CN103072777A - Chip grading library and picking and placing mechanism thereof and cache region planning method of chip grading library - Google Patents
Chip grading library and picking and placing mechanism thereof and cache region planning method of chip grading library Download PDFInfo
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- CN103072777A CN103072777A CN2013100074439A CN201310007443A CN103072777A CN 103072777 A CN103072777 A CN 103072777A CN 2013100074439 A CN2013100074439 A CN 2013100074439A CN 201310007443 A CN201310007443 A CN 201310007443A CN 103072777 A CN103072777 A CN 103072777A
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Abstract
The invention discloses a chip grading library and a picking and placing mechanism thereof and a cache region planning method of the chip grading library. According to the chip grading library, a chip grading box and a chip storing box are fixedly arranged on the same bracket to form an integrated library structure, the integrated library structure is matched with the corresponding picking and placing mechanism so that storage and automatic feeding and discharging of a grading disk and chips are realized; and the grading mechanism has the advantages of stability, expandability, interchangeability of the boxes, and the like. The picking and placing mechanism provided by the invention is placed on one side of the chip grading library, is used for picking and placing the chip grading disk or chip storing disk from the chip grading box or chip storing box through a clamping jaw mechanism through movements on X, Y and Z-axis directions, and has the advantages of simple structure and high working efficiency. The cache region planning method of the chip grading library overcomes the defects of the prior art by mainly using a method of arranging an empty card slot. The slot capacity can be effectively utilized and the capacity of the chip grading library is enlarged.
Description
Technical field
The present invention relates to the die sorter technical field, particularly the buffer area planing method in a kind of die grading storehouse and fetching device thereof and die grading storehouse.
Background technology
In the LED industry, owing to being subjected to the restriction of the techniques such as grinding and cutting in the chip manufacturing proces and epitaxial wafer growth, a large amount of chips that form after the same wafer cutting are such as dominant wavelength (peak length), luminous intensity (MCD), colour temperature (color temperature), operating voltage (V
f) etc. have larger inconsistency on the photoelectric properties parameter.Therefore, be necessary to be detected classification and similar chip is given merger according to its photoelectric properties parameter for chip.
The function of led chip screening installation is exactly the sort file according to wafer (wafer), realizes other chip of same class putting in order in same classification (Bin).Because the upper chip level number of wafer (wafer) is more, therefore, in assorting room, be necessary in time to change classification (Bin), to continue the die grading flow process.Now more and more higher to led chip photoelectric properties coherence request in industry, classifying rules also is tending towards classification, and existing led chip screening installation divides progression generally to reach more than 150.Therefore, extensively adopt storage and the automatic loading/unloading of class library mechanism to realize a plurality of classification, in addition, be the automatization level of further lifting means, a lot of equipment have also designed wafer (wafer) storehouse, to realize storage and the automatic loading/unloading of a plurality of wafers (wafer).
Fig. 1 is classification (Bin) storehouse and wafer (wafer) the storehouse mechanism scheme that generally adopts at present, classification (Bin) storehouse 10 and wafer (wafer) storehouse 20 are set respectively on the body platform, need to design separately wafer (wafer) storehouse fetching device 40 at wafer (wafer) bench board simultaneously, to realize picking and placeing of wafer (wafer); And design separately cover classification (Bin) dish fetching device 30 and cover classification (Bin) clamp mechanism of disk at classification (Bin) bench board, to realize respectively picking and placeing and the action in classification (Bin) storehouse 10 of coming in and going out of classification (Bin) dish.Generally speaking, itself all be attached with X-direction and Z-direction kinematic axis to realize picking and placeing of all singulizing discs 12 or wafer 22 for classification (Bin) storehouse 10 and wafer (wafer) storehouse 10, there is following problem in this mechanism design: at first, above-mentioned class library 10 and wafer storehouse 20 separation designs are so that mechanism is too complicated, layout is comparatively complicated, but also has reduced the interchangeability between classified card casket 11 and the wafer card casket 21; Secondly, classification (Bin) storehouse 10 and wafer (wafer) storehouse 10 itself need mass motion, to carry all singulizing discs 12 or wafer 22 on it during motion, so that this campaign-styled class library 10 and the load in wafer storehouse 20 increase, and extendability is relatively poor, can't expand storage capacity, be not easy to be applied on a large scale on the industry promote.
