CN103078477A - Intelligent power module terminal and connection structure thereof - Google Patents
Intelligent power module terminal and connection structure thereof Download PDFInfo
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- CN103078477A CN103078477A CN2013100336662A CN201310033666A CN103078477A CN 103078477 A CN103078477 A CN 103078477A CN 2013100336662 A CN2013100336662 A CN 2013100336662A CN 201310033666 A CN201310033666 A CN 201310033666A CN 103078477 A CN103078477 A CN 103078477A
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Abstract
The invention relates to an intelligent power module terminal and a connection structure thereof. The terminal is of a step structure, and comprises a connection column which is vertically positioned, an upper bonding seat which is arranged on the lower part of the connection column, a lower bonding seat on the bottom, and a connection seat which is vertically positioned between the upper bonding seat and the lower bonding seat. The terminals are embedded on the periphery of a shell window at interval, the connection seats of the terminals are arranged in a shell, the lower bonding seats are fixed on a lower step surface of the window, the upper bonding seats are fixed on an upper step surface of the window, the connection columns penetrate out of the upper end face of the shell, a main circuit board is sealed and fixed on the bottom of the shell, the lower bonding seats of the terminals are bonded with the main circuit board through metal bonding wires, and the upper bonding seats of the terminals are bonded with a drive circuit board, which is arranged in the shell, through the metal bonding wires. The intelligent power module terminal and the connection structure thereof have the characteristics of reasonability in structure, small size, firmness in terminal bonding and improved working reliability.
Description
Technical field
The present invention relates to a kind of Intelligent Power Module terminal and syndeton thereof, belong to power model manufacturing technology field.
Background technology
Intelligent Power Module (being called for short IPM) is widely used in ac motor speed control by variable frequency and direct current machine chopping regulating speed and various high-performance power supply, such as fields such as UPS, induction heating, electric welding machine, active compensation, DC-DC etc. and industrial electric automations, wide market is arranged.The traditional intelligence power semiconductor modular mainly comprises shell, main circuit board and drive circuit board, each device such as semiconductor chip and a plurality of terminal soldering are covering the cermet substrate and are consisting of main circuit board, and the printed circuit board (PCB) that is welded with integrated circuit (IC) chip and each device consists of drive circuit board, for reducing the volume of power model, drive circuit board is passed through on the screw mounting casing, terminal need pass terminal hole on the cover plate of outer casing and the terminal hole on the drive circuit board, again by scolder with terminal soldering on drive circuit board, realize input and output that are connected and drive signal with the power semiconductor modular external circuit by terminal.
At present the terminal on the power model mostly by the scolder high temperature sintering on the metal level that covers the cermet substrate, terminal comprises electrode terminal and signal terminal, in welding process, can make the metal level and the terminal that cover the cermet substrate produce welding stress at the solder layer place under the high temperature, and the operational environment of Intelligent Power Module is to circulate at-40 ℃ to 125 ℃, therefore after working after a while, can cause that finally metal level and the terminal junction of covering the cermet substrate come off, and produce the solder joint fatigue phenomenon, thereby have influence on the life-span of overall power device.Secondly, terminal adopts scolder to be welded on the metal level that covers the cermet substrate, not only layer on surface of metal and the terminal surfaces of covering the cermet substrate are had relatively high expectations, especially the metal level that covers the cermet substrate is also can have the thermal expansion difference between the copper material of Copper Foil and electrode terminal, welding performance is not high, and it is electrical and impact is led.Protective gas when welding process not only needs scolder, scaling powder and welding simultaneously; not only the high temperature sintering welding sequence time is long; and the high temperature that produces easily causes again other part material metallic character reductions; in addition factors such as the scolder in welding process trickling and welding resistance printing ink; the risk that can cause again solder side to stain; it is wayward that existing terminal soldering all exists solder side, complex operation, the problem that welding efficiency is low.Moreover, the electrode terminal technique of need to bending, but the dynamics of the bending of electrode terminal and angle are wayward, and bending technique is had relatively high expectations, electrode terminal also can crack at bending part on the one hand, causes the problem of local electrical resistance increase because of the existence of cracks.A plurality of electrode terminals after the bending are not easy at sustained height on the other hand, also can cause drive circuit board and termination contact is bad and contact resistance that cause is excessive, and then cause the phenomenon of local overheating, also can affect the fastness of terminal junction.
