 14c, 14d are arranged in each of both ends of the 2 mutually orthogonal strings in the 2nd optical lens 11b.
In the situation that the lens unit 50 of present embodiment is used as f θ lens, as shown in Fig. 5 (b), the zone of the illuminated laser beam 2 of the 2nd optical lens 11b becomes square or rectangle.
Therefore, the setting position of each Temperature Detector 14a in the 2nd optical lens 11b, 14b, 14c, 14d is the non-illuminated portion 26 of laser beam at 4 positions existing between the periphery of the circle of laser beam irradiation area 25 and the 2nd optical lens 11b.
As shown in Fig. 5 (b), for example in the 2nd optical lens 11b, the 1st Temperature Detector 14a is arranged in the dial plate of clock and the non-illuminated portions 26 of laser beam 12 suitable positions.
The 2nd Temperature Detector 14b is arranged in the dial plate of clock and the non-illuminated portions 26 of laser beam 6 suitable positions.
The 3rd Temperature Detector 14c is arranged in the dial plate of clock and the non-illuminated portions 26 of laser beam 9 suitable positions.
The 4th Temperature Detector 14d is arranged in the dial plate of clock and the non-illuminated portions 26 of laser beam 3 suitable positions.
Namely, in the lens unit 50 of present embodiment, so that as the D1 of the string by the 1st Temperature Detector 14a and the 2nd Temperature Detector 14b, with mode as the D2 quadrature of the string by the 3rd Temperature Detector 14c and the 4th Temperature Detector 14d, each Temperature Detector is disposed at the 2nd optical lens 11b.
In addition, the direction parallel with D1 is consistent with the direction that makes the 1st current mirror 3a deflection, and the direction parallel with D2 is consistent with the direction that makes the 2nd current mirror 3b deflection.
The lens unit 50 of present embodiment is in the situation that be used as the f θ lens of laser processing device, also in the non-illuminated portion 26 of laser beam in the 2nd little optical lens 11b of ratio of heat capacities lens barrel 13, set the 1st, the 2nd, the 3rd, the 4th Temperature Detector 14a, 14b, 14c, 14d, the non-illuminated portion 26 of laser beam is near laser beam irradiation area 25.
Thus, even in situation about rising in the temperature moment that makes the 2nd optical lens 11b due to the absorption (for example, msec unit's precision) of moment of high-octane laser beam 2, also can measure accurately the temperature of the 2nd optical lens 11b as temperature signal.
Particularly, 4 non-illuminated portions 26 of laser beam that Temperature Detector is arranged at the 2nd optical lens 11b so the deviation of the mean value of the ascending temperature of the 2nd optical lens 11b is little, can further improve the mensuration precision of ascending temperature.
In addition, it is not the face that contacts with extraneous gas that the Temperature Detector of the 2nd optical lens 11b arranges face, so can not be subject to the impact that adds the dust that occurs man-hour at workpiece 6.
The laser processing device of present embodiment is except having used lens unit 50 in f θ lens 5, identical with the laser processing device of embodiment 2.
So, make the direction of the D1 in lens unit 50 consistent with the directions X of workpiece 6, make the direction of D2 consistent with the Y-direction of workpiece 6.
In the laser processing device of present embodiment, with 4 Temperature Detectors measure in f θ lens 5 the 2nd optical lens 11b due to transient absorption (for example, msec unit's precision) high-octane laser beam 2 and the temperature of the 2nd optical lens 11b when making temperature increase, and these temperature are input to control device 9 as temperature signal.
Then, control device 9 is obtained the mean value of the ascending temperature of the 2nd optical lens 11b according to the temperature signal of 4 Temperature Detectors.
In addition, temperature signal according to the 1st Temperature Detector 14a and the 2nd Temperature Detector 14b, obtain the Temperature Distribution of the D1 direction of the 2nd optical lens 11b, according to the temperature signal of the 3rd Temperature Detector 14c and the 4th Temperature Detector 14d, obtain the Temperature Distribution of D2 direction.
Then, in the laser processing device of present embodiment, control the 1st, the 2nd current scanning device 4a, 4b according to the average data of the ascending temperature of the 2nd optical lens 11b, thus the optical system components group due to calibration of laser wave beam 2 by with the rise skew of focal point position of laser beam 2 that variations in refractive index together causes of temperature.
Simultaneously, control the 1st, the 2nd current scanning device 4a, 4b according to the temperature profile data of the D1 direction of the 2nd optical lens 11b and the temperature profile data of D2 direction, thus the skew of the focal point position of the laser beam 2 that the variations in refractive index that the Temperature Distribution by with the Temperature Distribution of the direction identical with the directions X of workpiece 6 and the direction identical with the Y-direction of workpiece 6 of the optical system components group due to calibration of laser wave beam 2 accompanies causes.
