CN103068207B - A kind of layout method of fin - Google Patents
A kind of layout method of fin Download PDFInfo
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- CN103068207B CN103068207B CN201210555519.7A CN201210555519A CN103068207B CN 103068207 B CN103068207 B CN 103068207B CN 201210555519 A CN201210555519 A CN 201210555519A CN 103068207 B CN103068207 B CN 103068207B
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- fin
- pcb board
- spacing distance
- electronic equipment
- layout method
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Abstract
The invention discloses a kind of layout method of fin, comprising: the spatial parameter obtaining pcb board; According to the spacing distance of the spatial parameter determination fin of described pcb board; According to the spacing distance determination fin of described fin and the position relationship of pcb board.The present invention, by the fin in rational deployment electronic equipment, increases area of dissipation, electronic device works ambient temperature is reduced, thus extends the useful life of electronic equipment, enhances the job stability of electronic equipment.
Description
Technical field
The present invention relates to the technical field of heat dissipation of electronic devices and components, more particularly, relate to a kind of layout method of fin.
Background technology
Because the efficiency of electronic devices and components can not reach 100%, therefore in the process of work, have heat unavoidably and send.And the electronic equipment of ours is at one's side bringing us easily simultaneously, also unnecessary heat can given out.Although this is normal phenomenon as you know, people is still unavoidably allowed to feel puzzlement sometimes.So we see various radiating mode in electronic equipment: fin, heat pipe, radiator fan or even water-cooled, moulding simultaneously is also of all kinds.
The radiator portion of current electronic equipment is mainly 3 points: first is chipset, and second is supply module, and the 3rd is the chip that some caloric values are higher separately.Chipset remains heating rich and influential family, and especially on some high-end chipsets, large-scale heat sink design right and wrong are usually shown in.
The material that current fin mainly uses mainly is divided three classes: a class is aluminium, and a class is copper, also has a class to be pottery.Comparatively common in copper heat spreader mainboard in early days, electronic equipment many uses aluminum thermal fin of now.No matter be which kind of heat sink material, have the pluses and minuses of oneself.Wherein Aluminium Radiator have found a well balance between radiating effect and cost, still very rational for electronic equipment dissipating heat.
In fin shape, due to the contact area strengthening fin and air will be considered, better the heat of fin is left.Fin mostly is fin-shaped moulding mostly at present, can strengthen area of dissipation when limited materials.
Therefore, how to design and not only allow equipment look more attractive in appearance, effectively can take away again the fin of the electronic devices and components of waste heat, be current urgent problem simultaneously.
Summary of the invention
In view of this, the invention provides a kind of layout method of fin, to realize fin can being made to play better radiating effect in the electronic device by layout.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of layout method of fin, comprising:
Obtain the spatial parameter of pcb board;
According to the spacing distance of the spatial parameter determination fin of described pcb board;
According to the spacing distance determination fin of described fin and the position relationship of pcb board.
Preferably, to be describedly specially according to the spacing distance determination fin of described fin and the position relationship of pcb board:
When the spacing distance of described fin is for being greater than 20mm, fin is placed with pcb board base vertical respectively.
Preferably, to be describedly specially according to the spacing distance determination fin of described fin and the position relationship of pcb board:
When the spacing distance of described fin is 15mm-20mm, fin wherein a slice and pcb board base vertical is placed, another sheet and pcb board base is at 45 ° or 135 ° of angles are placed.
Preferably, to be describedly specially according to the spacing distance determination fin of described fin and the position relationship of pcb board:
When the spacing distance of described fin is 10mm-15mm, fin respectively or 135 ° angles at 45 ° with pcb board base is placed.
As can be seen from above-mentioned technical scheme, the layout method of a kind of fin disclosed by the invention, by the fin in rational deployment electronic equipment, increase area of dissipation, electronic device works ambient temperature is reduced, thus extend the useful life of electronic equipment, enhance the job stability of resistance equipment.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The flow chart of Fig. 1 a kind of layout method of fin disclosed in the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the invention discloses a kind of layout method of fin, to realize fin can being made to play better radiating effect in the electronic device by layout.
