CN103059267A - 含有过量环氧树脂的环氧热固性组合物及其制备方法 - Google Patents
含有过量环氧树脂的环氧热固性组合物及其制备方法 Download PDFInfo
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- CN103059267A CN103059267A CN2012103902287A CN201210390228A CN103059267A CN 103059267 A CN103059267 A CN 103059267A CN 2012103902287 A CN2012103902287 A CN 2012103902287A CN 201210390228 A CN201210390228 A CN 201210390228A CN 103059267 A CN103059267 A CN 103059267A
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- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- QZQIWEZRSIPYCU-UHFFFAOYSA-N trithiole Chemical class S1SC=CS1 QZQIWEZRSIPYCU-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 150000003732 xanthenes Chemical class 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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| CN200880015360A Pending CN101679603A (zh) | 2007-05-09 | 2008-04-22 | 含有过量环氧树脂的环氧热固性组合物及其制备方法 |
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| BR112012029587A2 (pt) | 2010-05-21 | 2016-08-02 | Dow Global Technologies Llc | composição de resina epóxi contendo dióxido de divinilareno curável, processo para preparar uma composição de resina epóxi contendo dióxido de divinilareno curável, processo para preparar um termofixo curado e produto termofixo curado |
| US20110319564A1 (en) | 2010-06-24 | 2011-12-29 | Larry Steven Corley | Epoxy systems for composites |
| US9309354B2 (en) | 2011-06-24 | 2016-04-12 | Dow Global Technologies Llc | Thermosetting composition and process for preparing fiber-reinforced composites |
| US9688808B2 (en) | 2011-06-30 | 2017-06-27 | Dow Global Technologies Llc | Curable epoxy resin systems containing mixtures of amine hardeners and an excess of epoxide groups |
| MX365593B (es) * | 2011-12-20 | 2019-06-07 | Dow Global Technologies Llc | Proceso para preparar compuestos epoxicos curados. |
| WO2014062407A2 (en) | 2012-10-19 | 2014-04-24 | Dow Global Technologies Llc | Anhydride-cured epoxy resin systems containing divinylarene dioxides |
| WO2014078218A1 (en) | 2012-11-13 | 2014-05-22 | Dow Global Technologies Llc | Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes |
| CN104781303B (zh) * | 2012-11-13 | 2017-11-10 | 陶氏环球技术有限责任公司 | 用于树脂传递模塑方法的含多亚乙基四胺的环氧树脂体系 |
| US20150299510A1 (en) | 2012-12-21 | 2015-10-22 | Dow Global Technologies Llc | Non-Isocyanate Sealant for Electrical Cable Joining |
| US9790320B2 (en) | 2012-12-21 | 2017-10-17 | Dow Global Technologies Llc | Thiol-cured elastomeric epoxy resins |
| US9758615B2 (en) | 2012-12-21 | 2017-09-12 | Dow Global Technologies Llc | Phase-segmented non-isocyanate elastomers |
| SG11201601534WA (en) | 2013-09-16 | 2016-04-28 | Dow Global Technologies Llc | Polyurethane elastomer for use in subsea pipeline insulation |
| ES2773533T3 (es) | 2013-12-18 | 2020-07-13 | Dow Global Technologies Llc | Proceso para formar un polímero orgánico en una reacción de un polieno, una resina epoxi y una mezcla de agentes de curado de tiol y amina |
| WO2015103427A1 (en) | 2013-12-31 | 2015-07-09 | Saint-Gobain Performance Plastics Corporation | Composites for protecting signal transmitters/receivers |
| EP3102622B1 (en) | 2014-02-07 | 2019-01-09 | Dow Global Technologies Llc | Fast curing high glass transition temperature epoxy resin system |
| WO2015142771A1 (en) | 2014-03-18 | 2015-09-24 | Dow Global Technologies Llc | Epoxy resin system |
| WO2015164031A1 (en) | 2014-04-22 | 2015-10-29 | Dow Global Technologies Llc | Polyurethane-acrylate epoxy adhesive |
| US10023687B2 (en) | 2014-07-17 | 2018-07-17 | Dow Global Technologies Llc | Epoxy systems employing triethylaminetetraamine and tin catalysts |
| JP2017526794A (ja) * | 2014-09-12 | 2017-09-14 | ドレクセル ユニバーシティ | グラフト化トリグリセリドを使用した酸無水物硬化熱硬化性エポキシポリマーの強化 |
