CN103086320B - A kind of new producing method of flexible wall hot line microsensor - Google Patents
A kind of new producing method of flexible wall hot line microsensor Download PDFInfo
- Publication number
- CN103086320B CN103086320B CN201310021415.2A CN201310021415A CN103086320B CN 103086320 B CN103086320 B CN 103086320B CN 201310021415 A CN201310021415 A CN 201310021415A CN 103086320 B CN103086320 B CN 103086320B
- Authority
- CN
- China
- Prior art keywords
- flexible
- microsensor
- hot line
- etching
- wall hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Micromachines (AREA)
Abstract
The invention discloses a kind of new producing method of flexible wall hot line microsensor, belong to MEMS (MEMS) field.The present invention adopts flexible metal carrier to realize the fixing of flexible substrate in process, the graphical of flexible substrate front device and wire is realized by standard photolithography process, then at front coated with parylene (Parylene) conduct protection and strengthening layer, then photosensitive blue film is attached at the carrier back side, flexible metal, mask exposure and wet etching is adopted to realize the graphical of flexible metal carrier, form the hard mask being used for flexible substrate etching, the local etching of flexible substrate is realized again by reactive ion etching (RIE), the method having etched rear employing high-temperature heating realizes being separated of sensor and flexible metal carrier.The method effectively can protect the sensing unit of flexible wall hot line microsensor, and improve the performance of sensor, service life also can significantly increase.
Description
Art:
The present invention relates to a kind of new producing method of flexible wall hot line microsensor, belong to MEMS (MEMS) field.
Background technology:
Hot-wire transducer is one of measuring element important in information of flow field tests.Its efficient as one, reliable measuring element, is usually used in the detection of flow field flow state.Based on the wall hot line microsensor of MEMS because having fast, the highly sensitive and signal to noise ratio advantages of higher of dynamic response, be with a wide range of applications in fluid wall shear stress and nonstationary flow are measured.And adopt the wall hot line microsensor of polyimide flex substrate not only to have all advantages of conventional wall hot line microsensor, and the measurement of the various complex profiles such as wing, fuselage and turbo blade can be applied to, the experimental aerodynamics for correlation model provides reliable supporting method.
The typical structure of flexible wall hot line microsensor designs a cavity structure at the lower surface of sensing element, and sensing element is contacted completely with air.Berlin, Germany polytechnical university began one's study from 2005 the flexible wall hot line microsensor of this structure, its process implementation method is for first forming sensing element at polyimide flex substrate surface by photoetching process, then at its surface deposition layer of metal film, this metal film layer graphical again, it is made to carry out the dry etching of polyimides as mask, utilize root to cut effect (footing effect) and realize the unsettled of sensing element, finally mask metal layer is removed by wet etching.
The deficiency of this preparation method is after formation cavity structure, the sensing element formed can be corroded while wet etching removes mask metal layer, affect dimensional parameters and the measurement performance of sensing element, hot line sensing unit is made not reach designing requirement, easy fracture, reduce its service life, thus affect the performance of sensor.
Summary of the invention:
In order to overcome the shortcoming of the corrosion-susceptible unit that prior art is brought due to front etching flexible substrates, the invention provides a kind of process of flexible hot line microsensor back-etching flexible substrates.In order to compatible with standard MEMS processes, the present invention adopts hard substrates to realize the fixing of flexible substrates in process, the graphical of flexible substrates front device and wire is realized by standard photolithography process, then front coated with parylene as protection and strengthening layer, then photosensitive blue film is attached at the hard substrates back side, mask exposure and wet etching is adopted to realize the graphical of metallic carrier, form the hard mask being used for flexible substrates etching, the local etching of flexible substrates is realized again by reactive ion etching, the method having etched rear employing high-temperature heating realizes being separated of sensor and hard substrates.
The present invention solves the technical scheme that its technical problem is taked: a kind of new producing method of flexible wall hot line microsensor, comprises the steps:
Step 1: surface finish and cleaning are carried out to hard substrates;
Step 2: at hard substrates upper surface spin coating PDMS, described PDMS, as bonding agent, makes Kapton combine with hard substrates;
Step 3: Kapton is covered on the hard substrates surface that spin coating has PDMS, adopt temperature-pressure device to realize laminating, described Kapton forms the flexible substrates 2 of flexible wall hot line microsensor;
Step 4: deposit the first metal layer and the second metal level successively at polyimide surface, forms sensing element 1 and wire 5 after graphical;
Step 5: at the sensing element 1 of formation and the surface deposition Parylene 4 of wire 5;
Step 6: graphical to hard substrates, forms the mask layer of cavity 3;
Step 7: using patterned hard substrates as mask, carries out the etching of PDMS and polyimides, forms cavity 3;
Step 8: heating hard substrates, realizes the stripping of flexible wall hot line microsensor and hard substrates.
