CN103074584A - Film coating apparatus - Google Patents
Film coating apparatus Download PDFInfo
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- CN103074584A CN103074584A CN2011103275159A CN201110327515A CN103074584A CN 103074584 A CN103074584 A CN 103074584A CN 2011103275159 A CN2011103275159 A CN 2011103275159A CN 201110327515 A CN201110327515 A CN 201110327515A CN 103074584 A CN103074584 A CN 103074584A
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- film coating
- coating apparatus
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Abstract
The invention provides a film coating apparatus. The film coating apparatus comprises a bearing desk and a conductive lattice loop, wherein the bearing desk comprises a bearing surface used for bearing a workpiece to be coated and allowing the to-be-coated workpiece to be disposed in an electric field formed by the lattice loop, an ion source is arranged to face the bearing surface of the bearing desk and to be isolated from the bearing surface, the conductive lattice loop is arranged on the lattice loop and surrounds the to-be-coated workpiece, and a rotary focusing accelerating field directing to the to-be-coated workpiece is formed between the conductive lattice loop and the to-be-coated workpiece. The film coating apparatus provided by the invention overcomes the problem of a poor film coating effect on a workpiece with a small size in traditional film coating, processing cost for the apparatus is low, and the apparatus is applicable to large scale mass production.
Description
Technical field
The present invention relates to a kind of film coating apparatus, relate in particular to a kind of film coating apparatus that strip and the less workpiece plated film of size are carried out.
Background technology
At physical vapor deposition (Physical Vapor Deposition, PVD) in the process, target atom or ion deposition film forming on base material, but because special structure and the shape of small size workpiece to be processed, the small size workpiece with list structure that is difficult to realize such as conventional plated film mode, when carrying out ion film plating, because the less workpiece of size of above-mentioned strip has end face and most advanced and sophisticated position, cause the common curvature of such workpiece surface larger, therefore, electric charge is very easily assembled in most advanced and sophisticated and endface position, produce point discharge, change the electric-field intensity distribution of such workpiece surface, so that it is larger that such workpiece is carried out the difficulty of ion film plating, directly affected plated film quality and the yield of product.
Summary of the invention
In view of this, be necessary to provide a kind of film coating apparatus that can carry out to having the less workpiece of list structure and size plated film.
A kind of film coating apparatus, this film coating apparatus comprises plummer and conductive mesh circle, this plummer comprises a loading end, in order to carry this workpiece to be coated and to make this workpiece to be coated place the formed electric field of this conductive mesh circle, loading end and this loading end of interval towards this plummer are provided with an ion source, this conductive mesh circle is arranged on the plummer, and around workpiece to be coated in the inner, forms the rotary-focusing accelerating field of sensing workpiece to be coated between this conductive mesh circle and the workpiece to be coated.
Utilization of the present invention is installed in the discharge of the conductive mesh circle on the plummer in this film coating apparatus, one rotary-focusing electric field is provided, around the workpiece that is positioned at the conductive mesh circle, produce the even regular focusing electric field of a sensing workpiece, the ion that splashes of plated film accelerates to focus on and be deposited on the workpiece to workpiece under electric field action, thereby overcome the discharge that tapers off to a point of the end face that exists because of its list structure of small size workpiece and most advanced and sophisticated position, change the electric-field intensity distribution of workpiece surface, cause the ion film plating hard problem.
Description of drawings
Fig. 1 is preferred embodiment film coating apparatus stereographic map of the present invention.
Fig. 2 is preferred embodiment film coating apparatus sectional view of the present invention.
Fig. 3 is preferred embodiment film coating apparatus vertical view of the present invention.
The schematic diagram of conductive mesh circle among Fig. 4 the present invention.
The schematic diagram of fixing part and workpiece among Fig. 5 the present invention.
The main element nomenclature
| |
100 |
| |
10 |
| Fixed |
11 |
| The |
20 |
| |
30 |
| |
40 |
| Grid |
50 |
| |
60 |
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Referring to Fig. 1 and Fig. 2, the present invention's the first preferred embodiment provides a kind of film coating apparatus 100, is used for workpiece 30 is carried out vacuum ion membrane plating, and this workpiece to be coated 30 is elongate body or right cylinder preferably, and its size diameter is less than 0.5cm.
This film coating apparatus 100 comprises plummer 10, conductive mesh circle 20 and an ion source 40, and this ion source 40 can sputter plated film ion 41, and this conductive mesh circle 20 and these workpiece to be coated 30 concentric ground are fixed on the plummer 10.