Summary of the invention
The object of the invention is to the weak point that exists for prior art and the buffer area planing method in a kind of die grading storehouse and fetching device and die grading storehouse is provided.
To achieve these goals, the present invention adopts following technical scheme:
The invention provides a kind of die grading storehouse, comprise that support, sorting chips card casket and chip deposit the card casket, described sorting chips card casket and described chip are deposited the card casket and all are fixed in described support, described sorting chips card casket is provided with the draw-in groove for the fixed chip singulizing disc, and the sorting chips dish is fixed in the described sorting chips card casket by the draw-in groove of described sorting chips card casket; Described chip is deposited the card casket and is provided with draw-in groove for the fixed chip tray, and the draw-in groove that the chip tray is deposited the card casket by described chip is fixed in described chip to be deposited in the card casket; The structure of described sorting chips card casket is identical with the structure that described chip is deposited the card casket, and the oad of described sorting chips dish is identical with the oad of described chip tray; Described sorting chips card casket is provided be used to the classified card casket that picks and places described sorting chips dish and picks and places mouth, and described chip is deposited the card casket and is provided be used to the card casket of depositing that picks and places described chip tray and picks and places mouth.
Described sorting chips card casket and described chip are deposited card casket branch and/or apportion setting on described support, and are provided with at least one sorting chips card casket and at least one chip on the described support and deposit the card casket.
Described classified card casket picks and places mouthful and the described card casket of depositing picks and places and mouthful is positioned at the same side.
Described sorting chips dish is sequentially placed according to the draw-in groove of described sorting chips card casket.
Place at the draw-in groove interval that described chip tray is deposited the card casket according to described chip.
Described support adopts aluminium section bar to make.
The present invention also provides a kind of fetching device, fetching device is arranged at a side in die grading storehouse, comprise the X-axis guide rail, the Y-axis guide rail, the Z axis guide rail, the X-axis actuating device, the Y-axis actuating device, the Z axis actuating device, the X-axis pedestal of " L " shape, Y-axis pedestal and Z axis pedestal, described X-axis pedestal is movably set in described X-axis guide rail, described X-axis actuating device drives described X-axis pedestal along described X-axis guide rail crank motion, described Z axis guide rail is fixedly installed on the vertical plate of described X-axis pedestal, described Z axis pedestal is movably set in described Z axis guide rail, described Z axis actuating device drives described Z axis pedestal along described Z axis guide rail crank motion, described Y-axis guide rail is fixedly installed on described Z axis pedestal, described fetching device also comprises for the clip claw mechanism of clamping sorting chips dish or chip tray and controls the jaw actuating device that described clip claw mechanism moves up and down, described clip claw mechanism is connected with described Y-axis pedestal, described Y-axis pedestal is movably set in described Y-axis guide rail, and described Y-axis actuating device drives described Y-axis pedestal along described Y-axis guide rail crank motion.
Described jaw actuating device comprises the first jaw actuating device and the second jaw actuating device, and described the first jaw actuating device and described the second jaw actuating device all are arranged at described Y-axis pedestal.
Described the first jaw actuating device and described the second jaw actuating device all are set to cylinder-type drive set.
Described Z axis pedestal is provided with upper strata draw-in groove and lower floor's draw-in groove.
Described X-axis actuating device comprises X-axis motor, X-axis screw mandrel and X-axis nut, and described X-axis nut is arranged on the below of described X-axis pedestal, and described X-axis screw mandrel is connected with described X-axis nut thread, and the described X-axis pedestal of described X-axis motor-driven moves along described X-axis screw mandrel.
Described Z axis actuating device comprises Z axis motor, Z axis screw mandrel and Z axis nut, and described Z axis pedestal is connected with described Z axis wire rod thread, and described Z axis screw mandrel is connected with described Z axis nut thread, and the described Z axis pedestal of described Z axis motor-driven moves along described Z axis screw mandrel.
Described Y-axis actuating device comprises y-axis motor, gear and tooth bar, described y-axis motor is fixedly installed on described Y-axis pedestal, the coaxial output shaft that is arranged at described y-axis motor of described gear, described tooth bar is arranged at the medial surface of described Y-axis pedestal, described gear and the engagement of described tooth bar.