Summary of the invention
The purpose of this invention is to provide a kind of rational in infrastructurely, volume is little, and the terminal bonding is firm, can improve Intelligent Power Module terminal and the syndeton thereof of functional reliability.
The present invention is that the technical scheme that achieves the above object is: a kind of Intelligent Power Module terminal, it is characterized in that: terminal is terraced structure, and terminal comprises the lower bonding seat of the perpendicular joint pin of putting, the upper bonding seat that is arranged on the joint pin bottom, bottom and the perpendicular Connection Block of putting between upper bonding seat and lower bonding seat.
A kind of syndeton of Intelligent Power Module terminal, it is characterized in that: described terminal interlocking is at the periphery of shell window, the Connection Block setting of terminal in the enclosure, lower bonding seat is fixed on the leave from office terrace place of window, upper bonding seat is fixed on the terrace place of appearing on the stage of window, the upper surface that joint pin passes shell, the main circuit board sealing is fixed on the bottom of shell, the lower bonding seat of terminal is by metallic bond plying and main circuit board bonding, and the upper bonding seat of terminal is by metallic bond plying and the drive circuit board bonding that arranges in the enclosure.
Terminal of the present invention is terraced structure, therefore can process mechanically, energy is size and the evenness of control terminal well, because terminal is that interlocking is at the window periphery of shell, therefore after shell makes, the upper bonding seat that can realize all terminals is controlled at same plane, the lower bonding seat of all terminals also is controlled at same plane simultaneously, the present invention is fixed on terminal on the shell, especially the lower bonding seat of terminal is fixed on the leave from office terrace of window, bonding seat is fixed on the terrace of appearing on the stage of window on it, terminal and shell coupling part can both be wrapped in the enclosure, greatly strengthen the firm degree that terminal connects, terminal can not rock, and can avoid it to rock and the power loss that causes.When the present invention is fixed on outer casing bottom with the main circuit board sealing, because the lower joining base of terminal is positioned at the leave from office terrace place of window, upper joining base is positioned on the terrace of appearing on the stage of window, by the metallic bond plying with the lower bonding seat of terminal and main circuit board carries out bonding and during with upper bonding seat and drive circuit board bonding, by the parcel of shell to the Connection Block of terminal, especially the up and down bonding seat of terminal all can not rock, firm degree and the reliability of terminal bonding point can have been increased substantially, solve main circuit board and drive circuit board and termination contact is bad and contact resistance that cause is excessive, and then caused the problem of local overheating.The present invention is owing to need not terminal is carried out bending technique, so can improve the intensity of terminal self and the bonding strength of bonding point, under vibration environment, can at utmost reduce terminal when bearing mechanical oscillation, mechanical stress and thermal stress and act on its bonding point place, guarantee the functional reliability of Intelligent Power Module under adverse circumstances.The terminal of Intelligent Power Module power of the present invention adopts two bonding platform structures, terminal all passes through metallic bond plying bonding with main circuit board and drive circuit board and is connected, replace in the past in main circuit board and drive plate and terminal soldering technique on the one hand, can reduce the required area of terminal soldering, can make the less of main circuit board and drive circuit board design, further reduce the overall volume of Intelligent Power Module, on the other hand main circuit board and drive circuit board are integrated by shell, reduced outside connection wire, simplify circuit structure, can make the reliable conducting of power device and shutoff, not be vulnerable to external disturbance, and further improve its functional reliability.
Description of drawings
Below in conjunction with accompanying drawing embodiments of the invention are described in further detail.