Namely, in the laser processing device of present embodiment, data according to the Temperature Distribution of the data of the Temperature Distribution of the data of the mean value of the ascending temperature of the 2nd optical lens 11b, direction that the directions X with workpiece 6 in the 2nd optical lens 11b is identical and the identical direction of the Y-direction with workpiece 6 in the 2nd optical lens 11b, by the mechanism same with the laser processing device of embodiment 2, control the 1st, the 2nd current scanning device 4a, 4b.Thus, the skew of the focal point position of calibration of laser wave beam 2.
That is, control/proofread and correct by the action of 9 pairs of control device electric current mechanism, thus the skew of the focal point position of calibration of laser wave beam 2.
In fact, carry out by the following: consider that the position of predicting according to temperature data is offset, in order to shine desired locations, to output to current driver 8 from control device 9 with the target location after the correcting value data correction, and indicate from 8 pairs the 1st of current drivers, the 2nd current scanning device 4a, 4b.
Even in the processing of the laser processing device of present embodiment under high-octane Laser output, the also skew of the focal point position of calibration of laser wave beam 2 more accurately is so can realize more high-precision Laser Processing.
In the present embodiment, control device 9 also can be according to controlling XY platform 7 from the temperature signal of Temperature Detector input.
In the lens unit 50 that uses in the f of present embodiment θ lens, 4 Temperature Detector 14a, 14b, 14c, 14d are arranged at the 2nd optical lens 11b, as long as but be arranged in the face of the optical lens that does not contact with extraneous gas, just can be arranged at any optical lens.
In addition, also can the non-illuminated portion of laser beam in the face of a side opposite to the laser beam plane of incidence of protection window 12 in, 4 Temperature Detector 14a, 14b, 14c, 14d are set.
In addition, in each embodiment, enumerate on the surface of a side of laser beam 2 incidents of optical lens and be provided with the example of Temperature Detector and be illustrated, but also can be set to the face (back side of optical lens) of the optical lens of a side opposite with a side of laser beam 2 incidents.
In the present embodiment, be provided with 4 Temperature Detector 14a, 14b, 14c, 14d in the 2nd optical lens 11b of lens unit 50, but the both ends of string that also can be in the 2nd optical lens 11b are the symmetric position place, respectively arrange 1 and namely add up to 2 Temperature Detectors.
In addition, if can measure the Temperature Distribution of the direction parallel with the D1 direction of the 2nd optical lens 11b and the Temperature Distribution of the direction parallel with the D2 direction, the Temperature Detector more than 4 can be set also.
In addition, as the mechanism that makes laser beam 2 deflections, use the 1st, the 2nd current mirror 3a, 3b, but so long as make the mechanism of laser beam 2 deflections, just be not limited to this.
Processing content in laser processing device of the present invention is not limited to perforate, so long as the example that cut-out, distortion, welding, heat treatment or mark etc. can be processed by laser, can be just processing content arbitrarily.In addition, in machined object, so long as the variation that burning, melting, distillation or variable color etc. can occur by laser just can occur to change arbitrarily.
In addition, the present invention can in its scope of invention, freely make up each embodiment or each embodiment suitably is out of shape, omits.
Utilizability on industry
The skew that laser processing device of the present invention can be proofreaied and correct the focal point position accurately can realize high-precision Laser Processing, so can be used in the electronic circuit of high-precision refinement, the processing of electronic unit.
Claims (9)
1. lens unit to object focus irradiation laser beam, possesses:
Optical lens;
Lens barrel keeps described optical lens; And
A plurality of Temperature Detectors, wherein,
Described a plurality of Temperature Detector is arranged at the non-illuminated portion of laser beam that exists between the periphery of the laser beam irradiation area of described optical lens and described optical lens, to being used for obtaining the mean temperature of described optical lens or being used for obtaining the mean temperature of described optical lens and the temperature signal of the Temperature Distribution in face is measured.
2. lens unit according to claim 1, is characterized in that,
In each of both ends on the string of the central point that passes through described optical lens, configured at least 1 described Temperature Detector.
3. lens unit according to claim 1, is characterized in that,
In each of the both ends of each and another root string at the both ends of a string in 2 strings of the quadrature of the central point by described optical lens, configured at least 1 described Temperature Detector.
4. the described lens unit of any one according to claim 1 ~ 3, is characterized in that,
Dispose described Temperature Detector in the described optical lens that is disposed at the laser beam incident section.
5. the described lens unit of any one according to claim 1 ~ 3, is characterized in that,
Described Temperature Detector is disposed at the face that contacts with the extraneous gas face in addition of described optical lens.
6. laser processing device possesses:
Laser oscillator;
Current mirror makes from the laser beam deflection of described laser oscillator output;
The current scanning device drives described current mirror;
Lens unit, have optical lens, keep the lens barrel of described optical lens and be arranged at the non-illuminated portion of laser beam that exists and obtain the mean temperature of described optical lens or a plurality of Temperature Detectors of measuring for the temperature signal of the mean temperature of obtaining described optical lens and the Temperature Distribution in face to being used between the periphery of the laser beam irradiation area of described optical lens and described optical lens, described lens unit is towards the described laser beam of object focus irradiation by described current mirror deflection and incident;
The XY platform loads described object and moves in horizontal plane;
Current driver drives described current scanning device;
Control device is controlled described laser oscillator, described current driver and described XY platform; And
Holding wire is connected to described control device with described Temperature Detector, wherein,
Described control device is according to the temperature signal of being measured by described a plurality of Temperature Detectors, obtain described optical lens ascending temperature mean value or obtain the mean value of ascending temperature of described optical lens and the Temperature Distribution in face, and according to resulting result, proofread and correct the focal point position of described laser beam.