The present invention also provides a kind of buffer area planing method, in the die grading storehouse, select arbitrary sorting chips card casket or a plurality of sorting chips card casket as buffer area, and reserve an empty calorie groove in the sorting chips card casket of buffer area, other slots are set up and all load unsorted sorting chips dish; Carrying out along with sorting, when the sorting chips dish of a certain sorting chips card casket divides when full, the sorting chips dish that is about to this sorting chips card casket is offloaded to the empty calorie groove of buffer area, and then mend to this sorting chips card casket from the sorting chips dish that next draw-in groove of buffer area has taken out, next draw-in groove of buffer area namely can be used as the sorting chips dish of the next full sorting chips card casket of empty calorie groove carrying.
The first draw-in groove of the sorting chips card casket of buffer area is set to the empty calorie groove.
One of beneficial effect of the present invention: the present invention deposits the card casket with sorting chips card casket and chip and is fixedly installed on the same support, form the sorting library structure of integral type, after corresponding fetching device cooperates, realized storage and the automatic loading/unloading of singulizing disc and chip, and the sorting mechanism design have the advantages such as stationarity, extendability and card casket interchangeability.
Two of beneficial effect of the present invention: during use, fetching device is placed on a side in die grading storehouse, fetching device moves by X, Y and Z-direction, and deposit the card casket by clip claw mechanism from sorting chips card casket or chip and pick and place sorting chips dish or chip tray, simple in structure, high efficiency.
Three of beneficial effect of the present invention: when sorting work is carried out, when the sorting chips dish of a certain sorting chips card casket divides when full, the sorting chips dish that is about to this sorting chips card casket is offloaded to the empty calorie groove of buffer area, and then mend to this sorting chips card casket from the sorting chips dish that next draw-in groove of buffer area has taken out, next draw-in groove of buffer area namely can be used as the sorting chips dish of the next full sorting chips card casket of empty calorie groove carrying; Along with being on the increase of classified sorting chips card casket, the draw-in groove capacity of classified sorting chips card casket constantly increases, the draw-in groove capacity of non-classified sorting chips card casket constantly reduces, the method of this dynamic programming classified sorting chips card casket and non-classified sorting chips card casket, can effectively utilize the draw-in groove capacity, expand the capacity in die grading storehouse.
Description of drawings
The invention will be further described to utilize accompanying drawing, but the embodiment in the accompanying drawing does not consist of any limitation of the invention, for those of ordinary skill in the art, under the prerequisite of not paying creative work, can also obtain according to the following drawings other accompanying drawing.
Fig. 1 is the perspective view of existing class library and wafer storehouse separation design.
Fig. 2 is the perspective view of a preferred embodiment in die grading of the present invention storehouse.
Fig. 3 is the perspective view of a preferred embodiment of fetching device of the present invention.
Fig. 4 is the A place enlarged diagram among Fig. 3.
Fig. 5 is the structural representation of die grading of the present invention storehouse and fetching device.
Fig. 6 is the structural representation of the sorting chips card casket of buffer area planing method of the present invention.
In Fig. 1, comprise:
10---class library, 11---classified card casket, 12---singulizing discs;
20---wafer storehouse, 21---wafer card casket, 22---wafers;
30---the class library fetching device;
40---wafer storehouse fetching device;
In Fig. 2 to Fig. 6, comprise:
100---support;
200------the classified card casket picks and places mouth to sorting chips card casket, 201 with sorting chips dish, 202---draw-in groove, 203---;
300---chip is deposited card casket, 301, and---chip tray, 302---draw-in groove, 303---is deposited the card casket and is picked and placeed mouth;
400---X-axis guide rail, 401---X-axis actuating device, 4011---X-axis motor, 4012---X-axis screw mandrel, 402---X-axis pedestals;
500---Y-axis guide rail, 501---Y-axis actuating device, 5011---y-axis motor, 5012---tooth bar, 5013---gear, 502---Y-axis pedestals;
600---Z axis guide rail, 601---Z axis actuating device, 6011---Z axis motor, 602---Z axis pedestals;
700---clip claw mechanism, 702---jaw actuating device, 7021---the first jaw actuating device, 7022---the second jaw actuating device, 703---upper strata draw-in groove, 704---lower floor's draw-in grooves.
The specific embodiment
The present invention is described in further detail below in conjunction with embodiment and accompanying drawing, but embodiments of the present invention are not limited to this.