Fig. 1 is the structural representation of terminal of the present invention.
To be the present invention be fixed on structural representation on the Intelligent Power Module with terminal to Fig. 2.
To be the present invention be fixed on blast structural representation on the Intelligent Power Module with terminal to Fig. 3.
Fig. 4 is the structural representation of shell of the present invention.
Fig. 5 is that the A of Fig. 4 is to structural representation.
Wherein: 1-terminal, 1-1-joint pin, the upper bonding seat of 1-2-, the 1-3-Connection Block, bonding seat under the 1-4-, 2-shell, the spacing projection of 2-1-, 2-2-leave from office terrace, the 2-3-terrace of appearing on the stage, the 2-4-supporting table, 2-5-support column, seam under the 2-6-, the 3-cover plate, 4-main circuit board, the plying of 5-metallic bond, the 6-drive circuit board, 6-1-side stopper slot.
Embodiment
As shown in Figure 1, Intelligent Power Module terminal of the present invention, terminal 1 is terraced structure, terminal 1 comprises the lower bonding seat 1-4 of perpendicular joint pin 1-1, the upper bonding seat 1-2 that is arranged on joint pin 1-1 bottom that puts, bottom and erects the Connection Block 1-3 that puts that between upper bonding seat 1-2 and lower bonding seat 1-4 its joint pin 1-1, upper bonding seat 1-2, Connection Block 1-3 and lower bonding seat 1-4 are all fixing with shell 2.See Fig. 1 shown in, the joint pin 1-1 of terminal 1 of the present invention is inverted T-shaped.Terminal 1 of the present invention is that electrode terminal is or/and signal terminal.
See shown in Fig. 1-5, the syndeton of Intelligent Power Module terminal of the present invention, terminal 1 interlocking is at the periphery of shell 2 windows, and the Connection Block 1-3 of terminal 1 is arranged in the shell 2, lower bonding seat 1-4 is fixed on the leave from office terrace 2-2 place of window, upper bonding seat 1-2 is fixed on the terrace 2-3 place of appearing on the stage of window, the upper surface that joint pin 1-1 passes shell 2.See shown in Fig. 2-5, shell 2 of the present invention has window, ringwise step surface around the window, this step surface is the terrace 2-3 and at leave from office terrace 2-2 and the supporting table 2-4 between the terrace 2-3 of appearing on the stage of appearing on the stage on leave from office terrace 2-2, the top of bottom, and the present invention carries out bonding with a plurality of terminal intervals interlockings at the periphery of shell 2 windows and with main circuit board 4 and drive circuit board 6.
See shown in Fig. 2-5, main circuit board 4 sealings of the present invention are fixed on the bottom of shell 2, the lower bonding seat 1-4 of terminal 1 is by metallic bond plying 5 and main circuit board 4 bondings, metallic bond plying 5 can be adopted aluminium wire, copper wire or copper alloy silk, or aluminium wire and aluminum-alloy wire and existing spun gold or filamentary silver etc., can adopt supersonic bonding, shell 2 of the present invention is provided with lower seam 2-6 in the bottom of window, main circuit board 4 is arranged in the lower seam 2-6 of window and with shell 2 and is tightly connected, and main circuit board 4 is fixed on the bottom of shell 2 by fluid sealant.Main circuit board 4 of the present invention is that the devices such as semiconductor chip, electric capacity, resistance, diode are welded on the conversion of carrying out power on the metal level that covers the metal-insulator substrate, terminal 1 is bonded on the main circuit board 4, by being connected of terminal 1 realization and external power source and equipment.
