CN103060759A

CN103060759A - Coating device

Info

Publication number: CN103060759A
Application number: CN2011103226947A
Authority: CN
Inventors: 黄登聪; 彭立全
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2011-10-21
Filing date: 2011-10-21
Publication date: 2013-04-24
Also published as: TW201317376A

Abstract

The invention discloses a coating device, which is used for coating workpieces to be coated. The coating device comprises a bearing platform and at least one pair of conductive flat panels. The bearing platform comprises a bearing surface which is used for bearing the workpieces to be coated and placing the workpieces to be coated in an electric field formed by the conductive flat panels. An ion source is arranged towards the bearing surface of the bearing platform and an interval is formed between the bearing surface and ion source. The conductive flat panels are vertical to the bearing surface of the bearing platform and are arranged on the bearing platform, and are symmetrically arranged on two sides of the bearing platform by the workpieces to be coated as the center, and the conductive flat panels rotate at a constant speed relative to the coated workpieces. The coating device overcomes the problem of poor coating effect of the workpieces of small size in a traditional coating mode; and the coating device is low in processing cost and suitable for using in large-scale mass production.

Description

Film coating apparatus

Technical field

The present invention relates to for a kind of film coating apparatus, relate in particular to a kind of device that strip and the less workpiece of size is carried out plated film.

Background technology

At physical vapor deposition (Physical Vapor Deposition, PVD) in the process, target atom or ion deposition film forming on base material, but because special structure and the shape of small size workpiece to be processed, the small size workpiece with list structure that is difficult to realize such as conventional plated film mode, when carrying out ion film plating, because the less workpiece of size of above-mentioned strip has end face and most advanced and sophisticated position, cause the common curvature of such workpiece surface larger, therefore, electric charge is very easily assembled in most advanced and sophisticated and endface position, produce point discharge, change the electric-field intensity distribution of such workpiece surface, so that it is larger that such workpiece is carried out the difficulty of ion film plating, directly affected plated film quality and the yield of product.

Summary of the invention

In view of this, be necessary to provide a kind of film coating apparatus that can carry out to having the less workpiece of list structure and size plated film.

A kind of film coating apparatus, be used for treating film-coating workpiece and carry out plated film, this film coating apparatus comprises plummer and at least one pair of conducting plate, this plummer comprises a loading end, in order to the electric field that carries this workpiece to be coated and make this workpiece to be coated place this conducting plate to form, loading end and this loading end of interval towards this plummer are provided with an ion source, this conducting plate is arranged on the plummer perpendicular to the loading end of this plummer, and centered by workpiece to be coated, being symmetricly set in its both sides, this conducting plate at the uniform velocity rotates with respect to film-coating workpiece.

Utilization of the present invention is installed in the discharge of the conducting plate on the carrier in this film coating apparatus, one rotary-focusing electric field is provided, around the workpiece between two conducting plates, produce the focusing electric field of a sensing workpiece, the ion that splashes of plated film accelerates to focus on and be deposited on the workpiece to workpiece under electric field action, causes the ion film plating hard problem thereby overcome the taper off to a point electric-field intensity distribution that changes workpiece surface of discharging of the end face that exists because of its list structure of small size workpiece and most advanced and sophisticated position.

Description of drawings

Fig. 1 is preferred embodiment film coating apparatus stereographic map of the present invention.

Fig. 2 is preferred embodiment film coating apparatus vertical view of the present invention.

Electric field schematic diagram between conducting plate and the workpiece among Fig. 3 the present invention.

The vertical view of another embodiment film coating apparatus among Fig. 4 the present invention.

The main element nomenclature

Film coating apparatus	100
		Plummer	10
The workpiece fixed part	11
		Conducting plate	20
Workpiece	30
		Ion source	40

Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.

Embodiment

Referring to Fig. 1-3, preferred embodiment of the present invention provides a kind of film coating apparatus 100, be used for carrying out plated film to having the less workpiece of list structure and size 30, this workpiece to be coated 30 is chosen as the less elongate body of a size, it is a right cylinder that this elongate body also can be, and the size of its diameter can be less than 0.5cm.This film coating apparatus 100 comprises plummer 10, at least one pair of conducting plate 20 and an ion source 40.This at least one pair of conducting plate 20 is perpendicular to the loading end setting of plummer 10, and workpiece 30 to be coated is fixed in plummer 10 middle parts, forms an accelerating field E with this pair of conductive dull and stereotyped 20.This conducting plate 20 is symmetricly set in its both sides centered by film-coating workpiece 30, when this plummer 10 rotation, do at the uniform velocity rotation around film-coating workpiece 30.

Referring to Fig. 2, this plummer 10 is roughly a disc, the center of disk is provided with fixed part 11, this fixed part 11 can be fixed workpiece to be coated 30, in an embodiment, this fixed part 11 and plummer 10 concentric settings are provided with some shrinkage pools (not shown) on this fixed part 11, be used for fixation workpiece 30.