| US9822227B2 (en) | 2014-09-16 | 2017-11-21 | Isola Usa Corp. | High Tg epoxy formulation with good thermal properties |
| WO2016077095A1 (en) | 2014-11-11 | 2016-05-19 | Dow Global Technologies Llc | Fast curing high glass transition temperature epoxy resin system |
| EP3237485A1 (en) | 2014-12-24 | 2017-11-01 | Dow Global Technologies LLC | Rapid-set epoxy resin systems and process of coating pipelines using the epoxy resin system |
| JP6978326B2 (ja) | 2015-06-25 | 2021-12-08 | ダウ グローバル テクノロジーズ エルエルシー | 炭素繊維複合材を作製するための新規エポキシ樹脂系 |
| CN107922590B (zh) | 2015-07-07 | 2020-08-04 | 陶氏环球技术有限责任公司 | 用于制造复合材料的稳定高玻璃化转变温度环氧树脂系统 |
| KR102716321B1 (ko) | 2016-05-24 | 2024-10-14 | 주식회사 아모그린텍 | 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛 |
| WO2018017280A1 (en) | 2016-07-17 | 2018-01-25 | Dow Global Technologies Llc | In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin |
| EP3500612B1 (en) | 2016-08-19 | 2025-04-23 | Dow Global Technologies LLC | Epoxy resin compositions containing an internal mold release agent |
| US11261289B2 (en) * | 2016-10-17 | 2022-03-01 | Warren Environmental & Coating, Llc | Method of lining a pipeline with a delayed curing resin composition |
| US20200181361A1 (en) | 2017-03-09 | 2020-06-11 | Dow Global Technologies Llc | Stable epoxy/internal mold release agent blends for the manufacture of composite articles |
| KR102522215B1 (ko) | 2017-03-17 | 2023-04-18 | 다우 글로벌 테크놀로지스 엘엘씨 | 에폭시-아크릴계 하이브리드 접착제 |
| US20210277174A1 (en) | 2017-06-20 | 2021-09-09 | Dow Global Technologies Llc | Epoxy resin system for making fiber reinforced composites |
| WO2020005393A1 (en) | 2018-06-26 | 2020-01-02 | Dow Global Technologies Llc | Fibre-reinforced composite and process of making this composite |
| WO2020033036A1 (en) | 2018-08-08 | 2020-02-13 | Dow Global Technologies Llc | Epoxy resin composition |
| WO2020033037A1 (en) | 2018-08-08 | 2020-02-13 | Dow Global Technologies Llc | Epoxy resin composition |
| WO2021095534A1 (ja) * | 2019-11-14 | 2021-05-20 | Dic株式会社 | 硬化性組成物、硬化物、繊維強化複合材料、成形品及びその製造方法 |
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2008
- 2008-04-22 CN CN2012103902287A patent/CN103059267A/zh active Pending
- 2008-04-22 EP EP08746559.7A patent/EP2147034B1/en not_active Not-in-force
- 2008-04-22 KR KR1020097025616A patent/KR20100017712A/ko not_active Ceased
- 2008-04-22 WO PCT/US2008/061163 patent/WO2008140906A1/en active Application Filing
- 2008-04-22 US US12/598,520 patent/US20100144965A1/en not_active Abandoned
- 2008-04-22 JP JP2010507516A patent/JP2010526907A/ja active Pending
- 2008-04-22 CN CN200880015360A patent/CN101679603A/zh active Pending
- 2008-04-22 BR BRPI0810290-2A2A patent/BRPI0810290A2/pt not_active IP Right Cessation
- 2008-04-25 TW TW097115210A patent/TWI372766B/zh not_active IP Right Cessation
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| US5962586A (en) * | 1994-09-27 | 1999-10-05 | Harper; John D. | Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct |
| US5686185A (en) * | 1996-06-28 | 1997-11-11 | Morton International, Inc. | Disbondment resistant epoxy powder coating composition |
| CN1788062A (zh) * | 2003-02-28 | 2006-06-14 | 国家淀粉及化学投资控股公司 | 用于电子设备的具有电稳定性和良好抗冲击性的导电性粘合剂组合物 |
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| JP2010526907A (ja) | 2010-08-05 |
| EP2147034B1 (en) | 2014-12-17 |
| BRPI0810290A2 (pt) | 2014-11-04 |
| TWI372766B (en) | 2012-09-21 |
| KR20100017712A (ko) | 2010-02-16 |
| WO2008140906A1 (en) | 2008-11-20 |
| CN101679603A (zh) | 2010-03-24 |
| TW200914482A (en) | 2009-04-01 |
| EP2147034A1 (en) | 2010-01-27 |
| US20100144965A1 (en) | 2010-06-10 |
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