CN103109422B - 用于制造销形的接触元件的方法以及接触元件 - Google Patents
用于制造销形的接触元件的方法以及接触元件 Download PDFInfo
- Publication number
- CN103109422B CN103109422B CN201180043247.6A CN201180043247A CN103109422B CN 103109422 B CN103109422 B CN 103109422B CN 201180043247 A CN201180043247 A CN 201180043247A CN 103109422 B CN103109422 B CN 103109422B
- Authority
- CN
- China
- Prior art keywords
- section
- contact element
- metal wire
- press
- stamped area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 claims description 44
- 239000002184 metal Substances 0.000 claims description 36
- 238000012545 processing Methods 0.000 claims description 23
- 238000004080 punching Methods 0.000 claims description 5
- 238000012423 maintenance Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000004049 embossing Methods 0.000 abstract 3
- 239000007788 liquid Substances 0.000 description 4
- 238000005219 brazing Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F5/00—Upsetting wire or pressing operations affecting the wire cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010040561A DE102010040561A1 (de) | 2010-09-10 | 2010-09-10 | Verfahren zum Herstellen von stiftförmigen Kontaktelementen und Kontaktelement |
DE102010040561.2 | 2010-09-10 | ||
PCT/EP2011/065441 WO2012032077A1 (de) | 2010-09-10 | 2011-09-07 | Verfahren zum herstellen von stiftförmigen kontaktelementen und kontaktelement |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103109422A CN103109422A (zh) | 2013-05-15 |
CN103109422B true CN103109422B (zh) | 2015-07-22 |
Family
ID=44583048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180043247.6A Active CN103109422B (zh) | 2010-09-10 | 2011-09-07 | 用于制造销形的接触元件的方法以及接触元件 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2614559B1 (de) |
CN (1) | CN103109422B (de) |
DE (1) | DE102010040561A1 (de) |
WO (1) | WO2012032077A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3404774B1 (de) * | 2017-05-17 | 2021-10-06 | Infineon Technologies AG | Verfahren zum elektronischen verbinden eines elektronischen moduls und elektronische anordnung |
CN109692909B (zh) * | 2019-01-14 | 2023-12-15 | 上海徕木电子股份有限公司 | 一种连接器用鱼叉形端子的制备工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1149332A (en) * | 1967-01-27 | 1969-04-23 | Amp Inc | Electrical contact pins and method of manufacture |
US3634819A (en) * | 1970-03-18 | 1972-01-11 | William Robert Evans | Resilient pin and method of production thereof |
US4586778A (en) * | 1983-08-25 | 1986-05-06 | Bmc Industries, Inc. | Compliant pin |
US4606589A (en) * | 1984-01-12 | 1986-08-19 | H & V Services | Compliant pin |
US4831728A (en) * | 1987-06-05 | 1989-05-23 | Northern Telecom Limited | Method of making circuit board pin |
US5893779A (en) * | 1996-10-18 | 1999-04-13 | Autosplice Systems Inc. | Conforming press-fit contact pin for printed circuit board |
DE202006000183U1 (de) * | 2006-01-07 | 2006-05-11 | Sorig, Ludger | Einpresskontaktstift |
-
2010
- 2010-09-10 DE DE102010040561A patent/DE102010040561A1/de not_active Withdrawn
-
2011
- 2011-09-07 EP EP11754393.4A patent/EP2614559B1/de active Active
- 2011-09-07 WO PCT/EP2011/065441 patent/WO2012032077A1/de active Application Filing
- 2011-09-07 CN CN201180043247.6A patent/CN103109422B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1149332A (en) * | 1967-01-27 | 1969-04-23 | Amp Inc | Electrical contact pins and method of manufacture |
US3634819A (en) * | 1970-03-18 | 1972-01-11 | William Robert Evans | Resilient pin and method of production thereof |
US4586778A (en) * | 1983-08-25 | 1986-05-06 | Bmc Industries, Inc. | Compliant pin |
US4606589A (en) * | 1984-01-12 | 1986-08-19 | H & V Services | Compliant pin |
US4831728A (en) * | 1987-06-05 | 1989-05-23 | Northern Telecom Limited | Method of making circuit board pin |
US5893779A (en) * | 1996-10-18 | 1999-04-13 | Autosplice Systems Inc. | Conforming press-fit contact pin for printed circuit board |
DE202006000183U1 (de) * | 2006-01-07 | 2006-05-11 | Sorig, Ludger | Einpresskontaktstift |
Also Published As
Publication number | Publication date |
---|---|
DE102010040561A1 (de) | 2012-03-15 |
WO2012032077A1 (de) | 2012-03-15 |
EP2614559B1 (de) | 2017-11-15 |
CN103109422A (zh) | 2013-05-15 |
EP2614559A1 (de) | 2013-07-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |