CN103068207A - Arrangement method for heat dissipation fins - Google Patents
Arrangement method for heat dissipation fins Download PDFInfo
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- CN103068207A CN103068207A CN2012105555197A CN201210555519A CN103068207A CN 103068207 A CN103068207 A CN 103068207A CN 2012105555197 A CN2012105555197 A CN 2012105555197A CN 201210555519 A CN201210555519 A CN 201210555519A CN 103068207 A CN103068207 A CN 103068207A
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- fin
- pcb board
- heat dissipation
- spacing distance
- dissipation fins
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Abstract
The invention discloses an arrangement method for heat dissipation fins. The arrangement method for the heat dissipation fins comprises acquiring space parameters of a printed circuit board (PCB); determining spacing distance of the heat dissipation fins according the space parameters of the PCB; and determining a position relation of the heat dissipation fins and the PCB according to the spacing distance of the heat dissipation fins. According to reasonable arrangement of the heat dissipation fins in an electronic device, heat dissipation area is increased, temperature of a work environment of the electronic device is reduced, and therefore service life of the electronic device is prolonged and work stability of the electronic device is enhanced.
Description
Technical field
The present invention relates to the heat dissipation technology field of electronic devices and components, more particularly, relate to a kind of layout method of fin.
Background technology
Because the efficiency of electronic devices and components can not reach 100%, therefore in the process of work, have unavoidably heat and send.And the electronic equipment of ours is at one's side bringing us simultaneously easily, also can give out unnecessary heat.Although this is normal phenomenon as you know, still unavoidably allow sometimes the people feel puzzlement.So we have seen various radiating modes in the electronic equipment: fin, heat pipe, radiator fan or even water-cooled, simultaneously moulding also is of all kinds.
The radiator portion of electronic equipment is mainly 3 points at present: first is chipset, and second is supply module, and the 3rd is the higher chips of some caloric values separately.Chipset remains the heating rich and influential family, and especially on some high-end chipsets, large-scale heat sink design right and wrong are usually seen.
The material that present fin mainly uses mainly is divided three classes: a class is aluminium, and a class is copper, and also having a class is pottery.Comparatively common in the copper fin mainboard in early days, the electronic equipment of now uses aluminum thermal fin more.No matter be which kind of heat sink material, the pluses and minuses of oneself are arranged.Wherein Aluminium Radiator has found a good balance between radiating effect and cost, and it is still very rational to be used for electronic equipment dissipating heat.
Aspect fin shape, owing to will consider to strengthen the contact area of fin and air, the heat with fin leaves better.Fin mostly is the fin-shaped moulding mostly at present, can strengthen area of dissipation in the situation of limited materials.
Therefore, how designing and not only allow equipment look more attractive in appearance, can effectively take away again the fin of the electronic devices and components of waste heat simultaneously, is present urgent problem.
Summary of the invention
In view of this, the invention provides a kind of layout method of fin, can be so that fin plays better radiating effect in electronic equipment by layout with realization.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of layout method of fin comprises:
Obtain the spatial parameter of pcb board;
Determine the spacing distance of fin according to the spatial parameter of described pcb board;
Determine the position relationship of fin and pcb board according to the spacing distance of described fin.
Preferably, described spacing distance according to described fin determines that the position relationship of fin and pcb board is specially:
When the spacing distance of described fin is during greater than 20mm, fin is placed with the pcb board base is vertical respectively.
Preferably, described spacing distance according to described fin determines that the position relationship of fin and pcb board is specially:
When the spacing distance of described fin was 15mm-20mm, fin wherein a slice was placed with the pcb board base is vertical, the at 45 ° or 135 ° of angles placements in another sheet and pcb board base.
Preferably, described spacing distance according to described fin determines that the position relationship of fin and pcb board is specially:
When the spacing distance of described fin was 10mm-15mm, fin respectively or 135 ° angles at 45 ° with the pcb board base was placed.
Can find out from above-mentioned technical scheme, the layout method of a kind of fin disclosed by the invention, by the fin in the rational deployment electronic equipment, increase area of dissipation, the electronic device works ambient temperature is reduced, thereby prolong the useful life of electronic equipment, strengthened the job stability of resistance equipment.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the flow chart of the layout method of the disclosed a kind of fin of the embodiment of the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
The embodiment of the invention discloses a kind of layout method of fin, can be so that fin plays better radiating effect in electronic equipment by layout with realization.
As shown in Figure 1, a kind of layout method of fin comprises:
S101, obtain the spatial parameter of pcb board;
S102, determine the spacing distance of fin according to the spatial parameter of described pcb board;
S103, determine the position relationship of fin and pcb board according to the spacing distance of described fin.
Concrete, in the abundant situation in pcb board space, the fin spacing distance can be unfolded and is placed in 20mm when above, fin is placed respectively (being as the criterion with the fin direction) with the pcb board base is vertical, fin fin number increases (being increasing heat radiation area), increase heat-dissipating space and area of dissipation, made the electronic equipment heat be able to rapid diffusion, thereby reduced the electronic device works ambient temperature.
Concrete, in the abundant situation in pcb board space, the fin spacing distance is unfolded when being placed in 15mm-20mm, fin wherein a slice is placed with the pcb board base is vertical, a slice and pcb board base are at 45 ° in addition or (all being as the criterion with the fin direction) placed at 135 ° of angles, increase heat-dissipating space, made the electronic equipment heat be able to rapid diffusion, thereby reduced the electronic device works ambient temperature.
Concrete, in the situation of pcb board limited space, the fin spacing distance is unfolded only can be when 10mm-15mm, fin respectively or 135 ° angles at 45 ° with the pcb board base is placed (all being as the criterion with the fin direction), increase heat-dissipating space, make the electronic equipment heat be able to rapid diffusion, thereby reduce the electronic device works ambient temperature.
The present invention increases area of dissipation by the fin in the rational deployment electronic equipment, and the electronic device works ambient temperature is reduced, thereby prolongs the useful life of electronic equipment, has strengthened the job stability of electronic equipment.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and General Principle as defined herein can in the situation that does not break away from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (4)
1. the layout method of a fin is characterized in that, comprising:
Obtain the spatial parameter of pcb board;
Determine the spacing distance of fin according to the spatial parameter of described pcb board;
Determine the position relationship of fin and pcb board according to the spacing distance of described fin.
2. method according to claim 1 is characterized in that, described spacing distance according to described fin determines that the position relationship of fin and pcb board is specially:
When the spacing distance of described fin is during greater than 20mm, fin is placed with the pcb board base is vertical respectively.
3. method according to claim 1 is characterized in that, described spacing distance according to described fin determines that the position relationship of fin and pcb board is specially:
When the spacing distance of described fin was 15mm-20mm, fin wherein a slice was placed with the pcb board base is vertical, the at 45 ° or 135 ° of angles placements in another sheet and pcb board base.
4. method according to claim 1 is characterized in that, described spacing distance according to described fin determines that the position relationship of fin and pcb board is specially:
When the spacing distance of described fin was 10mm-15mm, fin respectively or 135 ° angles at 45 ° with the pcb board base was placed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210555519.7A CN103068207B (en) | 2012-12-19 | 2012-12-19 | A kind of layout method of fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210555519.7A CN103068207B (en) | 2012-12-19 | 2012-12-19 | A kind of layout method of fin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103068207A true CN103068207A (en) | 2013-04-24 |
| CN103068207B CN103068207B (en) | 2015-08-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210555519.7A Active CN103068207B (en) | 2012-12-19 | 2012-12-19 | A kind of layout method of fin |
Country Status (1)
| Country | Link |
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| CN (1) | CN103068207B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2624403Y (en) * | 2003-04-29 | 2004-07-07 | Tcl王牌电子(深圳)有限公司 | Semiconductor device radiator capable of combined using |
| CN1832155A (en) * | 2005-02-22 | 2006-09-13 | 三星Sdi株式会社 | Structure for heat dissipation of integrated circuit chip and display module including the same |
| CN201041983Y (en) * | 2007-04-25 | 2008-03-26 | 保锐科技股份有限公司 | Heat radiation structure of power supplier |
-
2012
- 2012-12-19 CN CN201210555519.7A patent/CN103068207B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2624403Y (en) * | 2003-04-29 | 2004-07-07 | Tcl王牌电子(深圳)有限公司 | Semiconductor device radiator capable of combined using |
| CN1832155A (en) * | 2005-02-22 | 2006-09-13 | 三星Sdi株式会社 | Structure for heat dissipation of integrated circuit chip and display module including the same |
| CN201041983Y (en) * | 2007-04-25 | 2008-03-26 | 保锐科技股份有限公司 | Heat radiation structure of power supplier |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103068207B (en) | 2015-08-26 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100191, room 11, 505 Garden Road East, Beijing, Haidian District Patentee after: BEIJING CYCLE CENTURY TECHNOOGY CO., LTD. Address before: 100191, room 11, 505 Garden Road East, Beijing, Haidian District Patentee before: Beijing Cycle Century Digital Technology Co., Ltd. |