See shown in Fig. 1-5, the upper bonding seat 1-2 of terminal 1 of the present invention is by metallic bond plying 5 and drive circuit board 6 bondings that are arranged in the shell 2, metallic bond plying 5 can be adopted aluminium wire, copper wire or copper alloy silk, or aluminium wire and aluminum-alloy wire and existing spun gold or filamentary silver etc., 6 of this drive circuit boards are by printed circuit board (PCB) and be welded on the devices such as resistance on the printed circuit board, electric capacity, diode, integrated circuit and consist of, and realize driving the I/O of signal by terminal 1.Shell 2 of the present invention has supporting table 2-4 and spacing projection 2-1 in window, drive circuit board 6 is arranged on the supporting table 2-4, and the side stopper slot 6-1 on the drive circuit board 6 and spacing projection 2-1 match, drive circuit board 6 is installed in the shell 2, the present invention also is provided with support column 2-5 on leave from office terrace 2-2, support column 2-5 and supporting table 2-4 are same plane, increase drive circuit board 6 with this and are bearing in bearing area on the shell 2.The drive circuit board 6 of invention also can directly be connected in the window, and drive circuit board 6 reliably is bearing in the shell 2, and cover plate 3 is fastened on cover top portion, and the joint pin 1-1 of each terminal 1 passes cover plate 3.
The present invention is all wrapped up by shell 2 owing to terminal 1, can strengthen the degree that is connected firmly of terminal 1, no matter by in supersonic bonding and the work, terminal 1 can not rock, improve the firm degree of terminal 1 bonding point, efficiency is avoided rocking the power loss that produces because of terminal 1.
Claims (5)
1. Intelligent Power Module terminal, it is characterized in that: terminal (1) is terraced structure, terminal (1) comprise the lower bonding seat (1-4) of the perpendicular joint pin (1-1) of putting, the upper bonding seat (1-2) that is arranged on joint pin (1-1) bottom, bottom and be positioned at bonding seat (1-2) with lower bonding seat (1-4) between erect the Connection Block (1-3) of putting.
2. Intelligent Power Module terminal according to claim 1, it is characterized in that: the joint pin (1-1) of described terminal (1) is inverted T-shaped.
3. the syndeton of Intelligent Power Module terminal according to claim 1, it is characterized in that: described terminal (1) interlocking is at the periphery of shell (2) window, the Connection Block (1-3) of terminal (1) is arranged in the shell (2), lower bonding seat (1-4) is fixed on the leave from office terrace (2-2) of window and locates, upper bonding seat (1-2) is fixed on the terrace of appearing on the stage (2-3) of window and locates, joint pin (1-1) passes the upper surface of shell (2), main circuit board (4) sealing is fixed on the bottom of shell (2), the lower bonding seat (1-4) of terminal (1) is by metallic bond plying (5) and main circuit board (4) bonding, and the upper bonding seat (1-2) of terminal (1) is by metallic bond plying (5) and drive circuit board (6) bonding that is arranged in the shell (2).
4. the syndeton of Intelligent Power Module terminal according to claim 3, it is characterized in that: described shell (2) is provided with lower seam (2-6) in the bottom of window, and main circuit board (4) is arranged in the lower seam (2-6) of window and with shell (2) and is tightly connected.