As shown in Figure 1, a kind of layout method of fin, comprising:
The spatial parameter of S101, acquisition pcb board;
S102, spacing distance according to the spatial parameter determination fin of described pcb board;
S103, according to the spacing distance determination fin of described fin and the position relationship of pcb board.
Concrete, when pcb board space is abundant, fin spacing distance can be unfolded when being placed in more than 20mm, fin is placed with pcb board base vertical respectively (being as the criterion with fin direction), fin fin number increases (i.e. increasing heat radiation area), add heat-dissipating space and area of dissipation, make electronic equipment heat be able to rapid diffusion, thus reduce electronic device works ambient temperature.
Concrete, when pcb board space is abundant, fin spacing distance is unfolded when being placed in 15mm-20mm, fin wherein a slice and pcb board base vertical is placed, a slice and pcb board base is at 45 ° or 135 ° of angles are placed (being all as the criterion with fin direction) in addition, add heat-dissipating space, make electronic equipment heat be able to rapid diffusion, thus reduce electronic device works ambient temperature.
Concrete, when pcb board limited space, fin spacing distance is unfolded only can when 10mm-15mm, fin respectively or 135 ° angles at 45 ° with pcb board base is placed (being all as the criterion with fin direction), increase heat-dissipating space, make electronic equipment heat be able to rapid diffusion, thus reduce electronic device works ambient temperature.
The present invention, by the fin in rational deployment electronic equipment, increases area of dissipation, electronic device works ambient temperature is reduced, thus extends the useful life of electronic equipment, enhances the job stability of electronic equipment.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (1)
1. a layout method for fin, is characterized in that, comprising:
Obtain the spatial parameter of pcb board;
According to the spacing distance of the spatial parameter determination fin of described pcb board;
According to the spacing distance determination fin of described fin and the position relationship of pcb board, comprising:
When the spacing distance of described fin is 15mm-20mm, fin wherein a slice and pcb board base vertical is placed, another sheet and pcb board base is at 45 ° or 135 ° of angles are placed;
When the spacing distance of described fin is 10mm-15mm, fin respectively or 135 ° angles at 45 ° with pcb board base is placed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210555519.7A CN103068207B (en) | 2012-12-19 | 2012-12-19 | A kind of layout method of fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210555519.7A CN103068207B (en) | 2012-12-19 | 2012-12-19 | A kind of layout method of fin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103068207A CN103068207A (en) | 2013-04-24 |
| CN103068207B true CN103068207B (en) | 2015-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210555519.7A Active CN103068207B (en) | 2012-12-19 | 2012-12-19 | A kind of layout method of fin |
Country Status (1)
| Country | Link |
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| CN (1) | CN103068207B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2624403Y (en) * | 2003-04-29 | 2004-07-07 | Tcl王牌电子(深圳)有限公司 | Semiconductor device radiator capable of combined using |
| CN1832155A (en) * | 2005-02-22 | 2006-09-13 | 三星Sdi株式会社 | Structure for heat dissipation of integrated circuit chip and display module including the same |
| CN201041983Y (en) * | 2007-04-25 | 2008-03-26 | 保锐科技股份有限公司 | Heat radiation structure of power supplier |
-
2012
- 2012-12-19 CN CN201210555519.7A patent/CN103068207B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2624403Y (en) * | 2003-04-29 | 2004-07-07 | Tcl王牌电子(深圳)有限公司 | Semiconductor device radiator capable of combined using |
| CN1832155A (en) * | 2005-02-22 | 2006-09-13 | 三星Sdi株式会社 | Structure for heat dissipation of integrated circuit chip and display module including the same |
| CN201041983Y (en) * | 2007-04-25 | 2008-03-26 | 保锐科技股份有限公司 | Heat radiation structure of power supplier |
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| Publication number | Publication date |
|---|---|
| CN103068207A (en) | 2013-04-24 |
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Address after: 100191, room 11, 505 Garden Road East, Beijing, Haidian District Patentee after: BEIJING CYCLE CENTURY TECHNOOGY CO., LTD. Address before: 100191, room 11, 505 Garden Road East, Beijing, Haidian District Patentee before: Beijing Cycle Century Digital Technology Co., Ltd. |