See Fig. 2, the invention provides a kind of die grading storehouse, comprise that support 100, sorting chips card casket 200 and chip deposit card casket 300, sorting chips card casket 200 and chip are deposited card casket 300 and all are fixed in support 100, sorting chips card casket 200 is provided with the draw-in groove 202 for fixed chip singulizing disc 201, and sorting chips dish 201 is fixed in the sorting chips card casket 200 by draw-in groove 202; Chip is deposited card casket 300 and is provided with draw-in groove 302 for fixed chip tray 301, and chip tray 301 is fixed in chip by draw-in groove 302 to be deposited in the card casket 300; The structure of sorting chips card casket 200 is identical with the structure that chip is deposited card casket 300, and the oad of sorting chips dish 201 is identical with the oad of chip tray 301, has interchangeability so that sorting chips card casket 200 and chip are deposited card casket 300; Sorting chips card casket 200 is provided be used to the classified card casket that picks and places sorting chips dish 201 and picks and places mouthfuls 203, and chip is deposited card casket 300 and is provided be used to the card casket of depositing that picks and places chip tray 301 and picks and places mouth 303.
Concrete, sorting chips card casket 200 and chip are deposited card casket 300 branch and/or apportion setting on support 100, and are provided with at least one sorting chips card casket 200 on the support 100 and deposit card casket 300 with at least one chip.User as required self-defined division sorting chips card casket 200 and chip deposits card casket 300, with the exchange that realizes that sorting chips card casket 200 and chip are deposited card casket 300.
Preferably, the classified card casket picks and places mouthfuls 203 and deposit card casket and pick and place mouth 303 and be positioned at the same side, makes things convenient for fetching device to pick and place sorting chips dish 201 or chip tray 301.
Concrete, sorting chips dish 201 is placed according to draw-in groove 202 orders of sorting chips card casket; Place at draw-in groove 302 intervals that chip tray 301 is deposited the card casket according to chip.
Concrete, the frame bracket that support 100 adopts aluminium section bar to make, this frame bracket has the frame unit of same space, and sorting chips card casket 200 and chip are deposited card casket 300 and be placed in respectively in this frame unit, adopts simultaneously aluminium section bar to cut down finished cost.The present invention directly is fixed on the body platform by support 100, for classification (Bin) storehouse and wafer (wafer) storehouse, itself be fixed, there is no additional kinematic axis or movable part, compared with prior art, the stationarity of lifting means alleviates load greatly, is convenient to expansion.Preferably, support 100 is provided with reinforcement, and at each frame unit reinforcement is set all, can improve the bearing capacity of support.
See Fig. 3 and Fig. 4, the present invention also provides a kind of fetching device that sorting chips dish 201 in the die grading storehouse and chip tray 301 pick and place that is applied to pick and place, this fetching device is arranged at a side in die grading storehouse, comprise X-axis guide rail 400, Y-axis guide rail 500, Z axis guide rail 600, X-axis actuating device 401, Y-axis actuating device 501, Z axis actuating device 601, the X-axis pedestal 402 of " L " shape, Y-axis pedestal 502 and Z axis pedestal 602, X-axis pedestal 402 slides and is arranged at X-axis guide rail 400, under the driving of X-axis actuating device 401, X-axis pedestal 402 can be along X-axis guide rail 400 crank motions, Z axis guide rail 600 is fixedly installed on the vertical plate of X-axis pedestal 402, Z axis pedestal 602 slides and is arranged at Z axis guide rail 600, Z axis actuating device 601 drives Z axis pedestal 602 along Z axis guide rail 600 crank motions, Y-axis guide rail 500 is fixedly installed on Z axis pedestal 602, also comprise the jaw actuating device 702 that clip claw mechanism 700 and control clip claw mechanism 700 for clamping sorting chips dish or chip tray move up and down, clip claw mechanism 700 is connected with Y-axis pedestal 502, Y-axis pedestal 502 is movably set in Y-axis guide rail 500, and Y-axis actuating device 501 drives Y-axis pedestal 502 along Y-axis guide rail 500 crank motions.
Preferably, jaw actuating device 702 comprises that the first jaw actuating device 7021 and the second jaw actuating device 7022, the first jaw actuating devices 7021 and the second jaw actuating device 7022 all are arranged at Y-axis pedestal 502.
Preferably, the first jaw actuating device 7021 and the second jaw actuating device 7022 all are set to cylinder-type drive set.