5. the syndeton of Intelligent Power Module terminal according to claim 3, it is characterized in that: described shell (2) is provided with supporting table (2-4) and spacing projection (2-1) in window, drive circuit board (6) is arranged on the supporting table (2-4), and the side stopper slot (6-1) on the drive circuit board (6) matches with spacing projection (2-1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310033666.2A CN103078477B (en) | 2013-01-28 | 2013-01-28 | Connection structure of intelligent power module terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310033666.2A CN103078477B (en) | 2013-01-28 | 2013-01-28 | Connection structure of intelligent power module terminal |
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| CN103078477A true CN103078477A (en) | 2013-05-01 |
| CN103078477B CN103078477B (en) | 2015-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310033666.2A Active CN103078477B (en) | 2013-01-28 | 2013-01-28 | Connection structure of intelligent power module terminal |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531555A (en) * | 2013-10-24 | 2014-01-22 | 江苏宏微科技股份有限公司 | Power module comprising welding-free terminals |
| CN111816632A (en) * | 2020-09-02 | 2020-10-23 | 江苏宏微科技股份有限公司 | Power module signal terminal |
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| JP2007215302A (en) * | 2006-02-08 | 2007-08-23 | Toshiba Corp | Inverter apparatus |
| CN101320938A (en) * | 2008-07-15 | 2008-12-10 | 南京银茂微电子制造有限公司 | Multi-use power module |
| CN101453159A (en) * | 2008-12-26 | 2009-06-10 | 南京银茂微电子制造有限公司 | Power terminal having built-in power terminal |
| CN201490187U (en) * | 2009-09-10 | 2010-05-26 | 嘉兴斯达微电子有限公司 | Novel direct bonding power module of power terminal |
| CN201845770U (en) * | 2010-11-04 | 2011-05-25 | 嘉兴斯达微电子有限公司 | Integrated power semiconductor type power module |
| CN102254892A (en) * | 2011-08-10 | 2011-11-23 | 嘉兴斯达微电子有限公司 | Thin high-power semiconductor module |
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2013
- 2013-01-28 CN CN201310033666.2A patent/CN103078477B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007215302A (en) * | 2006-02-08 | 2007-08-23 | Toshiba Corp | Inverter apparatus |
| CN101320938A (en) * | 2008-07-15 | 2008-12-10 | 南京银茂微电子制造有限公司 | Multi-use power module |
| CN101453159A (en) * | 2008-12-26 | 2009-06-10 | 南京银茂微电子制造有限公司 | Power terminal having built-in power terminal |
| CN201490187U (en) * | 2009-09-10 | 2010-05-26 | 嘉兴斯达微电子有限公司 | Novel direct bonding power module of power terminal |
| CN201845770U (en) * | 2010-11-04 | 2011-05-25 | 嘉兴斯达微电子有限公司 | Integrated power semiconductor type power module |
| CN102254892A (en) * | 2011-08-10 | 2011-11-23 | 嘉兴斯达微电子有限公司 | Thin high-power semiconductor module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531555A (en) * | 2013-10-24 | 2014-01-22 | 江苏宏微科技股份有限公司 | Power module comprising welding-free terminals |
| CN103531555B (en) * | 2013-10-24 | 2016-01-20 | 江苏宏微科技股份有限公司 | Exempt from the power model of solder terminal |
| CN111816632A (en) * | 2020-09-02 | 2020-10-23 | 江苏宏微科技股份有限公司 | Power module signal terminal |
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| Publication number | Publication date |
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| CN103078477B (en) | 2015-04-08 |
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| ASS | Succession or assignment of patent right |
Owner name: DELTA ELECTRONICS ENTERPRISE MANAGEMENT (SHANGHAI) Free format text: FORMER OWNER: JIANGSU MACMIC SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150116 |
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Free format text: CORRECT: ADDRESS; FROM: 213022 CHANGZHOU, JIANGSU PROVINCE TO: 201209 |
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Effective date of registration: 20150116 Address after: 201209, Pudong New Area, 1675 East China Road, 1, 1,, 7-8 Applicant after: Delta Electronic Enterprise Management (Shanghai) Co., Ltd. Address before: 213022 No. 18 middle Huashan Road, Xinbei District, Jiangsu, Changzhou Applicant before: Jiangsu Macmic Technology Co., Ltd. |
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| C53 | Correction of patent of invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Liao Xueguo Inventor after: Yuan Dewei Inventor after: Ji Weihao Inventor after: Zhou Yikai Inventor after: Cai Mingyuan Inventor before: Nie Shiyi Inventor before: Zhang Min Inventor before: Zheng Jun Inventor before: Qi Xiaoyan |
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| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: NIE SHIYI ZHANG MIN ZHENG JUN QI XIAOYAN TO: LIAO XUEGUO YUAN DEWEI JI WEIHAO ZHOU YIKAI CAI MINGYUAN |
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| C14 | Grant of patent or utility model | ||
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