The invention has the beneficial effects as follows:
1) adopt hard substrates as the carrier in process, not only can be compatible with MEMS technology, and the mask of polyimides etching can be used as;
2) in process, the pattern precision of sensing element is easy to ensure, can not affect sensing element in the process of carrying out flexible substrates back-etching;
3) pass through sensing element upper surface coated with parylene diaphragm, make device obtain protection in processing and use procedure, the flexible hot line microsensor machined even also can be applied in adverse circumstances.
Below in conjunction with drawings and Examples, the present invention is elaborated.
Accompanying drawing illustrates:
Fig. 1 is flexible wall hot line micro-sensor structure schematic diagram in embodiment;
Fig. 2 is the A-A sectional view of Fig. 1;
Fig. 3 is flexible wall hot line microsensor fabrication processing figure in embodiment 1
In figure, 1-sensing element; 2-flexible substrate; 3-cavity; 4-Parylene; 5-wire;
Detailed description of the invention:
Embodiment one:
The present embodiment proposes the method at flexible hot line microsensor back-etching, and mainly the patterning process of sensing element is wet corrosion technique, specifically comprises the steps:
Step 1: be that the Copper Foil of 100 microns is cut to the disk that diameter is 80mm by thickness, and adopt polishing machine to carry out surface finish, carry out the cleaning of Copper Foil after polishing;
Step 2: the PDMS of copper foil surface spin coating 5 micron thickness after cleaning, wherein the ratio of PDMS proportioning glue and curing agent is 10:1; Rotating speed is 2500RPM;
Step 3: be that the Kapton of 125 microns is covered on the copper foil surface that spin coating has PDMS by thickness, adopt temperature 70 C, pressure 130Pa fits;
Step 4: Copper Foil is put into sputtering cavity as the polyimides of carrier, deposit the nickel of 0.3 μm and the Copper thin film of 2 μm respectively, adoption rate is ammonium persulfate: hydrogen peroxide: the solution wet etching of water=1:1:20 realizes the graphical of copper conductor, adopts the FeCl of 30%
3solution realizes the graphical of nickel sensing element;
Step 5: the substrate after graphical is placed in the special parylene deposition equipment in SCS PDS2010 laboratory together with carrier, deposition 2-3 micron Parylene, is used as protection and invigoration effect.
Step 6: attach photosensitive blue film at the Copper Foil back side, developed by mask exposure, adopt FeCl after development
3solution wet etching Copper Foil also realizes graphical.
Step 7: whole slice, thin piece is inverted and comes, put into RIE etching apparatus, carried out the etching of polyimides by patterned Copper Foil.
Step 8: Copper Foil is heated to 80 DEG C, realizes being separated of polyimides substrate and PDMS.
Embodiment two:
The present embodiment proposes the method at flexible hot line microsensor back-etching, and mainly the graphic method of sensing element is stripping technology, specifically comprises the steps:
Step 1: be that the aluminium foil of 100 microns is cut to the disk that diameter is 80mm by thickness, and adopt polishing machine to carry out surface finish, carry out the cleaning of aluminium foil after polishing;
Step 2: the PDMS of aluminium foil surface spin coating 5 micron thickness after cleaning, wherein the ratio of PDMS proportioning glue and curing agent is 10:1; Rotating speed is 2500RPM;
Step 3: be that the Kapton of 125 microns is covered on the copper foil surface that spin coating has PDMS by thickness, adopt temperature 70 C, pressure 130Pa fits;
Step 4: using the polyimides spin coating photoresist of aluminium foil as carrier, and exposure imaging, put into sputtering cavity by the slice, thin piece after photoetching offset plate figure, deposit the platinum of 0.3 μm, the carrier depositing platinum film is carried out ultrasonic vibration, realize the smooth stripping of platinum film; Adopting uses the same method realizes the graphical of the gold thin film of 2 μm;
Step 5: the substrate after graphical is placed in the special parylene deposition equipment in SCS PDS2010 laboratory together with carrier, deposition 2-3 micron Parylene, is used as protection and invigoration effect.