Preferably, X-axis actuating device 401 comprises X-axis motor 4011, X-axis screw mandrel 4012 and X-axis nut (not shown in FIG.), the X-axis nut is arranged on the below of X-axis pedestal 402, and X-axis screw mandrel 4012 is connected with the X-axis nut thread, and X-axis motor 4011 drives X-axis pedestal 402 and moves along X-axis screw mandrel 4012.
Preferably, Z axis actuating device 601 comprises Z axis motor 6011, Z axis screw mandrel (being blocked by the X-axis pedestal 402 of " L " shape among the figure) and Z axis nut (not shown in FIG.), Z axis pedestal 602 is connected with the Z axis wire rod thread, the Z axis screw mandrel is connected with the Z axis nut thread, and Z axis motor 6011 drives Z axis pedestal 602 and moves along the Z axis screw mandrel.
Y-axis actuating device 501 comprises y-axis motor 5011, gear 5013 and tooth bar 5012, y-axis motor 5011 is fixedly installed on Y-axis pedestal 502, the gear 5013 coaxial output shafts that are arranged at y-axis motor 5011, tooth bar 5012 is arranged at the medial surface of Y-axis pedestal 502, gear 5013 and tooth bar 5012 engagements.Adopt gear and rack-driving can save the space, be used for realizing sorting chips dish or the handover of chip tray between sorting storehouse and fetching device.
See Fig. 5, the following describes fetching device and finish the specific works flow process that the warehouse-in action of sorting chips dish and chip tray, the warehouse-in that goes out take sorting chips dish 201 moves as example, at first fetching device moves to the sorting storehouse respectively in X-direction and Z-direction under X-axis motor 4011 and 6011 drivings of Z axis motor, makes lower floor's draw-in groove 704 alignings of fetching device treat sorting chips card casket 200 place draw-in grooves 202; Then, the y-axis motor 5011 of fetching device drives clip claw mechanism 700 and advances to clip position, then clip claw mechanism 700 clamps sorting chips dish 201, the y-axis motor 5011 of fetching device drives clip claw mechanism 700 and retreats, sorting chips dish 201 is transferred on the fetching device lower floor draw-in groove 704, after 201 motions of sorting chips dish put in place, clip claw mechanism 700 unclamps, and (there is the spacing about 5mm at the jaw edge of this position clip claw mechanism 700 and the edge of sorting chips dish to continue to move to a perch under y-axis motor 5011 drives, be convenient to the lifting of clip claw mechanism 700), then the first jaw actuating device 7021 and the second jaw actuating device 7022 drive clip claw mechanisms 700 and rise to and pick and place the platform top and dodge action to finish, and the clamping device of being convenient to be arranged in sorting chips dish 201 bench board one side is loaded into sorting chips dish 201 on the bench board of sorting chips dish 201 from fetching device lower floor draw-in groove 704.After a certain sorting chips card casket 20 sortings finish, clamping device will at first be offloaded to fetching device upper strata draw-in groove 703 with sorting chips dish 201 from bench board, then the fetching device warehouse-in draw-in groove 202 that moves to upper strata draw-in groove 703 and this sorting chips card casket 20 under the driving of X-axis motor 4011 and Z axis motor aligns, then the clip claw mechanism 700 of fetching device moves to above-mentioned perch under the driving of y-axis motor 5011, and under the first jaw actuating device 7021 and 7022 drivings of the second jaw actuating device, clip claw mechanism 700 is alignd with upper strata draw-in groove 703, then y-axis motor 5011 drives clip claw mechanism 700 and advances to clip position, (this position jaw and sorting chips dish 20 have about 5mm overlapping), the jaw of clip claw mechanism 700 clamps, y-axis motor 5011 works on, until sorting chips dish 201 is sent into sorting chips card casket 200, the jaw of last clip claw mechanism 700 unclamps and retreats under y-axis motor 5011 drives, to finish the warehouse-in action of sorting chips dish 201.
The present invention also provides the buffer area planing method in a kind of die grading storehouse, see Fig. 6, in the die grading storehouse, select arbitrary sorting chips card casket 200 or a plurality of sorting chips card casket 200 as buffer area, and the draw-in groove 202 of having reserved in the sorting chips card casket 200 of buffer area all loads unsorted sorting chips dish 201 on other draw-in groove 202 positions; Carrying out along with sorting, when the sorting chips dish of a certain sorting chips card casket 200 was expired in 201 minutes, the sorting chips dish 201 that is about to this sorting chips card casket 200 is offloaded to the empty calorie groove of buffer area, and then mend to this sorting chips card casket 200 from the sorting chips dish 201 that next draw-in groove of buffer area has taken out, next draw-in groove of buffer area namely can be used as the sorting chips dish 201 of the next full sorting chips card casket 200 of empty calorie groove carrying.