7. laser processing device according to claim 6, is characterized in that,
In each of both ends on the string of the central point that passes through described optical lens, configured at least 1 described Temperature Detector.
8. laser processing device according to claim 6, is characterized in that,
Described a plurality of Temperature Detector is these 4 of the 1st Temperature Detector, the 2nd Temperature Detector, the 3rd Temperature Detector and the 4th Temperature Detectors,
The both ends of a string in 2 mutually orthogonal strings of the central point by described optical lens have configured described the 1st Temperature Detector and described the 2nd Temperature Detector, described the 3rd Temperature Detector and described the 4th Temperature Detector have been configured at the both ends of another root string
Described control device is obtained the mean value of the ascending temperature of described optical lens according to all temperature signals of being measured by described a plurality of Temperature Detectors, obtain the Temperature Distribution of the directions X in described optical lens according to the described temperature signal of described the 1st Temperature Detector and described the 2nd Temperature Detector, obtain the Temperature Distribution of the Y-direction in described optical lens according to the described temperature signal of described the 3rd Temperature Detector and described the 4th Temperature Detector, and according to resulting each result, the focal point position of calibration of laser wave beam.
9. the described laser processing device of any one according to claim 6 ~ 8, is characterized in that,
Control described current scanning device by described control device via described current driver, proofread and correct the focal point position of described laser beam.
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| JP2012-139293 | 2012-06-21 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102547657B1 (en) * | 2018-10-01 | 2023-06-26 | 삼성디스플레이 주식회사 | Laser processing apparatus |
| KR102578688B1 (en) * | 2023-04-20 | 2023-09-14 | 제놉스 주식회사 | The f-theta lens module equipped with a function to monitor when to replace the protective window |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH026093A (en) * | 1988-06-22 | 1990-01-10 | Sumitomo Electric Ind Ltd | Automatic focal length adjusting device |
| CN1286654A (en) * | 1997-12-26 | 2001-03-07 | 三菱电机株式会社 | Laser processing apparatus |
| JP2002096502A (en) * | 2000-09-25 | 2002-04-02 | Ricoh Co Ltd | Imaging apparatus |
| US20030080098A1 (en) * | 2001-10-30 | 2003-05-01 | Tsunehiko Yamazaki | Method of controlling hardening with laser beam and laser beam hardening device |
| JP2003290944A (en) * | 2002-04-04 | 2003-10-14 | Mitsubishi Electric Corp | Laser beam machining apparatus |
| CN1508586A (en) * | 2002-12-18 | 2004-06-30 | ����ɭ������ѧ��˾ | Lens to adapt laser intensity for uniform welding |
| JP2010247233A (en) * | 2009-03-25 | 2010-11-04 | Universal Seikan Kk | Laser beam machining apparatus |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2812157B2 (en) * | 1993-08-18 | 1998-10-22 | 三菱電機株式会社 | Laser processing equipment |
| KR100355122B1 (en) * | 1997-12-26 | 2002-10-11 | 미쓰비시덴키 가부시키가이샤 | Laser machining apparatus |
-
2012
- 2012-11-13 CN CN201210452192.0A patent/CN103128439B/en active Active
- 2012-11-22 KR KR1020120132882A patent/KR101422932B1/en active IP Right Grant
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH026093A (en) * | 1988-06-22 | 1990-01-10 | Sumitomo Electric Ind Ltd | Automatic focal length adjusting device |
| CN1286654A (en) * | 1997-12-26 | 2001-03-07 | 三菱电机株式会社 | Laser processing apparatus |
| JP2002096502A (en) * | 2000-09-25 | 2002-04-02 | Ricoh Co Ltd | Imaging apparatus |
| US20030080098A1 (en) * | 2001-10-30 | 2003-05-01 | Tsunehiko Yamazaki | Method of controlling hardening with laser beam and laser beam hardening device |
| JP2003290944A (en) * | 2002-04-04 | 2003-10-14 | Mitsubishi Electric Corp | Laser beam machining apparatus |
| CN1508586A (en) * | 2002-12-18 | 2004-06-30 | ����ɭ������ѧ��˾ | Lens to adapt laser intensity for uniform welding |
| JP2010247233A (en) * | 2009-03-25 | 2010-11-04 | Universal Seikan Kk | Laser beam machining apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN103128439B (en) | 2015-05-20 |
| KR20130057946A (en) | 2013-06-03 |
| KR101422932B1 (en) | 2014-07-24 |
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