Referring to Fig. 2-3, this plummer 10, be roughly a disc, which is provided with a loading end, the center of this plummer 10 is provided with fixed part 11, and this fixed part 11 is a disk that arranges with plummer 10 concentrics, and this disk bottom is provided with a tumbler pin 111, the top of this fixed part 11 is provided with several grooves (not shown), and this groove can be fixed workpiece to be coated 30.
Further referring to Fig. 4, this conductive mesh circle 20 is the cylinder of a upper and lower opening and hollow, and the bottom margin of this conductive mesh circle 20 is provided with some fixedly pins 21, and the perisporium of this conductive mesh circle 20 is provided with some identical and equidistant through holes 23.The disc plummer 10 concentric settings of this conductive mesh circle 20 and plummer 10, and by this fixedly pin 21 be fixed on the plummer 10.In the preferred embodiment of the invention, the mode that this conductive mesh circle 20 is formed at plummer 10 can enter for the loading end phase riveting by fixing pin 21 and plummer 10, embedding or bonding, also can be other conventional fixed forms.When workpiece to be coated 30 was fixed in plummer 10 middle part, workpiece 30 to be coated was positioned at this conductive mesh circle 20 simultaneously.This conductive mesh circle 20 can at the uniform velocity rotate around workpiece to be coated 30 with this plummer 10.
Referring to Fig. 1-2, these plummer 10 tops are provided with an ion source 40, and it can provide plated film ion 41 when plated film, be provided with grid bias power supply 50 between this ion source 40 and the workpiece 30, can apply bias voltage between ion source 40 and workpiece 30.
Referring to Fig. 3, when using this film coating apparatus 100, comprise following basic step:
1) provide above-mentioned film coating apparatus 100, this conductive mesh circle 20 arranges with the loading end concentric of plummer 10, and is fixed on the plummer 10;
2) open film coating apparatus 100, make to produce an accelerating field E between conductive mesh circle 20 and the workpiece to be coated 30, the ion 41 that the ion source 40 from film coating apparatus 100 sputters is directed and is deposited on workpiece to be coated 30 surfaces under the effect of described electric field E.
Details are as follows for above-mentioned basic step:
During implementation step 2, this conductive mesh circle 20 is together rotated with plummer 10,20 pairs of workpiece of conductive mesh circle 30 form shielding effect.In this process, this conductive mesh circle 20 is anodal, this workpiece to be coated 30 is negative pole, and by horizontal accelerating power source 60 power supplies that are connected between conductive mesh circle 20 and the workpiece 30, between conductive mesh circle 20 and workpiece 30, form thus the focusing accelerating field E of the rotation of sensing workpiece 30 to be coated.This accelerating field E is used for guiding the target ions 41 that are splashed in this conductive mesh circle 20 to be splashed to this workpiece to be coated 30 surfaces, to realize treating film-coating workpiece 30 plated films.
During ion source 40 work, 40 plasma sputters 41 that form from the cathode ion source, under grid bias power supply 50 effects, march on towards at a high speed the workpiece 30 on the plummer, when moving to transverse electric field E zone, ion 41 is subject to the electrical forces of a sensing workpiece, and ion produces the lateral velocity V of a sensing workpiece under this electrical forces effect
1Speed V with horizontal direction
2, ion is under the comprehensive action of lateral velocity component and vertical component, with " class flat throw " movement velocity V motion and be deposited on the workpiece.When ion the closer to workpiece because the overstepping the bounds of propriety cloth of electric field line of electric field of living in is intensive, strength of electric field is larger, ion 41 suffered electrical forcess are just larger, ion can be deposited on workpiece 30 surfaces with ever-increasing acceleration.
Be appreciated that, in the second preferred embodiment, the fixed part 11 at plummer 10 centers of this film coating apparatus 100 can self drive its top when plated film workpiece 30 at the uniform velocity rotates, at this moment, but be fixed in one heart 20 transfixions of conductive mesh circle of plummer 10, the mode of the workpiece 30 that the electric field E guiding plated film ion bombardment that forms therebetween and sputter are to be coated is identical with the first preferred embodiment.