Preferably, the first draw-in groove 202 of the sorting chips card casket 200 of buffer area is set to the empty calorie groove.
Should be noted that at last; above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although with reference to preferred embodiment the present invention has been done to explain; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement technical scheme of the present invention, and not break away from essence and the scope of technical solution of the present invention.
Claims (14)
1. die grading storehouse, it is characterized in that: comprise that sorting chips card casket, chip deposit the card casket and be used for carries chips classified card casket and chip is deposited the support of card casket, described sorting chips card casket and described chip are deposited the card casket and all are fixed in described support, described sorting chips card casket is provided with the draw-in groove for the fixed chip singulizing disc, and the sorting chips dish is fixed in the described sorting chips card casket by the draw-in groove of described sorting chips card casket; Described chip is deposited the card casket and is provided with draw-in groove for the fixed chip tray, and the draw-in groove that the chip tray is deposited the card casket by described chip is fixed in described chip to be deposited in the card casket; The structure of described sorting chips card casket is identical with the structure that described chip is deposited the card casket, and the oad of described sorting chips dish is identical with the oad of described chip tray; Described sorting chips card casket is provided be used to the classified card casket that picks and places described sorting chips dish and picks and places mouth, and described chip is deposited the card casket and is provided be used to the card casket of depositing that picks and places described chip tray and picks and places mouth.
2. die grading according to claim 1 storehouse, it is characterized in that: described sorting chips card casket and described chip are deposited card casket branch and/or apportion setting on described support, and are provided with at least one sorting chips card casket and at least one chip on the described support and deposit the card casket.
3. die grading according to claim 1 storehouse is characterized in that: described classified card casket picks and places mouthful and the described card casket of depositing picks and places and mouthful is positioned at the same side.
4. die grading according to claim 1 storehouse, it is characterized in that: described sorting chips dish is sequentially placed according to the draw-in groove of described sorting chips card casket; Place at the draw-in groove interval that described chip tray is deposited the card casket according to described chip.
5. die grading according to claim 1 storehouse is characterized in that: the frame bracket that described support adopts aluminium section bar to make.
6. be used for picking and placeing the sorting chips dish of claim 1 to 5 any one or the fetching device of chip tray, this fetching device is arranged at a side in die grading storehouse, it is characterized in that: comprise the X-axis guide rail, the Y-axis guide rail, the Z axis guide rail, the X-axis actuating device, the Y-axis actuating device, the Z axis actuating device, the X-axis pedestal of " L " shape, Y-axis pedestal and Z axis pedestal, described X-axis pedestal is movably set in described X-axis guide rail, under described X-axis actuating device drives, described X-axis pedestal is along described X-axis guide rail crank motion, described Z axis guide rail is fixedly installed on the vertical plate of described X-axis pedestal, described Z axis pedestal is movably set in described Z axis guide rail, described Z axis actuating device drives described Z axis pedestal along described Z axis guide rail crank motion, and described Y-axis guide rail is fixedly installed on described Z axis pedestal; Described fetching device also comprises for the clip claw mechanism of clamping sorting chips dish or chip tray and controls the jaw actuating device that described clip claw mechanism moves up and down, described clip claw mechanism is connected with described Y-axis pedestal, described Y-axis pedestal is movably set in described Y-axis guide rail, and described Y-axis actuating device drives described Y-axis pedestal along described Y-axis guide rail crank motion.
7. fetching device according to claim 6, it is characterized in that: described jaw actuating device comprises the first jaw actuating device and the second jaw actuating device, and described the first jaw actuating device and described the second jaw actuating device all are arranged at described Y-axis pedestal.
8. fetching device according to claim 6, it is characterized in that: described the first jaw actuating device and described the second jaw actuating device all are set to cylinder-type drive set.
9. fetching device according to claim 6, it is characterized in that: described Z axis pedestal is provided with upper strata draw-in groove and lower floor's draw-in groove.
