CN202663702U - a radiator - Google Patents

Abstract

The heat radiator of the utility model comprises a cylindrical heat conducting column and more than two heat conducting fins extending from the heat conducting column to the periphery; each heat conducting sheet is provided with a first radiating fin in an extending mode, and the first radiating fins are arranged on the heat conducting sheet in parallel and at intervals. Because the heat conduction column extends to all around and is provided with the conducting strip more than two, every conducting strip all extends and is provided with first heat radiation fins, can increase heat radiating area, and the radiating effect is good, can not influence electronic product's performance.

Description

a radiator

technical field

The utility model relates to a radiator.

Background technique

Good heat dissipation is the prerequisite for ensuring the stable operation of electronic products. The radiators of existing electronic products are generally complicated in processing and production, the heat dissipation area is not large enough, and there is a lack of effective heat dissipation elements, so the heat dissipation effect is not very good. , it is proposed to design a heat sink with simple processing, large effective heat dissipation area and good heat dissipation effect.

Contents of the invention

The technical problem to be solved by the utility model is to provide a radiator with simple processing and manufacturing and a large heat dissipation area.

In order to solve the above technical problems, the utility model adopts the following technical scheme: it includes a cylindrical heat conduction column, and more than two heat conduction sheets extending from the heat conduction column to the surroundings; each heat conduction sheet is extended with a first The heat dissipation fins, the first heat dissipation fins are arranged on the heat conduction sheet in parallel and at intervals.

Further, second heat dissipation fins are arranged on the heat conduction columns between the adjacent heat conduction fins, and the second heat dissipation fins are arranged on the heat conduction columns in parallel and at intervals.

Further, the tail end of each heat conducting sheet is provided with a mounting hole.

Further, the first heat dissipation fins are obliquely arranged on the heat conduction sheet.

In the radiator of the present utility model, since the heat conduction column is extended to be provided with more than two heat conduction fins, and each heat conduction fin is extended with a first heat dissipation fin, the heat dissipation area can be increased, the heat dissipation effect is good, and the electronic device will not be affected. Product performance.

Description of drawings

Fig. 1 is a perspective view of a radiator of the present invention.

Detailed ways

In this embodiment, as shown in FIG. 1 , the radiator includes a cylindrical heat conduction column 1, and more than two heat conduction sheets 2 extending from the heat conduction column 1 to the surroundings; each heat conduction sheet 2 is First heat dissipation fins 3 are extended, and the first heat dissipation fins 3 are arranged on the heat conduction sheet 2 in parallel and at intervals. The heat dissipation area can be increased, the heat dissipation effect is good, and the performance of electronic products will not be affected.

Wherein, second heat dissipation fins 4 are arranged on the heat conduction columns 1 between the adjacent heat conduction fins 2 , and the second heat dissipation fins 4 are arranged on the heat conduction columns 1 in parallel and at intervals. A mounting hole 20 is provided at the end of each heat conducting sheet 2 . The first cooling fins 3 are obliquely arranged on the heat conducting fins 2 . In this embodiment, the heat conduction column 1 has four heat conduction fins 2 extending around.

In the radiator of the present utility model, since the heat conduction column is extended to be provided with more than two heat conduction fins, and each heat conduction fin is extended with a first heat dissipation fin, the heat dissipation area can be increased, the heat dissipation effect is good, and the electronic device will not be affected. Product performance.

The utility model has been described in detail above. The above description is only a preferred embodiment of the utility model. When it cannot limit the scope of the utility model, all equivalent changes and modifications made according to the scope of the application should be Still belong to the scope covered by the present utility model.

Claims (4)

1. A heat sink, characterized in that: it includes a cylindrical heat conduction column, and more than two heat conduction sheets extending from the heat conduction column to the surroundings; each heat conduction sheet is extended with a first heat dissipation fin , the first heat dissipation fins are arranged on the heat conduction sheet in parallel and at intervals. 2. The heat sink according to claim 1, characterized in that: second heat dissipation fins are arranged on the heat conduction columns between the adjacent heat conduction fins, and the second heat dissipation fins are arranged on the heat conduction columns in parallel and at intervals. on the heat conduction column. 3. The heat sink according to claim 1, characterized in that: the tail end of each heat conducting sheet is provided with a mounting hole. 4. The heat sink according to claim 1, wherein the first heat dissipation fins are obliquely arranged on the heat conduction sheet.

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