Referring to Fig. 1 and Fig. 2, each conducting plate 20 is a tabular, and every pair of conducting plate 20 is arranged on the plummer 10 centered by being fixed in the workpiece to be coated 30 on the fixed part 11 relatively symmetrically.The mode that this conducting plate 20 is formed at plummer 10 can enter for riveting, embedding or bonding, also can be other fixed form.It can together at the uniform velocity rotate with plummer 10.

In the coating process, this conducting plate 20 is anodal, this workpiece to be coated 30 is negative pole, by this conducting plate 20 is applied voltage, make it between two conducting plates 20 that relatively arrange, produce the electric field E of the rotary-focusing that points to workpiece 30 to be coated, this focusing electric field E can guide target ion 41 to be splashed on these workpiece to be coated 30 surfaces, to realize treating film-coating workpiece 30 plated films.

Referring to Fig. 1, these plummer 10 tops are provided with an ion source 40, and this ion source is negative pole, this conducting plate is anodal, it can provide plated film ion 41 when plated film, this ion 41 enters among the focusing electric field E that forms on this plummer 10, is directed being splashed on the workpiece 30 to be coated.

Referring to Fig. 3, together in the rotary course, 20 pairs of workpiece of conducting plate 30 form shielding effects for this conducting plate 20 and plummer 10, i.e. formation one accelerating field E between pair of conductive dull and stereotyped 20 and workpiece 30.Move with the electric field line guide tracks in this accelerating field E so that enter 41 in the ion of this electric field.As mentioned above, when target ion 41 enters this accelerating field E zone, be subject to pointing under the electrical forces effect of workpiece 30, produced the speed V that points to rotating disk institute direction of motion ₁Point to the movement velocity V of workpiece 30 from conducting plate 20 with another ₂Under this compound motion, ion can produce a sum velocity V who points to workpiece 30 to be coated, when ion 41 the closer to workpiece, because the overstepping the bounds of propriety cloth of electric field line of accelerating field E of living in is intensive, strength of electric field is larger, ion 41 suffered electrical forcess are just larger, and ever-increasing acceleration is deposited on workpiece 30 surfaces.Under the guiding of accelerating field E, ion 41 can be splashed on the workpiece to be coated 30 more accurately, thereby, overcome the taper off to a point electric-field intensity distribution of discharge and change workpiece surface of the end face that exists because of its list structure of small size workpiece and most advanced and sophisticated position and caused the ion film plating hard problem.

Be appreciated that, in this preferred another embodiment, the workpiece to be coated 30 that is fixed in these plummer 10 centers in this film coating apparatus 100 can self at the uniform velocity rotate when plated film, at this moment, 20 of conducting plates that are fixed in plummer 10 both sides can same transfixion, at this moment, the mode of the accelerating field E guiding plated film ion bombardment that forms of conducting plate 20 and sputter workpiece 30 to be coated is identical with the invention described above preferred embodiment.

Be appreciated that to see also Fig. 4, the quantity that this workpiece to be coated 30 is installed in plummer 10 middle fixed parts 11 at every turn can be a plurality of.

Compare prior art, utilization of the present invention is installed in 20 discharges of the conducting plate on the plummer 10 in this film coating apparatus 100, around the workpiece 30 between two conducting plates 20, produce the rotary-focusing electric field of a sensing workpiece 30, the ion 41 that splashes to be coated accelerates to focus on and be deposited on the workpiece 30 to workpiece 30 under accelerating field E effect, thereby realize strip and less workpiece 30 surface coatings of size, the present invention not only can solve the problem at the small size workpiece surface coating with strip, and because be provided with two conducting plates 20 near workpiece, produces one focusing rotating electric field, strengthened sedimentation velocity, so that being splashed to the reactive force on workpiece 30 surfaces, strengthens in ion 41, thereby, significantly improve rete in workpiece 30 bonding forces.And low processing cost, be fit to scale of mass production.

Claims

1. film coating apparatus, be used for treating film-coating workpiece and carry out plated film, it is characterized in that: this film coating apparatus comprises plummer and at least one pair of conducting plate, this plummer comprises a loading end, in order to the electric field that carries this workpiece to be coated and make this workpiece to be coated place this conducting plate to form, loading end and this loading end of interval towards this plummer are provided with an ion source, this conducting plate is arranged on the plummer perpendicular to the loading end of this plummer, and centered by workpiece to be coated, being symmetricly set in its both sides, this conducting plate at the uniform velocity rotates with respect to film-coating workpiece.

2. film coating apparatus as claimed in claim 1, it is characterized in that: the described conducting plate that is fixed on the plummer both sides at the uniform velocity rotates, and this workpiece can be motionless in the plummer central stationary.

3. film coating apparatus as claimed in claim 1, it is characterized in that: the described conducting plate transfixion that is fixed on the plummer both sides, this workpiece can be in the uniform rotation of plummer center.

4. such as the described film coating apparatus of claim 1-3 any one, it is characterized in that: workpiece to be coated is elongate body or right cylinder, and its size diameter is less than 0.5cm.

5. film coating apparatus as claimed in claim 4 is characterized in that: this plummer middle part is provided with a fixed part, and workpiece to be coated is fixed in the fixed part at plummer middle part, and this workpiece to be coated is fixed in plummer by riveted, bonding or embedded mode.