Compare prior art, utilization of the present invention is installed in 20 discharges of the conductive mesh circle on the plummer 10 in this film coating apparatus 100, produce the rotary-focusing electric field E of a sensing workpiece 30 around the workpiece 30 among conductive mesh circle 20, the ion 41 that splashes to be coated accelerates to focus on exactly and be deposited on the workpiece 30 to workpiece 30 under electric field E effect, thereby overcome the discharge that tapers off to a point of the end face that exists because of undersized workpiece 30 its list structures and most advanced and sophisticated position, changed the electric-field intensity distribution on workpiece 30 surfaces, and the plated film hard problem.That is to say, realize having list structure and size than small workpiece 30 surface coatings.And the present invention produces a focusing rotating electric field E by conductive mesh circle 20 is set near workpiece 30, accelerate sedimentation velocity, significantly improves the bonding force of rete and workpiece 30.And low processing cost, be fit to scale of mass production.
Claims (8)
1. film coating apparatus, it is characterized in that: this film coating apparatus comprises plummer and conductive mesh circle, this plummer comprises a loading end, in order to this workpiece to be coated of carrying, make this workpiece to be coated place the formed electric field of this conductive mesh circle, loading end and this loading end of interval towards this plummer are provided with an ion source, this conductive mesh circle is arranged on the plummer, and form around workpiece to be coated in the inner, the rotary-focusing accelerating field of sensing workpiece to be coated between this conductive mesh circle and the workpiece to be coated.
2. film coating apparatus as claimed in claim 1 is characterized in that: described conductive mesh circle comprises a fixing pin, and by this fixedly pin be fixed on this plummer.
3. film coating apparatus as claimed in claim 1 is characterized in that: the described conductive mesh circle transfixion that is fixed on the plummer, the described workpiece that is fixed on the fixed part is in the uniform rotation of plummer center.
4. film coating apparatus as claimed in claim 1, it is characterized in that: this conductive mesh circle is the cylinder of a upper and lower opening and hollow, this cylinder perisporium is provided with some identical and equidistant through holes.
5. such as the described film coating apparatus of claim 1-3 any one, it is characterized in that: workpiece to be coated is elongate body or cylinder, and its size diameter is less than 0.5cm.
6. film coating apparatus as claimed in claim 5 is characterized in that: this workpiece to be coated is fixed in plummer by riveted, bonding or embedded mode.
7. film coating apparatus as claimed in claim 1 is characterized in that: be provided with accelerating power source between the workpiece on this conductive mesh circle and the fixed part.
8. film coating apparatus as claimed in claim 1 is characterized in that: this conductive mesh circle and be located thereon between the ion source of section and be provided with grid bias power supply.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103275159A CN103074584A (en) | 2011-10-25 | 2011-10-25 | Film coating apparatus |
| TW100139419A TW201317377A (en) | 2011-10-25 | 2011-10-28 | Coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103275159A CN103074584A (en) | 2011-10-25 | 2011-10-25 | Film coating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103074584A true CN103074584A (en) | 2013-05-01 |
Family
ID=48151276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103275159A Pending CN103074584A (en) | 2011-10-25 | 2011-10-25 | Film coating apparatus |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103074584A (en) |
| TW (1) | TW201317377A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS531139A (en) * | 1976-06-25 | 1978-01-07 | Ulvac Corp | Method of coating inner surface of tube with metal* etc* |
| CN2099135U (en) * | 1991-10-26 | 1992-03-18 | 陆国民 | Plasma film coating machine for columnar target |
| JP2000080467A (en) * | 1998-09-01 | 2000-03-21 | Toyota Motor Corp | Formation of thin film and thin film forming device |
| CN101240411A (en) * | 2007-02-08 | 2008-08-13 | 鸿富锦精密工业（深圳）有限公司 | Sputtering type coating device and method |
| CN101861409A (en) * | 2007-11-19 | 2010-10-13 | 荏原优吉莱特株式会社 | Sputtering apparatus and film forming method |
-
2011
- 2011-10-25 CN CN2011103275159A patent/CN103074584A/en active Pending
- 2011-10-28 TW TW100139419A patent/TW201317377A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS531139A (en) * | 1976-06-25 | 1978-01-07 | Ulvac Corp | Method of coating inner surface of tube with metal* etc* |
| CN2099135U (en) * | 1991-10-26 | 1992-03-18 | 陆国民 | Plasma film coating machine for columnar target |
| JP2000080467A (en) * | 1998-09-01 | 2000-03-21 | Toyota Motor Corp | Formation of thin film and thin film forming device |
| CN101240411A (en) * | 2007-02-08 | 2008-08-13 | 鸿富锦精密工业（深圳）有限公司 | Sputtering type coating device and method |
| CN101861409A (en) * | 2007-11-19 | 2010-10-13 | 荏原优吉莱特株式会社 | Sputtering apparatus and film forming method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201317377A (en) | 2013-05-01 |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130501 |