10. fetching device according to claim 6, it is characterized in that: described X-axis actuating device comprises X-axis motor, X-axis screw mandrel and X-axis nut, described X-axis nut is arranged on the below of described X-axis pedestal, described X-axis screw mandrel is connected with described X-axis nut thread, and the described X-axis pedestal of described X-axis motor-driven moves along described X-axis screw mandrel.
11. fetching device according to claim 6, it is characterized in that: described Z axis actuating device comprises Z axis motor, Z axis screw mandrel and Z axis nut, described Z axis pedestal is connected with described Z axis wire rod thread, described Z axis screw mandrel is connected with described Z axis nut thread, and the described Z axis pedestal of described Z axis motor-driven moves along described Z axis screw mandrel.
12. fetching device according to claim 6, it is characterized in that: described Y-axis actuating device comprises y-axis motor, gear and tooth bar, described y-axis motor is fixedly installed on described Y-axis pedestal, the coaxial output shaft that is arranged at described y-axis motor of described gear, described tooth bar is arranged at the medial surface of described Y-axis pedestal, described gear and the engagement of described tooth bar.
13. be used for the buffer area planing method in the described die grading of claim 1 to 5 any one storehouse, in the die grading storehouse, select arbitrary sorting chips card casket or a plurality of sorting chips card casket as buffer area, and reserve an empty calorie groove in the sorting chips card casket of buffer area, other slots are set up and all load unsorted sorting chips dish; Carrying out along with sorting, when the sorting chips dish of a certain sorting chips card casket divides when full, the sorting chips dish that is about to this sorting chips card casket is offloaded to the empty calorie groove of buffer area, and then mend to this sorting chips card casket from the sorting chips dish that next draw-in groove of buffer area has taken out, next draw-in groove of buffer area namely can be used as the sorting chips dish of the next full sorting chips card casket of empty calorie groove carrying.
14. buffer area planing method according to claim 13 is characterized in that: the first draw-in groove of the sorting chips card casket of buffer area is set to the empty calorie groove.
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| CN201310007443.9A CN103072777B (en) | 2013-01-09 | 2013-01-09 | The buffer area planing method in die grading storehouse and fetching device and die grading storehouse |
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| CN201310007443.9A CN103072777B (en) | 2013-01-09 | 2013-01-09 | The buffer area planing method in die grading storehouse and fetching device and die grading storehouse |
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| CN106629083A (en) * | 2017-01-15 | 2017-05-10 | 无锡奥特维智能装备有限公司 | Battery cell box loading device |
| WO2017107503A1 (en) * | 2015-12-25 | 2017-06-29 | 福建联迪商用设备有限公司 | Device and method for grabbing and storing two-dimensional code card |
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| CN202028558U (en) * | 2011-01-26 | 2011-11-09 | 梭特科技股份有限公司 | Parallel automatic classifying picking mechanism |
| CN203246775U (en) * | 2013-01-09 | 2013-10-23 | 广东志成华科光电设备有限公司 | Chip sorting library |
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| US4074120A (en) * | 1976-03-02 | 1978-02-14 | Kenway Incorporated | Automated materials storage system and method |
| JP2000168949A (en) * | 1998-12-08 | 2000-06-20 | Murata Mach Ltd | Picking device |
| JP2000233338A (en) * | 1999-02-10 | 2000-08-29 | Amada Eng Center Co Ltd | Material feed device for shape steel and shape steel feed method using material feed device thereof |
| CN101807437A (en) * | 2009-02-12 | 2010-08-18 | 深圳市江波龙电子有限公司 | Automatic scanning and sorting system and automatic scanning method for flash memories |
| CN202028558U (en) * | 2011-01-26 | 2011-11-09 | 梭特科技股份有限公司 | Parallel automatic classifying picking mechanism |
| CN203246775U (en) * | 2013-01-09 | 2013-10-23 | 广东志成华科光电设备有限公司 | Chip sorting library |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017107503A1 (en) * | 2015-12-25 | 2017-06-29 | 福建联迪商用设备有限公司 | Device and method for grabbing and storing two-dimensional code card |
| US10625954B2 (en) | 2015-12-25 | 2020-04-21 | Fujian Landi Commercial Equipment Co., Ltd | Device and method for grabbing and storing two-dimensional code card |
| CN106629083A (en) * | 2017-01-15 | 2017-05-10 | 无锡奥特维智能装备有限公司 | Battery cell box loading device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103072777B (en) | 2015-11-25 |
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