Step 6: attach photosensitive blue film at the aluminium foil back side, developed by mask exposure, is adopted aluminium etching liquid wet etching aluminium foil and realizes graphical after development.
Step 7: whole slice, thin piece is inverted and comes, put into RIE etching apparatus, carried out the etching of polyimides by patterned aluminium foil.
Step 8: aluminium foil is heated to 80 DEG C, realizes being separated of polyimides substrate and PDMS.
Claims (1)
1. a new producing method for flexible wall hot line microsensor, comprises the steps:
Step 1: surface finish and cleaning are carried out to hard substrates;
Step 2: at hard substrates upper surface spin coating PDMS;
Step 3: Kapton is covered on the hard substrates surface that spin coating has PDMS, adopt temperature-pressure device to realize laminating, described Kapton forms the flexible substrates (2) of flexible wall hot line microsensor;
Step 4: deposit the first metal layer and the second metal level successively at polyimide surface, forms sensing element (1) and wire (5) after graphical;
Step 5: at the sensing element (1) of formation and the surface deposition Parylene (4) of wire (5);
Step 6: graphical to hard substrates, forms the mask layer of cavity (3);
Step 7: using patterned hard substrates as mask, carries out the etching of PDMS and polyimides, forms cavity (3);
Step 8: heating hard substrates, realizes the stripping of flexible wall hot line microsensor and hard substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310021415.2A CN103086320B (en) | 2013-01-21 | 2013-01-21 | A kind of new producing method of flexible wall hot line microsensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310021415.2A CN103086320B (en) | 2013-01-21 | 2013-01-21 | A kind of new producing method of flexible wall hot line microsensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103086320A CN103086320A (en) | 2013-05-08 |
| CN103086320B true CN103086320B (en) | 2015-08-05 |
Family
ID=48199528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310021415.2A Active CN103086320B (en) | 2013-01-21 | 2013-01-21 | A kind of new producing method of flexible wall hot line microsensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103086320B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109141731A (en) * | 2018-07-26 | 2019-01-04 | 西北工业大学 | A kind of flexible base microsensor can be used for underwater turbulent boundary layer wall surface surging pressure test and its manufacturing method |
| CN109904080B (en) * | 2019-03-20 | 2020-10-02 | 北京京东方显示技术有限公司 | Driving backboard, manufacturing method thereof and display device |
| US11001535B2 (en) * | 2019-04-26 | 2021-05-11 | Applied Materials, Inc. | Transferring nanostructures from wafers to transparent substrates |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950644A (en) * | 2010-09-09 | 2011-01-19 | 西北工业大学 | Manufacturing method of flexible heat-sensitive thin film resistor array |
| CN102519657A (en) * | 2011-11-22 | 2012-06-27 | 上海交通大学 | Two-dimensional vector flexible thermo-sensitive micro-shearing stress sensor, and array and preparation method thereof |
| CN102539029A (en) * | 2012-02-29 | 2012-07-04 | 上海交通大学 | Three-dimensional fluid stress sensor based on flexible MEMS (microelectromechanical system) technology and array thereof |
| CN102701140A (en) * | 2012-05-06 | 2012-10-03 | 西北工业大学 | Method for processing suspended silicon thermistor |
| CN102798648A (en) * | 2012-07-30 | 2012-11-28 | 中国科学院微电子研究所 | Method for preparing sensor membrane material based on flexible substrate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3679478B2 (en) * | 1995-11-29 | 2005-08-03 | 三洋電機株式会社 | Bending film-like solar cell element |
| TW201026513A (en) * | 2009-01-08 | 2010-07-16 | Univ Nat Cheng Kung | Imprinting process of polyimide |
-
2013
- 2013-01-21 CN CN201310021415.2A patent/CN103086320B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950644A (en) * | 2010-09-09 | 2011-01-19 | 西北工业大学 | Manufacturing method of flexible heat-sensitive thin film resistor array |
| CN102519657A (en) * | 2011-11-22 | 2012-06-27 | 上海交通大学 | Two-dimensional vector flexible thermo-sensitive micro-shearing stress sensor, and array and preparation method thereof |
| CN102539029A (en) * | 2012-02-29 | 2012-07-04 | 上海交通大学 | Three-dimensional fluid stress sensor based on flexible MEMS (microelectromechanical system) technology and array thereof |
| CN102701140A (en) * | 2012-05-06 | 2012-10-03 | 西北工业大学 | Method for processing suspended silicon thermistor |
| CN102798648A (en) * | 2012-07-30 | 2012-11-28 | 中国科学院微电子研究所 | Method for preparing sensor membrane material based on flexible substrate |
Non-Patent Citations (2)
| Title |
|---|
| "柔性微热剪切应力传感器阵列";王文君;《上海交通大学学报》;20120630;第46卷(第6期);第986页第2部分，图4 * |
| 马炳和."溅射-电镀微成型制造柔性热膜传感器阵列".《航空学报》.2011,第32卷(第11期), * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103086320A (en) | 2013-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101950644B (en) | Manufacturing method of flexible heat-sensitive thin film resistor array | |
| Kottapalli et al. | A liquid crystal polymer membrane MEMS sensor for flow rate and flow direction sensing applications | |
| JP4873659B2 (en) | Method for directly determining the boiling point of a fluid | |
| CN103086320B (en) | A kind of new producing method of flexible wall hot line microsensor | |
| CN105548606A (en) | Flexible flow velocity sensor based on MEMS, application of flexible flow velocity sensor, and preparation method for flexible flow velocity sensor | |
| CN105259733B (en) | One kind being used for the patterned flexible mask plate preparation method of curved surface | |
| CN109553061A (en) | Novel " sandwich " the structural flexibility hotting mask microsensor of one kind and production method | |
| CN109916501B (en) | MEMS thermal type sound particle vibration velocity sensor with sound field enhanced microstructure and method | |
| CN107917750A (en) | A kind of MEMS hot types sound particle sensor | |
| CN109141731A (en) | A kind of flexible base microsensor can be used for underwater turbulent boundary layer wall surface surging pressure test and its manufacturing method | |
| CN101917784A (en) | Three-dimensional micro heater with groove-shaped heating film region and manufacturing method thereof | |
| CN103663353A (en) | Air sound particle vibration velocity sensor and manufacturing method of air sound particle vibration velocity sensor | |
| CN108931321A (en) | Beam-island-film integration resonant mode pressure sensor structure and manufacturing method | |
| CN107167630A (en) | A kind of design of MEMS acceleration transducers based on flexible material and preparation method thereof | |
| Mat Nawi et al. | Review of MEMS flow sensors based on artificial hair cell sensor | |
| CN115863183B (en) | Manufacturing method of micro-flow channel with measurable flow for heat dissipation of three-dimensional integrated wafer system | |
| CN102175287A (en) | Measurement component of flow meter chip based on MEMS (micro electronic mechanical system) technology and manufacturing method thereof | |
| Li et al. | A novel five-wire micro anemometer with 3D directionality for low speed air flow detection and acoustic particle velocity detecting capability | |
| CN203798395U (en) | Graphene micro flow sensor | |
| CN107543648B (en) | High temperature shear stress sensor based on double F-P chambers and preparation method thereof | |
| Abbas et al. | MEMS sensors for flow separation detection | |
| CN107192849A (en) | A kind of design of micro-machine acceleration transducer based on thermal convection principle and preparation method thereof | |
| CN108981979B (en) | Ceramic-based high-temperature-resistant fluid wall shear stress microsensor chip and manufacturing process thereof | |
| Borisenkov et al. | Multiarray micromachined probe for turbulence measurements assembled of suspended hot-film sensors | |
| CN208060548U (en) | The micro- current meter of double mode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Yuan Weizheng Inventor after: Ma Binghe Inventor after: Zhu Pengfei Inventor after: Ma Xulun Inventor after: Deng Jinjun Inventor before: Ma Binghe Inventor before: Zhu Pengfei Inventor before: Ma Xulun Inventor before: Deng Jinjun |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20130508 Assignee: Xi'an reet mechatronic measurement and Control Technology Co., Ltd. Assignor: Northwestern Polytechnical University Contract record no.: 2018610000015 Denomination of invention: Novel manufacturing method of hot wire micro-sensor with flexible wall surface Granted publication date: 20150805 License type: Common License Record date: 20180424 |